Display device

Abstract

The disclosure relates to a display device. The display device includes a display panel including a display area and a peripheral area defined around the display area; a touch sensor including a touch sensing electrode disposed on the display panel and overlapping the display area of the display panel; a plurality of panel pads disposed on the peripheral area of the display panel; a plurality of dummy panel pads disposed on the peripheral area of the display panel and spaced apart from the plurality of panel pads; a driving circuit chip disposed between the display area and the plurality of panel pads and between the display area and the plurality of dummy panel pads; and a touch connection wiring connected to the touch sensing electrode and the driving circuit chip, wherein, in a plan view, the touch connection wiring is disposed between the plurality of dummy panel pads.

Description

Technical Field

[0001] Embodiments of this disclosure relate to display devices. Background Technology

[0002] Display devices are devices that display images and include liquid crystal displays (LCDs) and organic light-emitting diodes (OLEDs). These display devices are used in a variety of electronic devices, such as mobile phones, navigation devices, digital cameras, e-books, portable game consoles, and various terminals.

[0003] As an input device for this electronic device, a touch sensor is used, allowing users to input information by touching the screen with their fingers or a stylus. Among the various sensing methods of touch sensors, the capacitance type, which detects the location of capacitance changes due to contact between two spaced-apart electrodes, is the most common. Utility Model Content

[0004] The touch sensor of an electronic device may include multiple wires, which can be connected to test pads for testing the characteristics of the touch sensor. In such electronic devices, it is important to ensure alignment margins between the multiple wires connected to the test pads and adjacent components of the electronic device to prevent short circuits or other issues between the multiple wires connected to the test pads and adjacent components.

[0005] The embodiment relates to a display device including a driver circuit chip that drives a display panel and together drives a touch sensor, effectively preventing short circuits between the touch connection wiring of the touch sensor and the pads on the printed circuit board.

[0006] A display device according to an embodiment includes: a display panel including a display area and a peripheral area defined around the display area; a touch sensor including touch sensing electrodes disposed on the display panel and overlapping the display area of ​​the display panel; a plurality of panel pads disposed on the peripheral area of ​​the display panel; a plurality of dummy panel pads disposed on the peripheral area of ​​the display panel and spaced apart from the plurality of panel pads; a driving circuit chip disposed between the display area and the plurality of panel pads and between the display area and the plurality of dummy panel pads; and touch connection wiring connected to the touch sensing electrodes and the driving circuit chip, wherein, in a plan view, the touch connection wiring is disposed between the plurality of dummy panel pads.

[0007] In an implementation, multiple touch connection lines can be configured, and these multiple touch connection lines can be configured between adjacent dummy panel pads in a plurality of dummy panel pads.

[0008] In this implementation, the width of the multiple panel pads can be greater than the width of the multiple dummy panel pads.

[0009] In an implementation, the distance between adjacent panel pads in a plurality of panel pads can be less than the distance between adjacent dummy panel pads in a plurality of dummy panel pads.

[0010] In one implementation, multiple panel pads and multiple dummy panel pads can be arranged in a row to be adjacent to the driver circuit chip.

[0011] In one implementation, one end of the touch connection wiring can be connected to a touch sensing electrode, and in a plan view, the opposite end of the touch connection wiring can be aligned substantially with the same boundary as one end of the display panel, which is adjacent to a plurality of panel pads and a plurality of dummy panel pads.

[0012] In an implementation, in a plan view, the touch connection wiring may overlap with the driver circuit chip.

[0013] In this implementation, the multiple dummy panel pads may be floating.

[0014] According to an embodiment, the display device includes: a display panel including a display area and a peripheral area defined around the display area; a touch sensor including touch sensing electrodes overlapping the display area of ​​the display panel; a plurality of panel pads disposed on the peripheral area of ​​the display panel; a plurality of dummy panel pads spaced apart from the plurality of panel pads; a driving circuit chip disposed between the display area and the plurality of panel pads and between the display area and the plurality of dummy panel pads; touch connection wiring connected to the touch sensing electrodes and the driving circuit chip; a printed circuit board overlapping the plurality of panel pads and the plurality of dummy panel pads; a plurality of circuit pads disposed on the printed circuit board and facing the plurality of panel pads; and a plurality of dummy circuit pads disposed on the printed circuit board and facing the plurality of dummy panel pads, wherein, in a plan view, the touch connection wiring is located between the plurality of dummy panel pads.

[0015] In this implementation, the width of the plurality of dummy panel pads can be greater than the width of the plurality of dummy circuit pads.

[0016] In an implementation, multiple touch connection lines can be configured, and these multiple touch connection lines can be configured between adjacent dummy panel pads in a plurality of dummy panel pads.

[0017] In an implementation, in a plan view, a plurality of dummy circuit pads may overlap with a portion of a plurality of dummy panel pads.

[0018] In one implementation, the plurality of dummy circuit pads may overlap with one of the plurality of touch connection lines disposed between adjacent dummy panel pads in the plurality of dummy panel pads.

[0019] In this implementation, the width of the multiple circuit pads can be greater than the width of the multiple dummy circuit pads.

[0020] In this implementation, the width of the multiple panel pads can be greater than the width of the multiple dummy panel pads.

[0021] In an implementation, the distance between adjacent circuit pads in a plurality of circuit pads can be less than the distance between adjacent dummy circuit pads in a plurality of dummy circuit pads.

[0022] In an implementation, the distance between adjacent panel pads in a plurality of panel pads can be less than the distance between adjacent dummy panel pads in a plurality of dummy panel pads.

[0023] In an implementation, the ratio between the width of each of the plurality of dummy circuit pads and the distance between adjacent dummy circuit pads can be in the range of approximately 1:1 to 1:1.5.

[0024] In this implementation, the multiple dummy panel pads and multiple dummy circuit pads may be floating.

[0025] The display device according to the embodiments may further include conductive balls disposed between a plurality of panel pads and a plurality of circuit pads and between a plurality of dummy panel pads and a plurality of dummy circuit pads.

[0026] According to the implementation, dummy pads are placed on two opposite sides of the touch connection wiring extending into the pad area of ​​the display panel. The printed circuit board is attached to the pad area of ​​the display panel to test the characteristics of the touch sensor, thereby effectively preventing short circuits between the pads of the printed circuit board and the touch connection wiring. Attached Figure Description

[0027] Figure 1 This is a plan view showing a display device according to an embodiment.

[0028] Figure 2 This is a plan view showing the display panel and touch sensor of a display device according to an embodiment.

[0029] Figure 3 This is a partial enlarged view showing a portion of a display device according to an embodiment.

[0030] Figure 4 This is a partial enlarged view showing a portion of the display panel according to an embodiment.

[0031] Figure 5 This is a partial enlarged view showing a portion of a printed circuit board according to an embodiment.

[0032] Figure 6yes Figure 3 An enlarged planar view of region P1 in the diagram.

