A universal carrier suitable for mounting of various special-shaped PCBs

Abstract

The utility model discloses a kind of general carriers suitable for a variety of special-shaped PCB mounting, belong to PCB mounting carrier technical field, including shell, the inside fixed connection of shell has carrier plate, by the carrier plate in shell forms storage space, phase-change medium is placed in the storage space;Through the solid-liquid phase change characteristic of phase-change medium, temperature control is carried out with heating coil, can make supporting component with PCB shape dynamic adjustment deployment position and height, after melting, phase-change medium allows supporting component free displacement, after cooling solidification forms stable support structure, can perfectly adapt to different curvature, concave-convex structure special-shaped PCB, solve the problem that magnetic attraction is not stable, easily affect production, the control mechanism set with heating and cooling two modes, phase-change medium can be quickly melted by heating coil, then cooling water circulation is driven by miniature pump body, can be quickly completed medium solidification, simple and convenient to use, and adjustment speed is fast.

Description

Technical Field

[0001] This utility model relates to the field of PCB mounting equipment technology, specifically a universal mounting equipment suitable for mounting various irregularly shaped PCBs. Background Technology

[0002] PCB placement jigs are specialized tools used to fix and protect printed circuit boards (PCBs) during the placement process. They are typically made of high-temperature resistant materials such as synthetic stone or aluminum alloy to ensure they do not deform under high temperatures. Their design must precisely match the size and layout of the PCB, including features such as positioning holes, support pillars, and clearances to accommodate different component heights and avoid interference. These jigs improve placement accuracy and production efficiency, reduce the risk of PCB deformation and misalignment, and support mass production. They are suitable for processes such as SMT (Surface Mount Technology) and wave soldering, and are key auxiliary equipment in electronic manufacturing to ensure quality and consistency.

[0003] Upon investigation, a Chinese utility model patent (publication number: CN215301071U) discloses a universal carrier applicable to the mounting of various irregularly shaped PCBs, including a magnetic carrier disk and a magnetic movable block. The magnetic carrier disk has a receiving cavity inside, and the bottom of the magnetic movable block is attracted to the bottom surface of the receiving cavity and can move along the bottom surface of the receiving cavity.

[0004] While the aforementioned patent provides flexible point support for the PCB by attaching a magnetic movable block to the bottom surface of the receiving cavity and allowing its position to be adjusted freely along the bottom surface, and by flexibly configuring the magnetic carrier tray and magnetic movable block, the support they provide can meet the mounting needs of PCBs of different sizes and shapes. Because the magnetic movable block is movable and adjustable, there is no issue of PCB wobbling due to tolerances in dedicated carriers. The carrier's dimensions are fixed, avoiding the need to adjust the equipment guide rail width during line changes and improving line change efficiency, making it particularly suitable for mounting multi-variety, small-batch PCBs. However, its magnetic fixation method can lead to unstable installation of the magnetic movable block, making it prone to displacement during production and thus affecting production. Therefore, technical improvements are needed.

[0005] Therefore, this utility model provides a universal carrier suitable for mounting various irregularly shaped PCBs to solve the above problems. Utility Model Content

[0006] (a) Technical problems to be solved

[0007] This invention provides a universal carrier suitable for mounting various irregularly shaped PCBs, aiming to solve the problems mentioned in the background art.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, this utility model provides the following technical solution: a universal carrier suitable for mounting various irregularly shaped PCBs, including a housing, a carrier plate fixedly connected inside the housing, a storage space formed inside the housing by the carrier plate, a phase change medium placed inside the storage space, a support component for supporting the PCB board placed inside the phase change medium, and a control mechanism for controlling the usage state of the phase change medium provided below the carrier plate.

[0010] As a preferred technical solution of this application, a partition is fixedly connected inside the housing, the partition is disposed below the carrier plate, and an installation chamber is formed between the partition and the carrier plate.

[0011] As a preferred technical solution of this application, the control mechanism includes a plurality of heating coils fixedly connected inside the mounting chamber.

[0012] As a preferred technical solution of this application, a heat-conducting plate is fixedly connected inside the installation chamber, the upper end surface of the heat-conducting plate is in close contact with the bottom surface of the carrier plate, and a plurality of fins are fixedly connected to the lower end surface of the heat-conducting plate.

[0013] As a preferred technical solution of this application, a water storage chamber is formed between the shell and the partition. A cooling coil is embedded inside the heat-conducting plate. Both ends of the cooling coil penetrate the partition and extend into the interior of the water storage chamber. A micro pump is installed inside the water storage chamber. The output end of the micro pump is connected to one end of the cooling coil.

[0014] As a preferred technical solution of this application, the shell is provided with a water inlet communicating with the water storage chamber, and the water inlet is internally threaded with a cap.

