A high-performance loop heat pipe heat dissipation device for chip heat dissipation

Abstract

The utility model relates to the field of chip heat dissipation, especially a high performance loop heat pipe heat dissipation device for chip heat dissipation, the evaporator is composed of evaporation end cover, evaporation bottom surface and sintered porous capillary core, the sintered porous capillary core divides the inner chamber of evaporator into the liquid storage cavity of upper part and the evaporation area of lower part, the inner surface of evaporation bottom surface is equipped with micron level micro channel structure, and the sintered porous capillary core is welded on evaporation bottom surface. In the utility model, through the synergistic effect of micro channel structure in the evaporator and sintered porous capillary core, cooperate the double-sided fine capillary condensing structure on the condenser, strengthen the phase change heat transfer process, to realize the heat dissipation performance of extremely low thermal resistance, super high heat flow density and big total heat transfer quantity, the heat dissipation capacity is greatly promoted compared with the existing liquid cooling technology, can satisfy the severe heat dissipation demand of high performance chip, and the system operation is stable and reliable, improves the heat dissipation effect of high heat density chip.

Description

Technical Field

[0001] This utility model relates to the field of chip heat dissipation technology, and in particular to a high-performance loop heat pipe heat dissipation device for chip heat dissipation. Background Technology

[0002] With chip manufacturing processes approaching their physical limits and data center computing power demands surging, liquid cooling technology has become a key solution to overcome heat dissipation bottlenecks. Loop heat pipes, as a highly efficient passive two-phase cooling technology, have shown significant potential in server cooling. Their fully sealed structure eliminates leakage risks, ensuring high reliability and compatibility. Their flexible design adapts to various installation orientations. Furthermore, the entire loop heat pipe system has no moving parts, a lifespan exceeding 10 years, and low maintenance costs, making it highly economical. It is particularly suitable for scenarios with both high power density and high power consumption.

[0003] Loop heat pipe technology, as a highly efficient passive two-phase heat transfer method, was initially mainly used in the aerospace field, focusing on long-distance heat transfer. Its requirements for heat flux density are relatively low, and the system thermal resistance is relatively high. However, in civilian high-performance chip cooling applications, a comprehensive requirement of high heat flux density, high heat transfer, and low thermal resistance must be achieved within a limited volume. Existing loop heat pipe structures and performance are insufficient to meet practical needs. Therefore, there is an urgent need for a low-thermal-resistance loop heat pipe suitable for cooling high-power, high-heat-flux-density chips. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a high-performance loop heat pipe cooling device for chip heat dissipation.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-performance loop heat pipe heat dissipation device for chip heat dissipation includes an evaporator, which is composed of an evaporation end cap, an evaporation bottom surface and a sintered porous capillary core. The sintered porous capillary core divides the inner cavity of the evaporator into an upper liquid storage chamber and a lower evaporation area. The inner surface of the evaporation bottom surface is provided with a micron-level microchannel structure, and the sintered porous capillary core is welded to the evaporation bottom surface.

[0007] The condenser consists of a condensing end cap and a condensing bottom surface, and both the inner surface of the condensing end cap and the inner surface of the condensing bottom surface are provided with micron-level capillary structures and microchannel structures.

[0008] The loop heat pipe includes a liquid pipe and a vapor pipe, which are respectively connected between the evaporator end cap and the condenser end cap, and the liquid pipe is installed at a higher height than the vapor pipe.

[0009] The internal working fluid is pure water.

[0010] Furthermore, a preferred structure is that the pore diameter of the sintered porous capillary core is 0.1 μm-10 μm.

[0011] Furthermore, in a preferred configuration, the micron-scale capillary structure and microchannel structure on the condenser end cap and condenser bottom surface are one or more combinations of microchannels, micropillars, copper powder sintered capillary structures, or foam metal structures.

[0012] Furthermore, in a preferred configuration, the interface of the liquid pipeline on the evaporator side is located on the side wall of the liquid storage chamber, and the interface on the condenser side is located at the apex corner of the condenser.

[0013] Furthermore, a preferred configuration is that the number of liquid pipelines and steam pipelines is one or more.

[0014] Furthermore, a preferred configuration is that the cross-sectional area of ​​the steam pipe is larger than that of the liquid pipe.

[0015] In addition, the preferred structure is that the condenser is made of oxygen-free copper with a thickness of 1 mm.

[0016] Furthermore, a preferred configuration is one in which the total thermal resistance of the loop heat pipe is not higher than 0.005 K / W.

