Power supply and chassis

Abstract

This application relates to a power supply and chassis. The power supply includes: a housing; a fan mounted on the housing and configured to blow air in a first direction; a first circuit board mounted on the housing, arranged in a direction opposite to the first direction, with the top layer of the first circuit board facing the fan; and a second circuit board mounted on the first circuit board and at least partially located between the first circuit board and the fan. The second circuit board has a first surface, a second surface, and a side surface. The first and second surfaces are arranged opposite to each other. At least one of the first and second surfaces is equipped with a heat-generating element. The side surface connects to the first and second surfaces, with a portion of the side surface facing the fan, allowing the airflow generated by the fan to directly act on the first and second surfaces. Compared to traditional power supplies with only a single PCB, the power supply provided in this application has better heat dissipation, which is beneficial for improving the stability of the power supply and the reliability of electronic components.

Description

Technical Field

[0001] This application relates to the field of power supply heat dissipation technology, and in particular to power supplies and chassis. Background Technology

[0002] In traditional computer power supplies, all functional circuits are concentrated on a single PCB, which is mounted flush against the bottom wall of the power supply casing. The fan is mounted above the PCB and blows air downwards to dissipate heat. This layout suffers from poor heat dissipation. Utility Model Content

[0003] Therefore, it is necessary to provide a power supply and chassis that can improve heat dissipation.

[0004] In a first aspect, embodiments of this application provide a power supply, which includes a housing, a fan, a first circuit board, and a second circuit board. The fan is mounted on the housing and configured to blow air in a first direction. The first circuit board is mounted on the housing, with its top layer facing the fan in a direction opposite to the first direction. The second circuit board is mounted on the first circuit board and at least partially located between the first circuit board and the fan. The second circuit board has a first surface, a second surface, and a side surface. The first and second surfaces are disposed opposite to each other. At least one of the first and second surfaces is equipped with a heat-generating element. The side surface connects to the first and second surfaces, with a portion of the side surface facing the fan, so that the airflow generated by the fan can directly act on the first and second surfaces.

[0005] This power supply has at least the following beneficial effects:

[0006] In the power supply provided in this application, the PCB is at least divided into a first circuit board and a second circuit board, with the top layer of the first circuit board facing the fan, allowing the airflow generated by the fan to directly act on the first and second surfaces. This ensures good heat dissipation on both the fan-facing side of the first circuit board and both sides of the second circuit board. Compared to traditional power supplies with only a single PCB, the power supply provided in this application offers better heat dissipation, which improves power supply stability, enhances the reliability of electronic components, and extends the actual lifespan of electronic components.

[0007] In some embodiments, the top layer of the first circuit board has a third surface facing the fan. The first surface and / or the second surface are perpendicular to the third surface.

[0008] This configuration can improve the heat dissipation of the power supply.

[0009] In some embodiments, the power supply further includes a third circuit board mounted on the first circuit board; the third circuit board and the second circuit board are spaced apart along a second direction, and the third circuit board has a fourth surface and a fifth surface disposed opposite to each other.

[0010] In some embodiments, the second surface and the fourth surface are disposed opposite to each other, at least one of the second surface and the fourth surface is equipped with a heat sink, and both the first surface and the fifth surface are equipped with heat-generating elements.

[0011] This design helps dissipate the heat generated by the heating element, thus improving the power supply's heat dissipation effect.

[0012] In some embodiments, the fan includes a mounting portion and a plurality of fan blades mounted on the mounting portion. The fan has a mounting area surrounding the mounting portion, and the plurality of fan blades are spaced apart in the mounting area. In the opposite direction to the first direction, the projections of the heating elements mounted on the first and fifth surfaces are at least partially within the mounting area, and the projections of the heating elements mounted on the first and fifth surfaces are separate from the projection of the mounting portion.

[0013] This design allows the heat-generating components to be located in front of the fan blades, thus achieving better heat dissipation through the airflow from the fan.

[0014] In some embodiments, a first air duct is provided between the second surface and the fourth surface along the second direction, and the first air duct is located on one side of the mounting portion along the first direction.

[0015] This design helps to improve the structural compactness of the power supply.

[0016] In some embodiments, along a first direction, portions of the projection of the second circuit board, portions of the projection of the third circuit board, and portions of the projection of the fan are located outside the first circuit board.

