A vacuum adsorption fixture for testing integrated circuit chips

Abstract

This utility model relates to the field of chip testing device technology, and in particular to a vacuum adsorption fixture for testing integrated circuit chips. It includes a control switch handle, a vacuum adsorption module head, and a suction / air jet connection structure. The control switch handle is fixedly mounted on the vacuum adsorption module head, and the suction / air jet connection structure is also mounted on the vacuum adsorption module head. This utility model, through the cooperation of the control switch handle, the vacuum adsorption module head, and the suction / air jet connection structure, sets the vacuum adsorption fixture in a suspended manner, placing the testing device below the vacuum adsorption fixture. This allows for integrated picking and vacuum adsorption, eliminating the need for other gripping devices to pick up the integrated circuit chip under test. The entire testing process is simple, efficient, and helps reduce the probability of damage to the integrated circuit chip during testing due to repeated picking and placing.

Description

Technical Field

[0001] This utility model relates to a fixture, and more particularly to a vacuum adsorption fixture for testing integrated circuit chips, belonging to the technical field of chip testing devices. Background Technology

[0002] Integrated circuit chip testing vacuum adsorption fixtures are devices used to fix wafers during chip testing. They securely fix the wafers to the testing platform through vacuum adsorption, ensuring the accuracy and stability of the test. Vacuum adsorption fixtures play a very important role in integrated circuit chip testing, but with the continuous improvement of measurement accuracy requirements, the challenges they face are becoming increasingly prominent.

[0003] Existing integrated circuit chip testing vacuum adsorption fixtures are usually table-top structures. During operation, the testing device is placed on top of the vacuum adsorption fixture. The testing process requires another gripping device to pick up the integrated circuit chip to be tested. The whole process is very cumbersome, and the repeated picking and placing increases the chance of damage to the integrated circuit chip during testing. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a simple and efficient vacuum adsorption fixture for testing integrated circuit chips, or a vacuum adsorption device for testing integrated circuit chips.

[0005] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows:

[0006] A vacuum adsorption fixture for testing integrated circuit chips, comprising:

[0007] The vacuum adsorption module head is set at the bottom of the vacuum adsorption fixture as a base.

[0008] A control switch handle is fixedly installed on the vacuum adsorption module head, and the control switch handle is used by the operator to control the vacuum adsorption module head;

[0009] A suction-air connection structure is installed on the vacuum adsorption module head, and the suction-air connection structure is used to realize vacuum adsorption and air jet cleaning of the vacuum adsorption module head.

[0010] Furthermore, the control switch handle includes a C-shaped support frame, a control handle disposed at the opening of the C-shaped support frame, and a receiving control module disposed at the top of the C-shaped support frame, wherein the C-shaped support frame is fixedly installed on the head of the vacuum adsorption module.

[0011] Furthermore, the control handle includes a non-slip handle, a jet switch button located on the non-slip handle near the receiving control module, and a suction switch button.

[0012] Furthermore, the air intake and exhaust connection structure includes a main air pipe, an exhaust pipe connected to the top of the main air pipe, a hollow bolt connected to the bottom of the main air pipe, an exhaust pipe connected to the side of the main air pipe, a first electrically controlled valve on the exhaust pipe, and a second electrically controlled valve on the exhaust pipe.

[0013] Furthermore, the jet switch button is electrically connected to the receiving control module, the suction switch button is electrically connected to the receiving control module, the first electrically controlled valve is electrically connected to the receiving control module, and the second electrically controlled valve is electrically connected to the receiving control module.

[0014] Furthermore, the vacuum adsorption module head includes a support module, a plurality of valve mounting slots formed on the bottom surface of the support module, a self-selecting shut-off valve installed in the valve mounting slots, a vent hole formed in the support module connecting the plurality of valve mounting slots, and a mounting through hole formed on the upper surface of the support module.

[0015] Furthermore, the mounting through hole is connected to the vent hole, the hollow bolt is installed in the mounting through hole, limit fixing rings are symmetrically arranged on both sides of the support module, a silicone sleeve is fitted on the bottom of the support module, and several locking holes corresponding to several air valve mounting slots are opened through the silicone sleeve.

