A bone conduction sound generating device and bone conduction headphones
By improving the magnetic circuit structure and oscillator component design, and combining noise reduction mesh components and multi-microphone technology, the noise reduction and loudness issues of bone conduction headphones in windy environments have been solved, the ease of operation and light leakage issues have been optimized, and a better user experience has been achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU THOR ELECTRONIC TECH CO LTD
- Filing Date
- 2025-05-08
- Publication Date
- 2026-06-30
AI Technical Summary
Bone conduction headphones have poor noise reduction performance in windy environments, are inconvenient to operate, have low magnetic field utilization leading to insufficient loudness, and suffer from severe light leakage.
An improved magnetic circuit structure and oscillator assembly design are adopted to increase magnetic field utilization. Combined with noise reduction mesh components and multi-microphone noise reduction technology, the button layout and indicator light design are optimized.
It improved vibration intensity and loudness, enhanced call quality in windy environments, simplified operating procedures, and reduced light leakage.
Smart Images

Figure CN224439143U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of headphone technology, and in particular to a bone conduction sound generating device and a bone conduction headphone. Background Technology
[0002] Bone conduction headphones, as a sound reproduction device that does not pass through the ear canal, transmit the vibration output of the transducer through the human skeleton to the inner ear, allowing people to perceive sound signals. Bone conduction headphones have advantages such as open ear canals, no damage to hearing, and convenient use for people with ear canal injuries, making them especially suitable for use in sports scenarios.
[0003] Headphones are typically equipped with microphones to pick up external sounds for call or voice interaction functions. For example, some headphones feature a main and secondary microphone setup, using dual-microphone noise reduction technology to maintain clear calls.
[0004] The microphone is located inside the earphone housing. In order for the microphone to receive external sounds, a sound transmission channel connecting to the outside needs to be set on the housing so that the sound can be transmitted to the microphone through the sound transmission channel and then converted into an electrical signal to achieve sound pickup.
[0005] Because the sound transmission channel is directly connected to the outside world, wind noise will inevitably be generated when there is wind. The greater the wind speed, the greater the wind noise. This has an adverse effect on accurately picking up external sound signals and can easily lead to poor call experience and problems such as voice signals not being recognized.
[0006] Furthermore, let Vmain signal and Vmain noise be the target signal and noise signal collected by the main microphone, respectively, and Vsecondary signal and Vsecondary noise be the target signal and noise signal collected by the secondary microphone, respectively. V is the final acquired signal. Then, V = Vmain signal + Vmain noise - Vsecondary signal - Vsecondary noise. Typically, headphones are worn on the head, with the main microphone close to the mouth (target signal source) and the noise signal source far from both the main and secondary microphones. Therefore, Vmain signal can be considered greater than Vsecondary signal, and Vmain noise approximately equal to Vsecondary noise. The noise signal can then be eliminated by adjusting the final signal V.
[0007] However, when the user is in a windy environment, such as during high-speed exercise (running or cycling), wind noise will be generated near the earphone. At this time, the main noise V is greater than the secondary noise V. In the above formula, V main noise - V secondary noise cannot reliably eliminate wind noise, which means that the uplink call noise reduction effect will be affected.
[0008] In addition, current bone conduction headphones typically have buttons located in the control compartment area, usually 2-3 buttons, which are usually mechanical buttons with functions such as power on / off and volume adjustment. Because the control compartment is located behind the ear, operation is inconvenient, especially during exercise. Some products have an additional button on one earbud for some functions (play / pause or answer / hang up calls, etc.), but in this case, the user needs to operate two areas (earbud and control compartment) simultaneously, which is also cumbersome.
[0009] One solution is to implement all functions through a single button in the earphone head area. However, this button operation would be very complex, requiring combinations of various actions such as single click, double click, triple click, quadruple click, and long press, making the operation cumbersome for users.
[0010] In addition, bone conduction headphones are generally equipped with indicator lights to indicate charging or other statuses, usually located on the side of the control compartment or battery compartment. The indicator light consists of a light guide column and LEDs. When the LEDs emit light, the light source is transmitted to the light guide column. The light guide column itself generally contains light-diffusing powder, resulting in a uniform light emission effect after light enters it. Due to the assembly gap between the light guide column and the housing, light leakage may occur around the light guide column. This means that not only the light guide column itself emits light, but the gap around it or the housing also emits light. This is especially problematic when the assembly gap is too large, the housing is thin, or the housing is made of transparent, semi-transparent, or light-colored materials, easily leading to light leakage and forming a ring of light around the part of the housing that surrounds the light guide column.
[0011] Furthermore, bone conduction headphones typically house a bone conduction sound-generating device within the earpiece. This device generally includes a stator assembly and a vibrator assembly. The stator assembly comprises a conductive coil, and the vibrator assembly includes a magnetic circuit structure located inside the coil. When the conductive coil is energized, it experiences an Ampere force because it is situated within the magnetic field of the magnetic circuit structure. When the coil remains stationary, according to the principle of action and reaction, the vibrator assembly experiences a force equal in magnitude but opposite in direction to the coil, causing displacement. Since the coil is energized by alternating current, the force on the vibrator assembly is also an alternating driving force, which drives the vibrator assembly to reciprocate. However, the horizontal magnetic field component perpendicular to the coil current direction generated by the aforementioned magnetic circuit structure is relatively small, resulting in low magnetic field utilization and low electromechanical conversion efficiency. Under the same power consumption, the loudness perceived by the human ear is relatively low, leading to a poor listening experience for the wearer.
[0012] Therefore, there is still room for improvement in bone conduction headphones in terms of reducing wind noise, improving call quality, enhancing operational comfort, increasing loudness and listening experience, and reducing light leakage.
