PCBA board adsorption device and processing equipment

Abstract

The application provides a PCBA plate adsorption device and processing equipment, and relates to PCBA plate processing; wherein, including gantry, X-axis moving module, Z-axis moving module and jig adsorption structure, the X-axis moving module is installed on the gantry, the Z-axis moving module is installed on the translation end of the X-axis moving module, the jig adsorption structure is installed on the moving end of the Z-axis moving module, and the jig adsorption structure comprises a jig and an adsorption pipeline, the jig is provided with an adsorption end for adsorbing the PCBA plate, the adsorption pipeline is communicated with the adsorption end, a flow regulating valve is arranged on the adsorption pipeline, and the flow regulating valve is used for adjusting the vacuum degree of the adsorption pipeline.The application realizes stable adsorption transfer of the PCBA plate and reduces dust entering by adjusting the vacuum degree.

Description

Technical Field

[0001] This application relates to the field of PCBA board processing, and more specifically, to a PCBA board adsorption device and processing equipment. Background Technology

[0002] With the rapid development of electronic manufacturing technology, Dual In-line Package (DIP) production lines play a crucial role in the assembly of electronic products. In the DIP production process, the switch motherboard, as a core component, directly impacts the quality of the final product due to its processing precision and efficiency. Traditional Printed Circuit Board Assembly (PCBA) processing equipment is typically designed for small boards, and its worktable size, load-bearing capacity, and positioning accuracy are insufficient to meet the processing requirements of large-size switch motherboards.

[0003] Existing processing techniques typically include board picking, positioning, board separation, and unloading. In the board picking stage, vacuum adsorption is generally used to fix the motherboard, and the negative pressure generated by the suction cups transfers the motherboard from the material position to the processing position. Subsequently, a vision system precisely positions the motherboard to ensure the accuracy of the cutting path of the board separation mechanism. After board separation, the picking mechanism moves the finished product to the unloading position, and the vacuum is released to complete the unloading. However, in actual operation, the control of the adsorption force is particularly critical: if the suction force is insufficient, the motherboard may fall off during the transfer process due to vibration or inertia; if the suction force is too large, it may cause deformation of the motherboard edges or dust in the adsorption area to be sucked into the fixture. Due to the large size and weight of the switch motherboard, the micron-sized dust generated during the board separation process is more likely to enter the fixture cavity through the gaps between boards or the cutting path, and long-term accumulation may affect positioning accuracy or even damage the equipment. Utility Model Content

[0004] The purpose of this application is to provide a PCBA board adsorption device and processing equipment that can meet the processing needs of PCBA boards of different specifications, provide appropriate suction, and reduce dust entering the fixture cavity while ensuring stable transfer of PCBA boards.

[0005] In a first aspect, this utility model provides a PCBA board adsorption device, which includes a gantry frame, an X-axis moving module, a Z-axis moving module, and a fixture adsorption structure. The X-axis moving module is mounted on the gantry frame, the Z-axis moving module is mounted on the translation end of the X-axis moving module, and the fixture adsorption structure is mounted on the moving end of the Z-axis moving module. The fixture adsorption structure includes a fixture and an adsorption pipeline. The fixture is provided with an adsorption end for adsorbing PCBA boards, and the adsorption pipeline is connected to the adsorption end. A flow regulating valve is provided on the adsorption pipeline for adjusting the vacuum degree of the adsorption pipeline.

[0006] In an optional embodiment, the fixture includes a mounting component and an adsorption component. The mounting component is fixedly connected to the moving end of the Z-axis moving module and has a groove. The adsorption component is detachably connected to the mounting component. The adsorption component and the groove together define a vacuum cavity. The adsorption component is the adsorption end.

[0007] In an optional embodiment, the mounting component includes a first mounting part and a second mounting part. There are two first mounting parts, which are respectively disposed on both sides of the X-axis moving module. The second mounting part is fixedly connected to the two first mounting parts, and the second mounting part is provided with the groove.

[0008] In an optional embodiment, the fixture adsorption structure further includes a control valve and a clamping member, wherein the control valve is in air communication with the clamping member, and the clamping member is used to clamp the adsorption member and the mounting member.

[0009] In an optional embodiment, the clamping member is configured as a rotary clamping cylinder, which is disposed on the mounting member and has a clamping or releasing state.

[0010] In an optional embodiment, the mounting component is further provided with a guide rail located on the side wall of the groove, and the adsorption component is provided with a guide block that cooperates with the guide rail.

[0011] In an optional embodiment, the Z-axis moving module is configured as a dual-guide rail ball screw structure, which includes a screw and a nut, the nut moving on the screw, and the nut being the moving end.

[0012] In an optional implementation, the X-axis movement module is configured as a dual-rail ball screw structure.