[0017] In some embodiments, the housing includes a first wall along a first direction, the first wall being located on the side of the first circuit board away from the fan, and the first wall being spaced apart from the first circuit board.

[0018] With this configuration, the air blown out by the fan can enter the space between the first wall and the first circuit board through the first air duct, thereby dissipating heat on the side of the first circuit board away from the fan, which is beneficial to improving the heat dissipation effect of the power supply.

[0019] In some embodiments, the power supply further includes a fourth circuit board connected to the third circuit board and located on the side of the third circuit board facing away from the second circuit board. Along a first direction, the projection of the fourth circuit board overlaps with the projection of the first circuit board.

[0020] This design not only facilitates good heat dissipation for the fourth circuit board and improves the heat dissipation effect of the power supply, but also makes the power supply structure more compact.

[0021] In some embodiments, the first circuit board is an auxiliary power supply board, the second circuit board is a PFC board, the third circuit board is a DC-DC board, and the fourth circuit board is a BUCK board.

[0022] This setup serves two purposes. First, it disperses heat sources, preventing localized overheating and improving the power supply's heat dissipation. Second, each functional module (PFC, DC-DC, BUCK) is on its own board, avoiding mutual interference and facilitating individual debugging, testing, or replacement.

[0023] In some embodiments, the power supply further includes a constraint member comprising a rod, a first elastic arm, and a second elastic arm. The first and second elastic arms are arranged along the length of the rod. One end of the first elastic arm is connected to the rod, and the other end of the first elastic arm extends toward the second elastic arm. One end of the second elastic arm is connected to the rod, and the other end of the second elastic arm extends toward the first elastic arm. A second circuit board has a first connecting hole extending along a second direction, and a third circuit board has a second connecting hole extending along the second direction. The rod passes through the first and second connecting holes. A first surface abuts against the end of the first elastic arm facing the second elastic arm, a second surface abuts against the rod, a fifth surface abuts against the end of the second elastic arm facing the first elastic arm, and a fourth surface abuts against the rod.

[0024] This configuration, where the second and third circuit boards are fixed together by the constraint components, helps prevent them from tilting. Furthermore, the connection between the constraint components and the second and third circuit boards is a snap-fit ​​connection. This facilitates connection and prevents excessive pressure on the second and third circuit boards, thus protecting them.

[0025] In some embodiments, the power supply further includes a fifth circuit board, which is vertically mounted on top of the first circuit board. Along a third direction, the fifth circuit board includes a sixth surface and a seventh surface disposed opposite to each other. The sixth surface faces the second and third circuit boards, and the seventh surface is equipped with output terminals. The first direction, the second direction, and the third direction are perpendicular to each other.

[0026] This configuration, with the output function modules on independent boards, helps avoid mutual interference between circuits and facilitates individual debugging, testing, or replacement. Furthermore, the fifth, second, and third circuit boards are arranged in a Π-shape, which improves heat dissipation and enhances the power supply's cooling performance.

[0027] In some embodiments, the housing includes an air inlet, an air outlet, and an interface. Along a first direction, the air inlet is located on the side of the fan away from the first circuit board. Along a third direction, the air outlet is located on one side of the fifth circuit board, and the interface is located on the other side of the fifth circuit board. The interface exposes the output terminals. Along a second direction, a first air duct is formed between the second and fourth surfaces, a second air duct is formed between the first surface and the housing, and a third air duct is formed between the fifth surface and the housing. Along a third direction, the first, second, and third air ducts are located between the air outlet and the fifth circuit board.

[0028] With this configuration, during fan operation, cool outside air enters the first, second, and third air ducts from the air inlet along the first direction, and then exits the casing through the exhaust section along the third direction. This effectively removes heat from the power supply, ensuring good heat dissipation.

[0029] Secondly, embodiments of this application provide a chassis that includes the power supply described above.

