Clamping device for semiconductor testing

Abstract

This utility model relates to the field of semiconductor testing, and more particularly to a clamping device for semiconductor testing. It includes a support device and a clamping mechanism. The support device includes a base, on which the clamping mechanism and a support device are mounted. The clamping mechanism includes a movable clamp, which is sleeved on the outer wall of the base. A fixed clamp is fixedly connected to the upper edge of the base. Several sliding holes, evenly distributed front and back, are opened through the left and right ends of the movable and fixed clamps. A clamping mechanism is installed within the sliding holes. The clamping mechanism includes a sliding rod, which is slidably disposed within the sliding holes. A clamping block is fixedly connected to one end of the sliding rod that is close to the other. A spring surrounds the outer wall of the sliding rod. Through the added clamping mechanism, the spring pushes the clamping block to conform to the outer wall of the semiconductor element, maintaining the shape of the semiconductor element's outer wall, improving the clamping effect, and avoiding damage to the element caused by rigid clamping.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor testing, specifically relating to a clamping device for semiconductor testing. Background Technology

[0002] Clamping devices in semiconductor testing are key tools for fixing, positioning, and connecting semiconductor devices, ensuring the stability of electrical signals and machinery during testing. With the rapid development of semiconductor technology, the shapes and structures of semiconductor components are becoming increasingly diverse, resulting in a large number of semiconductor components with irregular outer walls.

[0003] Ordinary semiconductor testing clamping devices typically use fixed jaws to hold semiconductors. These fixed jaws are rigid structures, which can meet basic clamping requirements when holding regularly shaped semiconductor components. However, when dealing with semiconductor components with irregular outer walls, the clamping surface shape of the jaws is fixed and cannot adaptively adjust to the irregular outer walls of the semiconductor component. This results in rigid clamping, which leads to problems during the clamping process. Either the jaws do not make sufficient contact with the outer wall of the component, resulting in uneven distribution of clamping force and difficulty in clamping the component, affecting the stability of the testing process; or the clamping force is too large in some areas, causing damage to the semiconductor component. This risk of damage is even higher for some precision and fragile semiconductor components, seriously affecting the efficiency and quality of semiconductor testing. Utility Model Content

[0004] To overcome the problem that semiconductor testing fixtures are not easy to adapt to components with uneven outer walls, resulting in difficulty in clamping or damage to the components, a semiconductor testing clamping device is proposed.

[0005] The technical solution of this utility model is as follows: a clamping device for semiconductor testing, including a supporting device and a clamping mechanism. The supporting device includes a base, and the clamping mechanism and a support device are installed on the supporting device. The clamping mechanism includes a movable clamp, which is sleeved on the outer wall of the base. A fixed clamp is fixedly connected to the upper edge of the base. Several sliding holes are equidistantly distributed at the front and back ends of the movable clamp and the fixed clamp. A clamping mechanism is installed in the sliding holes. The clamping mechanism includes a sliding rod, which is slidably disposed in the sliding hole. A clamping block is fixedly connected to one end of the sliding rod that is close to each other. A spring is wrapped around the outer wall of the sliding rod. The one end of the spring that is close to each other is fixedly connected to the one end of the clamping block that is far from each other. The one end of the spring that is far from each other is fixedly connected to the one end of the movable clamp or the one end of the fixed clamp that is close to each other. A sliding groove and a sliding block are respectively opened at the front and back ends of the clamping block. The sliding groove and the sliding block between adjacent clamping blocks are adapted to each other. A soft pad is installed at the one end of the clamping blocks that is close to each other on the left and right sides.

[0006] Furthermore, the upper end of the base is provided with a symmetrical sliding groove, and the inner wall of the movable clamp is fixed with a symmetrical slider, which is slidably disposed in the sliding groove.

[0007] Furthermore, an electric cylinder is installed at the lower end of the base, and the output end of the electric cylinder is fixed to the left end of the movable clamp. The extension direction of the slide groove is the same as the extension and retraction direction of the output end of the electric cylinder.