[0013] In an optional embodiment, the X-axis moving module is provided with a mounting plate, and the fixture is slidably connected to the mounting plate.

[0014] Secondly, this utility model provides a PCBA board processing equipment, including the PCBA board adsorption device described in the foregoing embodiments.

[0015] Compared to existing technologies, the beneficial effects of this application are:

[0016] This application uses a gantry as the basis for hoisting and utilizes an X-axis moving module, a Z-axis moving module, and a fixture adsorption assembly to achieve the adsorption and transfer of PCBA boards. The flow regulating valve set in this application can adjust the vacuum level according to the specifications of the PCBA board, so that the adsorption end provides appropriate suction force, thereby reducing dust entering the fixture cavity while ensuring the PCBA board is transferred smoothly. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A three-dimensional structural schematic diagram of the PCBA board adsorption device is shown in some embodiments;

[0019] Figure 2 A three-dimensional structural schematic diagram of some components of the PCBA board adsorption device is shown in some embodiments;

[0020] Figure 3 Another three-dimensional structural schematic diagram of some components of the PCBA board adsorption device in some embodiments is shown;

[0021] Figure 4 A schematic diagram of the upper surface of the adsorption element in some embodiments is shown;

[0022] Figure 5 A schematic diagram of the lower surface of the adsorption element in some embodiments is shown;

[0023] Figure 6 A side view of the adsorption element in some embodiments is shown;

[0024] Figure 7 It shows Figure 2 Enlarged view of section A.

[0025] Explanation of key component symbols:

[0026] 100-Gantry frame; 200-X-axis moving module; 210-Mounting plate; 300-Z-axis moving module; 400-Jig adsorption structure; 410-Jig; 411-Mounting component; 4111-First mounting part; 4112-Second mounting part; 4112a-Guide rail; 4112b-Groove; 412-Adsorption component; 412a-Guide block; 420-Adsorption pipeline; 421-Flow regulating valve; 430-Control valve; 440-Clamping component; 441-Cylinder; 442-Clamping handle; 500-Vacuum pressure sensor. Detailed Implementation

[0027] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0028] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0031] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0032] Example 1

[0033] This embodiment is applicable to the picking, positioning, separating, and loading of PCBA boards.

[0034] Please see Figure 1 This embodiment provides a PCBA board adsorption device, which includes a gantry frame 100, an X-axis moving module 200, a Z-axis moving module 300, and a fixture adsorption structure 400.

[0035] The gantry 100 serves as the base for hoisting PCBA boards, and is placed on the workbench.

[0036] The X-axis moving module 200 is installed on the gantry 100. The X-axis moving module 200 can drive the PCBA board to move left and right along the X-axis direction. In this embodiment, the movement stroke of the X-axis can be set between the first position and the second position. The first position is located on the left and the second position is located on the right. The PCBA board adsorption device picks up the board at the first position, puts the board in at the second position, and positions and separates the board between the first position and the second position.

[0037] The X-axis moving module 200 is configured with a dual-rail ball screw structure.

[0038] The Z-axis moving module 300 is installed at the translation end of the X-axis moving module 200. The Z-axis moving module 300 can drive the PCBA board to move up and down along the Z-axis. In this embodiment, the Z-axis movement stroke can be set between the third position and the fourth position, with the third position located at the bottom and the fourth position located at the top. The PCBA board adsorption device picks up or puts down the board at the third position and positions or separates the board at the fourth position.

[0039] The Z-axis moving module 300 is configured as a dual-guide rail ball screw structure, which includes a screw and a nut, with the nut moving on the screw.

[0040] The fixture adsorption structure 400 is installed on the moving end of the Z-axis moving module 300. The moving end is a nut, that is, the fixture adsorption structure 400 is installed on the nut. The nut moves up and down under the driving action of the lead screw, and the fixture adsorption structure 400 also moves up and down accordingly to achieve Z-axis displacement.

[0041] The fixture adsorption structure 400 includes a fixture 410 and an adsorption pipeline 420.

[0042] The fixture 410 is provided with an adsorption end for adsorbing PCBA boards.

[0043] Please see Figures 1 to 3 The fixture 410 includes a mounting member 411 and an adsorption member 412. The mounting member 411 is fixedly connected to the moving end of the Z-axis moving module 300, and the mounting member 411 is provided with a groove 4112b. The adsorption member 412 is detachably connected to the mounting member 411. The adsorption member 412 and the groove 4112b together define a vacuum cavity. The adsorption member 412 is the adsorption end mentioned above.

[0044] In some embodiments, the mounting component 411 includes a first mounting portion 4111 and a second mounting portion 4112. There are two first mounting portions 4111, which are respectively disposed on both sides of the X-axis moving module 200. The second mounting portion 4112 is fixedly connected to the two first mounting portions 4111 respectively, and the second mounting portion 4112 is provided with a groove 4112b.

