A tiled server heat pipe vapor chamber sandwich

Abstract

This utility model discloses a spliced ​​server heat pipe vapor chamber sandwich, belonging to the field of electronic device heat dissipation technology. It includes a vapor chamber body and a support plate, with a sandwich body disposed between the vapor chamber body and the support plate. Extension blocks are fixedly connected to both sides of the sandwich body. Installation bolts are threadedly connected between the vapor chamber body, the extension blocks, and the support plate. In this utility model, the extension blocks on both sides of the sandwich body are aligned with the threaded holes of the vapor chamber body and the support plate, and are then fastened using installation bolts. This facilitates quick and easy assembly and disassembly, eliminating the need for maintenance personnel to spend a significant amount of time operating the system, preventing prolonged server downtime, ensuring business continuity, and further reducing maintenance costs. The sandwich body adopts a sandwich structure of a surface layer, a buffer layer, and a base layer, preventing interruption of the heat conduction path or increased contact thermal resistance, improving the heat transfer efficiency between the vapor chamber and the heat pipe, enabling rapid and uniform heat dissipation, preventing localized overheating, and ensuring the overall heat dissipation of the server.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and in particular to a spliced ​​server heat pipe vapor chamber sandwich layer. Background Technology

[0002] In a modular server, the heat pipe vapor chamber is a specific structural layer located between the heat pipes and the vapor chamber. Situated at the junction of the heat pipes and the vapor chamber, it is typically a thin layer composed of materials with specific properties. This layer may include thermally conductive materials, insulating materials, and cushioning materials to meet various functional requirements.

[0003] The existing heat pipe vapor chamber interlayer for modular servers still has the following areas for improvement during use:

[0004] 1. It is usually inconvenient to disassemble and assemble quickly. If the mezzanine design is complex and the disassembly and assembly steps are cumbersome, maintenance personnel need to spend a lot of time operating, resulting in long-term server downtime, affecting business continuity, and further increasing maintenance costs.

[0005] 2. Poor stability of the sandwich structure can lead to interruption of the heat conduction path or increase contact thermal resistance, reducing the heat transfer efficiency between the heat spreader and the heat pipe. This may prevent heat from spreading quickly and evenly, resulting in local overheating and affecting the overall heat dissipation of the server. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies by proposing a spliced ​​server heat pipe vapor chamber.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a spliced ​​server heat pipe heat pipe heat pipe sandwich panel, comprising a heat pipe body and a support plate, wherein a sandwich panel body is provided between the heat pipe body and the support plate, and extension blocks are fixedly connected to both sides of the sandwich panel body, and mounting bolts are threadedly connected between the heat pipe body, the extension blocks and the support plate, and a heat pipe body is connected to the support plate.

[0008] As a further description of the above technical solution:

[0009] The sandwich body includes a surface layer, a buffer layer, and a base layer, with the buffer layer connected and disposed between the surface layer and the base layer.

[0010] As a further description of the above technical solution:

[0011] Several sets of grooves are formed on the base layer.

[0012] As a further description of the above technical solution:

[0013] The base layer is made of oxygen-free copper.

[0014] As a further description of the above technical solution:

[0015] The buffer layer is made of silicone rubber.

[0016] As a further description of the above technical solution:

[0017] The surface layer is made of titanium.

[0018] This utility model has the following beneficial effects:

[0019] 1. In this utility model, the extension blocks on both sides of the sandwich body are aligned with the threaded holes of the heat spreader body and the support plate, and are fastened with mounting bolts. This facilitates quick assembly and disassembly, eliminates the need for maintenance personnel to spend a lot of time operating, avoids long-term server downtime, ensures business continuity, and further reduces maintenance costs.

[0020] 2. In this utility model, the sandwich body adopts a sandwich structure of surface layer, buffer layer and base layer to avoid interruption of heat conduction path or increase contact thermal resistance, improve the heat transfer efficiency between heat spreader and heat pipe, make heat spread quickly and evenly, prevent local overheating, and ensure the overall heat dissipation of server. Attached Figure Description

[0021] Figure 1 This is a first-view view of a spliced ​​server heat pipe vapor chamber sandwich layer proposed in this utility model.

[0022] Figure 2 This is a second-view view of a spliced ​​server heat pipe vapor chamber sandwich layer proposed in this utility model.

