A foam bonding device

Abstract

This utility model relates to the field of tooling technology, and more particularly to a foam bonding device, comprising: a bonding body having a bonding plane, the bonding plane having multiple adsorption holes communicating with the interior of the bonding body, and an air valve communicating with the interior for connecting to an external negative pressure source; a positioning pin, vertically fixed to the bonding plane and protruding from the bonding plane at its top, the positioning pin corresponding to a process hole on the product; and a positioning post disposed on the bonding body and extendable in a direction perpendicular to the bonding plane for ejecting the product with the foam bonded. This utility model, through the above-mentioned design, achieves automatic adsorption of the foam and improves positioning accuracy. The positioning post, movable along a direction perpendicular to the bonding plane, enables automatic detachment of the product with the foam bonded, thus improving the efficiency of foam bonding.

Description

Technical Field

[0001] This utility model relates to the field of tooling technology, and in particular to a foam bonding device. Background Technology

[0002] In the manufacturing process of products such as loudspeakers, buzzers, and alarms, it is often necessary to attach foam to the products. The function of foam is to seal, absorb shock, and insulate sound. Therefore, the quality of foam attachment is crucial in the product manufacturing process.

[0003] In existing technologies, foam is typically applied manually, with operators accurately attaching the foam to designated areas according to requirements; or automated equipment is used to precisely attach the foam to designated positions. For example, Chinese invention patent application CN119551496A, published on March 4, 2025, discloses a foam tape application device that achieves automated foam application through product tooling, a conveyor, a robotic arm, a negative pressure suction cup, and a feeding table.

[0004] However, manual bonding requires highly skilled operators and is slow, while the investment cost of using automated equipment for bonding is too high. Utility Model Content

[0005] In view of at least one of the above technical problems, the present invention provides a foam bonding device, which adopts structural improvements to improve the accuracy and efficiency of foam bonding.

[0006] According to a first aspect of the present invention, a foam bonding device is provided, comprising:

[0007] The bonding body has a bonding surface, and the bonding surface also has a plurality of adsorption holes communicating with the interior of the bonding body. The bonding body also has an air valve communicating with the interior, and the air valve is used to communicate with an external negative pressure source.

[0008] A positioning pin, vertically fixed to the mating surface, with its top protruding from the mating surface, corresponds to a process hole on the product; and

[0009] A positioning post is provided on the bonding body and is extendable in a direction perpendicular to the bonding plane, used to push out the product with the foam attached.

[0010] Furthermore, the positioning pin is detachably fixed to the fitting body.

[0011] Furthermore, the top of the locating pin is tapered.

[0012] Furthermore, the bonding surface has a positioning groove recessed towards the interior of the bonding body, and the positioning post is axially movable within the positioning groove.

[0013] Furthermore, the adsorption holes are disposed around the periphery of the positioning groove and are arranged around the edge of the positioning groove.

[0014] Furthermore, a top cover is detachably connected to the surface of the bonding body facing away from the bonding surface. The surface of the bonding body facing the top cover has a recessed negative pressure groove. The adsorption hole communicates with the negative pressure groove. A negative pressure interface is provided on the side wall of the negative pressure groove. The air valve communicates with the negative pressure interface.

[0015] Furthermore, the bonding body also has a sealing groove, which is disposed around the negative pressure groove, and the height of the sealing groove is greater than that of the negative pressure groove. The body also has a sealing gasket disposed within the sealing groove, and the thickness of the sealing gasket is greater than the depth of the sealing groove.

[0016] Furthermore, the negative pressure groove is annular, and the inside of the negative pressure groove also has a raised stepped column. The stepped surface of the stepped column is coplanar with the sealing groove. The stepped column also has a stepped hole communicating with the positioning groove. The positioning column is movably disposed in the stepped hole. The top of the positioning column also abuts against a spring, and the other end of the spring abuts against the upper cover.

[0017] Furthermore, the sealing gasket has a central hole, which passes through the upper part of the stepped column and overlaps the sealing groove and the stepped surface of the stepped column.

[0018] Furthermore, the bonding body and the upper cover also have corresponding connection holes, and the upper cover is connected to the bonding body by fasteners.