[0008] Furthermore, the left and right end clamps are provided with slots at the ends that are close to each other, and the soft pads are fixed with blocks at the ends that are far apart from each other, with the blocks and slots matching each other.

[0009] Furthermore, the support device includes a second slider, and the inner walls of the left and right ends of the base are provided with two grooves. The second slider is slidably disposed in the grooves, and the ends of the second slider that are close to each other are fixedly connected to a movable seat.

[0010] Furthermore, the front and rear ends of the movable seat are provided with four sliding grooves, and four sliding blocks are slidably arranged in the four sliding grooves. The ends of the four sliding blocks that are far apart from each other are fixedly connected to a movable sleeve, and a support frame is fixedly connected to the upper end of the movable sleeve.

[0011] Furthermore, a stud is rotatably mounted on one end of the support frame and the movable sleeve that are close to each other. A support plate is threaded onto the outer wall of the stud. Limiting holes are opened through the upper and lower ends of the support plate, and the inner wall of the limiting holes fits against the outer wall of the support frame.

[0012] The beneficial effects of this utility model are as follows: The movable clamp can move left and right along the outer wall of the base, thereby moving closer to or away from the fixed clamp. This allows the clamping mechanisms to move closer or further apart from each other. The movable clamp can drive the sliding rods to move closer to each other, so that the clamping blocks approach and press against the left and right ends of the component. Several clamping blocks distributed at equal intervals can work with springs to push the clamping blocks to fit the outer wall of the component. Compared with existing semiconductor test fixtures, the added clamping mechanism can use springs to push the clamping blocks to fit against the outer wall of the semiconductor component, so that the clamping blocks maintain the shape of the outer wall of the semiconductor component, improve the clamping effect, and avoid damage to the component caused by rigid clamping. Attached Figure Description

[0013] Figure 1 The diagram shown is a three-dimensional structural schematic of this utility model;

[0014] Figure 2 The diagram shown is a three-dimensional structural disassembly diagram of this utility model;

[0015] Figure 3 The diagram shown is a three-dimensional structural disassembled view of the support device of this utility model;

[0016] Figure 4 The diagram shown is a three-dimensional disassembled view of the clamping mechanism of this utility model.

[0017] Figure 5 The diagram shown is a three-dimensional disassembled view of the clamping mechanism of this utility model.

[0018] Figure 6 The diagram shown is a three-dimensional disassembled view of the support device of this utility model.

[0019] Explanation of reference numerals in the attached drawings: 1. Bearing device; 101. Base; 102. Slide groove one; 103. Slide groove two; 2. Clamping mechanism; 201. Movable clamp; 202. Fixed clamp; 203. Slide hole; 204. Slider one; 205. Electric cylinder; 3. Clamping mechanism; 301. Slide rod; 302. Clamping block; 303. Spring; 304. Slide groove three; 305. Slider three; 306. Slot; 307. Clamping block; 308. Soft pad; 4. Support device; 401. Movable seat; 402. Slider two; 403. Slide groove four; 404. Slider four; 405. Movable sleeve; 406. Support frame; 407. Stud; 408. Support plate; 409. Limiting hole. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Please see Figures 1-6 This utility model provides an embodiment of a semiconductor testing clamping device, including a support device 1 and a clamping mechanism 2. The support device 1 includes a base 101, and the clamping mechanism 2 and a support device 4 are mounted on the support device 1. The clamping mechanism 2 includes a movable clamp 201, which is sleeved on the outer wall of the base 101. A fixed clamp 202 is fixedly connected to the upper edge of the base 101. Several sliding holes 203, evenly distributed front and back, are opened through the left and right ends of the movable clamp 201 and the fixed clamp 202. A clamping mechanism 3 is installed in the sliding holes 203. The clamping mechanism 3 includes a sliding rod 301. The rod 301 is slidably disposed in the sliding hole 203. The ends of the rod 301 that are close to each other are fixedly connected to the clamping block 302. The outer wall of the rod 301 is surrounded by a spring 303. The ends of the spring 303 that are close to each other are fixedly connected to the ends of the clamping block 302 that are far apart from each other. The ends of the spring 303 that are far apart from each other are fixedly connected to the ends of the movable clamp 201 or the fixed clamp 202 that are close to each other. The front and rear ends of the clamping block 302 are respectively provided with a sliding groove 304 and a slider 305. The sliding groove 304 and the slider 305 between adjacent clamping blocks 302 are adapted to each other. The ends of the clamping blocks 302 that are close to each other at the left and right ends are provided with soft pads 308.