[0015] As a preferred technical solution of this application, a heat insulation pad is fixedly connected inside the installation chamber, and the heat insulation pad is disposed below the heating coil.

[0016] As a preferred technical solution of this application, a control switch is fixedly installed on the side of the housing, and a mounting bracket is fixedly connected to the lower end face of the housing.

[0017] As a preferred technical solution of this application, the support component is provided in multiple ways, each of which is fixedly connected with a pin and has a through hole.

[0018] (III) Beneficial Effects

[0019] By utilizing the solid-liquid phase change characteristics of the phase change medium and coordinating with a heating coil for temperature control, the support components can be dynamically adjusted in position and height according to the shape of the PCB. The molten phase change medium allows the support components to move freely, and after cooling and solidification, it forms a stable support structure that can perfectly adapt to irregularly shaped PCBs with different curvatures and uneven structures. This solves the problem of unstable magnetic fixation that can easily affect production. The control mechanism has two modes: heating and cooling. The phase change medium can be melted quickly by the heating coil, and then the cooling water is circulated by a micro pump to quickly solidify the medium. It is simple and convenient to use, and the adjustment speed is fast. Attached Figure Description

[0020] Figure 1 A perspective view of a universal carrier suitable for mounting various irregularly shaped PCBs;

[0021] Figure 2 This is a cross-sectional view of the housing in a universal carrier suitable for mounting various irregularly shaped PCBs;

[0022] Figure 3 A perspective view of a support component in a universal carrier suitable for mounting various irregularly shaped PCBs;

[0023] Figure 4 A perspective view of a cooling coil in a universal carrier suitable for mounting various irregularly shaped PCBs;

[0024] Figure 5 An enlarged view of the cover in a universal carrier suitable for mounting various irregularly shaped PCBs;

[0025] Figure 6 This is a three-dimensional view of a heat-conducting plate in a universal carrier suitable for mounting various irregularly shaped PCBs.

[0026] In the picture:

[0027] 1. Shell; 2. Carrier plate; 3. Storage space; 4. Phase change medium; 5. Support component; 6. Ejector pin; 7. Perforation; 8. Mounting chamber; 9. Heating coil; 10. Heat-conducting plate; 11. Fin; 12. Heat insulation pad; 13. Partition; 14. Water storage chamber; 15. Cooling coil; 16. Miniature pump body; 17. Water inlet; 18. Cover; 19. Control switch; 20. Mounting bracket. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] This utility model provides a universal carrier suitable for mounting various irregularly shaped PCBs, such as... Figures 1 to 6 As shown, the device includes a housing 1, a control switch 19 fixedly mounted on the side of the housing 1, and a mounting bracket 20 fixedly connected to the lower end face of the housing 1. A carrier plate 2 is fixedly connected inside the housing 1, forming a storage space 3 within the housing 1 through the carrier plate 2. A phase change medium 4 is placed in the storage space 3, and a support component 5 for supporting the PCB board is placed inside the phase change medium 4. Multiple support components 5 are provided, and each support component 5 is fixedly connected to a pin 6 and has a through hole 7.

[0030] The control switch 19 installed on the housing 1 integrates heating / cooling dual-mode control functions, allowing operators to monitor the equipment's operating status in real time. The carrier plate 2 is welded and fixed to the upper part of the inner cavity of the housing 1, and the resulting storage space 3 prevents leakage of the phase change medium 4. The phase change medium 4 is a paraffin-based composite phase change material with a melting point of 55-65℃. After melting, it ensures smooth movement of the support component 5 within it; after cooling and solidification, it provides fixation for the support component 5. The ejector pins 6 on the support component 5 ensure positioning accuracy, and the perforations 7 facilitate movement of the support component 5.

[0031] A control mechanism for controlling the usage state of the phase change medium 4 is provided below the carrier plate 2. A partition 13 is fixedly connected inside the housing 1, and the partition 13 is located below the carrier plate 2, forming an installation chamber 8 between the partition 13 and the carrier plate 2. The control mechanism includes multiple heating coils 9 fixedly connected inside the installation chamber 8. A heat-conducting plate 10 is fixedly connected inside the installation chamber 8, with its upper end face in close contact with the bottom surface of the carrier plate 2, and multiple fins 11 fixedly connected to its lower end face.

[0032] The heating coil 9 is made of nickel-chromium alloy wire and can be temperature-controlled within ±1℃. The heat-conducting plate 10 is in close contact with the partition 13, providing good heat conduction. The fins 11 further increase the heat dissipation area and improve the heat dissipation speed.