[0019] The beneficial effects of this utility model are as follows: This utility model achieves automatic adsorption of foam by setting adsorption holes on the bonding surface of the bonding body, improves the positioning accuracy by aligning the positioning pins with the process holes of the product, and achieves automatic detachment of the product bonded with foam by setting positioning columns that are movable along the vertical and bonding plane. Compared with the prior art, this utility model has a simple structure and improves the efficiency of bonding foam. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the foam bonding device in an embodiment of the present invention;

[0022] Figure 2 This is a cross-sectional view of the foam bonding device in an embodiment of the present invention.

[0023] Figure 3 This is a schematic diagram of the exploded disassembly structure of the foam bonding device in the embodiment of this utility model;

[0024] Figure 4 As an embodiment of this utility model Figure 3 Enlarged structural diagram at point A in the diagram;

[0025] Figure 5 This is a three-dimensional structural diagram of the body fitting in an embodiment of the present utility model (top cover omitted).

[0026] Figure 6 As an embodiment of this utility model Figure 5 BB-direction sectional view in the middle;

[0027] Figure 7 This is a schematic diagram of the structure of the foam bonding device adsorbing foam in an embodiment of this utility model;

[0028] Figure 8 This is a schematic diagram of the structure of the foam bonding device and the product in the embodiment of this utility model.

[0029] Figure 9 This is a schematic diagram of the structure of the foam bonding device when bonding foam in an embodiment of this utility model;

[0030] Figure 10 This is a schematic diagram of the product after the foam bonding device has finished bonding the foam in this embodiment of the present invention and pushed it out.

[0031] Explanation of reference numerals in the attached drawings: 1. Fitting body; 11. Fitting plane; 111. Adsorption hole; 112. Positioning groove; 113. Negative pressure groove; 114. Negative pressure interface; 115. Sealing groove; 116. Stepped column; 1161. Stepped surface; 117. Stepped hole; 118. Connecting hole; 12. Air valve; 13. Top cover; 2. Positioning pin; 3. Positioning post; 4. Sealing gasket; 5. Spring. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0033] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0035] like Figures 1 to 6 The foam bonding device shown includes a bonding body 1, a positioning pin 2, and a positioning post 3, as detailed below. Figure 1 and Figure 2 As shown, in some embodiments of this utility model, the bonding body 1 has a bonding surface 11, and the bonding surface 11 also has a plurality of adsorption holes 111 communicating with the interior of the bonding body 1. The bonding body 1 also has an air valve 12 communicating with the interior, and the air valve 12 is used to communicate with an external negative pressure source. In the specific adsorption of foam, the bonding surface of the foam bonding device is first moved close to the foam and in contact with the foam. Then, the negative pressure source generates negative pressure. Under the adsorption of negative pressure, the adsorption holes 111 generate an adsorption force on the foam, thereby realizing the adsorption of foam. It should be noted that the movement of the foam bonding device can be achieved by manual operation, or by a robotic arm or other driving device.

[0036] The positioning pin 2 is vertically fixed on the mating plane 11, and its top protrudes from the mating plane 11. The positioning pin 2 corresponds to the process hole on the product. Here, "corresponding" means that the position of the positioning pin 2 is consistent with the position of the process hole on the product. There are at least two positioning pins 2.

[0037] The positioning post 3 is set on the bonding body 1 and is telescopically set in a direction perpendicular to the bonding plane 11, for pushing out the product with the foam attached.

[0038] The specific steps for fitting are as follows: Figures 7 to 10 As shown, firstly as Figure 7 The foam is absorbed as shown, then as follows Figure 8 As shown, the foam bonding device is moved above the fixed product so that the positioning pin 2 aligns with the process hole of the product; then as shown... Figure 9 As shown, the foam bonding device is moved toward the product, causing the positioning pin 2 to press down along the process hole of the product. At this time, the positioning post 3 simultaneously presses the foam and comes into contact with the product. It should be noted that there is adhesive on the surface of the foam in contact with the product, so the foam and the bonding surface 11 can be fixed together under the pressure of the positioning pin 2 and the bonding surface 11. Figure 10 As shown, the spring 5 is then released, causing the positioning pin 3 to move in the opposite direction, pushing the product out. The product with the foam is then removed, and the foam bonding process continues for the next product. Furthermore, it should be noted that in embodiments of this invention, the foam may also have holes corresponding to the positioning pin 2; see the specific details below. Figure 7 and Figure 8 This structural design ensures the precision of the foam's fit to the product.

