A novel multilayer ceramic capacitor with a protective structure

Abstract

The utility model relates to multilayer ceramic capacitor technical field, concretely to a new multilayer ceramic capacitor with protection structure, include: support, the both ends tin soldering of support have capacitor body, the downside of support is equipped with two groups of support structure, the support structure includes first connecting piece, two groups first connecting piece are connected in the both ends of support bottom surface through tin soldering, the surface of first connecting piece integrative buffering piece has, the bottom of buffering piece integrative second connecting piece forms. The buffering piece of utility model setting is inclined and presents the zigzag shape structure, can reduce buffering piece's rigidity in vertical and left and right direction, improve the deformation sensitivity of support structure, and the bottom of two groups buffering piece is located left and right sides of support respectively, can increase the floor area of device, and then guarantee that device can stably place on the substrate, be convenient for translation activity and will not tip over, improve the convenience of welding.

Description

Technical Field

[0001] This utility model relates to the field of multilayer ceramic capacitor technology, specifically a novel multilayer ceramic capacitor with a protective structure. Background Technology

[0002] Multilayer ceramic chip capacitors are made by stacking ceramic dielectric films with printed electrodes in a staggered manner, sintering them at high temperature in one go to form a ceramic chip, and then sealing the two ends of the chip with metal layers to form external electrodes.

[0003] In response, Chinese patent application number CN201921565157.3 discloses a multilayer chip ceramic capacitor with a reinforced structure, including a capacitor body and external electrodes located at both ends of the capacitor body. Each external electrode is connected to a conductive support sheet extending below the capacitor body. A conductive groove is provided at the end of the conductive support sheet near the external electrode, and the capacitor body is fitted into the conductive groove. At least one deformation groove is provided on the sidewall of the conductive support sheet away from the conductive groove, and the deformation grooves are arranged sequentially along the vertical direction. This achieves the effect of reducing capacitor detachment or damage caused by substrate deformation during soldering and practical use.

[0004] The ceramic capacitor uses a wavy conductive support plate to buffer stress when the substrate deforms. However, the conductive support plate is set vertically and there are multiple sets of deformation grooves. When buffering stress, the deformation resistance of the deformation grooves is relatively large, so it still affects the solder joints and the capacitor. At the same time, the bottom area of ​​the device is small, making it difficult to stand on the substrate during welding. It is easy to tip over, which affects the welding efficiency.

[0005] Therefore, in order to solve the above problems, a novel multilayer ceramic capacitor with a protective structure is proposed. Utility Model Content

[0006] The purpose of this invention is to provide a novel multilayer ceramic capacitor with a protective structure to solve the problems mentioned in the background art. In the prior art, ceramic capacitors can buffer stress when the substrate is deformed by setting a wavy conductive support sheet. However, the conductive support sheet is set vertically and there are multiple sets of deformation grooves. When buffering stress, the deformation resistance of the deformation groove is large, so it still affects the solder joint and the capacitor. At the same time, the bottom area of ​​the device is small, making it difficult to stand on the substrate during welding. It is easy to tip over, which affects the welding efficiency.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a novel multilayer ceramic capacitor with a protective structure, comprising: a support, wherein the capacitor body is soldered to both ends of the support;

[0008] Two sets of support structures are installed on the lower side of the bracket. Each support structure includes a first connecting piece. The two sets of first connecting pieces are connected to both ends of the bottom surface of the bracket by soldering. A buffer piece is integrally formed on the surface of the first connecting piece. A second connecting piece is integrally formed at the bottom end of the buffer piece. A heat dissipation groove is stamped on the surface of the buffer piece. A guide hole is stamped on the surface of the second connecting piece.

[0009] A protective mechanism is installed on the outside of the capacitor body. The protective mechanism includes a protective shell, which is snapped onto the outside of the top surface of the capacitor body. A groove is formed on the inner wall of the protective shell, and heat dissipation fins are fixedly connected to the inner wall of the groove.

[0010] Preferably, the buffer sheet has a zigzag structure and is inclined.

[0011] Preferably, the two sets of the second connecting pieces are located on the left and right sides of the bracket, respectively.

[0012] Preferably, the heat dissipation groove has a triangular structure.

[0013] Preferably, the guide hole extends through both the upper and lower surfaces of the second connecting piece.

[0014] Preferably, the bottom end of the protective shell is clipped onto the bottom surface of the capacitor body, and the heat dissipation fins are attached to the surface of the capacitor body.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: The buffer sheet of this utility model is set at an angle and has a "Z" shape structure, which can reduce the rigidity of the buffer sheet in the vertical and left and right directions, improve the deformation sensitivity of the support structure, and the bottom ends of the two sets of buffer sheets are located on the left and right sides of the bracket, which can increase the floor area of ​​the device, thereby ensuring that the device can be stably placed on the base plate, which is convenient for horizontal movement without tipping over, and improves the convenience of welding.