[0017] Furthermore, a preferred configuration is that the maximum heat flux density of the evaporator is not less than 200 W / cm². 2 The maximum total heat transfer is not less than 1500W.

[0018] The beneficial effects of this invention are as follows: through the synergistic effect of the microchannel structure in the evaporator and the sintered porous capillary core, combined with the double-sided micro-capillary condensation structure on the condenser, the phase change heat transfer process is enhanced to achieve heat dissipation performance with extremely low thermal resistance, ultra-high heat flux density and large total heat transfer. Its heat dissipation capacity is greatly improved compared with the existing liquid cooling technology, which can meet the demanding heat dissipation requirements of high-performance chips. Moreover, the system operates stably and reliably, improving the heat dissipation effect of high heat density chips. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the evaporator proposed in this utility model;

[0020] Figure 2 This is a schematic diagram of the condenser proposed in this utility model;

[0021] Figure 3 This is a schematic diagram illustrating the working principle of the loop heat pipe proposed in this utility model.

[0022] Figure 4 This is a schematic diagram of the single-steam loop heat pipe heat dissipation device proposed in this utility model;

[0023] Figure 5 This is a schematic diagram of the structure of the dual-steam loop heat pipe heat dissipation device proposed in this utility model;

[0024] Figure 6 These represent various forms of condensation capillary structures.

[0025] In the diagram: 1 Evaporator, 1-1 Evaporation end cap, 1-2 Evaporation bottom surface, 1-3 Liquid storage chamber, 2 Sintered porous capillary wick, 3 Condenser, 3-1 Condensation end cap, 3-2 Condensation bottom surface, 3-3 Condensation capillary structure, 3-3-1 Microgroove structure, 3-3-2 Microcolumn structure, 3-3-3 Porous structure, 4 Liquid pipeline, 5 Steam pipeline, 6 Liquid filling port. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0027] Reference Figure 1-6 A high-performance loop heat pipe cooling device for chip heat dissipation includes an evaporator 1, which consists of an evaporation end cap 1-1, an evaporation bottom surface 1-2, and a sintered porous capillary wick 2. The sintered porous capillary wick 2 divides the inner cavity of the evaporator 1 into an upper liquid storage chamber 1-3 and a lower evaporation region. The inner surface of the evaporation bottom surface 1-2 is provided with a micron-level microchannel structure, and the sintered porous capillary wick 2 is welded to the evaporation bottom surface 1-2. A condenser 3 consists of a condensation end cap 3-1 and a condensation bottom surface 3-2, and both the inner surfaces of the condensation end cap 3-1 and the condensation bottom surface 3-2 are provided with condensation capillary structures 3-3. The loop heat pipe includes a liquid pipe 4 and a vapor pipe 5, which are respectively connected between the evaporation end cap 1-1 and the condensation end cap 3-1. The installation height of the liquid pipe 4 is higher than that of the vapor pipe 5, and the internal working fluid is pure water.

[0028] The sintered porous capillary core 2 has a pore diameter of 0.1μm-10μm. The pore diameter of the sintered porous capillary core 2 is on the micrometer scale, and the pore size is adjusted according to the requirements of capillary force. In addition, the thermal conductivity of the capillary core is required to be as low as possible.

[0029] The condensation capillary structure 3-3 on the condensation end cap 3-1 and the condensation bottom surface 3-2 is one or more combinations of microgroove structure 3-3-1, micropillar structure 3-3-2, or porous structure 3-3-3. The porous structure 3-3-3 (such as sintered metal powder or foamed metal) is preferably a combination of microgroove structure 3-3-1 and micropillar structure 3-3-2.

[0030] The interface of liquid pipeline 4 on the evaporator 1 side is located on the side wall of liquid storage chamber 1-3, and the interface on the condenser 3 side is located at the top corner of condenser 3. Steam pipeline 5 is connected to the side walls of evaporator 1 and condenser 3 respectively.

[0031] The liquid pipeline 4 and the steam pipeline 5 are both one or more, and the liquid pipeline 5 is equipped with a filling port 6.

[0032] Among them, the cross-sectional area of ​​steam pipe 5 is larger than that of liquid pipe 4.

[0033] The condenser 3 is made entirely of oxygen-free copper with a thickness of 1mm. The upper and lower condensation surfaces are designed with capillary and microchannel structures, with the microchannel size recommended to be no more than 200 micrometers. Combined with the internal airflow design, the condenser can achieve double-sided condensation, resulting in extremely high condensation efficiency. The capillary structures on the upper and lower surfaces can be implemented using technologies such as microgrooves, micropillars, copper powder sintering, or foamed metal.

