Electronic device bracket

By setting a positioning part and an excess glue receiving part on the connection surface of the bracket and the hinge, a stable connection is achieved by using adhesive, which solves the problems of high difficulty and high cost of riveting process, improves connection strength and reduces cost.

CN224433930UActive Publication Date: 2026-06-30SHENZHEN LANHE TECHNOLOGIES CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN LANHE TECHNOLOGIES CO LTD
Filing Date
2025-05-30
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

The existing connection methods between brackets and hinges are mostly riveting processes, which result in a small connection area, high manufacturing difficulty, and increased bracket costs. At the same time, the metal material of the bracket affects wireless charging performance and weight.

Method used

The first positioning part and the second positioning part cooperate to achieve the alignment of the connecting surfaces, and the adhesive connection between the connecting surfaces is provided, combined with the adhesive overflow receiving part to prevent adhesive overflow and enhance the connection strength.

Benefits of technology

It effectively prevents adhesive overflow from affecting appearance and function, while enhancing connection strength and reducing process difficulty and cost.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224433930U_ABST
    Figure CN224433930U_ABST
Patent Text Reader

Abstract

This utility model discloses an electronic device bracket, including a bracket body, a connecting portion, a first connecting surface, and a first positioning portion on the first connecting surface; and a connector, the bracket body being able to rotate via the connector, the connector including a second connecting surface, and a second positioning portion on the second connecting surface, the first positioning portion and the second positioning portion cooperating to achieve alignment of the first connecting surface and the second connecting surface, the connector and the connecting portion being connected by adhesive, the adhesive being disposed between the first connecting surface and the second connecting surface. Furthermore, by providing an overflow adhesive receiving portion, when the connector is attached to the bracket body, the adhesive is squeezed and flows into the overflow adhesive receiving portion, instead of overflowing from the edges.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of electronic device accessories technology, and in particular to an electronic device bracket. Background Technology

[0002] Mobile phones, tablets, and other electronic devices are favored by many users due to their rich functionality and portability. In practical scenarios such as watching videos and video communication, users often want to be able to operate the electronic devices without holding them, allowing them to perform other operations while viewing the screen. In this case, a stand can be used to support the electronic device, freeing up the user's hands.

[0003] Existing brackets typically achieve rotation via hinges. To ensure a secure connection, hinges are usually riveted to the bracket. Because the rotating structure requires relatively high strength, hinges are generally made of materials like manganese steel, necessitating riveting. This requires the bracket to be made of metal or an alloy. Generally, metal or alloy brackets offer high strength and longevity, making them excellent materials. However, in some usage scenarios, metal brackets can cause problems. For example, placing a metal bracket on the back of a phone case can affect the phone's wireless charging performance and efficiency. Furthermore, the weight of a metal bracket further increases the weight of the phone case. The small connection area between the bracket and the hinge makes riveting difficult, requiring high precision and craftsmanship, thus increasing the cost of the bracket. Therefore, achieving a stable connection between the bracket and the hinge when riveting is not feasible or not possible is a pressing issue for the industry. Utility Model Content

[0004] This application discloses an electronic device bracket, including a bracket body, the bracket body including a connecting part, the connecting part including a first connecting surface, and a first positioning part provided on the first connecting surface;

[0005] The connector allows the main body of the bracket to rotate. The connector includes a second connecting surface and a second positioning part. The first positioning part and the second positioning part cooperate to align the first connecting surface and the second connecting surface. The connector and the connecting part are connected by adhesive, which is placed between the first connecting surface and the second connecting surface.

[0006] An overflow caulking portion is provided on the first connecting surface and / or the second connecting surface.

[0007] Compared with the prior art, this application has at least the following beneficial effects:

[0008] The electronic device bracket disclosed in this application achieves alignment of the first connecting surface and the second connecting surface through the cooperation of the first positioning part and the second positioning part. Then, by applying adhesive between the first connecting surface and the second connecting surface, the connector and the bracket body are connected by adhesive. Furthermore, by providing an adhesive overflow receiving part on the first connecting surface and / or the second connecting surface, when the connector and the bracket body are attached, the adhesive between them is squeezed and flows into the adhesive overflow receiving part, instead of overflowing from the edges. On the one hand, this effectively prevents adhesive overflow from affecting the appearance and function of the bracket; on the other hand, it allows as much adhesive as possible to remain between the first connecting surface and the second connecting surface, enhancing the bonding strength between the first connecting surface and the second connecting surface. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in this application, the drawings used in the application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of connecting the bracket in the embodiment of this application to a mobile phone case;

[0011] Figure 2 This is a three-dimensional structural diagram of the bracket in the embodiments of this application;

[0012] Figure 3 yes Figure 1 The diagram shown is an exploded view of the support structure.