[0016] 1. This utility model, by incorporating a support structure and a protective mechanism, allows for the following manufacturing process: During production, two sets of first connecting plates are soldered to both ends of the bottom surface of the bracket, ensuring the two support structures are arranged in a figure-eight shape. The bottom ends of the two sets of buffer plates are located on both sides of the bracket. The protective shell is then secured to the outer side of the top surface of the capacitor body. The ends of the heat dissipation fins can adhere to the outer wall of the capacitor body, enabling heat dissipation when the capacitor body heats up. Airflow within the grooves carries away heat from the heat dissipation fins, thus protecting the capacitor body while ensuring effective heat dissipation. During installation, the two sets of second connecting plates are arranged... This design increases the device's footprint, ensuring it can be stably placed on the substrate, facilitating horizontal movement without tipping over, and improving soldering convenience. The second connecting piece is bonded to the substrate with solder paste. During reflow soldering, the solder paste melts and flows out from the guide hole, making the fixation between the second connecting piece and the substrate more stable. The buffer piece is inclined and has a zigzag structure, which reduces the rigidity of the buffer piece in the vertical and lateral directions, improves the deformation sensitivity of the support structure, and allows the buffer piece to deform quickly when the substrate deforms, thus preventing desoldering and keeping the capacitor body intact. Attached Figure Description

[0017] Figure 1 This is a front view schematic diagram of the structure of this utility model;

[0018] Figure 2 This is an exploded view of the structure of this utility model;

[0019] Figure 3 This is a side view of the support structure of this utility model;

[0020] Figure 4 This is a side sectional view of the support and protective mechanism of this utility model.

[0021] In the figure: 1. Bracket; 11. Capacitor body; 2. Support structure; 21. First connecting piece; 22. Buffer piece; 23. Second connecting piece; 24. Heat dissipation groove; 25. Air guide hole; 3. Protective mechanism; 31. Protective shell; 32. Groove; 33. Heat dissipation fins. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1-4This utility model provides an embodiment of a novel multilayer ceramic capacitor with a protective structure:

[0024] The bracket 1 and capacitor body 11 used in this application are products that can be purchased directly from the market. Their principles and connection methods are existing technologies well known to those skilled in the art, so they will not be described in detail here.

[0025] A novel multilayer ceramic capacitor with a protective structure includes: a support 1, with a capacitor body 11 soldered to both ends of the support 1;

[0026] Two sets of support structures 2 are installed on the lower side of the bracket 1. The support structure 2 includes a first connecting piece 21. The two sets of first connecting pieces 21 are connected to both ends of the bottom surface of the bracket 1 by soldering. A buffer piece 22 is integrally formed on the surface of the first connecting piece 21. A second connecting piece 23 is integrally formed at the bottom end of the buffer piece 22. A heat dissipation groove 24 is stamped on the surface of the buffer piece 22. A guide hole 25 is stamped on the surface of the second connecting piece 23. The buffer piece 22 is set at an angle and has a zigzag structure, which can reduce the rigidity of the buffer piece 22 in the vertical and left and right directions and improve the deformation sensitivity of the support structure 2. At the same time, the bottom ends of the two sets of buffer pieces 22 are located on the left and right sides of the bracket 1, which can increase the footprint of the device and thus ensure that the device can be stably placed on the substrate, making it easy to move without tipping over and improving the convenience of welding.

[0027] A protective mechanism 3 is installed on the outside of the capacitor body 11. The protective mechanism 3 includes a protective shell 31, which is snapped onto the outside of the top surface of the capacitor body 11. A groove 32 is provided on the inner wall of the protective shell 31, and heat dissipation fins 33 are fixedly connected to the inner wall of the groove 32.

[0028] Furthermore, the buffer sheet 22 has a zigzag structure and is inclined, which can reduce the rigidity of the buffer sheet 22 in the vertical and left and right directions, and improve the deformation sensitivity of the support structure 2. When the substrate is deformed, the buffer sheet 22 can deform quickly to avoid desoldering and keep the capacitor body 11 intact.

[0029] Furthermore, the two sets of second connecting pieces 23 are located on the left and right sides of the bracket 1, respectively. The arrangement of the two sets of second connecting pieces 23 can increase the floor area of ​​the device, thereby ensuring that the device can be stably placed on the substrate, making it easy to move horizontally without tipping over, and improving the convenience of welding.

[0030] Furthermore, the heat dissipation slot 24 has a triangular structure. The opening of the heat dissipation slot 24 can reduce the volume of the second connecting piece 23, reduce costs, ensure the deformation sensitivity of the buffer piece 22, and also bring about the effect of auxiliary heat dissipation.

