A wafer test probe station with heat dissipation function

Abstract

This utility model discloses a wafer testing probe station with heat dissipation function, including a base, a connecting frame fixedly connected to the top of the base, a motor fixedly connected to the bottom of the connecting frame, an output shaft of the motor passing through the connecting frame and fixedly connected to a water-cooling plate at the top, a water-cooling pipe disposed inside the water-cooling plate, a pump body fixedly connected to one side of the connecting frame, the pump body and the water-cooling pipe fixedly connected, a water tank fixedly connected to the top of the base, an inlet pipe fixedly connected between the water tank and the pump body, and a return pipe fixedly connected between the end of the water-cooling pipe away from the pump body and the water tank. This utility model, by activating the pump body, draws coolant from inside the water tank into the water-cooling pipe. The water-cooling pipe contacts a heat-conducting plate at the bottom of the support plate. The heat generated during wafer testing is transferred to the heat-conducting plate. The coolant flows within the water-cooling pipe and exchanges heat with the heat-conducting plate, thereby carrying away the heat and achieving wafer heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, specifically a wafer testing probe station with heat dissipation function. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seed crystals. Then it is slowly pulled out to form a cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, which is a wafer. Before the wafer is produced and put into use, it needs to be tested in advance using testing equipment to ensure that it works properly.

[0003] According to CN219936037U, a wafer test probe station allows for more precise connection of probes to the wafer during electrical testing. When a wafer needs to be electrically powered, an electric push rod A mounted on the top of the base pushes the support frame, and the longitudinal position of the support frame is adjusted to synchronously adjust the longitudinal position of the probes. Then, an electric push rod B mounted in the guide rail adjusts the lateral position of the moving seat within the guide rail. This moving seat then adjusts the lateral position of the mounting bracket located at the front of the mounting plate. Once the lateral position of the mounting bracket is adjusted, a marker light mounted at the bottom of the controller marks the position where the probes need to be connected to the power supply. This design allows for more accurate connection between the probes and the wafer, making it more practical. Finally, the electric push rod A on the top of the base drives the support frame downwards, allowing the probes mounted at the bottom of the mounting bracket to connect with the wafer, facilitating subsequent testing.

[0004] The aforementioned structures, such as needles and markers, can be used to inspect wafers. However, during wafer testing, the wafer heats up due to contact with the needles, current loading, and the operation of internal circuitry. If the local temperature of the wafer becomes too high, it can easily lead to oxidation or thermal damage to the wafer surface, causing damage to the wafer. Utility Model Content

[0005] The purpose of this invention is to provide a wafer test probe station with heat dissipation function to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a wafer test probe station with heat dissipation function, comprising a base, a connecting frame fixedly connected to the top of the base, a motor fixedly connected to the bottom of the connecting frame, the output shaft of the motor passing through the connecting frame and fixedly connected to a water-cooling plate at the top, a water-cooling pipe disposed inside the water-cooling plate, a pump body fixedly connected to one side of the connecting frame, the pump body and the water-cooling pipe being fixedly connected, a water tank fixedly connected to the top of the base, an inlet pipe fixedly connected between the water tank and the pump body, and a return pipe fixedly connected between the end of the water-cooling pipe away from the pump body and the water tank.

[0007] As a further preferred embodiment of this technical solution, an exhaust fan is fixedly connected to the side of the connecting frame away from the pump body, a support plate is fixedly connected to the top of the water-cooled plate, a connecting pipe is fixedly connected between the support plate and the exhaust fan, and multiple air ducts are provided on the top of the support plate.

[0008] As a further preferred embodiment of this technical solution, electric push rods are symmetrically arranged on both sides of the top of the base, and a mounting plate is fixedly connected to the top of the electric push rods.

[0009] As a further preferred embodiment of this technical solution, guide posts are fixedly connected to the four top corners of the base, the guide posts are slidably connected to the mounting plate, and a support spring is movably sleeved on the surface of the guide posts, the support spring being located between the base and the mounting plate.