[0030] This chassis has at least the following beneficial effects:

[0031] In the chassis provided in this application, the power supply PCB is at least divided into a first circuit board and a second circuit board. The top layer of the first circuit board faces the fan, allowing the airflow generated by the fan to directly act on both the first and second surfaces. This ensures good heat dissipation on both sides of the first circuit board facing the fan and on both sides of the second circuit board. Compared to traditional power supplies with only a single PCB, the power supply in the chassis provided in this application has better heat dissipation, which improves power supply stability, enhances the reliability of electronic components, and extends the actual lifespan of electronic components, thereby improving the reliability and lifespan of the chassis. Attached Figure Description

[0032] Figure 1 This is a perspective view of a power supply according to an embodiment of this application;

[0033] Figure 2 for Figure 1 An exploded view of the power supply shown.

[0034] Figure 3 for Figure 2 A three-dimensional schematic diagram of the middle section structure;

[0035] Figure 4 for Figure 3 An exploded view of the structure shown;

[0036] Figure 5 for Figure 4 A structural diagram of part of the fan shown;

[0037] Figure 6 for Figure 4 A three-dimensional schematic diagram of the central constraint component;

[0038] Figure 7 for Figure 1 A three-dimensional schematic diagram of part of the power supply shown;

[0039] Figure 8 for Figure 7 A three-dimensional schematic diagram of the middle section structure;

[0040] Figure 9 for Figure 8 A three-dimensional schematic diagram of the structure shown from another perspective;

[0041] Figure 10 for Figure 8 A three-dimensional schematic diagram of the structure shown from another perspective.

[0042] Figure 11 This is a schematic diagram of a chassis provided in one embodiment of this application.

[0043] Figure label:

[0044] 100. Power supply; 1. Housing; 11. Top cover; 111. Air inlet; 1111. Air inlet; 12. Bottom shell; 121. Exhaust section; 1211. Exhaust outlet; 122. First wall; 13. Output board cover; 131. Interface section; 1311. Clearance hole; 2. Fan; 21. Mounting section; 22. Fan blade; 23. Mounting area; 31. First circuit board; 311. Third surface; 32. Second circuit board; 321. First connector; 322. First connector hole; 323. First surface; 324. Second... Surface; 325, Side; 33, Third circuit board; 331, Second connector; 332, Second connector hole; 333, Fourth surface; 334, Fifth surface; 34, Fourth circuit board; 35, Fifth circuit board; 351, Sixth surface; 352, Seventh surface; 4, Constraint; 41, Rod; 42, First elastic arm; 43, Second elastic arm; 5, Heating element; 6, Heat sink; 7, Output terminal; 8, Insulating sheet; 10, First air duct; 20, Second air duct; 30, Third air duct; 1000, Chassis. Detailed Implementation

[0045] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0046] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0048] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0049] See Figure 1 and Figure 2 This application first provides a power supply 100, which includes a housing 1, a fan 2, a first circuit board 31, and a second circuit board 32. The fan 2 is mounted on the housing 1 and configured to blow air in a first direction. The first circuit board 31 is mounted on the housing 1, with its top layer facing the fan 2 in a direction opposite to the first direction. The second circuit board 32 is mounted on the first circuit board 31 and is at least partially located between the first circuit board 31 and the fan 2. The second circuit board 32 has a first surface 323, a second surface 324, and a side surface 325. The first surface 323 and the second surface 324 are arranged opposite to each other. At least one of the first surface 323 and the second surface 324 is equipped with a heating element 5. The side surface 325 connects the first surface 323 and the second surface 324, with a portion of the side surface 325 facing the fan 2, so that the airflow generated by the fan 2 can directly act on the first surface 323 and the second surface 324.

[0050] In the power supply 100 provided in this application, the PCB is at least divided into a first circuit board 31 and a second circuit board 32. The top layer of the first circuit board 31 faces the fan 2, and the airflow generated by the fan 2 can directly act on the first surface 323 and the second surface 324. In this way, both the side of the first circuit board 31 facing the fan 2 and both sides of the second circuit board 32 can achieve good heat dissipation. Compared with traditional power supplies that only have a single PCB, the power supply 100 provided in this application has better heat dissipation, which is beneficial to improving the stability of the power supply 100, improving the reliability of electronic components, and extending the actual service life of electronic components.

[0051] In some embodiments, the heating element 5 refers to an electronic component that generates heat during operation.