[0013] Figure 4 yes Figure 3 A partial enlarged view of the bracket shown;

[0014] Figure 5 yes Figure 1 The diagram shows an exploded view of the support structure from another angle.

[0015] Figure 6 yes Figure 5 A partial enlarged view of the bracket shown;

[0016] Figure 7 yes Figure 1 The diagram shows an exploded view of the support structure from another angle.

[0017] Figure 8 yes Figure 7 A partial enlarged view of the bracket shown;

[0018] Figure 9 This is an enlarged schematic diagram of an angle of the connecting part of the bracket in an embodiment of this application;

[0019] Figure 10 This is an enlarged schematic diagram of the connecting part of the bracket in an embodiment of this application from another angle. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] In this application, the terms "upper," "inner," "outer," "middle," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0022] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0023] Furthermore, the terms "provided with" and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0024] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0025] Stands support electronic devices (such as phones and tablets), allowing them to face the user at a suitable angle and freeing their hands, making them highly popular. For portability, stands may be integrated into the protective case of the electronic device or designed to detachably connect to it, such as magnetically. This allows the stand to be securely attached to the device, making it easy for users to carry and use. Furthermore, magnets on the stand can attract and hold wireless charging power supplies, ensuring they are close to and stable for wireless charging. Similarly, magnets can be used to attract other electronic accessories, such as card holders. Regardless of the connection method, the stand requires a hinge structure to rotate.

[0026] However, the current connection method between brackets and hinges is mostly riveting. Since the connection area between brackets and hinges is small, the riveting process is difficult to implement and requires high precision and process, which increases the cost of brackets.

[0027] To address the aforementioned technical problems, this application provides an electronic device bracket. The first and second positioning parts cooperate to align the first connecting surface with the second connecting surface. Then, adhesive is applied between the first and second connecting surfaces to connect the connector to the bracket body. Furthermore, by providing an adhesive overflow accommodating portion on the first and / or second connecting surfaces, when the connector and bracket body are attached, the adhesive between them is squeezed and flows into the overflow accommodating portion instead of overflowing from the edges. This effectively prevents adhesive overflow from affecting the bracket's appearance and function, and also allows as much adhesive as possible to remain between the first and second connecting surfaces, enhancing the bonding strength between them.

[0028] It is understood that the electronic device holder is configured to be disposed on the surface of the electronic device to support it. For example, it can be disposed on the back of the electronic device, that is, on the surface of the electronic device opposite to the display / viewing / operation surface. The electronic device can be a mobile phone, tablet computer, e-reader, etc., and this application does not specifically limit it.

[0029] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0030] Please refer to the following: Figures 1 to 6 The electronic device bracket 1 provided in this application embodiment includes a bracket body 10 and a connector 20. The bracket body 10 rotates through the connector 20, for example... Figure 1As shown, the stand body 10 can be connected to the phone case 2 via the connector 20, allowing the stand body 10 to rotate relative to the phone case 2 for support or storage. The stand body 10 includes a connecting portion 11, which has a first connecting surface 11a. The first connecting surface 11a has a first positioning portion 12 and an excess adhesive receiving portion 13. Furthermore, the connector 20 includes a second connecting surface 20a, which has a second positioning portion 21. (See reference...) Figure 2 The first positioning part 12 and the second positioning part 21 cooperate to align the first connecting surface 11a and the second connecting surface 20a. Simultaneously, adhesive is applied between the first connecting surface 11a and the second connecting surface 20a, allowing the connector 20 to be bonded to the connecting part 11. In other embodiments, an adhesive overflow receiving part 13 can be provided on the second connecting surface 20a to prevent adhesive overflow between the first connecting surface 11a and the second connecting surface 20a. Furthermore, if there is a relatively large amount of adhesive between the first connecting surface 11a and the second connecting surface 20a, adhesive overflow receiving parts 13 can be provided on both the first connecting surface 11a and the second connecting surface 20a to achieve the desired effect.