[0016] Furthermore, the self-selecting shut-off valve includes a hollow mounting housing, an internal hexagonal mounting groove formed on the bottom surface of the hollow mounting housing, a filter plate snapped into the internal hexagonal mounting groove, a sealing ball movably installed in the hollow mounting housing, and a spring spring that installs the sealing ball between the sealing ball and the top surface of the inner cavity of the hollow mounting housing.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] This invention, through the coordinated operation of the control switch handle, the vacuum adsorption module head, and the suction and air connection structure, allows the vacuum adsorption fixture to be configured as a suspended type, with the testing device positioned below the vacuum adsorption fixture. This enables the picking and vacuum adsorption to be performed in one integrated process, eliminating the need for other gripping devices to pick up the integrated circuit chip under test. The entire testing process is simple, efficient, and helps reduce the probability of damage to the integrated circuit chip due to repeated picking and placing during testing. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the control switch handle structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the air intake and exhaust connection structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the vacuum adsorption module head structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the self-selecting shut-off air valve structure of this utility model;

[0024] Figure 6 This is a schematic diagram of the bottom appearance structure of this utility model.

[0025] In the diagram: 1. Control switch handle; 2. Vacuum adsorption module head; 3. Inhalation and exhaust connection structure; 4. C-shaped support frame; 5. Control handle; 6. Receiver control module; 7. Anti-slip handle; 8. Exhaust switch button; 9. Exhaust switch button; 10. Main air pipe; 11. Exhaust pipe; 12. Hollow bolt; 13. Exhaust pipe; 14. First electrically controlled valve; 15. Second electrically controlled valve; 16. Support module; 17. Air valve mounting slot; 18. Self-selecting shut-off air valve; 19. Vent hole; 20. Mounting through hole; 21. Spring; 22. Limiting and fixing ring; 23. Silicone sleeve; 24. Clip hole; 25. Hollow mounting sleeve; 26. Hexagonal socket mounting groove; 27. Filter plate; 28. Sealing ball. Detailed Implementation

[0026] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] like Figures 1-6 As shown, the integrated circuit chip testing vacuum adsorption fixture provided in this embodiment includes:

[0028] Vacuum adsorption module head 2, which is set at the bottom of the vacuum adsorption fixture as a base;

[0029] Control switch handle 1 is fixedly installed on vacuum adsorption module head 2. It is used by the operator to operate vacuum adsorption module head 2 and control its operation switch. Vacuum adsorption module head 2 is used to control the vacuum adsorption clamping and fixing of the integrated circuit chip to be tested.

[0030] The suction and air jet connection structure 3 is installed on the vacuum adsorption module head 2. The suction and air jet connection structure 3 is used to realize the vacuum adsorption and air jet cleaning of the vacuum adsorption module head 2. It can connect the external air extraction pipe and the air jet pipe to the vacuum adsorption module head 2 through the suction and air jet connection structure 3.

[0031] Furthermore, such as Figure 2 , Figure 6 As shown, the control switch handle 1 includes a C-shaped support frame 4, a control handle 5 disposed at the opening of the C-shaped support frame 4, and a receiving control module 6 disposed at the top of the C-shaped support frame 4. The C-shaped support frame 4 is fixedly installed on the vacuum adsorption module head 2 by bolts. The C-shaped support frame 4 is used to fix and support the control handle 5. The control handle 5 is used by the operator to hold the vacuum adsorption module head 2 and control its opening and closing during operation. The receiving control module 6 is used to receive the instructions issued by the control handle 5 and control the action of the suction and air jet connection structure 3 according to the instructions. The receiving control module 6 is a conventional module in the prior art. Any control module that can receive control instructions and control the action of the corresponding structure can be applied in this application. Its specific structure and usage method will not be described in detail.