[0022] The movable clamp 201 can move left and right along the outer wall of the base 101, thereby moving closer to or away from the fixed clamp 202. This allows the clamping mechanisms 3 to move closer or further apart from each other. The movable clamp 201 can drive the slide bar 301 to move closer to each other, so that the clamping block 302 moves closer to and presses the left and right ends of the component. Several clamping blocks 302 distributed at equal intervals can cooperate with the spring 303 to push the clamping block 302 to adapt to the outer wall of the component, thereby improving the clamping effect on the component and avoiding damage to the component from direct clamping.

[0023] Please see Figures 3-4 In this embodiment, the upper end of the base 101 is provided with a symmetrical sliding groove 102. The inner wall of the movable clamp 201 is fixedly connected with a symmetrical slider 204. The slider 204 is slidably disposed in the sliding groove 102. In use, the slider 204 cooperates with the sliding groove 102 to improve the stability of the movable clamp 201 when it moves. The lower end of the base 101 is equipped with an electric cylinder 205. The output end of the electric cylinder 205 is fixedly connected to the left end of the movable clamp 201. The extension direction of the sliding groove 102 is the same as the extension direction of the output end of the electric cylinder 205. In use, the output end of the electric cylinder 205 can drive the movable clamp 201 to move left and right along the sliding groove 102, so that the movable clamp 201 is close to the fixed clamp 202 to complete the clamping of the semiconductor device.

[0024] Please see Figures 3-6 In this embodiment, the left and right clamping blocks 302 are provided with a slot 306 at their close ends, and the soft pads 308 are fixedly connected to a block 307 at their far ends. The block 307 and the slot 306 are compatible. In use, the soft pads 308 can be easily disassembled and installed by the block 307 and the slot 306, so that the soft pads 308 can be replaced individually. The support device 4 includes a second slider 402. The inner walls of the left and right ends of the base 101 are provided with a second sliding groove 103. The second slider 402 is slidably disposed in the second sliding groove 103. The close ends of the second slider 402 are fixedly connected to a movable seat 401. In use, the movable seat 401 can be moved back and forth by the second slider 402 and the second sliding groove 103, which improves the stability during movement.

[0025] Please see Figure 6 In this embodiment, the movable seat 401 has sliding grooves 403 at both ends. Sliding sliders 404 are slidably arranged in the sliding grooves 403. The ends of the sliding sliders 404 that are far apart from each other are fixedly connected to a movable sleeve 405. The upper end of the movable sleeve 405 is fixedly connected to a support frame 406. In use, the sliding grooves 403 and the sliding sliders 404 can improve the stability of the movable sleeve 405 moving left and right. The ends of the support frame 406 and the movable sleeve 405 that are close to each other are rotatably mounted with studs 407. The outer wall of the stud 407 is threaded with a support plate 408. The upper and lower ends of the support plate 408 are provided with limit holes 409. The inner wall of the limit holes 409 fits against the outer wall of the support frame 406. In use, by rotating the stud 407, the support plate 408 can move up and down along the outer wall of the support frame 406, thereby supporting the lower end of the semiconductor element and improving the stability of clamping.

[0026] During operation, first, push the movable seat 401 and pull the movable sleeve 405 to move the support plate 408 to the appropriate position. Then, according to the clamping requirements, rotate the stud 407 to adjust the height of the support plate 408. Next, place the component to be clamped on the upper end of the support plate 408. Then, start the electric cylinder 205 so that the output end of the electric cylinder 205 drives the movable clamp 201 closer to the fixed clamp 202, so that the clamping blocks 302 are close to each other to clamp the outer wall of the component. Then, according to the shape of the outer wall of the component, fine-tune the electric cylinder 205 so that the spring 303 pushes the clamping blocks 302 to fit and adapt to the outer wall of the component, thus completing the clamping of the component. Finally, use tools to test the component.

