A temperature monitoring device and an oven

Abstract

This application discloses a temperature monitoring device and an oven. The temperature monitoring device includes a housing, which is detachably installed on the target being tested. The housing has a storage section for housing the temperature measuring components. A temperature measuring probe is placed at the test point via a connector to measure the temperature at the test point. The temperature at the test point is collected by a microcontroller inside the housing. This allows for monitoring the temperature at different locations. The device can be freely fixed and removed for easy use and to reduce the difficulty of daily calibration and maintenance. The oven includes the aforementioned temperature monitoring device, which is fixed to the outer wall of the oven via a mounting section. It can monitor the temperature in real time inside the oven, ensuring the reliability and safety of experimental results.

Description

Technical Field

[0001] This application relates to the field of temperature monitoring device technology, and in particular to a temperature monitoring device and an oven. Background Technology

[0002] Laboratory ovens are widely used in scientific research and industry, and the accuracy and stability of their temperature control are crucial to the reliability and safety of experimental results. However, traditional ovens generally rely on a basic temperature control system integrated inside the oven, which has many drawbacks: the temperature measurement position cannot be adjusted according to the internal environment of the oven, the accuracy of temperature measurement and the stability of temperature control are not high, and daily calibration and maintenance are difficult.

[0003] These problems can lead to sample damage, equipment overheating, and even fire risks, causing significant economic losses and safety hazards. Therefore, there is an urgent need for a temperature monitoring device that integrates high-precision temperature monitoring, multi-level anomaly diagnosis, and intelligent alarm functions to ensure the safe operation of the oven and provide data support for fault analysis. Utility Model Content

[0004] To solve at least one of the above-mentioned technical problems, this application provides a temperature monitoring device and an oven, and the technical solution adopted is as follows.

[0005] The temperature monitoring device provided in this application includes a temperature measuring component, a housing, and a microcontroller. The temperature measuring component includes a temperature measuring probe and a connector, and the connector is connected to the temperature measuring probe.

[0006] The housing includes a storage section detachably mounted on the housing, the temperature measuring component being stored in or removed from the storage section, and the housing being detachably mounted on the target being detected.

[0007] The microcontroller is located inside the housing, and the temperature probe is electrically connected to the microcontroller. The microcontroller is used to collect the temperature data measured by the temperature probe.

[0008] In some embodiments of this application, the housing includes an attachment for removably adhering to the outer wall of the target being tested.

[0009] In some embodiments of this application, the connector is a flexible cable that passes through the storage portion and the housing and is electrically connected to the microcontroller.

[0010] In some embodiments of this application, the storage part includes a storage box, the interior of which forms a storage cavity, and the storage box is provided with an extension opening for the temperature measuring component to be stored in or extend out of the storage cavity. The storage part includes a limiting member for limiting the length of the connector after it extends out.

[0011] In some embodiments of this application, the storage shaft is disposed on the side of the housing used to house the storage box, wherein:

[0012] The storage shaft is fixed to the housing, and the storage box is connected to either the housing or the storage shaft, allowing the storage box to rotate relative to the storage shaft; or...

[0013] The storage box is fixed to the housing, and the storage shaft is connected to the housing or the storage box, and the storage shaft can rotate relative to the storage box.

[0014] In some embodiments of this application, a fan is provided on the housing corresponding to the microcontroller, and the fan is used to dissipate heat from the microcontroller.

[0015] In some embodiments of this application, the microcontroller is provided with a power input interface and a power output interface, the power input interface and the power output interface are used to be connected in series to the power supply circuit of the target being detected, and the temperature probe is used to monitor the temperature of the detection point of the target being detected;

[0016] The microcontroller can cut off the output of the power output interface when the temperature at the detected point exceeds a preset temperature.

[0017] In some embodiments of this application, the microcontroller includes a communication module and / or a storage module, wherein the communication module is used to transmit the temperature data measured by the temperature measuring component to a monitoring center, and the storage module is used to store the data.

[0018] This application also provides an oven, including the temperature monitoring device as described above.

[0019] This application has at least the following beneficial effects: The temperature monitoring device includes a housing, which is detachably installed on the target being tested. The housing's storage section is used to store the temperature measuring components. The temperature measuring probe is placed at the test point through a connector to measure the temperature at the test point. The temperature at the test point is collected by a microcontroller inside the housing. This allows for monitoring the temperature at different locations. The device can be freely fixed and removed, making it convenient to use and reducing the difficulty of daily calibration and maintenance. The oven includes the above-mentioned temperature monitoring device, which is fixed to the outer wall of the oven through a mounting section. It can penetrate deep into the oven to monitor the temperature in real time, ensuring the reliability and safety of the experimental results.

