A computer mainframe radiator

Abstract

The utility model discloses a computer mainframe radiator, including heat conduction seat, heat pipe mechanism, fin mechanism and fan mechanism, heat pipe mechanism includes the heat pipe one of carding in heat conduction seat bottom and the heat pipe two of welding in heat conduction seat upper surface middle part, fan mechanism fixed mounting is in fin mechanism one side, and the heat dissipation of fin mechanism is carried out through fan mechanism, and when fan mechanism works, the wind power that it generates enters the inside of flow channel no.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, and in particular to a computer host heat sink. Background Technology

[0002] In the wave of continuous upgrades to computer hardware, the performance of core components such as CPUs and GPUs is constantly breaking through, resulting in a significant increase in heat generation per unit time. An efficient cooling system has become a core element in ensuring stable computer operation and extending hardware lifespan, and the performance of the heatsink, as a key component of the cooling system, directly affects the host's operating efficiency and reliability.

[0003] Currently, tower coolers are the most widely used computer CPU coolers on the market. These coolers work by increasing the heat dissipation area with metal fins, combined with forced convection from fans, to dissipate heat generated by the hardware into the surrounding environment. However, traditional tower coolers often rely on increasing fan power to improve cooling performance—the faster the fan speed, the greater the airflow per unit time, and thus the enhanced cooling capacity. But this approach has significant limitations: increasing fan power directly leads to increased energy consumption, which not only contradicts current energy-saving and emission-reduction technological trends but may also cause problems such as excessive power load on the CPU and increased operating costs due to increased power consumption.

[0004] Therefore, this application provides a computer host heat sink. Utility Model Content

[0005] This invention provides a computer host heat sink that solves the problem of high energy consumption in traditional computer host heat sinks, which require increasing power to improve heat dissipation.

[0006] This utility model provides a computer host heat sink, comprising:

[0007] The heat dissipation mechanism includes a heat-conducting base, a heat pipe mechanism, a fin mechanism, and a fan mechanism. The heat pipe mechanism includes a heat pipe one fixed to the bottom of the heat-conducting base and a heat pipe two welded to the middle of the upper surface of the heat-conducting base. The fin mechanism includes multiple zigzag fin bodies fixedly installed on the outer wall of the heat pipe one and multiple rhomboid flow dividers fixedly installed on the outer wall of the heat pipe two. Two adjacent fin bodies are mirror images of each other, and two adjacent fin bodies respectively form a flow channel one with a gradually decreasing distance from both sides to the middle and a flow channel two with a gradually increasing distance from both sides to the middle. The flow channel one and flow channel two are staggered. The multiple rhomboid flow dividers are located in the middle of their corresponding flow channel two. The fan mechanism is fixedly installed on one side of the fin mechanism.

[0008] In a computer host heat sink according to one embodiment of the present invention, the middle part of the heat pipe is embedded and connected to the bottom of the heat conduction base, and its two ends are bent and extended to both sides with the heat conduction base as the center, and the extended part is set perpendicular to the ground.

[0009] In a computer host heat sink according to one embodiment of the present invention, the fan mechanism includes a mounting base fixedly installed on the right side of a plurality of fin bodies, a fan body fixedly installed on one side of the mounting base, and an air outlet adapted to the fan body is opened in the middle of the mounting base.

[0010] In a computer host heat sink according to an embodiment of the present invention, a plurality of heat pipes are embedded and connected at the lower end of the heat conduction base. A flow guide plate and a rhomboid flow divider are fixedly installed at the upper end of the plurality of heat pipes. A plurality of vertical fins are integrally provided on the upper surface of the flow guide plate. A mounting base is fixedly installed on the top of the vertical fins. A fan body is fixedly installed on the top of the mounting base. Two adjacent vertical fins are mirror images of each other, and two adjacent flow guide plates respectively form a vertical flow channel I with a gradually decreasing distance from both sides to the middle and a vertical flow channel II with a gradually increasing distance from both sides to the middle. The vertical flow channel I and the vertical flow channel II are staggered. The plurality of rhomboid flow dividers are located in the middle of their corresponding vertical flow channel II.

[0011] In a computer host heat sink according to one embodiment of the present invention, the bottom of a plurality of heat pipes with three self-conducting heat bases bends outward and the extended portion is arranged parallel to the ground.

[0012] In a computer host heat sink according to one embodiment of the present invention, a heat-conducting plate is fixedly installed at the upper end of the heat pipe, and a silicone heat-conducting pad is fixedly installed on the upper surface of the heat-conducting plate.