[0052] In some embodiments, see Figure 8 The top layer of the first circuit board 31 has a third surface 311 facing the fan 2, and the first surface 323 is perpendicular to the third surface 311. In this way, the side of the second circuit board 32 containing the first surface 323 can achieve good heat dissipation, and the pins of the various electronic components on the first surface 323 are not blocked by the components themselves, allowing the airflow from the fan 2 to reach these pins. Both of these factors improve the heat dissipation effect of the power supply 100.

[0053] In some embodiments, see Figure 9 The top layer of the first circuit board 31 has a third surface 311 facing the fan 2, and a second surface 324 perpendicular to the third surface 311. This allows for good heat dissipation on the side of the second circuit board 32 where the second surface 324 is located. Furthermore, the pins of the electronic components on the second surface 324 are not obstructed by the components themselves, allowing the airflow from the fan 2 to reach these pins. Both of these factors improve the heat dissipation effect of the power supply 100.

[0054] In some embodiments, the first surface 323 and the second surface 324 are both perpendicular to the third surface 311.

[0055] In some embodiments, the first surface 323 and the second surface 324 may also be slightly tilted relative to the third surface 311. For example, the angle between the first surface 323 and the third surface 311 and the angle between the second surface 324 and the third surface 311 are 80°, 81°, 82°, 83°, 84°, 85°, 86°, 87°, 88° or 89°.

[0056] In some embodiments, see Figures 2 to 4The power supply 100 also includes a third circuit board 33, which is mounted on the first circuit board 31. Along the second direction, the third circuit board 33 is spaced apart from the second circuit board 32, and the third circuit board 33 has a fourth surface 333 and a fifth surface 334 disposed opposite to each other. The second surface 324 is disposed opposite to the fourth surface 333.

[0057] In some embodiments, both the first surface 323 and the fifth surface 334 are equipped with heating elements 5. This facilitates the dissipation of heat generated by the heating elements 5, thereby improving the heat dissipation effect of the power supply 100.

[0058] In some embodiments, see Figure 7 Heat sinks 6 are installed on both the second surface 324 and the fourth surface 333.

[0059] In some embodiments, only the second surface 324 is fitted with the heat sink 6.

[0060] In some embodiments, only the fourth surface 333 is fitted with the heat sink 6.

[0061] In some embodiments, the number of heat sinks 6 can be one or more.

[0062] For example, heat sink 6 is an aluminum heat sink fin.

[0063] In some embodiments, see Figure 2 The fan 2 includes a mounting section 21 and a plurality of fan blades 22 mounted on the mounting section 21. (See also...) Figure 5 The fan 2 has a mounting area 23 surrounding the mounting part 21, and multiple fan blades 22 are arranged at intervals in the mounting area 23. It can be understood that the air blown by the fan 2 is mainly located in front of the fan blades 22.

[0064] In some embodiments, see Figure 2 Along the opposite direction of the first direction, the projections of the heat-generating element 5 mounted on the first surface 323 and the fifth surface 334 are at least partially within the mounting area 23, and the projections of the heat-generating element 5 mounted on the first surface 323 and the fifth surface 334 are separate from the projection of the mounting portion 21. This allows the heat-generating element 5 to be located in front of the fan blade 22 and to receive better heat dissipation under the action of the air blown out by the fan 2.

[0065] In some embodiments, see Figure 3 Along the second direction, a first air duct 10 is provided between the second surface 324 and the fourth surface 333, and the first air duct 10 is located on one side of the mounting part 21 along the first direction. In this way, the mounting part 21 is directly opposite the first air duct 10, which is beneficial for the heating element 5 on the second circuit board 32 and the third circuit board 33 to align with the fan blade 22, and also makes the structure of the power supply 100 more compact.

[0066] In other embodiments, the mounting part 21 and the first air duct 10 may not be directly opposite each other, but rather staggered.

[0067] In some embodiments, see Figure 4 The second circuit board 32 and the third circuit board 33 are arranged in parallel. In other embodiments, the second circuit board 32 and the third circuit board 33 may also be arranged in a figure-eight shape.

[0068] In some embodiments, see Figure 4 Along the first direction, the projected portion of the second circuit board 32, the projected portion of the third circuit board 33, and the projected portion of the fan 2 are located outside the first circuit board 31.