[0045] To achieve a detachable connection between the adsorption component 412 and the mounting component 411, this embodiment can be configured such that the fixture adsorption structure 400 further includes a control valve 430 and a clamping component 440. The control valve 430 and the clamping component 440 are connected by an air circuit, and the clamping component 440 is used to clamp the adsorption component 412 and the mounting component 411.

[0046] Control valve 430 is configured as a manual valve.

[0047] The clamping member 440 is configured as a rotary clamping cylinder, which is mounted on the mounting member 411 and has a clamping or releasing state.

[0048] Specifically, the rotary clamping cylinder includes a cylinder 441 and a clamping handle 442. The cylinder 441 is connected to the manual valve air circuit, and the clamping handle 442 is drivenly connected to the piston rod of the cylinder 441. The replacement steps for the adsorption component 412 are explained below:

[0049] Rotate the manual valve, and the cylinder 441 is vented. The piston rod drives the clamping handle 442 to move away from the adsorption element 412, thereby releasing the adsorption element 412. Then, the piston rod drives the clamping handle 442 to rotate 90° to avoid it. At this time, the rotating clamping cylinder is in the released state.

[0050] When the manual valve is rotated in the opposite direction, the cylinder 441 is cut off from air supply. The piston rod drives the clamping handle 442 to rotate back to its original position and moves the clamping handle 442 toward the adsorption component 412 until the adsorption component 412 is clamped. At this time, the rotating clamping cylinder is in the clamping state.

[0051] In the released state, the operator can pull the adsorption component 412 out of the mounting component 411 for replacement. After replacement, the rotary clamping cylinder can be switched to the clamping state to continue processing. Therefore, the replacement of the adsorption component 412 in this embodiment is simple and quick, reducing the workload of the operator.

[0052] Please see Figures 4 to 6 The illustration shows an adsorption component 412 corresponding to a PCBA board of a certain specification. The lower surface of the adsorption component 412 is provided with an adsorption end. Since the adsorption component 412 and the mounting component 411 in this embodiment are detachably connected, the adsorption component 412 can be replaced. When the specifications of the PCBA board are different, the circuit design on the PCBA board is different. In order to avoid the circuit, different adsorption components 412 need to be customized, and the adsorption openings on each adsorption component 412 are arranged differently.

[0053] Please continue reading. Figure 2 , Figure 3 and Figure 7 In some embodiments, the mounting member 411 is further provided with a guide rail 4112a, which is located on the side wall of the groove 4112b. The adsorption member 412 is provided with a guide block 412a that cooperates with the guide rail 4112a. The guide rail 4112a is made of graphite copper plate and has good smoothness, which facilitates the removal and replacement of the adsorption member 412 and saves time.

[0054] Please see Figure 1 and Figure 2 In some embodiments, the X-axis moving module 200 is provided with a mounting plate 210, and the fixture 410 is slidably connected to the mounting plate 210. The sliding connection can improve the movement stability of the fixture 410, prevent the fixture 410 from tilting, and ensure the product processing accuracy.

[0055] The adsorption pipeline 420 is connected to the adsorption end. The adsorption pipeline 420 is equipped with a flow regulating valve 421. The flow regulating valve 421 is used to adjust the vacuum degree of the adsorption pipeline 420. The vacuum degree of the adsorption pipeline 420 is the same as the vacuum degree of the adsorption end. The adjustment method is as follows: increase the valve opening of the flow regulating valve 421 to increase the fluid flow and thus increase the vacuum degree of the adsorption end; or decrease the valve opening to reduce the fluid flow and thus decrease the vacuum degree of the adsorption end.

[0056] When picking up the board, a negative pressure is created by using a vacuum state, and the adsorption end adsorbs the PCBA board. When discharging, the valve is blocked, thereby closing the flow regulating valve 421, releasing the vacuum state, and the adsorption end releases the PCBA board.

[0057] The flow control valve 421 controls the fluid flow by changing the flow area between the valve and the pipeline by controlling the valve opening degree. The greater the valve opening degree, the larger the flow area of ​​the pipeline, the greater the fluid velocity, and the greater the flow rate; conversely, the flow rate will decrease.

[0058] In this embodiment, the flow regulating valve 421 can be set as an automatic regulating valve. The automatic regulating valve can be automatically controlled by electrical, pneumatic or hydraulic means. Different flow rates are set according to different specifications of PCBA boards, thereby controlling the vacuum degree of the adsorption pipeline 420 so that the adsorption end provides appropriate suction force. Under the premise of ensuring that the PCBA board is transferred smoothly, dust is reduced from entering the cavity of the fixture 410.