[0013] The technical solution provided in this application embodiment can include the following beneficial effects: This application designs a computer host heat sink, which conducts the heat generated by the graphics card on the host by setting a heat conduction base, conducts the heat in the heat conduction base to the fin mechanism by a heat pipe mechanism, and dissipates heat from the fin mechanism by a fan mechanism. When the fan mechanism is working, the air force generated by it enters the interior of the first and second flow channels. Since the first flow channel has a structure in which the distance between the two sides gradually decreases from the middle, the airflow velocity will increase as the cross-sectional area of ​​the flow channel decreases. When the two sides of the first flow channel contract towards the middle, the air mass passing through the flow channel per unit time remains unchanged, but the flow space becomes smaller, and the airflow is forced to accelerate, passing through the first flow channel at a faster speed. The high-speed airflow can more quickly carry away the heat on the surface of the fin mechanism, reducing the residence time of hot air near the fins. At the same time, when the airflow enters the interior of the second flow channel, since the area with a large distance in the middle of the second flow channel is divided into two areas smaller than the distance between its two sides by a rhomboid diverter, the airflow flowing through the second flow channel will also accelerate according to the above principle, thereby improving the heat dissipation effect of the heat sink without increasing the power.

[0014] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of this application;

[0017] Figure 2 This is a schematic diagram of the structure after removing the fan mechanism in Embodiment 1 of this application;

[0018] Figure 3 This is a schematic diagram of the structure of the fin body in Embodiment 1 of this application;

[0019] Figure 4 This is a schematic diagram of the prismatic flow divider block in Embodiment 1 of this application;

[0020] Figure 5 This is a schematic diagram of the structure of Embodiment 2 of this application;

[0021] Figure 6 This is a schematic diagram of the flow guide plate in Embodiment 2 of this application;

[0022] Figure 7 This is a structural schematic diagram of Embodiment 3 of this application. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0024] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0025] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0026] Example 1

[0027] like Figures 1 to 4 As shown, this application provides a computer host heat sink, including:

[0028] The heat dissipation mechanism 100 includes a heat conduction base 10, a heat pipe mechanism 20, a fin mechanism 30, and a fan mechanism 40. The heat pipe mechanism 20 includes a heat pipe 21 fixed at the bottom of the heat conduction base 10 and a heat pipe 22 welded to the middle of the upper surface of the heat conduction base 10. The fin mechanism 30 includes multiple zigzag fin bodies 31 fixedly installed on the outer wall of the heat pipe 21 and multiple rhomboid flow dividers 32 fixedly installed on the outer wall of the heat pipe 22. Two adjacent fin bodies 31 are mirror images of each other, and two adjacent fin bodies 31 respectively form a flow channel 33 with a gradually decreasing distance from both sides to the middle and a flow channel 34 with a gradually increasing distance from both sides to the middle. The flow channel 33 and the flow channel 34 are staggered. The multiple rhomboid flow dividers 32 are located in the middle of their corresponding flow channel 34. The fan mechanism 40 is fixedly installed on one side of the fin mechanism 30.

[0029] After adopting the above technical solution, the heat generated by the graphics card on the host is conducted through the heat conduction base 10, and the heat in the heat conduction base 10 is conducted to the fin mechanism 30 through the heat pipe mechanism 20. The fin mechanism 30 is then cooled by the fan mechanism 40. When the fan mechanism 40 is working, the airflow generated by it enters the interior of the first flow channel 33 and the second flow channel 34. Since the first flow channel 33 has a structure in which the distance between the two sides gradually decreases towards the middle, the airflow velocity will increase as the cross-sectional area of ​​the flow channel decreases. When the two sides of the first flow channel 33 contract towards the middle, the airflow velocity per unit time increases. The air quality in the channel remains unchanged, but the flow space becomes smaller, forcing the airflow to accelerate and pass through the first channel 33 at a faster speed. The high-speed airflow can more quickly remove the heat from the surface of the fin mechanism 30, reducing the residence time of hot air near the fins. At the same time, when the airflow enters the second channel 34, the area with a large gap in the middle of the second channel 34 is divided into two areas smaller than the gap on both sides by the rhomboid diverter block 32. According to the above principle, the airflow flowing through the second channel 34 will also accelerate, thereby improving the heat dissipation effect of the radiator without increasing the power.

[0030] In an optional embodiment, the heat pipe 21 is embedded in the middle and connected to the bottom of the heat conduction base 10, and its two ends are bent and extended to both sides with the heat conduction base 10 as the center, and the extended part is set perpendicular to the ground, so that the fin body 31 can be arranged vertically, increasing the number of stacked fin bodies 31 and improving the heat dissipation effect.

[0031] In one optional embodiment, the fan mechanism 40 includes a mounting base 41 fixedly mounted on the right side of a plurality of fin bodies 31. A fan body 42 is fixedly mounted on one side of the mounting base 41. An air outlet adapted to the fan body 42 is opened in the middle of the mounting base 41, and the fan body 42 dissipates heat from the fin mechanism 30.