[0033] Figure 7 It is along Figure 6 A sectional view taken from line I-I'.

[0034] Figures 8 to 14 This is a plan view showing a portion of a display device according to some embodiments. Detailed Implementation

[0035] The present invention will now be described more fully with reference to the accompanying drawings, in which various embodiments are illustrated. However, the present invention may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals denote the same elements throughout.

[0036] What will be understood is that when an element is referred to as being "on" another element, it can be directly on said other element, or there can be an intervening element between them. Conversely, when an element is referred to as being "directly" on another element, there is no intervening element.

[0037] Furthermore, for ease of illustration, the dimensions and thicknesses of each component shown in the accompanying drawings are arbitrarily illustrated, and therefore this disclosure is not necessarily limited to what is shown. In the drawings, thicknesses are magnified to clearly represent the various layers and regions. Additionally, in the drawings, the thicknesses of some layers and regions are exaggerated for ease of illustration.

[0038] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, without departing from the teachings herein, “first element,” “first component,” “first region,” “first layer,” or “first part” discussed below may be referred to as a second element, second component, second region, second layer, or second part.

[0039] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a,” “an,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. Thus, reference to “a” element followed by “the” element in a claim includes one element and multiple elements. For example, “element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” is not to be construed as limiting “a” or “an.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that, when used in this specification, the terms “comprising” and / or “including” or “containing” and / or “comprising” specify the presence of the stated features, areas, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components, and / or groups thereof.

[0040] Furthermore, relative terms such as “down” or “bottom” and “up” or “top” may be used herein to describe the relationship between one element and another, as shown in the accompanying drawings. It will be understood that, in addition to the orientation depicted in the drawings, the relative terms are intended to also include different orientations of the device. For example, if a device in one of the drawings is flipped, an element described as being “down” to the other element will be oriented to be “up” to the other element. Thus, the term “down” can include both “down” and “up” orientations, depending on the specific orientation of the drawing. Similarly, if a device in one of the drawings is flipped, an element described as being “below” or “under” the other element will be oriented to be “above” the other element. Thus, the term “below” or “under” can include both “up” and “down” orientations.

[0041] Furthermore, throughout the instruction manual, when it is mentioned "in a plan view," it means the target part is viewed from above, and when it is mentioned "in a sectional view," it means a section of the target part that is cut vertically and viewed from the side.

[0042] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), the terms “about” or “approximately” as used herein include the stated value and mean within an acceptable deviation range of the particular value as determined by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0043] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having the same meaning as they have in the context of the relevant technology and this disclosure, and shall not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0044] Embodiments are described herein with reference to cross-sectional views, which are schematic representations of idealized embodiments. Therefore, variations in the shapes depicted in the figures will be anticipated due to factors such as manufacturing techniques and / or tolerances. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather include shape deviations, for example, due to manufacturing processes. For instance, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to represent the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0045] In the following text, reference will be made to Figures 1 to 7 Describes a display device according to an embodiment.

[0046] Figure 1 This is a plan view showing a display device according to an embodiment. Figure 2 This is a plan view showing the display panel and touch sensor of a display device according to an embodiment. Figure 3 This is a partial enlarged view showing a portion of a display device according to an embodiment. Figure 4 This is a partial enlarged view showing a portion of the display panel according to an embodiment. Figure 5 This is a partial enlarged view showing a portion of a printed circuit board according to an embodiment. Figure 6 yes Figure 3 An enlarged planar view of region P1 in the diagram. Figure 7 It is along Figure 6 A sectional view taken from line I-I'.

[0047] refer to Figures 1 to 7 The display device 10 according to the embodiment may include a display panel 100, a driving circuit chip 20, a printed circuit board 30, and a touch sensor 200.

[0048] The display panel 100 includes a display area DA corresponding to the screen on which images are displayed and a peripheral area NA. In an embodiment, such as... Figure 1 As shown, the outer region NA can surround the display region DA. However, this is just an example, and the arrangement relationship between the display region DA and the outer region NA can be changed in various ways.

[0049] Display panel 100 comprises or is made of a flexible material and can be shaped into various forms. Display panel 100 can be flexible, stretchable, foldable, bendable, or rollable. Display panel 100 can be bent at the boundary between display area DA and peripheral area NA. Peripheral area NA can be bent from display area DA such that a portion of peripheral area NA lies behind display area DA. However, this is an example, and the position of peripheral area NA can be changed in various ways.

[0050] The display area DA of the display panel 100 can be a roughly rectangular shape including its long and short sides, and the corners can be chamfered to have a curved shape. However, this shape of the display area DA is just an example and can be changed to various shapes. Multiple pixels PX are located in most of the display area DA to display an image. Some areas at the edges of the display area DA may have areas without positioned pixels PX, and therefore do not display an image.

[0051] Multiple pixels PX can be arranged in a matrix within the display area DA of the display panel 100. Signal lines such as gate lines, data lines, drive voltage lines, and initialization voltage lines can be positioned within the display area DA.

[0052] Gate lines may extend in a first direction X, and data lines and drive voltage lines may extend in a second direction Y intersecting the first direction X. Initialization voltage lines may include voltage lines extending in the first direction X and voltage lines extending in the second direction Y, and may be arranged in a mesh shape. Here, the third direction Z may be a direction perpendicular to the plane defined by the first direction X and the second direction Y, or the thickness direction of the display panel 100.

[0053] Each of the multiple pixels (PX) is connected to gate lines, data lines, drive voltage lines, initialization voltage lines, etc., and can receive gate signals, data voltages, drive voltages, initialization voltages, etc., from these signal lines. Each of the multiple pixels (PX) can also receive a common voltage. The multiple pixels (PX) can be implemented as light-emitting elements such as light-emitting diodes (LEDs).

[0054] A driving unit that generates and / or processes various signals for driving the display panel 100 may be located in the peripheral region NA of the display panel 100. The driving unit includes a data driver that applies data voltages to data lines, a gate driver that applies gate signals to gate lines, and a signal controller that controls the data driver and the gate driver. In response to the gate signals generated by the gate drivers, multiple pixels PX may receive data voltages at predetermined timings.

[0055] The gate driver can be integrated into the display panel 100 and can be located on at least one side of the display area DA. The data driver and signal controller can be provided as the drive circuit chip 20.

[0056] According to the implementation, the peripheral area NA may include a first pad area PA1 and a second pad area PA2, in which pads for inputting and outputting multiple signals are arranged.

[0057] The first pad region PA1 and the second pad region PA2 may be spaced apart in the second direction Y. The first pad region PA1 may be closer to the display area DA than the second pad region PA2. In an embodiment, for example, the second pad region PA2 may be positioned adjacent to the lower edge of the peripheral area NA of the display panel 100.

[0058] The display panel 100 according to the embodiment may further include a curved region BA located between the display area DA and the first pad area PA1. The curved region BA may extend in a first direction X between the display area DA and the first pad area PA1, and may have a predetermined width along a second direction Y.