[0032] Furthermore, such as Figure 2 , Figure 6 As shown, the control handle 5 includes an anti-slip handle 7, a jet switch button 8 located on the anti-slip handle 7 near the receiving control module 6, and a vacuum switch button 9 located on the anti-slip handle 7 below the jet switch button 8. The anti-slip handle 7 is for the user to hold. The jet switch button 8 is used to issue a jet command to the receiving control module 6, causing the receiving control module 6 to open the second electronically controlled valve 15. Gas is sprayed out from the vacuum adsorption module head 2 to clean foreign objects, dust, etc. in the self-selected closed air valve 18. The vacuum switch button 9 is used to issue a vacuum command to the receiving control module 6, causing the receiving control module 6 to open the first electronically controlled valve 14. Gas is extracted from the vacuum adsorption module head 2, forming a negative pressure zone on the lower surface of the vacuum adsorption module head 2, which adsorbs and clamps the integrated circuit chip located below the vacuum adsorption module head 2.

[0033] Furthermore, such as Figure 3 , Figure 6As shown, the suction-jet connection structure 3 includes a main air pipe 10, an extraction pipe 11 connected to the top of the main air pipe 10 and a jet pipe 13 on the side, a hollow bolt 12 connected to the bottom of the main air pipe 10, a first electrically controlled valve 14 on the extraction pipe 11, and a second electrically controlled valve 15 on the jet pipe 13. The main air pipe 10 is used for gas to flow into or out of the vacuum adsorption module head 2. The extraction pipe 11 is used to connect the device to an external vacuum machine, thereby enabling the device to achieve vacuum adsorption characteristics. The hollow bolt 12 is used to install the suction-jet connection structure 3 on the support module 16. The jet pipe 13 is used to connect the device to an external jet machine, enabling it to achieve jet cleaning characteristics. The first electrically controlled valve 14 is used to control the opening and closing of the extraction pipe 11, and the second electrically controlled valve 15 is used to control the opening and closing of the jet pipe 13.

[0034] Furthermore, such as Figure 2 , Figure 6 As shown, the jet switch button 8 is electrically connected to the receiving control module 6, the air extraction switch button 9 is electrically connected to the receiving control module 6, the first electrically controlled valve 14 is electrically connected to the receiving control module 6, and the second electrically controlled valve 15 is electrically connected to the receiving control module 6. This facilitates the receiving control module 6 to receive commands from the jet switch button 8 or the air extraction switch button 9, and to control the first electrically controlled valve 14 or the second electrically controlled valve 15 to perform operations according to the commands.

[0035] Furthermore, such as Figure 3 , Figure 4 and Figure 6 As shown, the vacuum adsorption module head 2 includes a support module 16, several valve mounting slots 17 formed on the bottom surface of the support module 16, self-selecting shut-off valves 18 installed in the valve mounting slots 17, vent holes 19 formed in the support module 16 connecting the several valve mounting slots 17, and mounting through holes 20 formed on the upper surface of the support module 16. The support module 16 is used to fix and support the several self-selecting shut-off valves 18. The valve mounting slots 17 allow the self-selecting shut-off valves 18 to be embedded in the support module 16. The self-selecting shut-off valves 18 are used to ensure that the air extraction holes covered by objects operate normally, while the air extraction holes not covered by objects are blocked, thus preventing the generation of additional adsorption force. The vent holes 19 allow the several valve mounting slots 17 to communicate with each other. The mounting through holes 20 are used for hollow bolts 12 to be installed on the support module 16.

[0036] Furthermore, such as Figure 3 , Figure 4 and Figure 6As shown, the mounting through hole 20 is connected to the vent hole 19. The hollow bolt 12 is installed in the mounting through hole 20. Limiting and fixing rings 22 are symmetrically arranged on both sides of the support module 16. A silicone sleeve 23 is fitted on the bottom of the support module 16. Several locking holes 24 corresponding to several air valve mounting slots 17 are opened through the silicone sleeve 23. The two limiting and fixing rings 22 are used to limit and fix the device on the testing instrument. The silicone sleeve 23 is used to protect the integrated circuit chip adsorbed and clamped, and also makes the adsorption of the integrated circuit chip more firm. The locking holes 24 are used to allow the several air valve mounting slots 17 to operate normally.