[0032] Example 2

[0033] like Figures 5 to 6As shown, in order to make the heat sink suitable for small computer mainframes, based on Embodiment 1, multiple heat pipes 23 are embedded and connected to the lower end of the heat conduction base 10. A flow guide plate 51 and multiple rhomboid flow dividers 32 are fixedly installed on the upper ends of the multiple heat pipes 23. Multiple vertical fins 52 are integrally formed on the upper surface of the flow guide plate 51. A mounting base 41 is fixedly installed on the top of the vertical fins 52, and a fan body 42 is fixedly installed on the top of the mounting base 41. Two adjacent vertical fins 52 are mirror images of each other, and two adjacent flow guide plates 51 respectively form vertical flow channels 53 with gradually decreasing spacing from both sides towards the center and vertical flow channels 53 with gradually decreasing spacing from both sides towards the center. The vertical flow channel 2 54 gradually increases in size. The vertical flow channel 1 53 and the vertical flow channel 2 54 are arranged in an alternating manner. Multiple rhomboid flow dividers 32 are located in the middle of the corresponding vertical flow channel 2 54. The overall volume of the heat sink is reduced by the downward pressure structure of the heat sink. During the heat dissipation process, the heat conduction base 10 conducts the heat from the computer host graphics card to the guide wheel base plate 51 and the vertical fins through the heat pipe 3 23. The fan mechanism 40 dissipates heat from the vertical fins 52. At the same time, the flow guide base plate 51 blocks the airflow that blows directly downwards, causing it to blow out to both sides along the gap between the vertical flow channels 1 53, preventing hot air from blowing directly onto the computer motherboard.

[0034] In an alternative embodiment, multiple heat pipes 23 are bent outward from the bottom of the heat-conducting base 10 and the extensions are parallel to the ground, so that the vertical flow channels 53 can be arranged laterally, reducing the overall volume of the heat sink.

[0035] Example 3

[0036] like Figure 7 As shown, in order to make the heat sink suitable for microcomputers, based on Embodiment 2, a heat-conducting plate 61 is fixedly installed on the upper end of the heat pipe 23, and a silicone heat-conducting pad 62 is fixedly installed on the upper surface of the heat-conducting plate 61. When using the heat sink, the heat-conducting base 10 is installed on the upper wall of the graphics card of the computer host, and the heat-conducting plate 61 is fixed to the inner wall of the computer case through the silicone heat-conducting pad 62. The heat generated by the graphics card of the computer host is conducted to the case of the computer host in sequence through the heat-conducting base 10, the heat pipe 23 and the heat-conducting plate 61, and heat dissipation is achieved through the contact between the computer host case and the air.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0038] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0039] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0040] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0041] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A computer host heat sink, characterized in that, include: The heat dissipation mechanism includes a heat-conducting base, a heat pipe mechanism, a fin mechanism, and a fan mechanism. The heat pipe mechanism includes a heat pipe one fixed to the bottom of the heat-conducting base and a heat pipe two welded to the middle of the upper surface of the heat-conducting base. The fin mechanism includes multiple zigzag fin bodies fixedly installed on the outer wall of the heat pipe one and multiple rhomboid flow dividers fixedly installed on the outer wall of the heat pipe two. Two adjacent fin bodies are mirror images of each other, and two adjacent fin bodies respectively form a flow channel one with a gradually decreasing distance from both sides to the middle and a flow channel two with a gradually increasing distance from both sides to the middle. The flow channel one and flow channel two are staggered. The multiple rhomboid flow dividers are located in the middle of their corresponding flow channel two. The fan mechanism is fixedly installed on one side of the fin mechanism.

2. A computer host heat sink according to claim 1, characterized in that, The heat pipe is embedded in the middle of the bottom of the heat-conducting base, and its two ends are bent and extended to both sides with the heat-conducting base as the center, and the extended part is set perpendicular to the ground.

3. A computer host heat sink according to claim 1, characterized in that, The fan mechanism includes a mounting base fixedly installed on the right side of multiple fin bodies. A fan body is fixedly installed on one side of the mounting base, and an air outlet adapted to the fan body is opened in the middle of the mounting base.

4. A computer host heat sink according to claim 1, characterized in that, The lower end of the heat-conducting base is embedded with multiple heat pipes 3. The upper ends of the multiple heat pipes 3 are fixedly installed with a flow guide base plate and a rhomboid flow divider block. Multiple vertical fins are integrally arranged on the upper surface of the flow guide base plate. A mounting base is fixedly installed on the top of the vertical fins. The fan body is fixedly installed on the top of the mounting base. Two adjacent vertical fins are mirror images of each other. Two adjacent flow guide base plates respectively form a vertical flow channel 1 with a gradually decreasing distance from both sides to the middle and a vertical flow channel 2 with a gradually increasing distance from both sides to the middle. The vertical flow channel 1 and vertical flow channel 2 are arranged alternately. The multiple rhomboid flow divider blocks are located in the middle of their corresponding vertical flow channel 2.

5. A computer host heat sink according to claim 4, characterized in that, The bottom of the multiple heat pipe self-conducting bases bends outward and extends, with the extended portion kept parallel to the ground.

6. A computer host heat sink according to claim 4, characterized in that, A heat-conducting plate is fixedly installed at the upper end of the heat pipe, and a silicone heat-conducting pad is fixedly installed on the upper surface of the heat-conducting plate.

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