[0069] In some embodiments, see Figure 2 The outer casing 1 includes a first wall 122. Along a first direction, the first wall 122 is located on the side of the first circuit board 31 away from the fan 2, and the first wall 122 and the first circuit board 31 are spaced apart. In this way, the air blown out by the fan 2 can enter the space between the first wall 122 and the first circuit board 31 through the first air duct 10, thereby dissipating heat on the side of the first circuit board 31 away from the fan 2, which is beneficial to improving the heat dissipation effect of the power supply 100.

[0070] In some embodiments, see Figures 2 to 4 The power supply 100 also includes a fourth circuit board 34, which is connected to the third circuit board 33 and located on the side of the third circuit board 33 facing away from the second circuit board 32. Along the first direction, the projection of the fourth circuit board 34 overlaps with the projection of the first circuit board 31. This not only facilitates good heat dissipation for the fourth circuit board 34 and improves the heat dissipation effect of the power supply 100, but also makes the power supply 100 more compact.

[0071] In some embodiments, the first circuit board 31 is an auxiliary power supply board.

[0072] In some embodiments, the second circuit board 32 is a PFC board (power factor correction board).

[0073] In some embodiments, the third circuit board 33 is a DC-DC converter board.

[0074] In some embodiments, the fourth circuit board 34 is a BUCK board (step-down converter board).

[0075] When the first circuit board 31 is an auxiliary power supply board, the second circuit board 32 is a PFC board (power factor correction board), the third circuit board 33 is a DC-DC converter board, and the fourth circuit board 34 is a BUCK board (buck converter board), on the one hand, this can disperse the heat source, which helps to avoid localized concentrated heat generation and improves the heat dissipation effect of the power supply 100. On the other hand, each functional module (PFC, DC-DC, BUCK) is on an independent board, avoiding mutual interference between circuits and facilitating individual debugging, testing, or replacement.

[0076] In some embodiments, see Figure 4 and Figure 6 The power supply 100 also includes a constraint member 4, which includes a rod 41, a first elastic arm 42, and a second elastic arm 43. The first elastic arm 42 and the second elastic arm 43 are arranged along the length of the rod 41. One end of the first elastic arm 42 is connected to the rod 41, and the other end of the first elastic arm 42 extends toward the second elastic arm 43. One end of the second elastic arm 43 is connected to the rod 41, and the other end of the second elastic arm 43 extends toward the first elastic arm 42. The second circuit board 32 is provided with a first connecting hole 322 extending along the second direction, and the third circuit board 33 is provided with a second connecting hole 332 extending along the second direction. The rod 41 passes through the first connecting hole 322 and the second connecting hole 332. A first surface 323 abuts against the end of the first elastic arm 42 facing the second elastic arm 43, a second surface 324 abuts against the rod 41, a fifth surface 334 abuts against the end of the second elastic arm 43 facing the first elastic arm 42, and a fourth surface 333 abuts against the rod 41. In this way, the second circuit board 32 and the third circuit board 33 are fixed together by the constraint member 4, which helps to prevent the second circuit board 32 and the third circuit board 33 from tilting. Moreover, the connection between the constraint member 4 and the second circuit board 32 and the third circuit board 33 is a snap-fit ​​connection. On the one hand, this facilitates the connection; on the other hand, it prevents the second circuit board 32 and the third circuit board 33 from being subjected to excessive pressure, which helps to protect the second circuit board 32 and the third circuit board 33.

[0077] In some embodiments, see Figure 4 The constraint member 4, the first connecting hole 322, and the second connecting hole 332 are all provided in multiples and are arranged in a one-to-one correspondence. This is beneficial for the second circuit board 32 and the third circuit board 33 to be stably fixed together. For example, there are 2, 3, or 4 constraint members 4.

[0078] In some embodiments, see Figure 2 and Figure 10The power supply 100 also includes a fifth circuit board 35, which is vertically mounted on top of the first circuit board 31. Along the third direction, the fifth circuit board 35 includes a sixth surface 351 and a seventh surface 352 arranged opposite to each other. The sixth surface 351 faces the second circuit board 32 and the third circuit board 33, and the seventh surface 352 is equipped with output terminals 7. The first, second, and third directions are all perpendicular to each other. This arrangement allows the output function modules to be independently boarded, which helps avoid mutual interference between circuits and facilitates individual debugging, testing, or replacement. Furthermore, the fifth circuit board 35, the second circuit board 32, and the third circuit board 33 are arranged in a Π-shape, which facilitates good heat dissipation and improves the heat dissipation effect of the power supply 100.