[0037] Furthermore, such as Figure 4 , Figure 5 and Figure 6 As shown, the self-selective shut-off valve 18 includes a hollow mounting housing 25, an internal hexagonal mounting groove 26 formed on the bottom surface of the hollow mounting housing 25, a filter plate 27 snapped into the internal hexagonal mounting groove 26, a sealing ball 28 movably mounted in the hollow mounting housing 25, and a spring 21 between the sealing ball 28 and the top surface of the inner cavity of the hollow mounting housing 25. The hollow mounting housing 25 is used to protect the internal parts of the self-selective shut-off valve 18, and the internal hexagonal mounting groove 26 is used to engage tools to open the self-selective shut-off valve 18. 8 is installed in the self-selection shut-off valve 18. The filter plate 27 prevents large foreign objects from entering the self-selection shut-off valve 18. The installation sealing ball 28 is used to block the inner hole of the hollow mounting sleeve 25 when a large amount of air enters, so that the air extraction hole that is not covered by an object is blocked, thus preventing the generation of additional suction force. Only the air extraction hole covered by an object will work normally and generate the suction force to adsorb and fix the integrated circuit chip. The elastic spring 21 is used to block the installation sealing ball 28 in the inner hole of the hollow mounting sleeve 25 and has the ability to reset.

[0038] like Figures 1-6 As shown, the principle of the integrated circuit chip testing vacuum adsorption fixture provided in this embodiment is as follows: When using the device, it is first softly connected to the testing instrument through the support frame and elastic connecting rope. The testing instrument should be equipped with a buckle assembly for fixing. The buckle assembly is used to cooperate with the two limiting and fixing rings 22 to limit and fix the device when testing the integrated circuit chip. The jet pipe 13 is connected to the external jet machine, and the suction pipe 11 is connected to the external vacuum machine.

[0039] The integrated circuit chip to be tested is placed next to the operator. The operator holds the non-slip handle 7 and attaches the support module 16, which is equipped with several self-selectable shut-off air valves 18 and silicone sleeves 23, to the upper surface of the integrated circuit chip to be tested. The operator presses the air extraction switch button 9 to transmit the operation command to the receiving control module 6. The receiving control module 6 controls the first electronically controlled valve 14 to open. The external vacuum machine quickly evacuates the air in the support module 16 through the air extraction pipe 11 and the main air pipe 10, so that a negative pressure zone is formed on the bottom surface of the support module 16. The integrated circuit chip to be tested, which is attached to the bottom surface of the support module 16, is quickly and firmly adsorbed onto the support module 16.

[0040] Only the valve mounting slots 17 covered by the integrated circuit chip under test, which are equipped with self-selective shut-off valves 18, have adsorption force. The uncovered valve mounting slots 17, which are equipped with self-selective shut-off valves 18, do not have adsorption force due to the large airflow. This causes the sealing ball 28 to block the inner hole of the hollow mounting sleeve 25. Therefore, the uncovered valve mounting slots 17, which are equipped with self-selective shut-off valves 18, do not have adsorption force and will not affect the testing of the integrated circuit chip. The operator moves the support module 16, which adsorbs and fixes the integrated circuit chip, to the fixing buckle on the testing instrument and fastens the fixing buckle to the two limiting fixing rings 22. The integrated circuit chip is then tested by the testing instrument.

[0041] After the test, the operator releases the fixing buckle from the two limiting fixing rings 22 and moves the device with the tested integrated circuit chip adsorbed to the tray. The operator presses the air extraction switch button 9 again to transmit the operation command to the receiving control module 6 to control the first electronically controlled valve 14 to close. The external vacuum machine blocks the air in the support module 16 through the air extraction pipe 11 and the main air pipe 10. No negative pressure area is formed on the bottom surface of the support module 16. The integrated circuit chip to be tested adsorbed on the bottom surface of the support module 16 will quickly detach from the support module 16 so that the next integrated circuit chip can be tested.