[0013] The above content is only used to help understand the technical solution of this application and does not constitute an admission that the above is prior art. Utility Model Content
[0014] The purpose of this invention is to provide a bone conduction sound device and bone conduction headphones to solve at least one of the above-mentioned problems.
[0015] To achieve the aforementioned objectives, this utility model proposes, on the one hand, a bone conduction sound-generating device, comprising,
[0016] support;
[0017] An oscillator assembly is movably disposed inside the support. The oscillator assembly includes a magnetic circuit assembly. At least at its outer edge, the magnetic circuit assembly has a first magnetic pole portion, a second magnetic pole portion, and a third magnetic pole portion located between the first and second magnetic pole portions along a first direction. The first and second magnetic pole portions are respectively located at both ends of the magnetic circuit assembly along the first direction. The first and second magnetic pole portions have the same polarity, and the third magnetic pole portion has the opposite polarity to the first magnetic pole portion.
[0018] A stator assembly is fixedly disposed inside the bracket. The stator assembly includes a first coil, which surrounds the outside of the magnetic circuit assembly. A first magnetic guide bracket and a second magnetic guide bracket are respectively disposed at both ends of the first coil along a first direction. The first magnetic guide bracket and the second magnetic guide bracket also surround the outside of the magnetic circuit assembly.
[0019] After the first coil is energized, the first coil is subjected to Ampere force, and magnetic force is generated between the magnetic circuit assembly, the first magnetic guide support, and the second magnetic guide support. The oscillator assembly vibrates along the first direction under the action of the reaction force of the Ampere force and the magnetic force.
[0020] On the other hand, this utility model proposes a bone conduction headphone, including the above-mentioned bone conduction sound generating device.
[0021] Compared with the prior art, the present invention has the following beneficial effects:
[0022] According to at least one embodiment of the present invention, the bone conduction sound generation device greatly improves the magnetic field utilization rate, so that the vibrator assembly vibrates under the combined drive of the reaction force of the Ampere force and the magnetic force, and the driving force is effectively improved, thereby greatly improving the vibration intensity of the vibrator assembly. This effectively improves the sensitivity of the bone conduction sound generation device in the effective frequency range (less than 5000Hz), thereby improving the loudness of the bone conduction headphones. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the headphones according to some embodiments of this utility model.
[0024] Figure 2 This is a schematic diagram of the earpiece head in some embodiments of this utility model.
[0025] Figure 3 yes Figure 2 The diagram shows a cross-sectional view of the headphone head.
[0026] Figure 4 This is a schematic diagram of a housing with a microphone and noise reduction mesh assembly in some embodiments of this utility model.
[0027] Figure 5 This is a cross-sectional view of the housing in some embodiments of the present invention when it is equipped with a microphone and a noise reduction mesh assembly.
[0028] Figure 6 yes Figure 5 Enlarged view of section I in the middle.
[0029] Figure 7 This is a schematic diagram of the housing in some embodiments of this utility model.
[0030] Figure 8 yes Figure 7 Enlarged view of Part II.
[0031] Figure 9 This is an exploded view of the noise reduction mesh component in some embodiments of this utility model.
[0032] Figure 10 This is a schematic diagram of the internal network structure in some embodiments of this utility model.
[0033] Figure 11 This is a schematic diagram of the noise reduction mesh assembly and the entrance cavity in some embodiments of this utility model.
[0034] Figure 12 This is a schematic diagram of the housing in some embodiments of this utility model.
[0035] Figure 13 yes Figure 12 A schematic diagram of the thickened section.
[0036] Figure 14 This is a schematic diagram showing the positions of the secondary microphone and housing in some embodiments of this utility model.
[0037] Figure 15 This is a schematic diagram showing the connection of the earphone head, functional compartment, and ear hook in some embodiments of this utility model.
[0038] Figure 16 This is a cross-sectional schematic diagram of the functional compartments in some embodiments of this utility model.
[0039] Figure 17 yes Figure 16 Enlarged view of Part III.
[0040] Figure 18 This is a schematic diagram showing the connection between the light guide and the housing assembly in some embodiments of this utility model.
[0041] Figure 19 This is an exploded view of the light guide, light shield, and control circuit board of some embodiments of this utility model.
[0042] Figure 20 This is a perspective view of the first outer shell of some embodiments of this utility model.
[0043] Figure 21 This is a schematic diagram showing the connection between the light guide and the housing assembly in some embodiments of this utility model.
[0044] Figure 22 This is a cross-sectional schematic diagram of the functional compartments in some embodiments of this utility model.
[0045] Figure 23 yes Figure 22 Enlarged view of Part III.
[0046] Figure 24 This is an exploded view of the light guide, light shield, first light shield, second light shield, and control circuit board of some embodiments of this utility model.
[0047] Figure 25 This is a three-dimensional schematic diagram of the light guide component in some embodiments of this utility model.
[0048] Figure 26 This is a schematic diagram of an earphone head with two button modules in some embodiments of this utility model.
[0049] Figure 27 This is a schematic diagram of a three-button module on the earphone head in some embodiments of this utility model.
[0050] Figure 28 This is a schematic diagram of a headphone head with four button modules in some embodiments of this utility model.
[0051] Figure 29 This is a perspective view of the earpiece head of some embodiments of this utility model.
[0052] Figure 30 yes Figure 29 The diagram shows the back of the earphone head.
[0053] Figure 31 It is along Figure 30 The sectional view obtained by cutting along section line AA.
[0054] Figure 32 yes Figure 30 A schematic diagram of the middle shell.
[0055] Figure 33 yes Figure 32 A schematic diagram of another view of the casing shown.
[0056] Figure 34 yes Figure 29 An exploded view of the press panel portion of the earphone head shown.
[0057] Figure 35 yes Figure 29 The diagram shows the back of the earphone head.
[0058] Figure 36 It is along Figure 35 A sectional view obtained by cutting along the BB section line.