[0034] The internal working fluid is pure water. Pure water possesses the highest quality factor (M=σ*hfg*ρl / μl) within the operating temperature range of the loop heat pipe, thus providing the best performance level. The pure water working fluid and oxygen-free copper exhibit good compatibility, supporting reliable and stable operation of the loop heat pipe within the product's lifespan requirements. The total thermal resistance of the loop heat pipe is no higher than 0.005 K / W, and the maximum heat flux density of evaporator 1 is no less than 200 W / cm³. 2 The maximum total heat transfer is not less than 1500W.

[0035] See Figure 1 Evaporator 1 consists of an evaporation end cap 1-1, an evaporation bottom surface 1-2, and a sintered porous capillary wick 2. The inner wall of the evaporation bottom surface 1-2 is machined with a microchannel structure. The bottom surface of the sintered porous capillary wick 2 is welded to the inner surface of the evaporation bottom surface 1-2. The evaporation end cap 1-1 and the evaporation bottom surface 1-2 together form an evaporation cavity. The space between the evaporation end cap 1-1 and the sintered porous capillary wick 2 is a liquid storage cavity 1-3, used to store the refluxed liquid working fluid. A steam pipe interface is provided on the side wall of the evaporation end cap 1-1 for connecting one end of the steam pipe 5; the upper part of the evaporation end cap 1-1 has a protruding structure, and the side wall of the protruding structure has a liquid pipe interface for connecting one end of the liquid pipe 4.

[0036] See Figure 2 The condenser 3 consists of a condensing end cap 3-1, a condensing bottom surface 3-2, and a condensing capillary structure 3-3. Both the inner walls of the condensing end cap 3-1 and the condensing bottom surface 3-2 are machined with capillary structures and microchannels. The side wall of the condensing end cap 3-1 has interfaces for steam pipes and liquid pipes, used to connect the other end of the steam pipe 5 and the other end of the liquid pipe 4, respectively.

[0037] See Figure 3The bottom surface of evaporator 1 is tightly attached to the high heat flux chip. When the chip is working, the heat generated is transferred to the inner surface of the evaporation bottom surface 1-2, and the temperature of the inner surface rises, causing the working fluid in the microchannels of the evaporation bottom surface 1-2 to evaporate into steam. The generated steam flows through the steam pipe 5 into the condenser 2. It condenses inside the condenser 3. The condensed liquid working fluid then flows back to the liquid storage chamber 1-3 of evaporator 1 along the liquid pipe 4 under the action of the thermal pressure difference between evaporator 1 and condenser 3. The liquid working fluid in the liquid storage chamber 1-3 is then transported to the evaporation bottom surface 1-2 by the capillary suction of the sintered porous liquid wick 2. This cycle repeats, spontaneously forming a gas-liquid two-phase cycle, achieving efficient heat transfer.

[0038] See Figure 4 The evaporator 1 and condenser 3 are connected by a steam pipe 5 and a liquid pipe 4. The liquid pipe 4 is higher than the steam pipe 5, with one end connected to the liquid storage chamber 1-3 of the evaporator 1, the connection port located on the side wall of the liquid storage chamber 1-3. The other end is connected to the condenser 3, the connection port located at the apex of the condenser 3. The steam pipe 5 is connected to the side walls of both the evaporator 1 and the condenser 3.

[0039] See Figure 5 The evaporator 1 and condenser 3 are connected by two steam pipes 5 and one liquid pipe 4. The liquid pipe 4 is higher than the steam pipes 5, with one end connected to the liquid storage chamber 1-3 of the evaporator 1, and the connection port located on the side wall of the liquid storage chamber 1-3. The other end is connected to the condenser 3, and the connection port is located at the apex of the condenser 3. The steam pipes 5 are connected to the side walls of both the evaporator 1 and the condenser 3.

[0040] See Figure 6 The condensation capillary structure can be a microgroove structure 3-3-1, a microcolumn structure 3-3-2, or a porous structure 3-3-3 (such as metal powder sintering or foam metal), with a combination of microgroove structure 3-3-1 and microcolumn structure 3-3-2 being preferred.