[0023] Figure 3 This is a structural diagram of the interlayer body of a spliced ​​server heat pipe vapor chamber proposed in this utility model.

[0024] Figure 4 This is a diagram of the base structure of a spliced ​​server heat pipe vapor chamber sandwich layer proposed in this utility model.

[0025] Legend:

[0026] 1. Heat spreader body; 2. Extension block; 3. Sandwich body; 4. Support plate; 5. Mounting bolts; 6. Heat pipe body; 7. Surface layer; 8. Buffer layer; 9. Base layer; 10. Groove. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Reference Figures 1-4 An embodiment of this utility model is provided: a spliced ​​server heat pipe heat pipe heat pipe sandwich panel, including a heat pipe body 1 and a support plate 4, a sandwich panel body 3 is provided between the heat pipe body 1 and the support plate 4, extension blocks 2 are fixedly connected to both sides of the sandwich panel body 3, and mounting bolts 5 are threadedly connected between the heat pipe body 1, the extension blocks 2 and the support plate 4, and a heat pipe body 6 is connected to the support plate 4.

[0029] The sandwich body 3 includes a surface layer 7, a buffer layer 8 and a base layer 9. The buffer layer 8 is connected between the surface layer 7 and the base layer 9. Several sets of grooves 10 are formed on the base layer 9. The base layer 9 is made of oxygen-free copper, the buffer layer 8 is made of silicone rubber, and the surface layer 7 is made of titanium, which improves corrosion resistance and structural strength.

[0030] Working principle: The heat spreader body 1 achieves heat conduction and structural support through the sandwich body 3 and the support plate 4. The sandwich body 3 adopts a sandwich structure of surface layer 7, buffer layer 8, and base layer 9. The base layer 9 is made of oxygen-free copper. Several sets of grooves 10 on its surface increase the contact area with the heat pipe body 6 and enhance the heat conduction efficiency. The buffer layer 8 is made of silicone rubber and is filled between the surface layer 7 and the base layer 9 to absorb the vibration of the server operation and prevent the heat pipe interface from loosening. The surface layer 7 is made of titanium to improve corrosion resistance and structural strength. During assembly, the extension blocks 2 on both sides of the sandwich body 3 are aligned with the threaded holes of the heat spreader body 1 and the support plate 4, and the connection is fastened with mounting bolts 5, so that the heat pipe body 6 is embedded in the grooves 10 of the base layer 9 to form a stable heat path. Finally, it achieves multi-layer synergistic heat dissipation and structural reliability assurance through titanium surface protection, silicone rubber buffering and oxygen-free copper heat conduction.

[0031] All electrical components mentioned in this article are electrically connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. The detailed description of known functions and known components is omitted in the specific embodiments disclosed herein. To ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] This solution is merely a structural design based on existing heat pipes and vapor chambers on the market. The structural technology of heat pipes and vapor chambers themselves is already very mature and has been widely used. Heat pipes and vapor chambers are common knowledge in this field and will not be described in detail here. At the same time, this application does not protect the specific structure of heat pipes and vapor chambers. Those skilled in the art can select heat pipes and vapor chambers based on practical experience and usage requirements.

[0034] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A tiled server heat pipe vapor chamber sandwich comprising a vapor chamber body (1) and a support plate (4), characterized in that: A sandwich body (3) is provided between the heat spreader body (1) and the support plate (4). Extension blocks (2) are fixedly connected to both sides of the sandwich body (3). Mounting bolts (5) are threadedly connected between the heat spreader body (1), the extension blocks (2) and the support plate (4). A heat pipe body (6) is connected to the support plate (4).

2. The sandwiched server heat pipe vapor chamber of claim 1, wherein: The interlayer body (3) includes a surface layer (7), a buffer layer (8) and a base layer (9), wherein the buffer layer (8) is connected and disposed between the surface layer (7) and the base layer (9).

3. The sandwich of claim 2, wherein: The base layer (9) has several sets of grooves (10).

4. The sandwich of claim 2, wherein: The base layer (9) is made of oxygen-free copper.

5. The sandwiched heat pipe MHP for servers of claim 2, wherein: The buffer layer (8) is made of silicone rubber.

6. The sandwiched heat pipe MHP for servers of claim 2, wherein: The surface layer (7) is made of titanium.

Images