[0079] In some embodiments, see Figure 3 A first connecting seat 321 is fixed on the corner of the second circuit board 32 away from the fifth circuit board 35 and the fan 2, and a second connecting seat 331 is fixed on the corner of the third circuit board 33 away from the fifth circuit board 35 and the fan 2. The first connecting seat 321 and the second connecting seat 331 are fixedly connected to the outer casing 1 by threaded connectors.

[0080] In some embodiments, the second circuit board 32, the third circuit board 33 and the fifth circuit board 35 are soldered or plugged into the first circuit board 31, and the fourth circuit board 34 is soldered or plugged into the third circuit board 33.

[0081] In some embodiments, see Figures 1 to 3 The housing 1 includes an air inlet 111, an exhaust 121, and an interface 131. Along a first direction, the air inlet 111 is located on the side of the fan 2 opposite to the first circuit board 31. Along a third direction, the exhaust 121 is located on one side of the fifth circuit board 35, and the interface 131 is located on the other side of the fifth circuit board 35. The interface 131 is used to expose the output terminal 7. Along a second direction, a first air duct 10 is formed between the second surface 324 and the fourth surface 333; a second air duct 20 is formed between the first surface 323 and the housing 1; and a third air duct 30 is formed between the fifth surface 334 and the housing 1. Along a third direction, the first air duct 10, the second air duct 20, and the third air duct 30 are located between the exhaust 121 and the fifth circuit board 35. In this way, during the operation of the fan 2, the cold air from the outside enters the first air duct 10, the second air duct 20 and the third air duct 30 from the air inlet 111 along the first direction, and then exits the outer casing 1 along the third direction through the exhaust duct 121. This can remove the heat inside the power supply 100 and make the power supply 100 well dissipated.

[0082] In some embodiments, see Figure 1 and Figure 2The outer casing 1 includes an upper cover 11, a bottom casing 12, and an output board cover 13. The upper cover 11, the bottom casing 12, and the output board cover 13 are detachably connected together. An air inlet 111 is located on the upper cover 11, an air outlet 121 is located on the bottom casing 12, and an interface 131 is located on the output board cover 13. The air inlet 111 has a plurality of air inlets 1111 evenly distributed, the air outlet 121 has a plurality of air outlets 1211 evenly distributed, and the interface 131 has a plurality of clearance holes 1311 through which the output terminal 7 is exposed. The first circuit board 31, the second circuit board 32, and the third circuit board 33 are all fixed to the bottom casing 12.

[0083] For example, the top cover 11, the bottom shell 12, and the output plate cover 13 are connected together by threads or mortise and tenon joints.

[0084] In some embodiments, see Figure 3 and Figure 4 The power supply 100 also includes an insulating sheet 8, a second circuit board 32 and a third circuit board 33 located on one side of the insulating sheet 8, and a fifth circuit board 35 located on the other side of the insulating sheet 8. The insulating sheet 8 serves as an insulating material.

[0085] See Figure 11 This application further provides a chassis 1000, which includes the aforementioned power supply 100. In the chassis 1000 provided in this application, the PCB of the power supply 100 is at least divided into a first circuit board 31 and a second circuit board 32. The top layer of the first circuit board 31 faces the fan 2, and the airflow generated by the fan 2 can directly act on the first surface 323 and the second surface 324. In this way, both the side of the first circuit board 31 facing the fan 2 and both sides of the second circuit board 32 can obtain good heat dissipation. Compared with the traditional power supply with only a single PCB, the power supply 100 in the chassis 1000 provided in this application has a better heat dissipation effect, which is beneficial to improving the stability of the power supply 100, improving the reliability of electronic components, and extending the actual service life of electronic components, thereby improving the reliability and service life of the chassis 1000.

[0086] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of protection of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the appended claims.

Claims

1. A power supply, characterized in that, include: shell; A fan is mounted on the housing and configured to blow air in a first direction; A first circuit board is mounted on the housing, and the top layer of the first circuit board faces the fan in a direction opposite to the first direction. A second circuit board is mounted on the first circuit board and is at least partially located between the first circuit board and the fan. The second circuit board has a first surface, a second surface, and a side surface. The first surface and the second surface are disposed opposite to each other. At least one of the first surface and the second surface is equipped with a heating element. The side surface connects the first surface and the second surface, and a portion of the side surface faces the fan, so that the airflow generated by the fan can directly act on the first surface and the second surface.