[0059] Based on a bending axis parallel to the first direction X within the curved region BA, the display panel 100 can be bent to a predetermined radius of curvature. In an embodiment where the display panel 100 is a front-emitting (top-emitting) type, the first pad region PA1 and the second pad region PA2 can be bent such that they are located on the back side of the display region DA, wherein the first pad region PA1 and the second pad region PA2 are farther away from the display region DA than the curved region BA. However, the embodiment is not limited to this, and the curved region BA may be located within the display region DA, or it may be positioned across the display region DA and the peripheral region NA.

[0060] The driving circuit chip 20 may be located in the peripheral area NA of the display panel 100. The driving circuit chip 20 may be bonded to the first pad area PA1. The driving circuit chip 20 may include an integrated circuit that drives the display panel 100.

[0061] The driving circuit chip 20 can be attached to the display panel 100 via an anisotropic conductive film, or it can be attached to the display panel 100 via ultrasonic bonding. The driving circuit chip 20 can be a chip-on-plastic (COP), but the implementation is not limited to this.

[0062] The driving circuit chip 20 may be an integrated driving circuit chip that applies a driving signal to the touch unit simultaneously with the application of a display driving signal. In an embodiment, for example, the driving circuit chip 20 may be a driver integrated circuit that integrates a display driver integrated circuit and a touch driver integrated circuit.

[0063] Multiple display signal wiring pads and touch signal wiring pads may be located in the first pad area PA1 of the display panel 100. In an embodiment where the driver circuit chip 20 generates display driving signals and touch unit driving signals together, multiple display signal wirings and touch signal wirings are electrically connected to the driver circuit chip 20, and multiple bumps on the driver circuit chip 20 may be electrically connected to multiple display signal wiring pads and touch signal wiring pads.

[0064] According to an embodiment, the display panel 100 may include a plurality of panel pads 261, a plurality of dummy panel pads 262 located in the second pad area PA2, and signal connection wiring 270 connected to the plurality of panel pads 261.

[0065] In the implementation method, such as Figure 2 As shown, each of the plurality of panel pads 261 can be connected to the signal connection wiring 270, and the plurality of dummy panel pads 262 can be unconnected to the signal connection wiring 270. That is, the plurality of dummy panel pads 262 can be electrically floating. In other words, since the plurality of dummy panel pads 262 are electrically floating, no voltage or signal needs to be applied to them.

[0066] Signal connection wiring 270, which connects to multiple panel pads 261, can extend to the first pad area PA1 of the display panel 100 and connect to the driver circuit chip 20. That is, multiple panel pads 261 can be electrically connected to the driver circuit chip 20 via signal connection wiring 270.

[0067] Although not explicitly stated, some of the signal connection wiring 270 connected to the multiple panel pads 261 extends into the peripheral area NA of the display panel 100 to connect to drive units located in the peripheral area NA, such as data drivers, gate drivers, and signal controllers.

[0068] In the second pad area PA2 of the display panel 100, a plurality of panel pads 261 and a plurality of dummy panel pads 262 are aligned adjacent to the driver circuit chip 20 along a first direction X. However, this is an example, and each of the plurality of panel pads 261 and the plurality of dummy panel pads 262 may be arranged to form a row along a different first direction X.

[0069] The number of panel pads 261 and the number of dummy panel pads 262 can be different. In one embodiment, for example, the number of panel pads 261 can be greater than the number of dummy panel pads 262. However, the embodiment is not limited to this, and the number of multiple panel pads 261 and multiple dummy panel pads 262 can be changed in various ways.

[0070] Multiple dummy panel pads 262 may be located between multiple panel pads 261. The multiple dummy panel pads 262 may be positioned adjacent to each other. In one embodiment, two or more dummy panel pads 262 may be arranged consecutively between multiple panel pads 261. However, the arrangement of the panel pads 261 and dummy panel pads 262 is not limited to this and can be varied in various ways. In another embodiment, for example, the multiple dummy panel pads 262 may be arranged consecutively at one edge and / or the other edge of the second pad region PA2 of the display panel 100. In such an embodiment, the multiple dummy panel pads 262 may be arranged on the outermost edge of one side and / or the other side of the second pad region PA2.

[0071] In an embodiment, the width of the panel pad 261 along the first direction X in the second pad area PA2 of the display panel 100 and the width of the dummy panel pad 262 along the first direction X can be substantially the same as each other.

[0072] Here, the width of panel pad 261 and dummy panel pad 262 in the first direction X can refer to the maximum width of panel pad 261 and dummy panel pad 262, respectively.

[0073] In an implementation, the distance between adjacent panel pads 261 can be substantially the same as the distance between adjacent dummy panel pads 262.

[0074] Here, the distance between adjacent panel pads 261 and the distance between adjacent dummy panel pads 262 can refer to the distance between facing sides on a plane along the first direction X. However, the widths of the panel pads 261 and the dummy panel pads 262, as well as the distance between them, can be varied in various ways, and will be referenced... Figures 9 to 14 It is described in detail.

[0075] In the implementation method, such as Figure 3 As shown, the printed circuit board 30 can be located in the peripheral area NA of the display panel 100. The printed circuit board 30 can be bonded to the second pad area PA2.

[0076] The printed circuit board 30 can be a flexible printed circuit board (FPC) or a film. In one embodiment, the printed circuit board 30 can be an integrated printed circuit board that drives both the display and the touch unit. In such an embodiment, the printed circuit board 30 can output signals and power for controlling the drive circuit chip 20.

[0077] However, the implementation is not limited to this, and the display driving substrate and the touch unit driving substrate may each be attached to the display panel 100.

[0078] In the implementation method, such as Figure 5As shown, the printed circuit board 30 may include a plurality of circuit pads 361, a plurality of dummy circuit pads 362, and a plurality of circuit connection wirings 370 connected to the plurality of circuit pads 361 on a surface of a second pad region PA2 facing the display panel 100.

[0079] Multiple circuit pads 361 face multiple panel pads 261 located in the second pad area PA2 of the display panel 100, and multiple dummy circuit pads 362 can be arranged to face multiple dummy panel pads 262. That is, each of the multiple circuit pads 361 overlaps with and is electrically connected to the multiple panel pads 261, and each of the multiple dummy circuit pads 362 overlaps with the multiple dummy panel pads 262.

[0080] In such an implementation, such as Figure 6 As shown, the arrangement relationship between the plurality of circuit pads 361 and the plurality of dummy circuit pads 362 can be substantially the same as the arrangement relationship between the plurality of panel pads 261 and the plurality of dummy panel pads 262 described above.

[0081] Each of the plurality of circuit pads 361 may be connected to the circuit connection wiring 370, and the plurality of dummy circuit pads 362 may not be connected to the circuit connection wiring 370. In an embodiment, similar to the dummy panel pads 262 described above, the plurality of dummy circuit pads 362 may be electrically floating. In such an embodiment, since the plurality of dummy circuit pads 362 are electrically floating, no voltage or signal may be applied to them.