[0031] The first positioning part 12 and the second positioning part 21 cooperate to align the first connecting surface 11a and the second connecting surface 20a. Then, adhesive is applied between the first connecting surface 11a and the second connecting surface 20a to connect the connector 20 and the bracket body 10. Furthermore, by providing an overflow adhesive receiving part 13 on the first connecting surface 11a and / or the second connecting surface 20a, when the connector 20 and the bracket body 10 are attached, the adhesive between them is squeezed and flows into the overflow adhesive receiving part 13, instead of overflowing from the edges. On the one hand, this effectively prevents adhesive overflow from affecting the appearance and function of the electronic device bracket 1. On the other hand, it allows as much adhesive as possible to remain between the first connecting surface 11a and the second connecting surface 20a, enhancing the bonding strength between the first connecting surface 11a and the second connecting surface 20a.

[0032] In some embodiments, continue reading Figure 3 , Figure 5 , Figure 7 and Figure 8The bracket body 10 shown in the figure includes an upper surface 10a and a lower surface 10b, and a side surface 10c located between the upper surface 10a and the lower surface 10b. The connecting part 11 includes a mounting groove 111 recessed in the lower surface 10b. The bottom surface of the mounting groove 111 is a first connecting surface 11a. One side of the mounting groove 111 penetrates the side surface 10c of the bracket body 10, so that the mounting groove 111 forms an opening. When the connector 20 is installed in the mounting groove 111, a part of the connector 20 protrudes out of the bracket body 10 through the opening. Figure 2 and Figure 8 As shown, the portion of the connector 20 extending beyond the main body 10 of the bracket forms a bushing for the insertion of a rotating shaft. Both ends of the rotating shaft protrude outside the bushing, enabling rotatable connection with external structures such as mobile phone cases and power banks. In this embodiment, by providing a mounting groove 111 on the connecting portion 11, the connector 20 can be accommodated within the mounting groove 111 when connected to the connecting portion 11, without protruding from the surface of the connecting portion 11, effectively reducing the overall thickness of the electronic device bracket 1. Furthermore, due to the mounting groove 111, when the connector 20 is installed within the mounting groove 111, the adhesive between the connector 20 and the mounting groove 111 is less likely to overflow from the edge of the mounting groove 111, further preventing adhesive overflow.

[0033] In some embodiments, further refer to Figure 9 The adhesive overflow receiving portion 13 includes a first adhesive overflow groove 131a recessed in the first connecting surface 11a, located near the opening of the mounting groove 111. As can be seen from the above embodiment, the mounting groove 111 extends through one side of the side 10c of the bracket body 10, forming an opening. When the connector 20 is installed in the mounting groove 111, a portion of the connector 20 protrudes outside the bracket body 10 through the opening. Because of the opening, adhesive overflow is more likely to occur at the opening. Therefore, by placing the first adhesive overflow groove 131a near the opening, the problem of adhesive overflow at the opening can be specifically solved. Similarly, if the first adhesive overflow groove 131a is placed on the second connecting surface 20a, it can also be placed close to the opening. The principle is the same as in the above embodiment, and will not be repeated here.

[0034] Furthermore, the first overflow groove 131a is positioned closer to the opening than the first positioning part 12. This arrangement effectively prevents adhesive from overflowing from the opening due to pressure from the first positioning part 12. Simultaneously, the first overflow groove 131a extends along the length of the opening. (See reference...) Figure 9In the figure, the length direction of the opening refers to the horizontal direction shown in the figure. By extending the first overflow groove 131a along the length direction of the opening, the length of the first overflow groove 131a can be increased as much as possible, so that it can better accommodate overflow. Optimally, the length of the first overflow groove 131a can be equal to the length of the opening to maximize its overflow capacity. In other embodiments, the length of the first overflow groove 131a can also be set to be less than the length of the opening according to actual needs.

[0035] In some embodiments, further refer to Figure 6 and Figure 8 The first positioning part 12 includes a protrusion 121 protruding from the bottom surface of the mounting groove 111, and the second positioning part 21 includes a through hole 211 provided on the connector 20. The through hole 211 is fitted onto the protrusion 121 to position the connector 20 within the mounting groove 111, and the surface of the connector 20 is flush with or lower than the opening of the mounting groove 111. That is, after the connector 20 is installed in the mounting groove 111, the connector 20 will not protrude outside the mounting groove 111 in the thickness direction of the bracket body 10. In this embodiment, by fitting the through hole 211 onto the protrusion 121, on the one hand, the assembly difficulty can be reduced during assembly, and the assembly alignment accuracy can be increased, preventing the connector 20 from being misaligned and affecting the rotation function of the bracket body 10; on the other hand, it can prevent the bracket body 10 from shaking with the connector 20 during use, affecting the support function and user experience of the bracket.