[0010] As a further preferred embodiment of this technical solution, motors are symmetrically arranged on both sides of the bottom of the mounting plate. The output shaft of the motors passes through the mounting plate and is fixedly connected to a rotating plate at the top. A rotating seat is fixedly connected to the top of the rotating plate. An adjusting block is rotatably connected inside the rotating seat. An adjusting screw is provided between the adjusting block and the rotating seat. A plum blossom handle is fixedly connected to one end of the adjusting screw. A nut is threadedly connected to the side of the adjusting screw away from the plum blossom handle, and the nut is fixed to one side of the rotating seat.

[0011] As a further preferred embodiment of this technical solution, a cylinder is fixedly connected to the top of the adjusting block, and grid meshes are symmetrically arranged at both ends of the cylinder, with a cooling fan installed inside the cylinder.

[0012] As a further preferred embodiment of this technical solution, a longitudinal moving frame is provided on the top edge of the mounting plate, and a transverse moving frame is provided on the side of the longitudinal moving frame near the support plate. A test probe is provided in the output direction of the transverse moving frame.

[0013] This invention provides a wafer test probe station with heat dissipation function, which has the following beneficial effects:

[0014] (1) In this utility model, when the wafer is tested, the pump body is started to pump the coolant inside the water tank into the water cooling pipe. The water cooling pipe and the heat-conducting plate at the bottom of the support plate are in contact. The heat generated by the wafer test is transferred to the heat-conducting plate. At the same time, the coolant flows in the water cooling pipe and exchanges heat with the heat-conducting plate, thereby carrying away the heat to achieve heat dissipation of the wafer and avoid the wafer from being damaged due to excessive temperature.

[0015] (2) By connecting the power supply, the system controls the cooling fan to work, thereby accelerating the airflow at the contact position between the test probe and the wafer, so that the heat generated by the test can be quickly dissipated into the air with the airflow. The second motor is started, and its output shaft drives the rotating plate and rotating seat to rotate. The cylinder drives the cooling fan to rotate, thereby adjusting the air outlet range to improve the heat dissipation effect. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the exhaust fan structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the water-cooled plate and water-cooled pipe structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the mounting plate structure of this utility model;

[0020] Figure 5 This is a schematic diagram of the grid structure of this utility model;

[0021] Figure 6 This is a schematic diagram of the cross-sectional structure of the cylindrical body of this utility model.

[0022] In the diagram: 1. Base; 2. Connecting frame; 3. Motor 1; 4. Water-cooled plate; 5. Water-cooled pipe; 6. Pump body; 7. Inlet pipe; 8. Water tank; 9. Return pipe; 10. Exhaust fan; 11. Connecting pipe; 12. Support plate; 13. Air duct; 14. Electric push rod; 15. Mounting plate; 16. Guide column; 17. Support spring; 18. Motor 2; 19. Rotating plate; 20. Rotary seat; 21. Adjusting block; 22. Adjusting screw; 23. Plum blossom handle; 24. Nut; 25. Cylinder; 26. Grille; 27. Cooling fan; 28. Longitudinal moving frame; 29. ​​Lateral moving frame; 30. Test probe. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0024] This utility model provides a technical solution: such as Figures 1 to 6As shown in this embodiment, a wafer test probe station with heat dissipation function includes a base 1, a connecting frame 2 fixedly connected to the top of the base 1, a motor 3 fixedly connected to the bottom of the connecting frame 2, the output shaft of the motor 3 passing through the connecting frame 2 and fixedly connected to a water-cooling plate 4 at the top, a water-cooling pipe 5 disposed inside the water-cooling plate 4, a pump body 6 fixedly connected to one side of the connecting frame 2, the pump body 6 and the water-cooling pipe 5 fixedly connected, a water tank 8 fixedly connected to the top of the base 1, an inlet pipe 7 fixedly connected between the water tank 8 and the pump body 6, and a return pipe 9 fixedly connected between the end of the water-cooling pipe 5 away from the pump body 6 and the water tank 8.