[0082] The width of the circuit pad 361 of the printed circuit board 30 along the first direction X and the width of the dummy circuit pad 362 along the first direction X can be substantially the same as each other.

[0083] The width of the circuit pad 361 along the first direction X is smaller than the width of the panel pad 261 along the first direction X, and the width of the dummy circuit pad 362 along the first direction X can be smaller than the width of the dummy panel pad 262 along the first direction X.

[0084] Here, the width of circuit pad 361 and dummy circuit pad 362 can refer to the maximum width of circuit pad 361 and dummy circuit pad 362, respectively.

[0085] The distance between adjacent circuit pads 361 can be approximately equal to the distance between adjacent dummy circuit pads 362.

[0086] Here, the distance between adjacent circuit pads 361 and the distance between adjacent dummy circuit pads 362 can refer to the distance between facing sides on a plane along the first direction X. However, the widths of the circuit pads 361 and dummy circuit pads 362, as well as the distance between them, can be varied in various ways, and will be referenced... Figures 9 to 14 It is described in detail.

[0087] like Figure 7 As shown, the display panel 100 according to the embodiment may include a substrate 110 and an insulating layer 120 located on the substrate 110.

[0088] The substrate 110 may be a rigid substrate or a flexible substrate that can be bent, folded, rolled, etc. In an embodiment, for example, the substrate 110 may include one of polyimide, polyamide, and polyethylene terephthalate.

[0089] The insulating layer 120 is located on the substrate 110 and may cover at least a portion of the substrate 110. In an embodiment, such as... Figure 7 As shown, the insulating layer 120 may be defined or composed of a single layer, but the embodiments are not limited thereto, and the insulating layer 120 may be defined or composed of multiple layers.

[0090] The insulating layer 120 may include an inorganic insulating material, such as one of silicon oxide, silicon nitride, silicon oxynitride, hafnium oxide, aluminum oxide, titanium oxide, tantalum oxide, and zinc oxide.

[0091] Multiple panel pads 261 and multiple dummy panel pads 262 may be located on the insulating layer 120. In an embodiment, such as Figure 7 As shown, the plurality of panel pads 261 and the plurality of dummy panel pads 262 may be defined or configured by a single layer, but are not limited thereto, and the panel pads 261 and the dummy panel pads 262 may be configured as multiple layers. In another embodiment, for example, each of the panel pads 261 and the dummy panel pads 262 may be defined by or composed of multiple conductive material layers.

[0092] The display device 10 according to the embodiment may further include an anisotropic conductive film (ACF) 400 located between the display panel 100 and the printed circuit board 30.

[0093] Anisotropic conductive film 400 may be located between the first pad area PA1 of the display panel 100 and the driving circuit chip 20, and between the second pad area PA2 and the printed circuit board 30.

[0094] In the implementation method, such as Figure 7As shown, the anisotropic conductive film 400 may be located between the panel pad 261 and the circuit pad 361 positioned in the second pad region PA2, and between the dummy panel pad 262 and the dummy circuit pad 362.

[0095] The anisotropic conductive film 400 may include an insulating resin 410 and a plurality of conductive balls 420 dispersed in the insulating resin 410.

[0096] Multiple conductive balls 420 are located between panel pads 261 and circuit pads 361, and can contact each of panel pads 261 and circuit pads 361. Panel pads 261 and circuit pads 361 can be electrically connected through the multiple conductive balls 420.

[0097] In one embodiment, a plurality of conductive balls 420 may be located between the dummy panel pad 262 and the dummy circuit pad 362. The plurality of conductive balls 420 may contact each of the dummy panel pad 262 and the dummy circuit pad 362. However, the arrangement of the plurality of conductive balls 420 is not limited thereto and may be varied. In another embodiment, for example, the plurality of conductive balls 420 may be located between the panel pad 261 and the circuit pad 361, but may not be located between the dummy panel pad 262 and the dummy circuit pad 362.

[0098] The touch sensor 200 may be located on the display panel 100. In one embodiment, an anti-reflective layer (not shown) that reduces the reflection of external light may also be located on the touch sensor 200. The anti-reflective layer may include or be made of a polarizing layer, which may include a linear polarizer, a delay plate, etc. In another embodiment, a cover window (not shown) may also be located above the touch sensor 200. The cover window may be used to protect the touch sensor 200 and the display panel 100 located below it.

[0099] Touch sensor 200 may include a touch sensing area TA and a peripheral area NA. The touch sensing area TA of touch sensor 200 may be positioned to correspond to the display area DA of display panel 100 (e.g., overlapping or covering the display area DA of display panel 100), and the peripheral area NA of touch sensor 200 may be positioned to correspond to the peripheral area NA of display panel 100. However, this is an example, and the touch sensing area TA may not match the display area DA. In another embodiment, for example, the touch sensing area TA may be narrower or wider than the display area DA.

[0100] Touch sensor 200 can detect contact with external objects (such as fingers or pens) appearing within the touch sensing area TA. Touch sensor 200 can detect not only when the external object is in direct contact, but also when the external object is hovering nearby or when the external object is approaching.

[0101] The touch sensor 200 can be located on the outer surface of the display panel 100 (on-unit type) or on the inner side (in-unit type). Alternatively, the touch sensor 200 can be formed on a separate panel and attached to the display panel 100 (attached type). In the following description, for ease of explanation, an embodiment where the touch sensor 200 is located on the outer surface of the display panel 100 will be described. However, the embodiment is not limited to this, and the position of the touch sensor 200 can be changed.

[0102] In the implementation method, such as Figures 2 to 4 As shown, the touch sensor 200 may include a touch sensing electrode 240 located in the touch sensing region TA and a touch connection wiring 250 connected to the touch sensing electrode 240. However, the implementation is not limited to this, and the touch sensing electrode 240 may be positioned to extend into the peripheral region NA. In such an implementation, the touch sensing electrode 240 may be used as an operation unit to control the display device 10.

[0103] The touch sensing electrode 240 may include a first touch sensing electrode 241 extending along a first direction X, and a second touch sensing electrode 242 extending along a second direction Y intersecting the first direction X.

[0104] The first touch sensing electrode 241 may include a plurality of first sensing units 241a arranged along the first direction X, and a plurality of first connecting portions 241b extending along the first direction X and connecting the plurality of first sensing units 241a.

[0105] The first touch sensing electrode 241 may be a transmitter touch electrode (Tx touch electrode), through which a first touch signal for detecting the coordinate value in the second direction Y is transmitted. The first sensing unit 241a may have a generally rhomboid (or oblique square) shape. However, this is just an example, and the shape of the first sensing unit 241a can be changed. In embodiments, for example, the first sensing unit 241a may be formed in a polygonal shape such as a hexagon, a circular shape, an elliptical shape, etc. The first sensing unit 241a may be formed in a mesh shape. That is, the first sensing unit 241a may be arranged such that multiple conductive wires intersect to form a mesh shape. In addition, the first sensing unit 241a may have various shapes, such as protrusions, to improve the sensitivity of the touch sensor 200.

