Aging test board of solid state disk

Abstract

The utility model relates to the field of electronic device test, a kind of solid state disk's ageing test board, it is characterized by: ageing test board is provided with the multiple SSD module of to be tested, and test main control chip, test main control chip monitors and drive voltage conversion module being arranged on ageing test board, and respectively to each SSD module or each group of SSD module to be tested respectively by multiple grouping test control chip is carried out test control, voltage conversion module one end is provided with external power connection interface, another end is connected with multiple overload protection module, each overload protection module is connected each SSD module or each group of SSD module, and grouping test control chip is connected each SSD module or each group of SSD module by overload protection module. The utility model has realized the ageing test of a large number of SSD module at the same time, has very high flexibility, compatibility and high efficiency.

Description

Technical Field

[0001] This utility model relates to the field of electronic devices, and in particular to an aging test board for solid-state drives. Background Technology

[0002] Traditional SSD aging tests require multiple manual steps, including RDT card opening and aging test turnaround, resulting in low production efficiency, high labor intensity, and a high risk of operational errors leading to losses. Furthermore, current SSD aging tests primarily use aging boards designed for IC testing, rather than dedicated SSD test boards. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide an aging test board for solid-state drives, which solves the technical problems of the need for manual operation and the lack of a dedicated SSD test board.

[0004] Technical solution

[0005] An aging test board for solid-state drives (SSDs) is characterized in that: the aging test board is provided with multiple SSD modules to be tested, and a test main control chip. The test main control chip monitors and drives a voltage conversion module set on the aging test board, and performs test control on each SSD module or group of SSD modules separately through multiple group test control chips. One end of the voltage conversion module is provided with an external power connection interface, and the other end is connected to multiple overload protection modules. Each overload protection module is connected to each SSD module or group of SSD modules. The group test control chip is connected to each SSD module or group of SSD modules through the overload protection modules.

[0006] The aging test board is equipped with a SATA connector, which can test solid-state drive modules using the SATA interface, and can be converted to mSATA modules, M.2SATA modules or M.2PCIe modules through a SATA interface adapter board.

[0007] Each of the group test control chips is connected to one or more overload protection modules to control one or more groups of SSD modules to be tested.

[0008] The voltage conversion module converts the high voltage of the external power supply into the test voltage. The voltage conversion module, together with the overload protection module of each group, can manage the output of the test voltage according to the requirements of the SSD module under test or the different requirements of each group.

[0009] The aging test board is set inside the aging test furnace and is connected to an external power supply and communication via gold fingers. The external power supply module and the test controller are connected to the voltage conversion module and the main test control chip on the aging test board via gold fingers. The external power supply module provides power for the test, and the test controller communicates with the main test control chip on the aging test board and sends test control signals to the main test control chip to control the test process on the aging test board.

[0010] Beneficial effects

[0011] This invention, by incorporating a voltage conversion module and a group control chip on an aging test board, enables aging tests on different solid-state drive (SSD) modules to meet varying requirements. Through group control, it not only allows for simultaneous aging tests on multiple SSD products, increasing test capacity and efficiency, but also enables aging tests on SSD products with different requirements, improving test compatibility and further enhancing efficiency. Furthermore, the invention includes a SATA connector on the aging test board, enabling testing of SSD modules using the SATA interface. A SATA adapter board can also be used to connect to mSATA, M.2 SATA, or M.2 PCIe modules, further improving the compatibility and flexibility of aging tests for SSD products. Through communication between a test controller located outside the aging test chamber and the main control chip and group control chip on the aging test board, accurate monitoring and communication control can be achieved for each SSD module or group of SSD modules under test. This allows for meeting the testing requirements of different scenarios for the products under test, achieving full automation, intelligent operation, and remote control, with high flexibility, compatibility, and efficiency. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the system structure of this utility model. Detailed Implementation

[0013] The present invention will be further described below with reference to specific embodiments and accompanying drawings.

[0014] The solid-state drive aging test board of this invention is equipped with multiple SSD modules to be tested and a test main control chip. The test main control chip monitors and drives the voltage conversion module set on the aging test board, and performs test control on each SSD module or group of SSD modules separately through multiple group test control chips. One end of the voltage conversion module is equipped with an external power connection interface, and the other end is connected to multiple overload protection modules. Each overload protection module is connected to each SSD module or group of SSD modules. The group test control chip is connected to each SSD module or group of SSD modules through the overload protection modules.

[0015] The aging test board combines gold fingers with an external power supply and communication system. A voltage conversion module converts the high voltage from the external power supply into the test voltage, as shown in the attached diagram. Figure 1 As shown, the voltage conversion module reduces the external high voltage of 12V to 5V on the aging test board. This method can increase the power wattage of the aging test board, thereby increasing the number of SSD modules that can be tested on a single aging test board. The voltage conversion module, in conjunction with the overload protection module for each group, can also manage the output test voltage according to the requirements of the SSD module under test or the different requirements of each group.