[0036] Furthermore, in some embodiments, the overflow receiving portion 13 may also include a fourth overflow groove (not shown) to further increase the storage capacity of overflow. The fourth overflow groove is recessed on the second connecting surface 20a, and the fourth overflow groove is spaced apart from the through hole 211. The spaced-apart arrangement prevents the overflow in the fourth overflow groove from entering the through hole 211 and affecting the through hole 211's fit on the protrusion 121.

[0037] In some embodiments, further refer to Figure 9 and Figure 10The mounting groove 111 has an overall U-shaped structure, including a main groove 111a and a protruding groove 111b. The main groove 111a is the lower half of the U-shape, and the protruding groove 111b is the upper half. The end of the protruding groove 111b away from the main groove 111a extends to the edge of the bracket body 10 and passes through the side 10c of the bracket body 10 to form the opening mentioned in the above embodiment. The first overflow groove 131a is provided on the protruding groove 111b. The U-shaped mounting groove 111 design can effectively limit the connector 20 installed in the mounting groove 111, preventing the connector 20 from shaking or falling off from the opening; on the other hand, it increases the bonding area between the connector 20 and the bottom surface of the mounting groove 111, making the connection between the two more firm and reliable.

[0038] For further information, please refer to [link / reference]. Figure 9 and Figure 10 The protrusion 121 includes a first protrusion group 121a, which consists of two first protrusions spaced apart on the main body groove 111a. The adhesive overflow receiving portion 13 also includes a second adhesive overflow channel 131b, which is located on the main body groove 111a and between the two first protrusions of the first protrusion group 121a. The second adhesive overflow channel 131b extends from one of the first protrusions toward the other. In other words, one end of the second adhesive overflow channel 131b is close to one of the first protrusions, and the other end extends toward the other first protrusion, maximizing the length of the second adhesive overflow channel 131b to accommodate more adhesive overflow.

[0039] Continue reading Figure 9 In some embodiments, two second overflow grooves 131b can be provided as needed. The two second overflow grooves 131b are arranged alternately and parallel on the main body groove 111a. In some embodiments, the arrangement direction of the two second overflow grooves 131b can also be perpendicular to its extension direction. That is, as can be seen from the figure, both second overflow grooves 131b extend in the horizontal direction, while the two second overflow grooves 131b are arranged in the vertical direction. Since the area of ​​the main body groove 111a is relatively large, the amount of glue coated on its surface is relatively large. Therefore, two or more second overflow grooves 131b can be provided to accommodate the overflow glue. At the same time, by providing multiple second overflow grooves 131b spaced apart instead of providing a large overflow groove, it is possible to avoid the occurrence of unbonded areas between the first connecting surface 11a and the second connecting surface 20a in a local area due to an excessively large overflow groove, which would affect the bonding strength.

[0040] Continue reading Figure 9 and Figure 10In some embodiments, the protrusion 121 further includes a second protrusion group 121b, which also consists of two second protrusions spaced apart on the protruding groove 111b. It is understood that the protrusions constituting the first protrusion group 121a and the second protrusion group 121b are different protrusions. Furthermore, the distance between the two first protrusions constituting the first protrusion group 121a is greater than the distance between the two second protrusions constituting the second protrusion group 121b. By setting different protrusion groups, more precise positioning can be achieved during assembly. Additionally, setting different distances between different protrusion groups can also prevent errors, avoid assembly mistakes, and improve assembly efficiency.

[0041] In some embodiments, continue reading Figure 9 and Figure 10 The glue overflow receiving portion 13 also includes a third glue overflow channel 131c. As shown in the figure, the third glue overflow channel 131c is located between the first glue overflow channel 131a and the second glue overflow channel 131b. In addition to the first glue overflow channel 131a being located at the opening, the second glue overflow channel 131b is located in the main body groove portion 111a and between the two protrusions 121 of the first protrusion group 121a. The third glue overflow channel 131c is located in the protruding groove portion 111b and between the two protrusions 121 of the second protrusion group 121b. The third glue overflow channel 131c also extends from one of the second protrusions towards the other second protrusion. That is, one end of the third glue overflow channel 131c is close to one of the second protrusions, and the other end extends towards the other second protrusion, in order to maximize the length of the third glue overflow channel 131c so that it can accommodate more glue overflow.