[0039] In the above embodiments, the adsorption holes 111 provided on the bonding surface of the bonding body 1 enable automatic adsorption of foam. The positioning pins 2 correspond to the process holes of the product, improving the positioning accuracy. The positioning pins 3 are movably positioned along the bonding plane 11, enabling automatic detachment of the product from the foam. Compared with the prior art, the structure is simple while improving the efficiency of foam bonding.

[0040] In this embodiment of the invention, the positioning pin 2 is detachably fixed to the fitting body 1. Specifically, it can be connected to the fitting body 1 by a threaded connection to facilitate more precise positioning of products with different hole diameters. Furthermore, in this embodiment of the invention, the top of the positioning pin 2 is tapered, such as... Figure 2 As shown, the top conical structure can guide the positioning pin 2 when it is inserted into the process hole of the product, thereby improving the accuracy of foam bonding.

[0041] Please continue to refer to Figure 1 and Figure 2 In an embodiment of this utility model, the bonding surface has a positioning groove 112 recessed towards the interior of the bonding body 1, and the positioning post 3 is axially movable within the positioning groove 112. The positioning groove 112 provides space for bonding the product and avoids interference from the positioning post 3 when adsorbing foam.

[0042] In embodiments of this utility model, such as Figure 1As shown, the adsorption holes 111 are disposed around the periphery of the positioning groove 112 and are arranged around the edge of the positioning groove 112. By placing the adsorption holes 111 on the edge of the positioning groove 112, and in this embodiment of the present invention, multiple adsorption holes 111 are evenly distributed on the edge of the positioning groove 112. This structural form allows the foam to be subjected to force at multiple points during adsorption, improving the success rate of adsorption, preventing the foam from lifting, and improving the reliability of foam fixation during movement.

[0043] like Figure 3 and Figure 4 As shown in the embodiments of this utility model, a top cover 13 is detachably connected to the surface of the fitting body 1 facing away from the fitting surface. This detachable connection can take various forms, such as in some embodiments of this utility model. Figure 3 As shown, the bonding body 1 and the upper cover 13 also have corresponding connecting holes 118. The upper cover 13 is connected to the bonding body 1 by fasteners, which can be screws. The screws pass through the upper cover 13 and are screwed into the connecting holes 118. The bonding body 1 has a recessed negative pressure groove 113 on the surface facing the upper cover 13. The adsorption holes 111 communicate with the negative pressure groove 113. The side wall of the negative pressure groove 113 has a negative pressure interface 114, and the air valve 12 communicates with the negative pressure interface 114. In this way, by communicating with the adsorption holes 111 through the negative pressure groove 113 and connecting with the negative pressure groove 113 through the negative pressure interface 114, negative pressure can be applied to multiple adsorption holes 111 simultaneously through the negative pressure groove 113. This structural design is beneficial to the uniformity of adsorption. Of course, it should also be noted that the air valve 12 can be a throttle valve or a straight-through valve, and the positioning pin 2 and positioning post 3 are made of materials with high hardness such as stainless steel. Those skilled in the art can set them as needed.

[0044] Please continue to refer to Figure 5 and Figure 6 In this embodiment of the invention, to ensure the sealing performance of the negative pressure groove 113, the main body 1 also has a sealing groove 115. The sealing groove 115 is located around the negative pressure groove 113, and the height of the sealing groove 115 is greater than that of the negative pressure groove 113. The main body also has a sealing gasket 4 disposed within the sealing groove 115, and the thickness of the sealing gasket 4 is greater than the depth of the sealing groove 115. By covering the upper part of the negative pressure groove 113 with the sealing gasket 4, and by pressing the sealing gasket 4 with the upper cover 13 during installation, the sealing performance can be guaranteed and the leakage of negative pressure can be reduced. The sealing gasket 4 can be made of materials such as rubber or foam.

