Wafer adapting support mechanism

By designing a wafer adapter support mechanism and using a synchronous belt and synchronous wheel system to automatically adjust the swing arm distance, the problem of adapting wafers of different sizes was solved, the detection efficiency and accuracy were improved, and the shortcomings of existing technologies were overcome.

CN224419249UActive Publication Date: 2026-06-26SHANGHAI QIANSHI INTELLIGENT TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANGHAI QIANSHI INTELLIGENT TECH CO LTD
Filing Date
2025-08-27
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing technologies struggle to quickly adapt to wafers of different sizes in semiconductor wafer inspection without changing tooling or requiring manual intervention, resulting in low inspection efficiency and difficulty in guaranteeing accuracy.

Method used

A wafer adapter support mechanism was designed. The drive unit drives the synchronous belt to rotate the synchronous wheel. The sliding component slides in the slide groove and drives the swing arm to rotate. The distance between the swing arms can be adjusted to accommodate wafers of different sizes. Combined with components such as bearings, sensors and tension wheels, accurate positioning is ensured.

Benefits of technology

It enables rapid adaptation to wafers of different sizes without changing tooling or manual intervention, improving testing efficiency and accuracy while reducing operational complexity and errors.

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Abstract

The application provides a wafer adapting support mechanism, comprising a driving part, a synchronous belt, a synchronous wheel, a base and at least three adjusting parts. The driving part is used to drive the synchronous belt to move, and the synchronous belt drives the synchronous wheel to rotate. The adjusting part comprises a fixed column, a swing arm and a sliding piece, and the swing arm is provided with a sliding groove. The fixed column is fixed to the base, one end of the swing arm is connected with the fixed column to make the swing arm rotate around the fixed column, the other end of the swing arm is used to support the wafer, one end of the sliding piece is fixed to the synchronous wheel, and the other end of the sliding piece passes through the sliding groove. When the synchronous wheel rotates, the sliding piece slides in the sliding groove along with the synchronous wheel, and the movement of the sliding piece drives the movement of the swing arm to adapt to wafers of different sizes. In this way, the synchronous belt can drive the synchronous wheel to rotate, and when the synchronous wheel rotates, the sliding piece will slide in the sliding groove along with the synchronous wheel, and then the sliding piece can drive the swing arm to rotate around the fixed column, and the distance between the at least three swing arms is adjusted by rotation to adapt to wafers of different sizes.
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