[0059] Figure 37 It is along Figure 35 A sectional view obtained by cutting along the CC section line.
[0060] Figure 38 This is a schematic diagram showing the connection between a flexible circuit board and a circuit board in some embodiments of this utility model.
[0061] Figure 39 yes Figure 38 A schematic diagram of a flexible circuit board.
[0062] Figure 40 yes Figure 37 A cross-sectional view of the second pressing panel section.
[0063] Figure 41 yes Figure 37 A schematic diagram illustrating the reason for the second press panel.
[0064] Figure 42 yes Figure 29 A three-dimensional schematic diagram of the middle shell.
[0065] Figure 43 This is a schematic diagram showing the positions of the pressure sensor and micro switch in some embodiments of this utility model.
[0066] Figure 44 yes Figure 31 A cross-sectional view of the first and second pressing panels.
[0067] Figure 45 yes Figure 29 A schematic diagram showing the positions of the first and second pressing panels.
[0068] Figure 46 yes Figure 45 Top view of the second press panel.
[0069] Figure 47This is a top view of the second pressing panel in some embodiments of this utility model.
[0070] Figure 48 It is along Figure 30 The sectional view obtained by cutting along the DD section line.
[0071] Figure 49 yes Figure 29 A three-dimensional schematic diagram of the middle cover.
[0072] Figure 50 This is a top view schematic diagram of a bone conduction sound generating device according to some embodiments of this utility model.
[0073] Figure 51 yes Figure 50 The structure shown is a cross-sectional view at EE.
[0074] Figure 52 yes Figure 51 A magnified view of a section at point M.
[0075] Figure 53 This is a three-dimensional schematic diagram of a bone conduction sound generating device according to some embodiments of this utility model.
[0076] Figure 54 yes Figure 53 A schematic diagram of the structure shown from another angle.
[0077] Figure 55 yes Figure 53 Exploded view of the structure shown.
[0078] Figure 56 yes Figure 55 A schematic diagram of the magnetic component in the structure shown.
[0079] Figure 57 yes Figure 56 A schematic diagram of the structure of the first magnetic plate.
[0080] Figure 58 This is a cross-sectional schematic diagram of a bone conduction sound generating device according to some embodiments of this utility model.
[0081] Figure 59 This is a cross-sectional schematic diagram of a bone conduction sound generating device according to some embodiments of this utility model.
[0082] Figure 60 This is a three-dimensional schematic diagram of a bone conduction sound generating device according to some embodiments of this utility model.
[0083] Figure 61 This is a comparison diagram of the frequency response curves of the bone conduction sound generation device of some embodiments of this utility model and the prior art.
[0084] Figure 62This is a top view schematic diagram of a bone conduction sound generating device according to some embodiments of this utility model.
[0085] Figure 63 yes Figure 62 The structure shown is a cross-sectional view at FF.
[0086] Figure 64 yes Figure 63 A magnified view of a portion of point N in the middle.
[0087] Figure 65 This is a cross-sectional schematic diagram of a bone conduction sound generating device according to some embodiments of this utility model.
[0088] Figure 66 This is a three-dimensional schematic diagram of a bone conduction sound generating device according to some embodiments of this utility model.
[0089] Figure 67 Yes, yes Figure 66 Exploded view of the structure shown.
[0090] Figure 68 This is a comparison diagram of the frequency response curves of the bone conduction sound generation device of some embodiments of this utility model and the prior art. Detailed Implementation
[0091] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.
[0092] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.
[0093] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0094] Unless otherwise specified, the terms “length,” “width,” “depth,” and “thickness” used to refer to a component refer to the maximum dimensions in the length, width, depth, and thickness directions of that component, respectively.
[0095] Some embodiments of this utility model propose an earphone, such as Figure 1 As shown, Figure 1 A bone conduction headset is shown. The headset includes an earpiece 60, a functional compartment 61, an ear hook 62 connecting the earpiece 60 and the functional compartment 61, and a back hook 63 connecting the two functional compartments 61. The earpiece 60 is equipped with a bone conduction sound transmitting device, which can be equipped with only a bone conduction sound transmitting device or with both a bone conduction sound transmitting device and an air conduction sound transmitting device. When only a bone conduction sound transmitting device is provided, the headset transmits sound via bone conduction. When both a bone conduction sound transmitting device and an air conduction sound transmitting device are provided, the headset transmits sound via both bone conduction and air conduction simultaneously. The functional compartment 61 is used to house a control circuit board and / or a battery.
[0096] Next, we will provide examples to illustrate the content related to reducing wind noise.
[0097] like Figures 2 to 4 As shown, the headphone head 60 may include a housing assembly, a microphone 2, and a noise-canceling mesh assembly 3.
[0098] The housing assembly includes a housing 1 and a cover 600. The cover 600 seals the open end of the housing 1, creating a relatively sealed space inside the earphone head 60 for contact with the scalp during earphone use. The earphone head 60 also includes a bone conduction sound transmitting device 8 connected to the cover 600, which transmits sound via bone conduction through vibration.
[0099] like Figure 5 and Figure 6 As shown, the housing 1 has a sound transmission channel 10 connecting its interior and exterior. One end of the sound transmission channel 10 is adjacent to the outside and is used to receive sound entering from the outside; this end is the outer end 10a. The other end of the sound transmission channel 10 is adjacent to the microphone 2 and is used to transmit sound to the microphone 2; this end is the inner end 10b. The microphone 2 is located inside the housing 1, at the inner end 10b of the sound transmission channel 10. External sound is transmitted to the microphone 2 through the sound transmission channel 10 and picked up by the microphone 2.