[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0021] The present application will be further illustrated below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments illustrated in the following drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application.

[0022] Figure 1 This is a front view of the temperature monitoring device;

[0023] Figure 2 This is a view of the back of the temperature monitoring device;

[0024] Figure 3 This is a diagram of the storage section.

[0025] Reference numerals: Casing 100;

[0026] Attachment 110;

[0027] Mounting part 120; Mounting hole 121;

[0028] Storage section 130; storage cavity 131; storage box 132; extension opening 1321; storage shaft 133;

[0029] Fan 140;

[0030] Temperature measuring component 200; temperature measuring probe 210; connector 220.

[0031] Microcontroller 300; Display screen 310; Device switch 320; Temperature sensor switch 330; Calibration reset button 340; Power output interface 350. Detailed Implementation

[0032] The following is combined with Figures 1 to 3 The embodiments of this application are described in detail below, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0033] In the description of this application, it should be understood that the terms "center", "middle", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0034] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0035] In the description of this application, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] In the description of this application, the use of terms such as "one embodiment," "some embodiments," "an example," "some instances," "some embodiments," "illustrative embodiment," "example," "specific example," and "some examples" indicates that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0037] This application provides a temperature monitoring device, which will be described below.

[0038] Combination Figure 1 As shown, the temperature detection device includes a housing 100, a temperature measuring component 200, and a microcontroller 300. The temperature measuring component 200 includes a temperature probe 210 and a connector 220. The connector 220 is connected to the temperature probe 210, which is used to measure the temperature of the detected point. The housing 100 includes a storage section 130, which is detachably mounted on the housing 100. The temperature measuring component 200 is stored in or removed from the storage section 130. The housing 100 is detachably mounted on the detected target. The microcontroller 300 is located inside the housing 100, and the temperature probe 210 is electrically connected to the microcontroller 300. The microcontroller 300 is used to collect the temperature data measured by the temperature probe 210.

[0039] The temperature probe 210 is disposed inside or outside the housing 100. It can be connected to the microcontroller 300 via a connector 220, which enables electrical connection. The connector 220 extends from inside the housing 100 to the outside of the housing 100 to enable the temperature probe 210 to operate. The connecting wire can be disposed inside the connector 220 or on one side of the connector 220, or the connector 220 itself can be the connecting wire.

[0040] The connector 220 may be fixed inside or outside the housing 100, while the temperature probe 210 and the microcontroller 300 are electrically connected through a connecting wire, which is independent of the connector 220.

[0041] The housing 130 is detachably mounted on the housing 100 and can be installed inside or outside the housing 100. The temperature measuring component 200 is housed in or extends out of the housing 130. The temperature measuring probe 210 and the connector 220 can be completely housed in the housing 130. The housing 130 can be removed to take out the temperature measuring probe 210. The connector 220 maintains its connection with the microcontroller 300. Alternatively, an outlet for the temperature measuring probe 210 to pass through can be provided in the housing 130. The temperature measuring probe 210 passes through the outlet of the housing 130 to reach the detection point.

[0042] Temperature probe 210 and microcontroller: Temperature probe 210 is equipped with a temperature sensor. Temperature probe 210 can be placed at the detection point to monitor the temperature of the detection point. Microcontroller 300 is located inside housing 100, which protects microcontroller 300. Temperature probe 210 is electrically connected to microcontroller 300. Microcontroller 300 is used to collect temperature data of the detection point measured by temperature probe 210. Temperature probe 210 can continuously monitor the temperature of the detection point in real time. Temperature probe 210 can be placed in multiple locations for monitoring. Microcontroller 300 analyzes temperature data to calibrate deviations, prevent temperature monitoring failure, and ensure the accuracy and stability of temperature control. Housing 100 is detachably installed on the outer wall of the target being tested, and can be freely fixed and removed for easy use and to reduce the difficulty of daily calibration and maintenance.

[0043] The connector 220 can be a telescopic rod fixed to the housing 100 or the storage part 130. The length of the telescopic rod can be adjusted to remove the temperature probe 210 from the storage part 130 to reach the detection point. Alternatively, it can be a combination of a spherical hinge seat and a telescopic rod. The spherical hinge seat is fixed to the housing 100 or the storage part 130, and the extension angle of the connector 220 can be adjusted.