[0042] After a period of use, the device can be paused. The operator presses the jet switch button 8 to transmit the operation command to the receiving control module 6, which controls the second electrically controlled valve 15 to open. Gas enters from the jet pipe 13 and is quickly ejected from the vacuum adsorption module head 2 through the main gas pipe 10, cleaning the vacuum adsorption module head 2 and the testing instrument to prevent foreign objects from falling onto the testing instrument or clogging the vacuum adsorption module head 2. After cleaning, the operator presses the jet switch button 8 again to make the receiving control module 6 receive the operation command and control the second electrically controlled valve 15 to close. However, when using the device, the first electrically controlled valve 14 and the second electrically controlled valve 15 must always be in a state of simultaneous closure or one of them being open, and cannot be opened at the same time.

[0043] The foregoing description illustrates and describes preferred embodiments of the present invention. It should be understood that the present invention is not limited to the forms disclosed herein. Any modifications and variations made by those skilled in the art without departing from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A vacuum adsorption fixture for testing integrated circuit chips, characterized in that, include: The vacuum adsorption module head (2) is set at the bottom of the vacuum adsorption fixture as a base; Control switch handle (1), the control switch handle (1) is fixedly installed on the vacuum adsorption module head (2), the control switch handle (1) is used by the operator to control the vacuum adsorption module head (2). The suction and air jet connection structure (3) is installed on the vacuum adsorption module head (2). The suction and air jet connection structure (3) is used to realize vacuum adsorption and air jet cleaning of the vacuum adsorption module head (2).

2. The integrated circuit chip testing vacuum adsorption fixture according to claim 1, characterized in that: The control switch handle (1) includes a C-shaped support frame (4), a control handle (5) set at the opening of the C-shaped support frame (4), and a receiving control module (6) set at the top of the C-shaped support frame (4). The C-shaped support frame (4) is fixedly installed on the vacuum adsorption module head (2).

3. The integrated circuit chip testing vacuum adsorption fixture according to claim 2, characterized in that: The control handle (5) includes a non-slip handle (7), a jet switch button (8) and a suction switch button (9) located on the non-slip handle (7) near the receiving control module (6).

4. The integrated circuit chip testing vacuum adsorption fixture according to claim 3, characterized in that: The air intake and exhaust connection structure (3) includes a main air pipe (10), an exhaust pipe (11) connected to the top of the main air pipe (10) and an exhaust pipe (13) on the side, a hollow bolt (12) connected to the bottom of the main air pipe (10), a first electrically controlled valve (14) on the exhaust pipe (11) and a second electrically controlled valve (15) on the exhaust pipe (13).

5. The integrated circuit chip testing vacuum adsorption fixture according to claim 4, characterized in that: The jet switch button (8) is electrically connected to the receiving control module (6), the air extraction switch button (9) is electrically connected to the receiving control module (6), the first electrically controlled valve (14) is electrically connected to the receiving control module (6), and the second electrically controlled valve (15) is electrically connected to the receiving control module (6).

6. The integrated circuit chip testing vacuum adsorption fixture according to claim 4, characterized in that: The vacuum adsorption module head (2) includes a support module (16), a plurality of valve mounting slots (17) formed on the bottom surface of the support module (16), a self-selecting shut-off valve (18) installed in the valve mounting slots (17), a vent hole (19) formed in the support module (16) connecting the plurality of valve mounting slots (17), and a mounting through hole (20) formed on the upper surface of the support module (16).

7. The integrated circuit chip testing vacuum adsorption fixture according to claim 6, characterized in that: The mounting through hole (20) is connected to the vent hole (19), the hollow bolt (12) is installed in the mounting through hole (20), the support module (16) is symmetrically provided with limit fixing rings (22) on both sides, the bottom of the support module (16) is fitted with a silicone sleeve (23), and the silicone sleeve (23) is provided with a number of locking holes (24) corresponding to a number of air valve mounting slots (17).

8. The integrated circuit chip testing vacuum adsorption fixture according to claim 7, characterized in that: The self-selecting shut-off valve (18) includes a hollow mounting housing (25), an internal hexagonal mounting groove (26) formed on the bottom surface of the hollow mounting housing (25), a filter plate (27) snapped into the internal hexagonal mounting groove (26), a sealing ball (28) movably installed in the hollow mounting housing (25), and a spring spring (21) between the sealing ball (28) and the top surface of the inner cavity of the hollow mounting housing (25).

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