[0025] The pump body 6 is started to pump the coolant inside the water tank 8 into the water-cooling pipe 5. The water-cooling pipe 5 contacts the heat-conducting plate at the bottom of the support plate 12. The heat generated by the wafer testing is transferred to the heat-conducting plate. At the same time, the coolant flows in the water-cooling pipe 5 and exchanges heat with the heat-conducting plate, thereby carrying away the heat to dissipate heat from the wafer and prevent the wafer from being damaged due to excessive temperature. After heat exchange, the coolant flows back to the water tank 8 through the return pipe 9. The water tank 8 is equipped with a heat-insulating baffle to block the two parts of coolant. The temperature of the coolant is detected by a temperature sensor installed in the inner cavity of the water tank 8. After the heat is dissipated, it can be pumped back into the other inner cavity of the water tank 8 for water cooling, realizing the recycling of resources.

[0026] A fan 10 is fixedly connected to the side of the connecting frame 2 away from the pump body 6. A support plate 12 is fixedly connected to the top of the water-cooled plate 4. A connecting pipe 11 is fixedly connected between the support plate 12 and the fan 10. Multiple air ducts 13 are provided on the top of the support plate 12.

[0027] The exhaust fan 10 is turned on to extract the air between the wafer and the support plate 12 through the air duct 13. Under the action of air pressure, the wafer is fixed to the support plate 12. While fixing the wafer, friction with other components can be reduced, thus avoiding damage to the wafer.

[0028] Electric push rods 14 are symmetrically arranged on both sides of the top of the base 1, and a mounting plate 15 is fixedly connected to the top of the electric push rods 14.

[0029] Guide posts 16 are fixedly connected to the four corners of the top of the base 1. The guide posts 16 and the mounting plate 15 are slidably connected. A support spring 17 is movably sleeved on the surface of the guide posts 16. The support spring 17 is located between the base 1 and the mounting plate 15.

[0030] When the electric push rod 14 is activated, its output rod pushes or pulls the mounting plate 15 up and down to adjust the height of the test probe 30, which facilitates wafer inspection. During the movement, the mounting plate 15 and the guide post 16 slide, and the support spring 17 deforms, thereby ensuring stability during the movement.

[0031] Motor 2 18 is symmetrically arranged on both sides of the bottom of the mounting plate 15. The output shaft of motor 2 18 passes through the mounting plate 15 and is fixedly connected to the top of the rotating plate 19. Rotary seat 20 is fixedly connected to the top of the rotating plate 19. Adjusting block 21 is rotatably connected inside the rotating seat 20. Adjusting screw 22 is arranged between the adjusting block 21 and the rotating seat 20. One end of the adjusting screw 22 is fixedly connected to a plum blossom handle 23. A nut 24 is threadedly connected to the side of the adjusting screw 22 away from the plum blossom handle 23, and the nut 24 is fixed to one side of the rotating seat 20.

[0032] Rotate the plum blossom handle 23 to make the adjusting screw 22 rotate inside the nut 24, the rotating seat 20 and the adjusting block 21 separate, and the cylinder 25 can rotate through the adjusting block 21, thereby adjusting the tilt angle of the cylinder 25 to change the air outlet angle.

[0033] The top of the adjusting block 21 is fixedly connected to the cylinder 25, and the two ends of the cylinder 25 are symmetrically provided with grid mesh 26. The inside of the cylinder 25 is provided with a cooling fan 27.

[0034] When the power is turned on, the control system makes the cooling fan 27 work, thereby increasing the airflow speed at the contact position between the test probe 30 and the wafer, so that the heat generated by the test can be quickly dissipated into the air with the airflow. The motor 18 is started, and its output shaft drives the rotating plate 19 and the rotating base 20 to rotate. The cylinder 25 drives the cooling fan 27 to rotate, thereby adjusting the air outlet range to improve the heat dissipation effect.

[0035] A longitudinal moving frame 28 is provided on the top edge of the mounting plate 15, and a transverse moving frame 29 is provided on the side of the longitudinal moving frame 28 near the support plate 12. A test probe 30 is provided in the output direction of the transverse moving frame 29.