[0044] When using the temperature monitoring device, first take the temperature probe 210 out of the storage section 130, place the temperature probe 210 at the point to be detected, and then collect the temperature data measured by the temperature probe 210 through the microcontroller 300.

[0045] Specifically, in combination Figure 1 and Figure 2 As shown, the housing 100 includes an attachment 110 for detachably adhering to the outer wall of the target being tested. The attachment 110 can be a magnetic fastener, suction cup, or adhesive fixing structure, etc., for adhering to the outer wall of the target being tested. If a suction cup or adhesive fixing structure is used, its attachment surface is coated with a high-temperature resistant adhesive layer to prevent damage from high temperatures. The housing 100 also includes a mounting part 120 for fixing the housing 100 in one position for temperature measurement, such as fixing it to the target being tested. The mounting part 120 can be a perforated plate with mounting holes 121 for bolt connection, where bolts pass through the mounting holes 121 for fixation. The mounting part 120 allows the temperature monitoring device to be installed on the outside of the target being tested, such as on the outer wall of an oven, providing a reliable fixation method and facilitating accurate temperature measurement data.

[0046] Combination Figure 1 As shown, the microcontroller 300 is connected to the display screen 310. The temperature data collected by the microcontroller 300 can be displayed on the display screen 310 in real time, which is used to monitor the temperature of the detected point in real time, so as to realize active early warning when the heating element of the detected target is abnormal, the sensor is damaged or the circuit is faulty.

[0047] Combination Figure 1 As shown, the microcontroller 300 is also connected to a device switch 320, which is used to turn the temperature monitoring device on or off. The microcontroller 300 is also connected to a temperature measuring switch 330, which is used to start or stop the temperature measuring probe 210 from measuring.

[0048] The microcontroller 300 is also connected to a calibration reset button 340. Pressing the calibration reset button 340 for less than or equal to three seconds triggers the calibration mode, which is used to maintain the temperature monitoring device and ensure accurate temperature measurement. Pressing the calibration reset button 340 for more than five seconds triggers the reset mode, which clears the temperature data records.

[0049] The microcontroller 300 can be powered by connecting to the power supply of the target being monitored, or by a built-in battery.

[0050] In some embodiments, the connector 220 is a flexible cable that passes through the storage section 130 and the housing 100 and is electrically connected to the microcontroller 300. The flexible cable can be freely stretched or shortened, has a large range of movement, and is easy to store in the storage section 130, allowing the temperature probe 210 to monitor more locations and further improving the accuracy of temperature monitoring.

[0051] The flexible cable connector 220 can be fitted with a malleable, deformable sheath to fix the position of the temperature probe 210 after it extends, while also facilitating the flexible cable's adaptability to maintain its monitoring shape. The flexible cable is also equipped with an insulation or heat-insulating layer to prevent damage in high-temperature environments.

[0052] A magnetic base or adhesive layer may be provided at the end of the temperature probe 210 or on the part of the connector 220 near the temperature probe 210 for fixing it to the point being tested and continuously monitoring the temperature.

[0053] In some embodiments, combined with Figure 1 and Figure 3 As shown, the storage unit 130 includes a storage box 132, the interior of which forms a storage cavity 131. The storage box 132 is provided with an extension opening 1321, which is used for the temperature measuring component 200 to be stored in or extend out of the storage cavity 131. The storage box 132 can be disposed inside the housing 100 or on the outer wall of the housing 100. The connector 220 passes through the storage box 132 and is placed inside the storage cavity 131. When using the temperature measuring probe 210, the temperature measuring probe 210 extends out from the extension opening 1321. The storage box 132 is detachable for easy maintenance. The storage box 132 not only stores the temperature measuring component 200, saving space, but also protects it from corrosion of the temperature measuring probe 210 by high temperature or humid environments. The extension opening 1321 is provided with an elastic sealing ring to protect the temperature measuring component 200 from damage and further prevent corrosion by high temperature or humid environments.

[0054] The storage section 130 includes a limiting member, which limits the extended length of the connector 220. An elastic clip, Velcro strap, adhesive pad, or similar material can be used to secure a portion of the connector 220 to the storage section 130 or the housing 100, or filler material can be provided at the protrusion opening 1321 to prevent changes in the extended length of the connector 220.

[0055] In some embodiments, combined with Figure 3 As shown, the storage section 130 includes a storage shaft 133, which is disposed within the storage cavity 131. The connector 220 is wound around the storage shaft 133. The connector 220 can be spirally wound around the storage shaft 133 for storage by opening the storage box 132, further saving space and preventing the connector 220 from becoming tangled within the storage cavity 131, thus preventing difficulty in extending the temperature probe 210 during use.