[0100] The sound transmission channel 10 includes an entrance cavity 100 adjacent to the outer surface 1a of the housing 1 and a first channel 101 connected to the entrance cavity 100. The cross-sectional area of the entrance cavity 100 is larger than the cross-sectional area of the first channel 101. A cross-section refers to the area of a section cut by a plane perpendicular to the extension direction of the corresponding structure (e.g., the entrance cavity 100 or the first channel 101). The extension direction can also be considered as the axial direction of the corresponding structure. When the cross-sectional area differs at different locations of the structure, the average of the maximum and minimum cross-sectional areas is used as the cross-sectional area of the corresponding structure. Optionally, the extension direction of the first channel 101 is consistent with the extension direction of the entrance cavity 100, that is, the axis 100a of the entrance cavity 100 and the axis 101a of the first channel 101 are parallel or coincident.
[0101] The noise reduction mesh assembly 3 can be disposed at the outer end 10a of the sound transmission channel 10 and cover the outside of the entrance cavity 100. The noise reduction mesh assembly 3 has fine mesh holes, which can reduce the flow resistance coefficient and reduce the airflow entering the sound transmission channel 10. After the airflow passes through the noise reduction mesh assembly 3, it is broken into small turbulences that enter the entrance cavity 100, thereby consuming some of the airflow energy and achieving a preliminary effect of reducing wind noise. Furthermore, the entrance cavity 100 has a larger cross-sectional area than the first channel 101, thus forming a buffer space for airflow, which can further disrupt turbulence and absorb the energy of the airflow, thereby achieving a better noise reduction effect.
[0102] In some embodiments, the ratio of the cross-sectional area of the first channel 101 to the cross-sectional area of the entrance cavity 100 is 20% to 40%, so that the entrance cavity 100 and the first channel 101 form a relatively significant size difference, ensuring the buffering effect of the entrance cavity 100. Further optionally, the ratio of the cross-sectional area of the first channel 101 to the cross-sectional area of the entrance cavity 100 is 25% to 35%, and even more optionally, the ratio is 26% to 28%, to further ensure the effect.
[0103] Optionally, the cross-sectional area of the entrance cavity 100 is 2 mm². 2 ~10mm 2 The depth is 0.1mm to 0.5mm to provide a certain buffering and noise reduction effect, while ensuring that the area is not too large, so as not to cause excessive airflow and poor noise reduction effect. The depth is the dimension of the entrance cavity 100 along its extension direction, and the depth range refers to the dimension range of the shallowest part of the entrance cavity 100. Further optionally, the cross-sectional area of the entrance cavity 100 is 3mm². 2 ~7mm 2The depth is 0.15mm to 0.4mm, giving the entrance cavity 100 a suitable cross-sectional area, allowing for a more appropriate airflow into the entrance cavity 100. Simultaneously, the volume of the entrance cavity 100 is suitable, enabling it to better serve as a buffer and ensure noise reduction effectiveness. Alternatively, the cross-sectional area of the entrance cavity 100 can be 4mm². 2 ~5mm 2 With a depth of 0.2mm to 0.3mm, the volume and cross-sectional area of the sound cavity 100 are more suitable, which can better ensure the effect of reducing wind noise.
[0104] In some embodiments, such as Figures 6 to 8 As shown, the outer surface 1a of the housing 1 is provided with a mounting groove 11, which is recessed from the outer surface 1a of the housing 1 to form a bottom surface 110 and an inner wall 112. The sound inlet cavity 100 communicates with the mounting groove 11. For example, it can be directly connected to the bottom surface 110 of the groove. Alternatively, when the mounting groove 11 is provided with a support boss 111 as described below, it can directly penetrate the top surface 1110 of the support boss 111. The noise reduction mesh assembly 3 is disposed in the mounting groove 11. Optionally, refer to Figure 4 and Figure 5 The outer surface 3a of the noise reduction mesh component 3 is flush with the outer surface 1a of the shell 1, forming a streamlined structure with smooth lines and no large undulations or sharp edges. This can reduce the flow resistance coefficient and reduce the incoming airflow, thereby improving the wind noise reduction effect.
[0105] In some embodiments, the noise reduction mesh assembly 3 includes at least one mesh layer, such as the outer mesh 30 or inner mesh 31 described below. In other embodiments, the noise reduction mesh assembly 3 includes at least two mesh layers to further improve the noise reduction effect. Optionally, the area of individual mesh openings is larger in the outermost mesh layers, so that the airflow passing through the noise reduction mesh assembly 3 can be gradually broken into smaller turbulences and more converted into heat energy. The heat energy does not affect the microphone's sound pickup effect, thereby achieving a better noise reduction effect. Figure 6 and Figure 9 As shown, Figure 6 and Figure 9 In the illustrated embodiment, the noise reduction mesh assembly 3 may include an outer mesh 30 and an inner mesh 31 that are attached to each other. The outer mesh 30 is closer to the outside of the housing 1 than the inner mesh 31. Both the outer mesh 30 and the inner mesh 31 are provided with mesh openings 300 for airflow (the mesh openings on the inner mesh 31 are not shown in the figure), and the area of a single mesh opening 300 of the outer mesh 30 is larger than the area of a single mesh opening 300 of the inner mesh 31. When the airflow passes through the outer mesh 30, it will form relatively large turbulence. When the large turbulence enters the inner mesh 31, it will be broken into smaller turbulence by the mesh openings 300 of the inner mesh 31. Some of the kinetic energy is absorbed by the inner mesh 31, and some is converted into heat. Then, the smaller turbulence enters the sound inlet cavity 100 and is further absorbed, thereby achieving the purpose of reducing environmental noise.