2. The power supply according to claim 1, characterized in that, The top layer of the first circuit board has a third surface, which faces the fan; The first surface and / or the second surface are perpendicular to the third surface.

3. The power supply according to claim 1, characterized in that, The power supply also includes a third circuit board, which is mounted on the first circuit board; along the second direction, the third circuit board and the second circuit board are spaced apart, and the third circuit board has a fourth surface and a fifth surface disposed opposite to each other. The second surface is disposed opposite to the fourth surface, and a heat dissipation component is installed on at least one of the second surface and the fourth surface. The heat dissipation component is installed on both the first surface and the fifth surface.

4. The power supply according to claim 3, characterized in that, The fan includes a mounting part and a plurality of fan blades mounted on the mounting part. The fan has a mounting area surrounding the mounting part, and the plurality of fan blades are arranged at intervals in the mounting area. Along the opposite direction of the first direction, the projection of the heating element mounted on the first surface and the fifth surface is at least partially within the range of the mounting area, and the projection of the heating element mounted on the first surface and the fifth surface is separate from the projection of the mounting portion; Along the second direction, a first air duct is provided between the second surface and the fourth surface, the first air duct being located on one side of the mounting portion along the first direction.

5. The power supply according to claim 4, characterized in that, Along the first direction, the projected portion of the second circuit board, the projected portion of the third circuit board, and the projected portion of the fan are located outside the first circuit board. The housing includes a first wall along the first direction, the first wall being located on the side of the first circuit board away from the fan, and the first wall being spaced apart from the first circuit board.

6. The power supply according to claim 3, characterized in that, The power supply also includes a fourth circuit board, which is connected to the third circuit board and located on the side of the third circuit board facing away from the second circuit board. Along the first direction, the projection of the fourth circuit board overlaps with the projection of the first circuit board.

7. The power supply according to claim 6, characterized in that, The first circuit board is an auxiliary power supply board, the second circuit board is a PFC board, the third circuit board is a DC-DC board, and the fourth circuit board is a BUCK board.

8. The power supply according to any one of claims 3 to 7, characterized in that, The power supply also includes a constraint member, which includes a rod, a first elastic arm, and a second elastic arm. The first elastic arm and the second elastic arm are arranged along the length direction of the rod. One end of the first elastic arm is connected to the rod, and the other end of the first elastic arm extends toward the direction close to the second elastic arm. One end of the second elastic arm is connected to the rod, and the other end of the second elastic arm extends toward the direction close to the first elastic arm. The second circuit board is provided with a first connecting hole that extends through the second direction, the third circuit board is provided with a second connecting hole that extends through the second direction, and the rod passes through the first connecting hole and the second connecting hole; the first surface abuts against the end of the first elastic arm facing the second elastic arm, the second surface abuts against the rod, the fifth surface abuts against the end of the second elastic arm facing the first elastic arm, and the fourth surface abuts against the rod.

9. The power supply according to any one of claims 3 to 7, characterized in that, The power supply also includes a fifth circuit board, which is vertically mounted on the top layer of the first circuit board in a third direction. The fifth circuit board includes a sixth surface and a seventh surface arranged opposite to each other. The sixth surface faces the second circuit board and the third circuit board, and the seventh surface is equipped with output terminals. The first direction, the second direction, and the third direction are perpendicular to each other.

10. The power supply according to claim 9, characterized in that, The housing includes an air inlet, an air outlet, and an interface. Along the first direction, the air inlet is located on the side of the fan away from the first circuit board. Along the third direction, the air outlet is located on one side of the fifth circuit board, and the interface is located on the other side of the fifth circuit board. The interface is used to expose the output terminal. Along the second direction, a first air duct is provided between the second surface and the fourth surface, a second air duct is provided between the first surface and the housing, and a third air duct is provided between the fifth surface and the housing; along the third direction, the first air duct, the second air duct, and the third air duct are located between the exhaust section and the fifth circuit board.

11. A chassis, characterized in that, The power source includes any one of claims 1 to 10.

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