[0036] This invention provides a wafer test probe station with heat dissipation function, and its specific working principle is as follows:

[0037] In use, the wafer is placed on the support plate 12, and the exhaust fan 10 is turned on to extract the air between the wafer and the support plate 12, fixing the wafer to the support plate 12 under air pressure. The test probe 30 is moved to a suitable position by the longitudinal moving frame 28 and the transverse moving frame 29. The electric push rod 14 operates and drives the mounting plate 15 to move down, so that the test probe 30 contacts the wafer, thereby testing the wafer. At the same time as the test, the pump body 6 is turned on to pump the coolant inside the water tank 8 into the water cooling pipe 5. The water cooling pipe 5 is connected to the heat conduction plate at the bottom of the support plate 12. When the test probe 30 touches the wafer, the heat generated during the test is transferred to the heat-conducting plate. The coolant flows in the water-cooling pipe 5 and exchanges heat with the heat-conducting plate, thereby carrying away the heat and dissipating heat to the bottom of the wafer. This also activates the cooling fan 27, which accelerates the airflow at the contact point between the test probe 30 and the wafer, allowing the heat generated during the test to dissipate quickly into the air. The motor 28 is then started, and its output shaft drives the rotating plate 19 and the rotating base 20 to rotate. The cylinder 25 drives the cooling fan 27 to rotate, thereby adjusting the airflow direction to adapt to the testing at different positions on the wafer.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer test probe station with heat dissipation function, comprising a base (1), characterized in that: A connecting frame (2) is fixedly connected to the top of the base (1), and a motor (3) is fixedly connected to the bottom of the connecting frame (2). The output shaft of the motor (3) passes through the connecting frame (2) and is fixedly connected to a water-cooled plate (4) at the top. A water-cooled pipe (5) is provided inside the water-cooled plate (4). A pump body (6) is fixedly connected to one side of the connecting frame (2). The pump body (6) and the water-cooled pipe (5) are fixedly connected. A water tank (8) is fixedly connected to the top of the base (1). An inlet pipe (7) is fixedly connected between the water tank (8) and the pump body (6). A return pipe (9) is fixedly connected between the end of the water-cooled pipe (5) away from the pump body (6) and the water tank (8).

2. A wafer test probe station with heat dissipation function according to claim 1, characterized in that: The connecting frame (2) is fixedly connected to the side away from the pump body (6) with a fan (10), the top of the water-cooled plate (4) is fixedly connected with a support plate (12), a connecting pipe (11) is fixedly connected between the support plate (12) and the fan (10), and multiple air ducts (13) are provided on the top of the support plate (12).

3. A wafer test probe station with heat dissipation function according to claim 1, characterized in that: Electric push rods (14) are symmetrically arranged on both sides of the top of the base (1), and an installation plate (15) is fixedly connected to the top of the electric push rods (14).

4. A wafer test probe station with heat dissipation function according to claim 1, characterized in that: The base (1) has guide posts (16) fixedly connected to the top four corners. The guide posts (16) and the mounting plate (15) are slidably connected. A support spring (17) is movably sleeved on the surface of the guide posts (16). The support spring (17) is located between the base (1) and the mounting plate (15).

5. A wafer test probe station with heat dissipation function according to claim 3, characterized in that: Motor 2 (18) is symmetrically arranged on both sides of the bottom of the mounting plate (15). The output shaft of the motor 2 (18) passes through the mounting plate (15) and is fixedly connected to the top of the rotating plate (19). The top of the rotating plate (19) is fixedly connected to the rotating seat (20). An adjusting block (21) is rotatably connected inside the rotating seat (20). An adjusting screw (22) is provided between the adjusting block (21) and the rotating seat (20). One end of the adjusting screw (22) is fixedly connected to a plum blossom handle (23). A nut (24) is threadedly connected to the side of the adjusting screw (22) away from the plum blossom handle (23), and the nut (24) is fixed to one side of the rotating seat (20).

6. A wafer test probe station with heat dissipation function according to claim 5, characterized in that: The top of the adjusting block (21) is fixedly connected to a cylinder (25), and grid mesh (26) is symmetrically arranged at both ends of the cylinder (25). A cooling fan (27) is arranged inside the cylinder (25).

7. A wafer test probe station with heat dissipation function according to claim 3, characterized in that: The top edge of the mounting plate (15) is provided with a longitudinal moving frame (28), and the side of the longitudinal moving frame (28) near the support plate (12) is provided with a transverse moving frame (29). The output direction of the transverse moving frame (29) is provided with a test probe (30).

Images