[0106] Optionally, the area of a single mesh 300 in the outer mesh 30 is 0.04 mm². 2 ~0.1mm 2 The area ratio of a single mesh opening 300 in the inner mesh 31 to that in the outer mesh 30 is 2%–5%. This allows the airflow to be broken down from large turbulence into smaller turbulence as it passes through the outer mesh 30 and inner mesh 31, resulting in better absorption by the inner mesh 31. Furthermore, the smaller turbulence can be converted into heat energy, which does not affect the microphone's sound pickup, further ensuring noise reduction. Optionally, both the outer mesh 30 and the inner mesh 31 have circular openings, with the aperture of a single mesh opening 300 in the inner mesh 31 being less than or equal to 50 μm.
[0107] Optionally, the porosity of the outer mesh 30 is 1% to 3% (inclusive) greater than that of the inner mesh 31, meaning the difference between the porosity of the outer mesh 30 and the inner mesh 31 is 1% to 3%. The outer mesh 30 has a relatively larger opening area, which helps ensure the volume entering the sound transmission channel 10 and guarantees the sound pickup effect of the microphone 2. Alternatively, the porosity of the outer mesh 30 is 20% to 35%, and the porosity of the inner mesh 31 is also 20% to 35%. A higher porosity results in better sound pickup, but also weakens the structural strength. Setting the porosity to 20% to 35% achieves a better balance between structural strength and sound pickup effect, thereby ensuring product quality and reliability during later use.
[0108] Optionally, the outer mesh 30 has a thickness of 0.1mm to 0.3mm, and the inner mesh 31 has a thickness of 0.1mm to 0.3mm. Appropriate thicknesses allow the airflow to be more reliably broken into smaller turbulences and improve the absorption of airflow kinetic energy, thereby ensuring noise reduction. In some embodiments, the outer mesh 30 has a thickness of 0.15mm, and the inner mesh 31 has a thickness of 0.15mm.
[0109] In some embodiments, the outer mesh 30 is made of a rigid material, optionally a metal such as stainless steel. The rigid material outer mesh 30 provides a degree of protection. In some embodiments, the outer mesh 30 may be made of SUS304 or other stampable metals such as copper, nickel, or aluminum alloys, formed by etching and stamping processes. In other embodiments, the outer mesh 30 may also be injection molded from a high-rigidity plastic, such as a nylon-glass fiber composite material.
[0110] In some embodiments, the inner mesh 31 is made of polyester, which is formed by a weaving process. Polyester material has a certain degree of elasticity, which can better absorb the kinetic energy of the airflow. Optionally, the weaving process is a 3D Dutch weave reverse weave process. This structure can better reduce the drag coefficient, effectively block the air intake of the sound transmission channel, and thus effectively suppress wind noise. At the same time, it also reduces the impact on the frequency response curve at the resonant frequency point. Figure 10 The diagram shows schematic images of the inner mesh 31, fabricated using a 3D Dutch weave reverse weave process, from two different perspectives. In other embodiments, the inner mesh 31 may also be made of a rigid material, such as stainless steel, to further enhance the strength of the noise reduction mesh assembly 3.
[0111] Optionally, the outer mesh 30 and the inner mesh 31 are connected by adhesive or double-sided adhesive or welding, and the noise reduction mesh assembly 3 and the housing 1 are glued together.
[0112] In some embodiments, the plane 30b containing the outer surface 30a of the outer mesh 30 is perpendicular to the axis 100a of the entrance cavity 100. In other embodiments, such as Figure 11 As shown, the plane 30b containing the outer surface 30a of the outer mesh 30 is not perpendicular to the axis 100a of the acoustic cavity 100; instead, they are inclined relative to each other. This forces the airflow entering through the mesh 300 of the outer mesh 30 to be redirected within the acoustic cavity 100 before moving along the first channel 101. The acoustic cavity 100 provides better buffering for the airflow, reducing its impact on microphone pickup and further improving wind noise reduction. Optionally, the angle α2 between the plane 30b containing the outer surface 30a of the outer mesh 30 and the axis 100a of the acoustic cavity 100 is 60°–80° to make the angle more suitable, improving noise reduction without affecting pickup performance. It should be noted that when the outer surface 30a of the outer mesh 30 is a plane, the plane 30b on which the outer surface 30a is located coincides with the outer surface 30a. When the outer surface 30a of the outer mesh 30 is a curved surface, the plane 30b on which the outer surface 30a is located refers to the tangent plane of the most convex or concave point of the outer surface 30a.
[0113] Optionally, the bottom surface 100b of the entrance cavity 100 is inclined relative to the plane 30b containing the outer surface 30a of the outer mesh 30, and the distance between the bottom surface 100b and the plane 30b gradually increases. The first channel 101 is closer to the end with the smaller width between the bottom surface 100b and the plane 30b. In this way, when the airflow enters the entrance cavity 100, it points to a deeper position in the entrance cavity 100, which can better buffer the airflow, reduce the airflow velocity, and further improve the noise reduction effect. The distance refers to the distance between the bottom surface 100b and the plane 30b along the axis 100a.
[0114] In some embodiments, such as Figures 6 to 9 As shown, the housing 1 is provided with a support boss 111 protruding outward from the bottom surface 110 of the mounting groove 11. The support boss 111 and the inner wall 112 of the mounting groove 11 form an annular groove 113. The outer edge of the inner mesh 31 is connected to the top surface 1110 of the support boss 111, for example, by adhesive bonding. The outer edge of the outer mesh 30 is provided with a ring portion 301 extending into the annular groove 113. The ring portion 301 forms a gap with the support boss 111 and / or the inner wall 112 of the mounting groove 11 to accommodate adhesive, which can increase the contact area between the adhesive and the noise reduction mesh assembly 3, improve the firmness of the connection between the noise reduction mesh assembly 3 and the housing 1, and help prevent the noise reduction mesh assembly 3 from falling off the housing 1. Optionally, the height of the ring portion 301 can be set to 0.2mm to 3mm.