[0031] Furthermore, the guide hole 25 penetrates the upper and lower surfaces of the second connecting piece 23. During reflow soldering, solder paste overflows from the guide hole 25 onto the surface of the second connecting piece 23. After curing, it will more firmly fix the second connecting piece 23 onto the substrate.

[0032] Furthermore, the bottom end of the protective shell 31 is clipped onto the bottom surface of the capacitor body 11, and the heat dissipation fins 33 are attached to the surface of the capacitor body 11. The protective shell 31 is easy to install on the capacitor body 11. The heat dissipation fins 33 can conduct heat out of the capacitor body 11. When air flows inside the groove 32, it can carry away the heat on the heat dissipation fins 33, thereby cooling the capacitor body 11.

[0033] Working principle: During production, two sets of first connecting pieces 21 can be installed at both ends of the bottom surface of the bracket 1 by soldering, and the two sets of support structures 2 are arranged in a figure-eight shape. The bottom ends of the two sets of buffer pieces 22 are located on both sides of the bracket 1. The protective shell 31 is snapped onto the outer side of the top surface of the capacitor body 11. The end of the heat dissipation fins 33 can be attached to the outer wall of the capacitor body 11, so that heat can be dissipated when the capacitor body 11 heats up. When the air flows inside the groove 32, it can carry away the heat on the heat dissipation fins 33. This can protect the capacitor body 11 while ensuring the heat dissipation effect.

[0034] During installation, the arrangement of two sets of second connecting pieces 23 can increase the footprint of the device, thereby ensuring that the device can be stably placed on the substrate, making it easy to move without tipping over, improving the convenience of soldering. The second connecting pieces 23 are glued to the substrate with solder paste. During reflow soldering, the solder paste melts and flows out from the guide hole 25, thereby making the fixation of the second connecting pieces 23 to the substrate more stable.

[0035] The buffer sheet 22 is inclined and has a zigzag structure, which can reduce the rigidity of the buffer sheet 22 in the vertical and lateral directions and improve the deformation sensitivity of the support structure 2. When the substrate is deformed, the buffer sheet 22 can deform quickly to avoid desoldering and keep the capacitor body 11 intact.

[0036] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Those skilled in the art can readily implement this utility model based on the accompanying drawings and the above description. However, any modifications, alterations, or equivalent variations made by those skilled in the art without departing from the scope of the utility model's technical solution, utilizing the disclosed technical content, are considered equivalent embodiments of this utility model. Furthermore, any equivalent changes, alterations, or variations made to the above embodiments based on the essential technology of this utility model are still within the protection scope of this utility model's technical solution.

Claims

1. A novel multilayer ceramic capacitor with a protective structure, comprising: A bracket (1) is provided, with capacitor bodies (11) soldered to both ends of the bracket (1); Its features are: Two sets of support structures (2) are installed on the lower side of the bracket (1). The support structure (2) includes a first connecting piece (21). The two sets of first connecting pieces (21) are connected to both ends of the bottom surface of the bracket (1) by soldering. A buffer piece (22) is integrally formed on the surface of the first connecting piece (21). A second connecting piece (23) is integrally formed at the bottom end of the buffer piece (22). A heat dissipation groove (24) is stamped on the surface of the buffer piece (22). A guide hole (25) is stamped on the surface of the second connecting piece (23). A protective mechanism (3) is installed on the outside of the capacitor body (11). The protective mechanism (3) includes a protective shell (31). The protective shell (31) is clamped on the outside of the top surface of the capacitor body (11). A groove (32) is provided on the inner wall of the protective shell (31). A heat dissipation fin (33) is fixedly connected to the inner wall of the groove (32).

2. A novel multilayer ceramic capacitor with a protective structure according to claim 1, characterized in that: The buffer sheet (22) has a zigzag structure and is set at an angle.

3. A novel multilayer ceramic capacitor with a protective structure according to claim 1, characterized in that: The two sets of the second connecting pieces (23) are located on the left and right sides of the bracket (1), respectively.

4. A novel multilayer ceramic capacitor with a protective structure according to claim 1, characterized in that: The heat dissipation groove (24) has a triangular structure.

5. A novel multilayer ceramic capacitor with a protective structure according to claim 1, characterized in that: The guide hole (25) penetrates the upper and lower surfaces of the second connecting piece (23).

6. A novel multilayer ceramic capacitor with a protective structure according to claim 1, characterized in that: The bottom end of the protective shell (31) is attached to the bottom surface of the capacitor body (11), and the heat dissipation fins (33) are attached to the surface of the capacitor body (11).

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