[0016] Each group test control chip can connect to one or a group of SSD modules under test by connecting to one overload protection module, or it can connect to multiple (e.g., two) overload protection modules to control multiple or more groups of SSD modules under test. Considering that some products require more testing, multiple chips can be controlled as a group. (See attached...) Figure 1 As shown, four DUT MCU group test control chips are used, and the power conversion module has 16 groups to realize the test control of multiple power conversion groups in the same group.

[0017] The aging test board uses a SATA connector, which can test general SSD SATA interface modules. Additionally, it can be connected to mSATA, M.2 SATA, or M.2 PCIe modules via a SATA interface adapter board. The aging test board has a power and communication interface with an external system via gold fingers. The external test controller's test system can use this communication interface to notify the main control MCU on the aging test board to power on the module under test for aging testing at an appropriate time (when the ambient temperature reaches a set value).

[0018] This utility model solution allows software to control the operation of the aging test furnace via a communication interface. When the temperature of the aging test furnace reaches the set value, it notifies the test master control MCU of the aging test board to turn on the power supply of the module under test for aging test. At this time, the aging test board switches from a high voltage (12V) to a low voltage (5V) and passes through the current overload protection circuit module to turn on the power supply to the module under test, enabling the module under test to start operating and receive test control from the group test control MCU chip. (See attached...) Figure 1 The single-chip aging test board with the structure shown can test 80 SSD modules at the same time.

[0019] The operation process of the SSD aging test board is as follows: the control software of the test controller notifies the main control chip of the aging test board, i.e., the attached... Figure 1As shown above, the Main MCU begins testing. The Main MCU activates the voltage conversion module, confirms its proper functioning, and waits for the control software to notify the Main MCU to begin SSD aging module testing. The Main MCU then notifies all group test control chips to proceed with the test. Figure 1 As shown above, the DUT MCU activates its overload protection mechanism and begins supplying power to the SSD module for aging test. The aging test continues until the control software notifies the Main MCU to end the test, at which point the Main MCU instructs all DUT MCUs to shut off power to the SSD module, thus ending the aging test.

[0020] This invention, by incorporating a voltage conversion module and a group control chip on an aging test board, enables aging tests on different solid-state drive (SSD) modules to meet varying requirements. Through group control, it not only allows for simultaneous aging tests on multiple SSD products, increasing test capacity and efficiency, but also enables aging tests on SSD products with different requirements, improving test compatibility and further enhancing efficiency. Furthermore, the invention includes a SATA connector on the aging test board, enabling testing of SSD modules using the SATA interface. A SATA adapter board can also be used to connect to mSATA, M.2 SATA, or M.2 PCIe modules, further improving the compatibility and flexibility of aging tests for SSD products. Through communication between a test controller located outside the aging test chamber and the main control chip and group control chip on the aging test board, accurate monitoring and communication control can be achieved for each SSD module or group of SSD modules under test. This allows for meeting the testing requirements of different scenarios for the products under test, achieving full automation, intelligent operation, and remote control, with high flexibility, compatibility, and efficiency.

[0021] Verification has shown that by adopting this technical solution, aging tests on a large number of SSD modules can be performed simultaneously. This not only improves the automation level of the test and greatly enhances the test efficiency, but also increases the accuracy and has high compatibility.

[0022] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An aging test board for a solid-state drive, characterized in that: The aging test board is equipped with multiple SSD modules to be tested, as well as a main test control chip. The main test control chip monitors and drives the voltage conversion module on the aging test board, and performs test control on each SSD module or group of SSD modules separately through multiple group test control chips. Through the communication connection between the test controller located outside the aging test furnace and the main control chip and group control chips on the aging test board, each SSD module or group of SSD modules to be tested can be accurately monitored and controlled. One end of the voltage conversion module is equipped with an external power connection interface, and the other end is connected to multiple overload protection modules. Each overload protection module is electrically connected to each SSD module or group of SSD modules. The group test control chip is connected to each SSD module or group of SSD modules through the overload protection modules.

2. The aging test board for a solid-state drive as described in claim 1, characterized in that: The aging test board is equipped with a SATA connector, which can test solid-state drive modules using the SATA interface, and can also be used to connect to mSATA modules or M.2 SATA modules via a SATA interface adapter board.

3. The aging test board for a solid-state drive as described in claim 1 or 2, characterized in that: Each of the group test control chips is connected to one or more overload protection modules to control one or more groups of SSD modules to be tested.

4. The aging test board for a solid-state drive as described in claim 3, characterized in that: The voltage conversion module converts the high voltage of the external power supply into the test voltage. The voltage conversion module, together with the overload protection module of each group, can manage the output of the test voltage according to the requirements of the SSD module under test or the different requirements of each group.

5. The aging test board for a solid-state drive as described in claim 3, characterized in that: The aging test board is set inside the aging test furnace and is connected to an external power supply and communication via gold fingers. The external power supply module and the test controller are connected to the voltage conversion module and the main test control chip on the aging test board via gold fingers. The external power supply module provides power for the test, and the test controller communicates with the main test control chip on the aging test board and sends test control signals to the main test control chip to control the test process on the aging test board.

Images