[0045] Regarding the moving structure of positioning column 3, such as Figure 3 and Figure 6As shown, the negative pressure groove 113 is annular, and inside the negative pressure groove 113, there is a raised stepped post 116. The stepped surface 1161 of the stepped post 116 is coplanar with the sealing groove 115. A stepped hole 117 communicating with the positioning groove 112 is also opened in the stepped post 116. The positioning post 3 is movably set in the stepped hole 117, and the top of the positioning post 3 abuts against the spring 5. The other end of the spring 5 abuts against the upper cover 13. It should be noted that the positioning post 3 is movably set in the stepped hole 117, specifically, the diameter of the top of the positioning post 3 is larger than the smaller diameter of the stepped hole 117, so as to prevent the positioning post 3 from slipping. Through the compression of the spring 5, on the one hand, the pressure during foam bonding can be achieved, and on the other hand, the product can be ejected after the foam bonding is completed. In addition, the stepped hole 117 in the stepped post 116 can also serve to limit and guide the spring 5.

[0046] like Figure 2 and Figure 3 As shown in the embodiment of this utility model, to avoid interference between the spring 5 and the sealing gasket 4, a central hole is provided on the sealing gasket 4. The central hole passes through the upper part of the stepped post 116 and overlaps the sealing groove 115 and the stepped surface 1161 of the stepped post 116. Thus, as Figure 2 As shown, the sealing gasket 4 passes through the upper part of the stepped column 116 and simultaneously seals the bottom surface of the stepped surface 1161 and the sealing groove 115, thus preventing leakage of the negative pressure groove 113 and interference of the spring 5.

[0047] Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A foam bonding device, characterized in that, include: The bonding body has a bonding surface, and the bonding surface also has a plurality of adsorption holes communicating with the interior of the bonding body. The bonding body also has an air valve communicating with the interior, and the air valve is used to communicate with an external negative pressure source. A positioning pin is vertically fixed on the mating surface, and its top protrudes from the mating surface. The positioning pin corresponds to the process hole on the product. as well as A positioning post is provided on the bonding body and is extendable in a direction perpendicular to the bonding plane, used to push out the product with the foam attached.

2. The foam bonding device according to claim 1, characterized in that, The positioning pin is detachably fixed to the fitting body.

3. The foam bonding device according to claim 1, characterized in that, The top of the locating pin is tapered.

4. The foam bonding device according to claim 1, characterized in that, The bonding surface has a positioning groove recessed towards the interior of the bonding body, and the positioning post is axially movable within the positioning groove.

5. The foam bonding device according to claim 4, characterized in that, The adsorption holes are located around the periphery of the positioning groove and are arranged around the edge of the positioning groove.

6. The foam bonding device according to claim 4, characterized in that, A top cover is detachably connected to the surface of the bonding body facing away from the bonding surface. The surface of the bonding body facing the top cover has a recessed negative pressure groove. The adsorption hole communicates with the negative pressure groove. A negative pressure interface is provided on the side wall of the negative pressure groove. The air valve communicates with the negative pressure interface.

7. The foam bonding device according to claim 6, characterized in that, The bonding body also has a sealing groove, which is located around the negative pressure groove and has a height greater than the negative pressure groove. The body also has a sealing gasket located inside the sealing groove, and the thickness of the sealing gasket is greater than the depth of the sealing groove.

8. The foam bonding device according to claim 7, characterized in that, The negative pressure groove is annular, and the inside of the negative pressure groove also has a raised stepped column. The stepped surface of the stepped column is coplanar with the sealing groove. The stepped column also has a stepped hole communicating with the positioning groove. The positioning column is movably disposed in the stepped hole. The top of the positioning column also abuts against a spring, and the other end of the spring abuts against the upper cover.

9. The foam bonding device according to claim 8, characterized in that, The sealing gasket has a central hole, which passes through the upper part of the stepped column and overlaps the sealing groove and the stepped surface of the stepped column.

10. The foam bonding device according to claim 6, characterized in that, The bonding body and the upper cover also have corresponding connection holes, and the upper cover is connected to the bonding body by fasteners.

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