[0106] The second touch sensing electrode 242 may include a plurality of second sensing units 242a arranged along the second direction Y, and a plurality of second connecting portions 242b extending along the second direction Y and connecting the plurality of second sensing units 242a. The second touch sensing electrode 242 may be a receiver touch electrode (Rx touch electrode), through which a second touch signal for detecting coordinate values ​​in the first direction X is transmitted. The second sensing units 242a may have a generally rhomboid (or oblique) shape. However, this is just an example, and the shape of the second sensing units 242a can be varied. In another embodiment, for example, the second sensing units 242a may be formed in a polygonal shape such as a hexagon, a circular shape, an elliptical shape, etc. The second sensing units 242a may be formed in a mesh shape. That is, the second sensing units 242a may be arranged such that a plurality of conductive wires intersect to form a mesh shape. Additionally, the second sensing units 242a may have various shapes, such as protrusions, to improve the sensitivity of the touch sensor 200.

[0107] The first touch sensing electrode 241 and the second touch sensing electrode 242 may be located in different layers. In the plan view, the first sensing unit 241a and the second sensing unit 242a are adjacent to each other, and the first connecting portion 241b and the second connecting portion 242b overlap each other but can be insulated from each other by an insulating layer. That is, the insulating layer may be located between the first touch sensing electrode 241 and the second touch sensing electrode 242. However, this is just an example, and the first touch sensing electrode 241 and the second touch sensing electrode 242 may be located at least partially in the same layer (or directly on the same layer). In an embodiment, for example, the first sensing unit 241a and the second sensing unit 242a may be located in the same layer (or directly on the same layer). In such an embodiment, one of the first connecting portion 241b and the second connecting portion 242b may be located in the same layer as the first sensing unit 241a and the second sensing unit 242a (or directly on the same layer as the first sensing unit 241a and the second sensing unit 242a), and the other of the first connecting portion 241b and the second connecting portion 242b may be located in a different layer on which the first sensing unit 241a and the second sensing unit 242a are positioned (or directly on a different layer on which the first sensing unit 241a and the second sensing unit 242a are positioned). In another embodiment, for example, the first connecting portion 241b may be located in a different layer than the first sensing unit 241a and the second sensing unit 242a (or directly on a different layer than the first sensing unit 241a and the second sensing unit 242a), and the second connecting portion 242b may be located in the same layer as the layer on which the first sensing unit 241a and the second sensing unit 242a are positioned (or directly on the same layer as the layer on which the first sensing unit 241a and the second sensing unit 242a are positioned). An insulating layer may be located between the first connecting portion 241b and the first sensing unit 241a, and the first connecting portion 241b and the first sensing unit 241a may be connected to each other through contact holes defined or formed in the insulating layer.

[0108] The touch sensing electrode 240 may include a low-resistance metal selected from silver (Ag), aluminum (Al), copper (Cu), chromium (Cr), and nickel (Ni), or may include a conductive nanomaterial selected from silver nanowires and carbon nanotubes. Alternatively, the touch sensing electrode 240 may include a transparent metal oxide, such as indium tin oxide (ITO) or indium zinc oxide (IZO). Furthermore, the touch sensing electrode 240 may include multiple layers comprising titanium (Ti) / aluminum (Al) / titanium (Ti) or be made of multiple layers comprising titanium (Ti) / aluminum (Al) / titanium (Ti). In such embodiments, the touch sensing electrode 240 can have low resistance, which reduces RC delay, and high ductility, making it less prone to breakage even when subjected to repeated deformation (such as bending).

[0109] The first touch sensing electrode 241 and the second touch sensing electrode 242, which are adjacent to each other, can form a mutual capacitance that serves as the touch sensor 200. The mutual capacitance can receive a drive signal through the first touch sensing electrode 241 or the second touch sensing electrode 242, and can output the change in charge caused by the touch of an external object as an output signal through the remaining touch electrodes.

[0110] Alternatively, the plurality of first touch sensing electrodes 241 may be separated from each other, and the plurality of second touch sensing electrodes 242 may also be separated from each other to form independent touch electrodes. In such an embodiment, each touch sensing electrode 240 may function as a touch sensor 200 and form a self-capacitance. The magnetic capacitor may receive a drive signal and be charged with a predetermined amount of charge, and when a touch is present on it, may output a change in charge and an output signal different from the input drive signal.

[0111] The touch connection wiring 250 may include a plurality of first touch connection wirings 251 connected to a plurality of first touch sensing electrodes 241 and a plurality of second touch connection wirings 252 connected to second touch sensing electrodes 242.

[0112] Some of the multiple second touch connection wires 252 can be connected to the upper end of the second touch sensing electrode 242, while the rest can be connected to the lower end of the second touch sensing electrode 242.

[0113] In one embodiment, a plurality of first touch connection wires 251 and a plurality of second touch connection wires 252 can extend from the touch sensing area TA of the touch sensor 200 through the peripheral area NA of the touch sensor 200, the first pad area PA1 of the display panel 100 and the second pad area PA2 of the display panel 100 to reach one edge of the peripheral area NA.

[0114] In the implementation method, such as Figure 4As shown, in a plan view or when viewed in a third-party direction Z, a plurality of first touch connection wires 251 and a plurality of second touch connection wires 252 overlap with and can be electrically connected to the driver circuit chip 20, which is attached to the first pad area PA1 of the display panel 100. In an embodiment, for example, the plurality of first touch connection wires 251 and a plurality of second touch connection wires 252 are connected to a plurality of touch signal wiring pads located in the first pad area PA1, and a plurality of bumps of the driver circuit chip 20 can be electrically connected to the plurality of touch signal wiring pads. However, this is only an example, and various modifications can be made to the connection relationship between the plurality of first touch connection wires 251 and a plurality of second touch connection wires 252 and the driver circuit chip 20.

[0115] In one embodiment, the first touch connection wiring 251 and the second touch connection wiring 252 may extend between a plurality of dummy panel pads 262 located in the second pad area PA2 of the display panel 100. That is, in a plan view, the dummy panel pads 262 may be located on two opposite sides of the first touch connection wiring 251 and the second touch connection wiring 252. In such an embodiment, each of the first touch connection wiring 251 and the second touch connection wiring 252 may be located between dummy panel pads 262 positioned adjacent to each other.

[0116] In one embodiment, the first touch connection wiring 251 may be located between a plurality of dummy panel pads 262 positioned adjacent to one side edge of the second pad area PA2, and the second touch connection wiring 252 may be located between a plurality of dummy panel pads 262 positioned adjacent to the other side edge of the second pad area PA2.