[0115] In some embodiments, the sound transmission channel 10 is directly connected to the microphone 2 through the first channel 101. In this case, the sound transmission channel 10 is generally in the shape of a through hole, and the first channel 101 is provided with the inner end portion 10b. In other embodiments, such as Figure 6 As shown, the sound transmission channel 10 also includes a second channel 102 connected to the first channel 101, and is connected to the microphone 2 via the second channel 102. The second channel 102 has an inner end portion 10b. Optionally, the angle α1 between the extension directions of the second channel 102 and the first channel 101 is 75° to 95°, and the extension direction is consistent with the axial direction of the channel. In this case, a relatively large turning angle is formed between the second channel 102 and the first channel 101, which is beneficial to further break up the turbulence of the airflow at the turning point of the second channel 102 and can be converted into heat energy, thereby improving the noise reduction effect. Optionally, the angle α1 between the extension directions of the second channel 102 and the first channel 101 is 87° to 93°. Further optionally, the angle α1 between the extension directions of the second channel 102 and the first channel 101 is 90°, and the airflow along the path of the first channel 101 and the second channel 102 to the microphone 2 is L-shaped.
[0116] In some embodiments, the second channel 102 is provided with a blind hole portion 1020 extending toward the side away from the microphone 2. The blind hole portion 1020 can further provide a buffer space for airflow, reduce the flow rate of airflow into the microphone 2. Flow-induced noise is exponentially proportional to velocity, so reducing the flow rate can effectively reduce flow noise and further improve the final noise reduction effect.
[0117] Optionally, the depth H1 of the blind hole 1020 is 0.2–1 mm to ensure its wind noise reduction effect. Simultaneously, the depth H1 is not excessive, preventing localized weak points in the housing 1 and affecting its structural strength. Optionally, the depth H2 of the second channel 102 is 0.8 mm–1.5 mm. A deeper second channel 102 results in poorer microphone pickup, while a shallower depth leads to unsatisfactory noise reduction. Setting the depth H2 to 0.8 mm–1.5 mm helps to achieve a relatively ideal noise reduction effect while ensuring good pickup. Further optionally, the depth H2 of the second channel 102 is 1.1 mm–1.5 mm, and even more specifically, 1.2 mm–1.4 mm, to further achieve a balance between pickup and noise reduction effects.
[0118] Optionally, the ratio of the depth H1 of the blind aperture 1020 to the depth H2 of the second channel 102 is 0.1 to 0.5 to further ensure sound pickup and noise reduction effects. More optionally, the ratio of the depth H1 of the blind aperture 1020 to the depth H2 of the second channel 102 is 0.12 to 0.2.
[0119] Optionally, the length L10 of the first channel 101 is 1mm to 2mm, which is a suitable length and helps to ensure the sound pickup effect.
[0120] Optionally, the cross-sectional area of the second channel 102 is larger than that of the first channel 101, which can form a relatively larger buffer space to ensure noise reduction effect. Optionally, the cross-sectional area of the second channel 102 is 1 square millimeter to 2 square millimeters, and the cross-sectional area of the first channel is 0.3 square millimeters to 0.7 square millimeters.
[0121] In some embodiments, such as Figure 5 , Figure 12 and Figure 13 As shown, the housing 1 includes a base plate 12 and an annular side frame 13 connected to the base plate 12. The housing 1 also includes a thickened portion 120 connected to the base plate 12 and protruding into the housing 1. The first channel 101 and the second channel 102 are at least partially located within the thickened portion 120. The base plate 12, the side frame 13, and the thickened portion 120 are integrally formed. The thickened portion 120 can strengthen the structure of this part of the housing 1 and prevent the structural strength of this part from being affected by the sound transmission channel 10. In the embodiment shown, the thickened portion 120 is frustum-shaped. In other embodiments, the thickened portion 120 can also be set as a separate part, which can be separately formed and assembled with the base plate 12 and the side frame 13, thereby reducing the complexity of the mold for forming the housing 1.
[0122] like Figure 5 and Figure 6As shown, the earphone also includes a circuit board 32 that is spaced apart from the substrate 12. The circuit board 32 can be connected to the substrate 12, for example. Specifically, a limiting boss 121 can be provided on the substrate 12 to support the circuit board 32, and the circuit board 32 can be fixedly connected to the housing 1 by means of adhesive, hot melt pin or screw connection.
[0123] The headphones also include a waterproof membrane assembly 33 that is fitted to the thickened portion 120, such as Figure 5 , Figure 6 , Figure 12 and Figure 13 As shown, to accurately position the waterproof membrane assembly 33, a positioning groove 1200 is provided on the surface of the thickened portion 120 facing the circuit board 32. The waterproof membrane assembly 33 is disposed within the positioning groove 1200 and can be positioned through the positioning groove 1200. The waterproof membrane assembly 33 is clamped between the circuit board 32 and the thickened portion 120 and covers the inner end portion 10b. The waterproof membrane assembly 33 has waterproof and breathable functions; it can prevent liquid from passing through but does not affect gas passage, thereby achieving a waterproof effect.
[0124] like Figure 6 As shown, the waterproof membrane assembly 33 includes a waterproof membrane 330 and a sealing ring 331 connected to the waterproof membrane 330. The compressive force generated by the elastic deformation of the sealing ring 331 gives the waterproof membrane assembly 33 good lateral waterproof performance, preventing liquid leakage from the side of the sealing ring 331. The sealing ring 331 also reduces the mutual interference between the sound inside the housing 1 and the sound in the inner hole of the sealing ring 331. The projections of the sealing ring 331 and the second channel 102 on the contact surface between the thickened portion 120 and the waterproof membrane assembly 33 at least partially overlap, allowing fluid communication between the inner hole of the sealing ring 331 and the sound transmission channel 10, preventing the sealing ring 331 from blocking the inner end 10b and affecting the sound pickup effect of the microphone 2. Optionally, the projection of the sealing ring 331 on the contact surface between the thickened portion 120 and the waterproof membrane assembly 33 surrounds the outside of the second channel 102.