[0042] Since the adhesive is evenly applied to the second connecting surface 20a, overflow grooves are provided at different locations to ensure that any overflow from each location flows into the grooves and does not spill from the edges. Furthermore, since the protrusions 121 are more prone to overflow, the overflow grooves are placed between the protrusions 121, effectively mitigating the risk of overflow at these locations. Moreover, overflow grooves of different lengths can be provided based on the varying distances between the protrusions 121. As shown in the figure, the length of the second overflow groove 131b between the first protrusion group 121a is greater than the length of the third overflow groove 131c between the second protrusion group 121b. Similarly, the number of overflow grooves can be adjusted according to the amount of overflow; for example, the second overflow groove 131b in the figure consists of two grooves. Flexibly setting the length and number of overflow grooves according to the varying amount of overflow at different locations can maximize the resolution of the overflow problem.

[0043] The above provides a detailed description of an electronic device bracket disclosed in the embodiments of this application. This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand an electronic device bracket and its core ideas in this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An electronic device bracket, characterized in that, The electronic device bracket includes: The bracket body includes a connecting part, the connecting part includes a first connecting surface, and a first positioning part is provided on the first connecting surface; The connector allows the main body of the bracket to rotate. The connector includes a second connecting surface and a second positioning part. The first positioning part and the second positioning part cooperate to align the first connecting surface and the second connecting surface. The connector and the connecting part are connected by adhesive, which is placed between the first connecting surface and the second connecting surface. An overflow caulking portion is provided on the first connecting surface and / or the second connecting surface.

2. The electronic device bracket according to claim 1, characterized in that, The bracket body includes an upper surface and a lower surface opposite to each other, and a side surface located between the upper surface and the lower surface. The connecting part includes a mounting groove recessed in the lower surface. The bottom surface of the mounting groove is the first connecting surface. One side of the mounting groove penetrates the side surface of the bracket body to form an opening. The connector is installed in the mounting groove, and a portion of the connector extends out of the bracket body through the opening.

3. The electronic device bracket according to claim 2, characterized in that, The overflow caulking portion includes a first overflow groove recessed in the first connecting surface, and the first overflow groove is located near the opening of the mounting groove.

4. The electronic device bracket according to claim 3, characterized in that, The first overflow groove is closer to the opening than the first positioning part, and the first overflow groove extends along the length direction of the opening and the length of the first overflow groove is less than or equal to the length of the opening.

5. The electronic device bracket according to claim 3, characterized in that, The mounting groove has a convex shape and includes a main groove and a protruding groove. The end of the protruding groove away from the main groove extends to the edge of the bracket body and penetrates the side of the bracket body to form the opening. The first overflow groove is provided on the protruding groove.

6. The electronic device bracket according to claim 5, characterized in that, The first positioning part includes a protrusion protruding from the bottom surface of the mounting groove. The protrusion includes a first protrusion group, which includes two first protrusions. The two first protrusions are spaced apart in the main body groove. The overflow adhesive receiving part also includes a second overflow adhesive groove, which is disposed in the main body groove and located between the two first protrusions of the first protrusion group. The second overflow adhesive groove extends from one of the first protrusions toward the other first protrusion.

7. The electronic device bracket according to claim 6, characterized in that, The second overflow groove includes two, which are spaced apart and arranged in parallel on the main body groove.

8. The electronic device bracket according to claim 6, characterized in that, The protrusion further includes a second protrusion group, which includes two second protrusions spaced apart in the protrusion groove. The overflow receiving portion further includes a third overflow groove, which is located between the first overflow groove and the second overflow groove. The third overflow groove is located in the protrusion groove and between the two protrusions in the second protrusion group. The third overflow groove extends from one of the second protrusions toward the other second protrusion.

9. The electronic device bracket according to claim 8, characterized in that, The distance between the two first protrusions in the first protrusion group is greater than the distance between the two second protrusions in the second protrusion group.

10. The electronic device bracket according to any one of claims 2-9, characterized in that, The first positioning part includes a protrusion protruding from the bottom surface of the mounting groove, the second positioning part includes a through hole provided on the connector, the through hole is sleeved on the protrusion to position the connector in the mounting groove, and the overflow adhesive receiving part includes a fourth overflow adhesive groove recessed in the second connecting surface, the fourth overflow adhesive groove being spaced apart from the through hole. And / or, the portion of the connector extending out of the bracket body through the opening forms a bushing for the insertion of the rotating shaft.