[0117] In one embodiment, a plurality of touch connection lines 250 may be located between dummy panel pads 262 positioned adjacent to each other in a plan view. In another embodiment, for example, at least two touch connection lines 250 may be located between dummy panel pads 262 positioned adjacent to each other. However, the number of touch connection lines 250 located between dummy panel pads 262 positioned adjacent to each other is not limited to this and may be varied. In another embodiment, for example, only one touch connection line 250 may be located between dummy panel pads 262 positioned adjacent to each other.

[0118] In one embodiment, the touch connection wiring 250 between adjacent dummy panel pads 262 in the second pad region PA2 of the display panel 100 can be connected to a test pad to test the characteristics of the touch sensor 200. This portion can be removed along with the test pad during the process of cutting a portion of the display panel 100. That is, the touch connection wiring 250 between adjacent dummy panel pads 262 can correspond to the remaining wiring portion, wherein, during the process of cutting a portion of the display panel 100, the portion of the touch connection wiring 250 connected to the test pad is removed. In this embodiment, the touch connection wiring 250 between the dummy panel pads 262 in the second pad region PA2 can be a wiring portion used for testing the characteristics of the touch sensor 200.

[0119] In this embodiment, as described above, the touch connection wiring 250 located between adjacent dummy panel pads 262 corresponds to the remaining wiring portion after the process of cutting a portion of the display panel 100. Therefore, the ends of the touch connection wiring 250 extending between adjacent dummy panel pads 262 can be substantially aligned with the same boundary as the corresponding ends of the peripheral region NA of the display panel 100. That is, in a plan view, the ends of the plurality of touch connection wiring 250 extending between adjacent dummy panel pads 262 can be aligned with the lower end of the peripheral region NA of the display panel 100. In such an embodiment, one end of the touch connection wiring 250 can be connected to the touch sensing electrode 240, and the other end of the touch connection wiring 250 can be floating.

[0120] In one embodiment, the touch connection wiring 250 may include a first wiring portion located in the peripheral region NA of the touch sensor 200, and a second wiring portion extending through the curved region BA of the display panel 100, the first pad region PA1, and the second pad region PA2 to the edge of the peripheral region NA of the display panel 100. The same touch signal can be applied to both the first and second wiring portions of the touch connection wiring 250.

[0121] The first and second wiring portions of the touch connection wiring 250 can be integrally formed into a single, independent entity. However, the implementation is not limited to this and can be modified. In another implementation, for example, the first and second wiring portions of the touch connection wiring 250 can be configured to be located separately in different layers (or directly on different layers) and electrically connected to each other.

[0122] In another embodiment, for example, the touch connection wiring 250 includes a first wiring portion connecting the touch sensing electrode 240 to the driving circuit chip 20, and a second wiring portion connecting to the driving circuit chip 20 and extending between adjacent dummy panel pads 262 in the second pad region PA2, wherein the first wiring portion and the second wiring portion may be configured separately and electrically connected to each other.

[0123] In the implementation method, such as Figure 7 As shown, the touch connection wiring 250 located between adjacent dummy panel pads 262 may be located in a different layer than the dummy panel pads 262 (or directly on a different layer than the dummy panel pads 262). The touch connection wiring 250 located between the dummy panel pads 262 may be located on the substrate 110, and the dummy panel pads 262 may be located on the insulating layer 120. The touch connection wiring 250 located between the dummy panel pads 262 may be completely covered by the insulating layer 120. However, the implementation is not limited to this and may be modified. In another implementation, for example, the dummy panel pads 262 and the touch connection wiring 250 located between the dummy panel pads 262 may be located in the same layer as each other (or directly on the same layer as each other).

[0124] When the printed circuit board 30 is attached to the second pad area PA2 of the display panel 100, the touch connection wiring 250 located between the dummy panel pads 262 can overlap with the printed circuit board 30 in the thickness direction or the third direction Z.

[0125] In one embodiment, the circuit pads 361 and dummy circuit pads 362 of the printed circuit board 30 may not overlap with the touch connection wiring 250. In such an embodiment, when the dummy circuit pads 362 of the printed circuit board 30 are positioned to overlap with the dummy panel pads 262 located in the second pad area PA2 of the display panel 100, the dummy circuit pads 362 may be located on two opposite sides of the touch connection wiring 250.

[0126] According to an embodiment of the display device 10, the dummy panel pads 262 and the dummy circuit pads 362 of the printed circuit board 30 can be located on either side of the touch connection wiring 250, which extends from the touch sensor 200 to the pad area of ​​the display panel 100 to which the printed circuit board 30 is attached, to ensure alignment margin of the pads of the printed circuit board 30 that are coupled to each of the pads of the display panel 100.

[0127] Therefore, it is possible to effectively prevent short circuits between the touch connection wiring 250 located between the pads on the printed circuit board 30 and the dummy panel pads 262.

[0128] In the following text, reference will be made to Figures 8 to 14 This describes display devices according to various embodiments. In the following description of embodiments, components that are the same as those in the previously described embodiments will be indicated by the same reference numerals, any repeated detailed descriptions will be omitted or simplified, and the differences will be mainly described.

[0129] Figures 8 to 14 This is a plan view showing portions of a display device according to some embodiments. Specifically, Figures 8 to 14 This is an enlarged view of regions P2 to P8, which correspond to... Figure 3 Region P1 in the middle.

[0130] According to the implementation method, such as Figure 8 As shown, the circuit pads 361 and dummy circuit pads 362 of the printed circuit board 30 can be misaligned with and bonded to the panel pads 261 and dummy panel pads 262, respectively.

[0131] In such an implementation, the circuit pads 361 and dummy circuit pads 362 of the printed circuit board 30 are arranged to not completely overlap with the panel pads 261 and dummy panel pads 262, and the circuit pads 361 and dummy circuit pads 362 of the printed circuit board 30 may be misaligned with the panel pads 261 and dummy panel pads 262 to partially overlap with the panel pads 261 and dummy panel pads 262.

[0132] In such an implementation, such as Figure 8 As shown, the circuit pads 361 of the printed circuit board 30 may overlap with a portion of the panel pads 261. A portion of the circuit pads 361 may overlap with the panel pads 261 in the thickness direction (or the third direction Z), and the remaining portion of the circuit pads 361 may not overlap with the panel pads 261 in the thickness direction.

[0133] The dummy circuit pads 362 of the printed circuit board 30 may overlap with a portion of the dummy panel pads 262. When the dummy circuit pads 362 of the printed circuit board 30 are shifted to partially overlap with the dummy panel pads 262, some portions of the dummy circuit pads 362 overlap with the dummy panel pads 262 in the thickness direction, and the remaining portions may overlap with any one of the plurality of touch connection lines 250 located between adjacent dummy panel pads 262 in the thickness direction.