[0125] Microphone 2 is disposed on the surface of circuit board 32 opposite to the thickened portion 120. Circuit board 32 has a through hole 320 for sound to enter microphone 2. The projection of sealing ring 331 on the surface of circuit board 32 surrounds the outside of through hole 320, so that the inner hole of sealing ring 331 communicates with through hole 320. Sealing ring 331 can be disposed between waterproof membrane 330 and thickened portion 120, or between waterproof membrane 330 and circuit board 32. Optionally, sealing ring 331 is disposed between waterproof membrane 330 and circuit board 32, with waterproof membrane 330 in contact with thickened portion 120. It is understood that, compared with circuit board 32, thickened portion 120 usually has a flatter surface, which is beneficial to better prevent liquid from entering the interior of housing 1.
[0126] In some embodiments, such as Figure 4 , Figure 5 and Figure 14 As shown, the earphone head 60 includes two microphones 2, namely a main microphone 20 and a secondary microphone 21. The main microphone 20 and the secondary microphone 21 work together to achieve noise reduction. The main microphone 20 and the secondary microphone 21 are each provided with a corresponding sound transmission channel 10. For the sake of convenience, the sound transmission channel 10 corresponding to the main microphone 20 is referred to as the first sound transmission channel 14, and the sound transmission channel 10 corresponding to the secondary microphone 21 is referred to as the second sound transmission channel 15.
[0127] In some embodiments, the first sound transmission channel 14 and the second sound transmission channel 15 have the same structure, and their structures and parameters can be referred to above. In other embodiments, the first sound transmission channel 14 and the second sound transmission channel 15 have different structures.
[0128] In some embodiments, such as Figure 5 and Figure 14 As shown, the first sound transmission channel 14 is provided with the aforementioned noise reduction mesh assembly 3, and the second sound transmission channel 15 is directly connected to the outer surface 1a of the housing 1, without the aforementioned noise reduction mesh assembly 3 and the corresponding entrance cavity 100 and mounting groove 11.
[0129] As described in the background section, when the user is in a windy environment, the main noise (Vprimary) is greater than the secondary noise (Vsecondary), making it difficult to reliably eliminate wind noise. By setting a noise reduction mesh component 3 at the first transmission channel 14 and not setting a noise reduction mesh component 3 at the second transmission channel 15, the noise signal (Vprimary) picked up by the main microphone 20 is reduced, and the noise signal (Vprimary) picked up by the main microphone 20 and the noise signal (Vsecondary) picked up by the secondary microphone 21 are closer in magnitude, which can more reliably eliminate wind noise and thus improve the noise reduction effect of calls.
[0130] When the headphones are worn, the first sound transmission channel 14 is closer to the person's mouth than the second sound transmission channel 15. This allows the main microphone 20 to pick up a larger voice signal (target signal) and the secondary microphone 21 to pick up ambient noise better, thereby improving the noise reduction effect and call quality.
[0131] Optionally, the opening of the first sound transmission channel 14 on the outer surface 1a of the housing 1 has a first axis, and the opening of the second sound transmission channel 15 on the outer surface 1a of the housing 1 has a second axis. Figure 6 In the illustrated embodiment, the first sound transmission channel 14 has an entrance cavity 100, the axis of which is the axis 100a of the entrance cavity 100. Figure 14In the illustrated embodiment, the second sound transmission channel 15 does not have an entrance cavity 100, and the first channel 101 is directly connected to the outer surface 1a. The axis of its opening refers to the axis 101a of the first channel 101. The outward direction of the first axis points towards the side where the person's mouth is located, and the outward direction of the second axis points away from the side where the person's mouth is located. The outward direction refers to the direction towards the outside of the housing 1. In this way, the voice signal picked up by the main microphone 20 can be increased while the voice signal picked up by the secondary microphone 21 can be reduced, further improving the clarity of the voice signal.
[0132] In some embodiments, such as Figure 15 As shown, the noise-canceling mesh assembly 3 is located on the lower corner 602 of the housing assembly (housing 1 in the figure), on the side opposite to the earphone's functional compartment 61. When the earphone is worn, the first corner 602 is relatively closer to the user's mouth. By placing the noise-canceling mesh assembly 3 on this first corner 602, the outer end of the first sound transmission channel 14 can be closer to the user's mouth, thereby obtaining a clearer voice signal.
[0133] Optionally, when the bone conduction headphones are worn, the first corner 602 protrudes downwards, as... Figure 15 As shown, the first corner 602 protrudes more (lower) than the second corner 604 at the lower end of the housing assembly (housing 1 in the figure) near the functional compartment 61, so that it is closer to the mouth. At the same time, the downward protruding first corner 602 increases the distance between the main microphone 20 and the secondary microphone 21, which helps to further reduce the correlation between the two, improve the noise reduction effect, and ensure the clarity of the voice signal.
[0134] In some embodiments, the outer ends 10a of both the first sound transmission channel 14 and the second sound transmission channel 15 are connected to the side frame 13. The outer end 10a of the first sound transmission channel 14 is located on the lower corner 602 of the housing assembly on the side away from the earphone's functional compartment 61, and the outer end 10a of the second sound transmission channel 15 is located on the upper triangular portion 603 of the housing assembly (housing 1 in the figure) on the side near the earphone's functional compartment 61. In this way, the distance between the outer ends 10a of the two sound transmission channels is greater, and they are respectively positioned facing and away from the mouth, which can better improve call quality.