[0056] The storage section 130 can store the connector 220 independently by setting the storage shaft 133, which is convenient and quick to use.

[0057] In some embodiments, a storage shaft 133 is disposed on the side of the housing 100 used for housing the storage box 132. The storage shaft 133 is fixed to the housing 100, and the storage box 132 is connected to the housing or the storage shaft 133. The storage box 132 can rotate relative to the storage shaft 133 to adjust the extension length of the connector 220. The storage box 132 is rotatably connected to the housing or the storage shaft 133, and the portion of the connector 220 connected to the microcontroller 300 is fixed. When using the temperature probe 210, the temperature probe 210 is removed from the storage cavity 131. By rotating the storage box 132 relative to the storage shaft 133, the extension length of the connector 220 is changed. When storing the temperature probe 210 in the storage cavity 131, the storage box 132 is rotated relative to the storage shaft 133 in the opposite direction of the above rotation to store the temperature probe 210 in the storage cavity 131, preventing the connector 220 from breaking due to twisting.

[0058] Alternatively, the storage box 132 can be fixed to the housing 100, and the storage shaft 133 can be connected to the housing 100 or the storage box 132. The storage shaft 133 and the storage box 132 can rotate relative to each other. The end of the connector 220 away from the temperature probe 210 passes through one side or the axis of the storage shaft 133, and then passes through the housing 100 or through the storage box 132 and the housing 100 to connect to the microcontroller 300. When using the temperature probe 210, the temperature probe 210 is pulled out from the protrusion 1321, and the storage shaft 133 rotates around its own axis in one direction, thereby extending the connector 220, allowing the temperature probe 210 to be placed at the detection point. The cable management efficiency can be improved by removing the storage box 132 and then winding the connector 220 around the storage shaft 133, or by setting a torsion spring on the storage shaft 133, which automatically retracts through the preload of the torsion spring. The storage shaft 133 can also be equipped with a drive motor to drive the storage shaft 133 to rotate the storage connector 220, or the end of the storage shaft 133 away from the housing 100 can extend out of the storage cavity 131, and the storage connector 220 can be stored by rotating the end of the storage shaft 133 away from the housing 100.

[0059] Specifically, the axis of the storage shaft 133 is perpendicular to the side of the housing 100 connected to the storage part 130. The storage shaft 133 is fixed to the housing 100. When the storage box 132 is connected to the housing or the storage shaft 133, the storage box 132 rotates around the axis of the storage shaft 133. Alternatively, the storage box 132 is fixed to the housing 100, and the storage shaft 133 is connected to the housing 100 or the storage box 132, and the storage shaft 133 rotates around its own axis.

[0060] In some embodiments, combined with Figure 2 As shown, a fan 140 is installed inside the housing 100 to dissipate heat from the microcontroller 300. A window is provided at the location of the fan 140 in the housing 100 to allow for air circulation and ventilation, facilitating heat dissipation from the microcontroller 300 and ensuring the safe and reliable use of the temperature monitoring device.

[0061] In some embodiments, the microcontroller 300 is provided with a power input interface and a power output interface 350, which are connected in series to the power supply circuit of the target being detected. The temperature probe 210 is used to monitor the temperature of the detected point of the target being detected. The microcontroller 300 can cut off the output of the power output interface 350 when the temperature of the detected point exceeds a preset temperature. The microcontroller 300 is connected to a temperature comparison circuit, and the output of the temperature comparison circuit is connected to a solid-state relay. When the temperature comparison circuit outputs a high level, the microcontroller 300 drives the solid-state relay to cut off the output of the power output interface 350, thereby cutting off the power supply to the target being detected. This fast disconnection prevents damage to the target being detected or the temperature monitoring device.

[0062] In some embodiments, the microcontroller 300 includes a communication module for transmitting temperature data measured by the temperature sensing component 200 to a monitoring center. The communication module includes a wireless transmission chip soldered onto the microcontroller 300, which transmits the temperature data measured by the temperature sensing component 200 to the monitoring center. Alternatively, the communication module includes a 5G module for transmitting the temperature data measured by the temperature sensing component 200 to the monitoring center. The microcontroller 300 also includes a storage module for storing data, including the temperature and time at which the measured temperature exceeds a preset temperature at the detected point.