[0059] When the adsorption end leaks air or dust or other impurities enter, the actual vacuum level at the adsorption end will be inconsistent with the vacuum level originally preset by the flow regulating valve 421. This embodiment also includes a vacuum pressure sensor 500. The detection end of the vacuum pressure sensor 500 is set in the vacuum chamber inside the adsorption end. Based on the value of the vacuum pressure sensor 500, the flow regulating valve 421 is automatically and slightly adjusted to ensure that the adsorption end provides appropriate suction.

[0060] This application uses a gantry 100 as the base for hoisting and utilizes an X-axis moving module 200, a Z-axis moving module 300, and a fixture 410 adsorption assembly to achieve the adsorption and transfer of PCBA boards. The hoisting method adopted in this application not only has high precision and good stability, but also has a large load capacity and good shock resistance, and achieves displacement in both the X and Z directions.

[0061] Based on the above, this embodiment further explains the operating principle of the PCBA board adsorption device as follows:

[0062] S100. Activate the X-axis moving module 200 to move the adsorption end horizontally to the first position;

[0063] S200. Activate the Z-axis moving module 300, move the adsorption end to the third position, adsorb the PCBA board and pick it up;

[0064] S300. Start the Z-axis moving module 300 to move the adsorption end to the fourth position for positioning and separation.

[0065] According to processing needs, the X-axis moving module 200 can be activated to move the adsorption end horizontally between the first and second positions.

[0066] S400. Activate the X-axis moving module 200 to move the adsorption end horizontally to the second position;

[0067] S500. Start the Z-axis moving module 300, move the adsorption end to the fourth position, stop adsorbing PCBA boards and unload them.

[0068] Example 2

[0069] Based on the above embodiments, this embodiment provides a PCBA board processing equipment, which includes the PCBA board adsorption device described in the above embodiments.

[0070] PCBA board processing equipment includes a board splitter. Since this embodiment has the PCBA board adsorption device of the embodiment, this embodiment has all the advantages of the first embodiment, and this embodiment can guarantee the processing accuracy of the board splitter during cutting.

[0071] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0072] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A PCBA board adsorption device, characterized in that, The device includes a gantry frame, an X-axis moving module, a Z-axis moving module, and a fixture adsorption structure. The X-axis moving module is mounted on the gantry frame, the Z-axis moving module is mounted on the translation end of the X-axis moving module, and the fixture adsorption structure is mounted on the moving end of the Z-axis moving module. The fixture adsorption structure includes a fixture and an adsorption pipeline. The fixture has an adsorption end for adsorbing PCBA boards, and the adsorption pipeline is connected to the adsorption end. The adsorption pipeline is equipped with a flow regulating valve for adjusting the vacuum level of the adsorption pipeline.

2. The PCBA board adsorption device as described in claim 1, characterized in that, The fixture includes a mounting component and an adsorption component. The mounting component is fixedly connected to the moving end of the Z-axis moving module and has a groove. The adsorption component is detachably connected to the mounting component. The adsorption component and the groove together define a vacuum cavity. The adsorption component is the adsorption end.

3. The PCBA board adsorption device as described in claim 2, characterized in that, The mounting component includes a first mounting part and a second mounting part. There are two first mounting parts, which are respectively disposed on both sides of the X-axis moving module. The second mounting part is fixedly connected to the two first mounting parts, and the second mounting part is provided with the groove.

4. The PCBA board adsorption device as described in claim 2, characterized in that, The fixture adsorption structure further includes a control valve and a clamping member. The control valve is connected to the clamping member via an air circuit, and the clamping member is used to clamp the adsorption member and the mounting member.

5. The PCBA board adsorption device as described in claim 4, characterized in that, The clamping member is configured as a rotary clamping cylinder, which is disposed on the mounting member and has a clamping or releasing state.

6. The PCBA board adsorption device according to any one of claims 2 to 5, characterized in that, The mounting component is also provided with a guide rail, which is located on the side wall of the groove, and the adsorption component is provided with a guide block that cooperates with the guide rail.

7. The PCBA board adsorption device according to any one of claims 1 to 5, characterized in that, The Z-axis moving module is configured as a dual-guide rail ball screw structure, which includes a screw and a nut. The nut moves on the screw and is the moving end.

8. The PCBA board adsorption device according to any one of claims 1 to 5, characterized in that, The X-axis moving module is configured as a dual-guide rail ball screw structure.

9. The PCBA board adsorption device according to any one of claims 1 to 5, characterized in that, The X-axis moving module is provided with a mounting plate, and the fixture is slidably connected to the mounting plate.

10. A PCBA board processing equipment, characterized in that, Includes the PCBA board adsorption device according to any one of claims 1 to 9.

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