[0033] A water storage chamber 14 is formed between the shell 1 and the partition 13. A cooling coil 15 is embedded inside the heat-conducting plate 10. Both ends of the cooling coil 15 penetrate the partition 13 and extend into the water storage chamber 14. A miniature pump 16 is installed inside the water storage chamber 14. The output end of the miniature pump 16 is connected to one end of the cooling coil 15. A water inlet 17 communicating with the water storage chamber 14 is provided on the shell 1. A cap 18 is threadedly connected to the inside of the water inlet 17.

[0034] The water storage chamber 14 can store cooling medium, which can be transported to the cooling coil 15 by the micro pump body 16, further dissipating heat from the heat conduction plate 10.

[0035] A heat insulation pad 12 is fixedly connected inside the mounting chamber 8. The heat insulation pad 12 is located below the heating coil 9 and can isolate the heat of the heating coil 9.

[0036] Working principle: In the initial state, the phase change medium 4 is in a solid state, the support component 5 can be fixed inside the medium, and the ejector pin 6 maintains its initial position. At this time, the carrier can be used as a regular PCB carrier, suitable for mounting standard planar PCBs. When it is necessary to adapt to irregularly shaped PCBs, the heating coil 9 can be activated to heat the phase change medium 4. After being heated, the phase change medium 4 changes from a solid state to a liquid state. The support component 5 can move freely in the liquid medium. Then, the position of the support component 5 can be directly adjusted so that the ejector pin 6 can accurately fit the curved surface or special structure of the PCB. After positioning is completed, the heating coil 9 is turned off and the micro pump is activated. 16. The coolant in the water storage chamber 14 can be driven to flow through the cooling coil 15 to cool the phase change medium 4. The heat dissipation area can be further increased by the heat conduction plate 10 and fins 11, so that the phase change medium 4 can be quickly solidified. After the medium is solidified, the support component 5 can be firmly fixed, thus forming a support structure that is completely matched with the PCB. After the mounting is completed, the medium can be melted by reheating, so that the support component 5 can be restored to a free state, which is convenient for replacing a new PCB or adjusting the support structure. The phase change medium 4 can be a paraffin-based composite material, which has high cycle stability and can be reused many times without failure.

[0037] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A universal carrier suitable for mounting various irregularly shaped PCBs, comprising a housing (1), characterized in that: A carrier plate (2) is fixedly connected inside the housing (1). A storage space (3) is formed inside the housing (1) through the carrier plate (2). A phase change medium (4) is placed inside the storage space (3). A support component (5) for supporting the PCB board is placed inside the phase change medium (4). A control mechanism for controlling the usage state of the phase change medium (4) is provided below the carrier plate (2).

2. The universal carrier applicable to mounting various irregularly shaped PCBs according to claim 1, characterized in that: A partition (13) is fixedly connected inside the housing (1). The partition (13) is located below the carrier plate (2). An installation chamber (8) is formed between the partition (13) and the carrier plate (2).

3. A universal carrier suitable for mounting various irregularly shaped PCBs according to claim 2, characterized in that: The control mechanism includes multiple heating coils (9) fixedly connected inside the mounting chamber (8).

4. A universal carrier suitable for mounting various irregularly shaped PCBs according to claim 3, characterized in that: A heat-conducting plate (10) is fixedly connected inside the installation chamber (8). The upper end face of the heat-conducting plate (10) is in close contact with the bottom surface of the carrier plate (2). A plurality of fins (11) are fixedly connected to the lower end face of the heat-conducting plate (10).

5. A universal carrier suitable for mounting various irregularly shaped PCBs according to claim 4, characterized in that: A water storage chamber (14) is formed between the shell (1) and the partition (13). A cooling coil (15) is embedded inside the heat-conducting plate (10). Both ends of the cooling coil (15) penetrate the partition (13) and extend into the interior of the water storage chamber (14). A micro pump (16) is installed inside the water storage chamber (14). The output end of the micro pump (16) is connected to one end of the cooling coil (15).

6. A universal carrier suitable for mounting various irregularly shaped PCBs according to claim 5, characterized in that: The housing (1) has a water inlet (17) that communicates with the water storage chamber (14), and the inside of the water inlet (17) is threaded with a cap (18).

7. A universal carrier suitable for mounting various irregularly shaped PCBs according to claim 3, characterized in that: A heat insulation pad (12) is fixedly connected inside the installation chamber (8), and the heat insulation pad (12) is located below the heating coil (9).

8. A universal carrier suitable for mounting various irregularly shaped PCBs according to claim 1, characterized in that: A control switch (19) is fixedly installed on the side of the housing (1), and a mounting bracket (20) is fixedly connected to the lower end face of the housing (1).

9. A universal carrier suitable for mounting various irregularly shaped PCBs according to claim 1, characterized in that: The support component (5) is provided in multiple ways, and each support component (5) is fixedly connected with a pin (6), and each support component (5) is provided with a through hole (7).

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