[0063] The communication module transmits the temperature data measured by the temperature sensing component 200 to the monitoring center. The storage module stores the data, enabling the monitoring center to receive temperature data and operational status information in real time. Monitoring personnel can visually observe the operation of the monitored target at the monitoring center. Collected temperature data and alarm information are stored for subsequent querying and analysis. Various statistical reports and trend charts can be generated based on the data received by the monitoring center, helping managers understand the long-term operating trends of the monitored target and predict potential failure risks. When an abnormal alarm is received during operation, the monitoring center immediately displays the alarm information for monitoring personnel to handle, such as remotely cutting off the power.

[0064] The stored data includes the temperature and time when the measured temperature data exceeds the preset temperature of the monitored point, so that monitoring personnel can analyze and prevent situations where the measured temperature data exceeds the preset temperature of the monitored point.

[0065] This application also provides an oven, including a chamber and a temperature monitoring device as described above. The temperature monitoring device includes a mounting part 120 for fixing the temperature monitoring device to the outer wall of the oven. The chamber is provided with a detection hole, and a temperature probe 210 extends through the detection hole into the interior of the chamber to monitor the temperature.

[0066] In some embodiments, for example, a portion of the connector 220 or one end of the temperature probe 210 is fixed by a magnetic base or adhesive layer to be fixed inside the chamber for continuous temperature monitoring at the detection point. After a portion of the connector 220 is removed from the storage part 130, the temperature monitoring device is fixed to the chamber by the mounting part 120 for temperature measurement and recording by the microcontroller 300.

[0067] In some embodiments, the power input interface of the microcontroller 300 is connected to a power source, and the oven is powered through the power output interface 350 of the microcontroller 300. The microcontroller 300 is connected to a temperature comparison circuit, and the output of the temperature comparison circuit is connected to a solid-state relay. When the temperature comparison circuit outputs a high level, the microcontroller 300 drives the solid-state relay to cut off the output of the power output interface 350, thereby cutting off the power supply to the oven. This fast disconnection prevents damage to the oven or the temperature monitoring device. Simultaneously, the storage module stores the temperature and time when the temperature exceeds the preset temperature of the detected point.

[0068] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A temperature monitoring device, characterized in that, include: A temperature measuring assembly includes a temperature measuring probe and a connector, wherein the connector is connected to the temperature measuring probe; The housing includes a storage section detachably mounted on the housing, the temperature measuring component being stored in or removed from the storage section, and the housing being detachably mounted on the target being detected; A microcontroller is disposed inside the housing, and the temperature probe is electrically connected to the microcontroller. The microcontroller is used to collect temperature data measured by the temperature probe.

2. The temperature monitoring device according to claim 1, characterized in that: The housing includes an attachment for removably adhering to the outer wall of the target being tested.

3. The temperature monitoring device according to claim 1, characterized in that: The connector is a flexible cable that passes through the storage section and the housing and is electrically connected to the microcontroller.

4. The temperature monitoring device according to claim 3, characterized in that: The storage part includes a storage box, the interior of which forms a storage cavity. The storage box is provided with an extension opening, which is used for the temperature measuring component to be stored in or extend out of the storage cavity. The storage part includes a limiting member, which is used to limit the length of the connector after it extends out.

5. The temperature monitoring device according to claim 4, characterized in that: The storage section includes a storage shaft, which is disposed within the storage cavity, and the connector is wound around the storage shaft.

6. The temperature monitoring device according to claim 5, characterized in that: The storage shaft is disposed on the side of the housing used to house the storage box, wherein: The storage shaft is fixed to the housing, and the storage box is connected to either the housing or the storage shaft, allowing the storage box to rotate relative to the storage shaft; or... The storage box is fixed to the housing, and the storage shaft is connected to the housing or the storage box, and the storage shaft can rotate relative to the storage box.

7. The temperature monitoring device according to claim 1, characterized in that: A fan is provided on the housing corresponding to the microcontroller, and the fan is used to dissipate heat from the microcontroller.

8. The temperature monitoring device according to claim 1, characterized in that: The microcontroller is provided with a power input interface and a power output interface. The power input interface and the power output interface are used to connect in series to the power supply circuit of the target being detected. The temperature probe is used to monitor the temperature of the detection point of the target being detected. The microcontroller can cut off the output of the power output interface when the temperature at the detected point exceeds a preset temperature.

9. The temperature monitoring device according to claim 1, characterized in that: The microcontroller includes a communication module and / or a storage module. The communication module is used to transmit the temperature data measured by the temperature measuring component to the monitoring center, and the storage module is used to store the data.

10. An oven, characterized in that, include: The temperature monitoring device as described in any one of claims 1 to 9.

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