[0041] Referring to Table 1 below, with an evaporation area of ​​7.68 cm² 2 Under these conditions, the single-steam loop heat pipe can still operate normally under a heating condition of Q=1550W, and its heat flux density reaches q=201.8W / cm³. 2 At this point, the evaporator bottom surface temperature T1 is 61℃, the condenser temperature T3 is 53℃, and the thermal resistance R1 of the loop heat pipe is only 0.0053K / W. The heat dissipation capacity of this embodiment is significantly higher than the limit of existing liquid cooling plate technology (approximately 100W / cm²). 2 The heat transfer effect is significantly improved.

[0042] Table 1

[0043]

[0044] Referring to Table 2 below, with an evaporation area of ​​only 7.68 cm² 2 Under these conditions, the dual-steam loop heat pipe can still operate normally under extreme heating conditions of Q=1550W, and its heat flux density reaches q=201.8W / cm³. 2 At this point, the evaporator bottom surface temperature T1 is only 59°C, the condenser temperature T3 is only 53°C, and the thermal resistance R1 of the loop heat pipe is only 0.0038 K / W. The heat dissipation capacity of this embodiment far exceeds that of existing liquid cooling plate technology (approaching 100 W / cm²). 2 ).

[0045] Table 2

[0046]

[0047] In this invention, the phase change heat transfer process is enhanced through the synergistic effect of the microchannel structure in the evaporator 1 and the sintered porous capillary wick 2, combined with the double-sided micro-capillary condensation structure 3-3 on the condenser 3. This achieves heat dissipation performance with extremely low thermal resistance, ultra-high heat flux density and large total heat transfer. Its heat dissipation capacity is significantly improved compared with the existing liquid cooling technology, which can meet the demanding heat dissipation requirements of high-performance chips. Moreover, the system operates stably and reliably, improving the heat dissipation effect of high heat density chips.

[0048] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high performance loop heat pipe heat sink for chip cooling, characterized in that, include: Evaporator (1), the evaporator (1) is composed of an evaporation end cap (1-1), an evaporation bottom surface (1-2) and a sintered porous capillary core (2). The sintered porous capillary core (2) divides the inner cavity of the evaporator (1) into an upper liquid storage chamber (1-3) and a lower evaporation area. The inner surface of the evaporation bottom surface (1-2) is provided with a micron-level microchannel structure, and the sintered porous capillary core (2) is welded to the evaporation bottom surface (1-2). The condenser (3) is composed of a condensing end cap (3-1) and a condensing bottom surface (3-2), and both the inner surface of the condensing end cap (3-1) and the inner surface of the condensing bottom surface (3-2) are provided with condensing capillary structures (3-3). The loop heat pipe includes a liquid pipe (4) and a steam pipe (5), which are respectively connected between the evaporator end cap (1-1) and the condenser end cap (3-1), and the installation height of the liquid pipe (4) is higher than that of the steam pipe (5). The internal working fluid is pure water.

2. The high-performance loop heat pipe heat dissipation device for chip heat dissipation according to claim 1, characterized in that, The pore diameter of the sintered porous capillary core (2) is 0.1μm-10μm.

3. The high-performance loop heat pipe heat dissipation device for chip heat dissipation according to claim 1, characterized in that, The condensation capillary structure (3-3) on the condensation end cap (3-1) and the condensation bottom surface (3-2) is one or more combinations of microgroove structure (3-3-1), microcolumn structure (3-3-2) or porous structure (3-3-3).

4. A high-performance loop heat pipe cooling device for chip heat dissipation according to claim 1, characterized in that, The interface of the liquid pipeline (4) on the evaporator (1) side is located on the side wall of the liquid storage chamber (1-3), and the interface on the condenser (3) side is located at the top corner of the condenser (3).

5. A high-performance loop heat pipe cooling device for chip heat dissipation according to claim 1, characterized in that, The number of liquid pipelines (4) and steam pipelines (5) is one or more, and the liquid pipelines (4) are provided with filling ports (6).

6. A high-performance loop heat pipe cooling device for chip heat dissipation according to claim 5, characterized in that, The cross-sectional area of ​​the steam pipe (5) is larger than that of the liquid pipe (4).

7. A high-performance loop heat pipe cooling device for chip heat dissipation according to claim 1, characterized in that, The condenser (3) is made of oxygen-free copper with a thickness of 1 mm.

8. A high-performance loop heat pipe cooling device for chip heat dissipation according to claim 1, characterized in that, The total thermal resistance of the loop heat pipe is not higher than 0.005 K / W.

9. A high-performance loop heat pipe cooling device for chip heat dissipation according to claim 1, characterized in that, The maximum heat flux density of the evaporator (1) is not less than 200 W / cm 2 , and the maximum total heat transfer capacity is not less than 1500 W.

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