Auxiliary equipment based on semiconductor chip packaging

By using a linear slide drive and limit unit design with sliding rods and guide rails, the problem of unstable carrier board transportation in traditional equipment is solved, realizing the synchronous and stable transportation of multiple chip carrier boards, improving packaging efficiency and reducing the risk of chip displacement.

CN224419232UActive Publication Date: 2026-06-26FURE AUTOMATION EQUIP (WUXI) CO LTD
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Patent Information

Application Number
CN202521810641.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-25
Publication Date
2026-06-26
Estimated Expiration
2035-08-25

AI Technical Summary

Technical Problem

Traditional semiconductor chip packaging equipment involves conveying single carrier boards one by one during the transportation process, resulting in long production line cycle times. This makes it difficult to match the requirements of high-speed packaging processes. Furthermore, the carrier boards are susceptible to vibration and may shift. When multiple chips are transported in parallel, the synchronization is poor, increasing the risk of chip position errors.

Method used

By employing the sliding cooperation between the sliding rod and the guide rail, combined with the linear slide drive, the pusher plate synchronously pushes multiple chip carrier boards. Through the gear-rack transmission of the limit unit and the linkage design with the electric push rod, the lateral separation force is offset in real time, ensuring stable transport of the carrier boards.

Benefits of technology

It enables the synchronous and stable transport of multiple chip carrier boards, improves packaging efficiency, reduces the risk of chip displacement, adapts to high-speed transport scenarios, and avoids carrier board damage.

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Abstract

The utility model relates to the technical field of packaging equipment, and provides auxiliary equipment for packaging based on a semiconductor chip, which comprises a frame and a sliding rail arranged on a cross beam on the frame, and is characterized by further comprising a conveying unit, and the conveying unit comprises a linear sliding table fixed on a longitudinal beam of the frame; the guide rail is fixed on the upper cross beam; the sliding rod is connected with the moving platform of the linear sliding table through a connecting plate and is in sliding fit with the sliding block of the guide rail through a fixing plate; the linear sliding table drives the sliding rod to reciprocate along the guide rail. Through the sliding fit of the sliding rod and the guide rail and the active driving of the linear sliding table to the sliding rod, the synchronous and stable conveying of the plurality of chip carrier plates is realized by combining the station interval formed by the push plates arranged at intervals, and the packaging efficiency is obviously improved.
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