[0134] According to this embodiment, it can have substantially the same effect as the display device 10 according to the embodiment. That is, even if the dummy circuit pads 362 of the printed circuit board 30 are not aligned to overlap with one of the plurality of touch connection lines 250 located between the plurality of dummy panel pads 262, since the dummy panel pads 262 and the dummy circuit pads 362 are electrically floating, defects can be effectively prevented even if a short circuit occurs between the dummy circuit pads 362 and the touch connection lines 250.

[0135] According to the implementation method, such as Figures 9 to 11 As shown, the gap or spacing between adjacent dummy panel pads 262 and / or adjacent dummy circuit pads 362 can be changed differently.

[0136] According to Figures 9 to 11 In one embodiment, the width of panel pad 261 in the first direction X can be substantially the same as the width of dummy panel pad 262 in the first direction X, and the width of circuit pad 361 in the first direction X can be substantially the same as the width of dummy circuit pad 362 in the first direction X.

[0137] refer to Figures 9 to 11 The adjacent panel pads 261 are spaced apart by a first distance D1 along the first direction X, and the adjacent dummy panel pads 262 can be spaced apart by a second distance D2 along the first direction X.

[0138] Here, the first distance D1 and the second distance D2 can each refer to the distance along the first direction X between two facing sides of adjacent panel pads 261 and the distance along the first direction X between two facing sides of adjacent dummy panel pads 262.

[0139] Adjacent circuit pads 361 may be spaced apart by a third distance D3 along the first direction X, and adjacent dummy circuit pads 362 may be spaced apart by a fourth distance D4 along the first direction X.

[0140] Here, the third distance D3 and the fourth distance D4 can each refer to the distance between the two facing sides of two adjacent circuit pads 361 in the first direction X and the distance between the two facing sides of two adjacent dummy circuit pads 362 in the first direction X, respectively.

[0141] According to the implementation method, such as Figure 9As shown, panel pads 261 and dummy panel pads 262 can be arranged such that the spacing between adjacent dummy panel pads 262 is wider than the spacing between adjacent panel pads 261, and circuit pads 361 and dummy circuit pads 362 can be arranged such that the spacing between adjacent circuit pads 361 and the spacing between adjacent dummy circuit pads 362 are substantially the same. That is, the first distance D1 can be less than the second distance D2, and the third distance D3 can be substantially equal to the fourth distance D4. In such an embodiment, the second distance D2 can be greater than the fourth distance D4.

[0142] In such an implementation, by arranging the panel pads 261 and the dummy panel pads 262 such that the spacing between adjacent panel pads 261 is different from the spacing between adjacent dummy panel pads 262, the dummy circuit pads 362 of the printed circuit board 30 can be positioned to overlap a portion of the dummy panel pads 262 in the thickness direction.

[0143] According to the implementation, as the distance between adjacent dummy panel pads 262 increases, the spacing between touch connection lines 250 located between adjacent dummy panel pads 262 can be changed, or the number of touch connection lines 250 between them can be changed.

[0144] Therefore, this implementation can have substantially the same effects or desired characteristics as the implementation described above. Furthermore, the number and arrangement of the dummy panel pads 262 located in the area attached to the printed circuit board 30 can be varied.

[0145] According to the implementation method, such as Figure 10 As shown, circuit pads 361 and dummy circuit pads 362 can be arranged such that the spacing between adjacent dummy circuit pads 362 is wider than the spacing between adjacent circuit pads 361, and panel pads 261 and dummy panel pads 262 can be arranged such that the spacing between adjacent panel pads 261 and the spacing between adjacent dummy panel pads 262 are substantially the same. That is, the first distance D1 can be substantially equal to the second distance D2, and the third distance D3 can be less than the fourth distance D4. Furthermore, the second distance D2 can be less than the fourth distance D4.

[0146] In such an implementation, by arranging the circuit pads 361 and the dummy circuit pads 362 such that the spacing between adjacent circuit pads 361 and the spacing between adjacent dummy circuit pads 362 are different, the dummy circuit pads 362 of the printed circuit board 30 can be positioned to overlap a portion of the dummy panel pads 262 in the thickness direction.

[0147] According to the implementation, as the gap between adjacent dummy circuit pads 362 is widened, the alignment margin between the dummy circuit pads 362 of the printed circuit board 30 and the dummy panel pads 262 is further ensured.

[0148] According to the implementation method, such as Figure 11 As shown, panel pads 261 and dummy panel pads 262 can be arranged such that the gap between adjacent dummy panel pads 262 is wider than the gap between adjacent panel pads 261, and circuit pads 361 and dummy circuit pads 362 can be arranged such that the gap between adjacent dummy circuit pads 362 is wider than the gap between adjacent circuit pads 361. That is, the first distance D1 can be smaller than the second distance D2, and the third distance D3 can be smaller than the fourth distance D4. In such an embodiment, the second distance D2 can be smaller than the fourth distance D4.

[0149] According to one embodiment, the dummy circuit pads 362 of the printed circuit board 30 can be arranged to completely overlap with the dummy panel pads 262 in the thickness direction. However, the embodiment is not limited to this, and the dummy circuit pads 362 can be arranged to partially overlap with the dummy panel pads 262 in the thickness direction.

[0150] In such an implementation, it is possible to have the same characteristics as the above reference. Figure 9 and Figure 10 The described implementation methods have essentially the same effects or desired characteristics.

[0151] According to the implementation method, such as Figures 12 to 14 As shown, the width of the dummy panel pad 262 and / or the width of the dummy circuit pad 362 can be changed.

[0152] In the implementation method, such as Figures 12 to 14 As shown, panel pad 261 may have a first width W1 in the first direction X, and dummy panel pad 262 may have a second width W2 in the first direction X.

[0153] The circuit pad 361 of the printed circuit board 30 that overlaps with the panel pad 261 has a third width W3 in the first direction X, and the dummy circuit pad 362 that overlaps with the dummy panel pad 262 may have a fourth width W4 in the first direction X.

[0154] The adjacent panel pads 261 are spaced apart by a first distance D1 in the first direction X, and the adjacent dummy panel pads 262 may be spaced apart by a second distance D2 in the first direction X.

[0155] In addition, adjacent circuit pads 361 can be spaced apart by a third distance D3 in the first direction X, and adjacent dummy circuit pads 362 can be spaced apart by a fourth distance D4 in the first direction X.

[0156] According to the implementation method, such as Figure 12 As shown, the width of panel pad 261 is substantially the same as the width of dummy panel pad 262, and the width of circuit pad 361 is greater than the width of dummy circuit pad 362. That is, the first width W1 can be substantially equal to the second width W2, and the third width W3 can be greater than the fourth width W4. Additionally, the first width W1 can be greater than the third width W3, and the second width W2 can be greater than the fourth width W4.

[0157] In this implementation, since the width of the circuit pad 361 is greater than the width of the dummy circuit pad 362, the space between adjacent circuit pads 361 can be smaller than the space between adjacent dummy circuit pads 362. That is, the third distance D3 can be smaller than the fourth distance D4.