[0027] Through the above steps, the movable clamp 201 can move left and right along the outer wall of the base 101, thereby moving closer to or away from the fixed clamp 202. This allows the clamping mechanisms 3 to move closer or further apart from each other. The movable clamp 201 can drive the slide bar 301 to move closer to each other, so that the clamping block 302 moves closer to and presses the left and right ends of the component. Several clamping blocks 302 distributed at equal intervals can cooperate with the spring 303 to push the clamping block 302 to adapt to the outer wall of the component. This solves the problem that the fixture for semiconductor testing is not easy to adapt to components with uneven outer walls, which leads to difficulty in clamping or damage to the components.

Claims

1. A clamping device for semiconductor testing, comprising a support device (1) and a clamping mechanism (2), characterized in that: The bearing device (1) includes a base (101), and a clamping mechanism (2) and a support device (4) are installed on the bearing device (1). The clamping mechanism (2) includes a movable clamp (201), which is sleeved on the outer wall of the base (101). A fixed clamp (202) is fixedly connected to the upper edge of the base (101). Several sliding holes (203) are equidistantly distributed at the front and back ends of the movable clamp (201) and the fixed clamp (202). A clamping mechanism (3) is installed in the sliding holes (203). The clamping mechanism (3) includes a sliding rod (301), which is slidably disposed in the sliding holes (203). A clamping block (302) is fixed to one end of the rod (301) that is close to each other. A spring (303) is surrounded on the outer wall of the sliding rod (301). The end of the spring (303) that is close to each other is fixed to the end of the clamping block (302) that is far apart from each other. The end of the spring (303) that is far apart from each other is fixed to the end of the movable clamp (201) or the end of the fixed clamp (202) that is close to each other. The front and rear ends of the clamping block (302) are respectively provided with a sliding groove (304) and a slider (305). The sliding groove (304) and the slider (305) between adjacent clamping blocks (302) are adapted to each other. A soft pad (308) is installed at the end of the clamping blocks (302) that is close to each other on the left and right sides.

2. The clamping device for semiconductor testing according to claim 1, characterized in that: The upper end of the base (101) is provided with a front-to-back symmetrical sliding groove (102), and the inner wall of the movable clamp (201) is fixed with a front-to-back symmetrical slider (204), which is slidably disposed in the sliding groove (102).

3. The clamping device for semiconductor testing according to claim 2, characterized in that: An electric cylinder (205) is installed at the lower end of the base (101). The output end of the electric cylinder (205) is fixed to the left end of the movable clamp (201). The extension direction of the slide groove (102) is the same as the extension direction of the output end of the electric cylinder (205).

4. The clamping device for semiconductor testing according to claim 1, characterized in that: The left and right clamping blocks (302) are provided with a slot (306) at the end that is close to each other, and the soft pad (308) is fixed with a block (307) at the end that is far away from each other. The block (307) and the slot (306) are compatible.

5. The clamping device for semiconductor testing according to claim 1, characterized in that: The support device (4) includes a second slider (402), and the inner walls of the left and right ends of the base (101) are provided with a second groove (103). The second slider (402) is slidably disposed in the second groove (103), and the two ends of the second slider (402) that are close to each other are fixedly connected to a movable seat (401).

6. The clamping device for semiconductor testing according to claim 5, characterized in that: The movable seat (401) has four sliding grooves (403) at both ends. Sliding blocks (404) are slidably arranged in the four sliding grooves (403). The ends of the four sliding blocks (404) that are far apart from each other are fixedly connected to a movable sleeve (405). The upper end of the movable sleeve (405) is fixedly connected to a support frame (406).

7. The clamping device for semiconductor testing according to claim 6, characterized in that: The support frame (406) and the movable sleeve (405) are rotatably mounted together at their respective ends. The outer wall of the stud (407) is threaded with a support plate (408). Limiting holes (409) are opened through the upper and lower ends of the support plate (408). The inner wall of the limiting hole (409) fits against the outer wall of the support frame (406).

Images