[0158] In this embodiment, since the width of the panel pad 261 is substantially the same as the width of the dummy panel pad 262, the spacing between adjacent panel pads 261 can be substantially the same as the spacing between adjacent dummy panel pads 262. That is, the first distance D1 can be substantially equal to the second distance D2.

[0159] In such an implementation, the ratio between the fourth width W4 and the fourth distance D4 can be in the range of approximately 1:1 to approximately 1:1.5. In one implementation, for example, the ratio between the fourth width W4 and the fourth distance D4 can be approximately 1:3. In another implementation, for example, the ratio between the fourth width W4 and the fourth distance D4 can be approximately 1:5. However, the ratio between the fourth width W4 and the fourth distance D4 is not limited to this and can be varied.

[0160] In this implementation, the ratio of the fourth width W4 to the fourth distance D4 is within the aforementioned numerical range, thereby obtaining an alignment margin that can prevent short circuits or the like between the dummy circuit pads 362 of the printed circuit board 30 and the touch connection wiring 250 located between adjacent dummy panel pads 262 of the printed circuit board 30.

[0161] Such an implementation can have the same characteristics as the above references. Figure 10 The described implementation methods have essentially the same effects or desired characteristics.

[0162] According to the implementation method, such as Figure 13As shown, the width of panel pad 261 is greater than the width of dummy panel pad 262, and the width of circuit pad 361 is substantially the same as the width of dummy circuit pad 362.

[0163] In this embodiment, the width of the dummy panel pad 262 can be greater than the width of the dummy circuit pad 362. That is, the first width W1 can be greater than the second width W2, and the third width W3 can be substantially equal to the fourth width W4. In this embodiment, the first width W1 can be greater than the third width W3, and the second width W2 can be greater than the fourth width W4.

[0164] In this implementation, since the width of the panel pad 261 is greater than the width of the dummy panel pad 262, the gap between adjacent panel pads 261 can be smaller than the gap between adjacent dummy panel pads 262. That is, the first distance D1 can be smaller than the second distance D2.

[0165] In this implementation, since the width of the circuit pad 361 is substantially the same as the width of the dummy circuit pad 362, the spacing between adjacent circuit pads 361 can be substantially the same as the spacing between adjacent dummy circuit pads 362. That is, the third distance D3 can be substantially equal to the fourth distance D4.

[0166] In this embodiment, the dummy circuit pad 362 can be arranged to completely overlap with the dummy panel pad 262 in the thickness direction. In this embodiment, since the width of the dummy circuit pad 362 is smaller than the width of the dummy panel pad 262, the dummy circuit pad 362 can still be arranged to completely overlap with the dummy panel pad 262 in the thickness direction even if the circuit pad 361 is not aligned and bonded to the panel pad 261.

[0167] Such an implementation can have the same characteristics as the above references. Figure 9 The described implementation methods have essentially the same effects or desired characteristics.

[0168] According to the implementation method, such as Figure 14 As shown, the width of panel pad 261 can be greater than the width of dummy panel pad 262, and the width of circuit pad 361 can be greater than the width of dummy circuit pad 362.

[0169] In this embodiment, the width of the dummy panel pad 262 can be greater than the width of the dummy circuit pad 362. That is, the first width W1 can be greater than the second width W2, and the third width W3 can be greater than the fourth width W4.

[0170] In this implementation, since the width of the panel pad 261 is greater than the width of the dummy panel pad 262, the space between adjacent panel pads 261 can be smaller than the space between adjacent dummy panel pads 262. That is, the first distance D1 can be smaller than the second distance D2.

[0171] In this implementation, since the width of the circuit pad 361 is greater than the width of the dummy circuit pad 362, the gap between adjacent circuit pads 361 becomes smaller than the gap between adjacent dummy circuit pads 362. That is, the third distance D3 can be smaller than the fourth distance D4.

[0172] Such an implementation can have the same characteristics as the above references. Figure 11 The described implementation methods have essentially the same effects or desired characteristics.

[0173] This invention should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of this invention to those skilled in the art.

[0174] Although the present invention has been specifically shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the present invention as defined by the appended claims.

Claims

1. A display device, characterized by comprising: include: The display panel includes a display area and a peripheral area defined around the display area; A touch sensor, including touch sensing electrodes, the touch sensing electrodes being disposed on the display panel and overlapping the display area of ​​the display panel; Multiple panel pads are disposed on the peripheral area of ​​the display panel; Multiple dummy panel pads are disposed on the peripheral area of ​​the display panel and spaced apart from the multiple panel pads; A driving circuit chip is disposed between the display area and the plurality of panel pads and between the display area and the plurality of dummy panel pads; as well as The touch connection wiring connects to the touch sensing electrode and the driving circuit chip. In the plane, the touch connection wiring is disposed between the plurality of dummy panel pads.

2. The display device according to claim 1, characterized in that, The touch connection wiring is configured in multiple ways, and The multiple touch connection wirings are arranged between adjacent dummy panel pads in the multiple dummy panel pads.

3. The display device according to claim 1, characterized in that, The width of the plurality of panel pads is greater than the width of the plurality of dummy panel pads.

4. The display device according to claim 1, characterized in that, The distance between adjacent panel pads in the plurality of panel pads is less than the distance between adjacent dummy panel pads in the plurality of dummy panel pads.

5. The display device according to claim 1, characterized in that, The plurality of panel pads and the plurality of dummy panel pads are arranged in a row to be adjacent to the driving circuit chip.

6. The display device according to claim 1, characterized in that, One end of the touch connection wiring is connected to the touch sensing electrode, and In the plane, the opposite ends of the touch connection wiring are aligned with the same boundary as one end of the display panel, and the one end of the display panel is adjacent to the plurality of panel pads and the plurality of dummy panel pads.

7. The display device according to claim 1, characterized in that, In the plane, the touch connection wiring overlaps with the driving circuit chip.

8. The display device according to claim 1, characterized in that, The multiple dummy panel pads are floating.

9. A display device, characterized by include: The display panel includes a display area and a peripheral area defined around the display area; A touch sensor, including touch sensing electrodes, the touch sensing electrodes being on the display panel and overlapping the display area of ​​the display panel; Multiple panel pads are disposed on the peripheral area of ​​the display panel; Multiple dummy panel pads are spaced apart from the multiple panel pads; A driving circuit chip is disposed between the display area and the plurality of panel pads and between the display area and the plurality of dummy panel pads; Touch connection wiring connects to the touch sensing electrode and the driving circuit chip; The printed circuit board overlaps with the plurality of panel pads and the plurality of dummy panel pads; Multiple circuit pads are disposed on the printed circuit board to face the multiple panel pads; as well as Multiple dummy circuit pads are disposed on the printed circuit board facing the multiple dummy panel pads. In the plane, the touch connection wiring is disposed between the plurality of dummy panel pads.

10. The display device according to claim 9, characterized in that, The width of the plurality of dummy panel pads is greater than the width of the plurality of dummy circuit pads.

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