[0135] Figure 5 and Figure 14In the illustrated embodiment, both the first sound transmission channel 14 and the second sound transmission channel 15 include a first channel 101 and a second channel 102, with an included angle α1 between the first channel 101 and the second channel 102 of 75° to 95°. The second channel 102 of the second sound transmission channel 15 has an inner end portion 10b. The first channel 101 of the second sound transmission channel 15 is directly connected to the outer surface 1a of the housing 1, and no noise reduction mesh assembly 3 is provided. The positional relationship between the second sound transmission channel 15 and the secondary microphone 21, as well as the waterproof membrane assembly 33 disposed between them, can be referenced from the relevant content of the first sound transmission channel 14.
[0136] In the embodiments described above, the noise reduction mesh component 3 is provided only outside the second sound transmission channel 15. It is understood that in other embodiments, the noise reduction mesh component 3 may be provided outside both sound transmission channels.
[0137] It is understandable that, although the above example uses the earphone head with a microphone and noise-canceling mesh assembly 3 as an illustration, the microphone and noise-canceling mesh assembly 3 and other structures can also be set on other housings, such as on the function compartment 61.
[0138] Optionally, the headphones may include a light indicator to convey information to the user, such as power on / off status, charging status, or incoming call notifications, facilitating the use of the headphones. The following section provides examples of the headphone's light indicator functionality.
[0139] In some embodiments, the headphones include a functional compartment 61. Figure 1 In the illustrated embodiment, the earphone includes two functional compartments 61. Optionally, one functional compartment 61 is used to house a control circuit board, which can be referred to as the control compartment, and the other functional compartment 61 is used to house a battery, which can be referred to as the battery compartment. Of course, both functional compartments 61 can also house both a battery and a control circuit board.
[0140] The earphone's functional compartment 61 is equipped with an indicator light unit. This indicator light unit can be located on one or both functional compartments 61. Optionally, the indicator light unit is located on the functional compartment 61 containing the control circuit board for ease of installation. Alternatively, of the two functional compartments of the earphone, one is a control compartment housing the control circuit board 51, and the other is a battery compartment housing the battery; the indicator light unit is located on the control compartment.
[0141] like Figure 16 and Figure 17 As shown, the functional compartment 61 includes a housing assembly 50, a control circuit board 51, and a light guide 52.
[0142] The housing assembly 50 can be formed by connecting two or more components. Optionally, the housing assembly 50 includes a first housing 50a and a second housing 50b, which are connected to form a space for accommodating components such as the control circuit board 51. The housing assembly 50 (specifically its first housing 50a) is provided with a light-emitting hole 500, which is used to accommodate a light guide 52 for light to be emitted.
[0143] The control circuit board 51 is located inside the housing assembly 50 and is equipped with lamp beads 510, such as LED lamp beads.
[0144] The light guide 52 is correspondingly arranged with the lamp bead 510. The light guide 52 is made of a light-transmitting material to transmit light; for example, it can be made of a transparent or semi-transparent material. Figure 16 As shown, the light guide 52 is at least partially positioned opposite the LED bead 510, allowing the light from the LED bead 510 to efficiently enter the light guide 52 and cause it to emit light. The light guide 52 has an insert 520 located within the light emission hole 500. The insert 520 and the inner wall of the light emission hole 500 are bonded together by an opaque adhesive layer 54. The adhesive layer 54 prevents light from escaping from the side of the insert 520, thus preventing light leakage, and also improves the connection and waterproofing between the insert 520 and the housing assembly 50. Optionally, the adhesive layer 54 is made of silicone; more preferably, it is made of black silicone, which provides good light-shielding properties.
[0145] In some embodiments, the functional compartment 61 further includes a light-shielding member 53, which is annular in shape. The LED bead 510 is located within the light-shielding member 53, and at least a portion of the light guide member 52 is located within the light-shielding member 53. After the LED bead 510 emits light, its light enters the light guide member 52, illuminating it. The portion of the light guide member 52 exposed outside the housing assembly 50 then displays a light-emitting effect. The light-shielding member 53 blocks the light emitted by the LED bead 510, allowing the light from the LED bead 510 to enter the light guide member 52, while simultaneously preventing light from directly entering the housing assembly 50, further reducing the possibility of light leakage. Optionally, the material of the light-shielding member 53 is foam.
[0146] By combining the light-shielding element 53 and the adhesive layer 54, the light emitted from the lamp bead 510 onto the housing assembly 50 and the light emitted from the side of the embedded part 520 can be reduced, thereby achieving a good light leakage prevention effect.
[0147] In some embodiments, light guide 52 is filled with light-diffusing powder to make the brightness of light guide 52 more uniform.
[0148] In some embodiments, the light guide 52 is at least partially located inside the housing assembly 50 and not within the light outlet 500. This shortens the distance between the light guide 52 and the LED 510, thereby increasing brightness.
[0149] In some embodiments, the light guide 52 includes a stepped portion 521 connected to the embedded portion 520 and protruding laterally outward relative to the embedded portion 520. The stepped portion 521 is disposed opposite to the inner surface 502 of the housing assembly 50. Optionally, the stepped portion 521 is connected to the inner surface 502 of the housing assembly 50. The step portion 521 can, on the one hand, improve the connection strength between the light guide 52 and the housing assembly 50, preventing the light guide 52 from disengaging from the light outlet 500. On the other hand, the light guide 52 can be limited by the stepped portion 521, thereby improving the positional accuracy.
[0150] In some embodiments, such as Figure 18 As shown, a first light-shielding sheet 55 is provided between the step portion 521 and the inner surface 502 of the housing assembly 50. Optionally, the first light-shielding sheet 55 is connected to the step portion 521 and / or the housing assembly 50, for example, by adhesive bonding. The first light-shielding sheet 55 is made of an opaque material, which can prevent light from shining from the step portion 521 onto the corresponding part of the housing assembly 50 and the step portion 521, preventing the corresponding part of the housing assembly 50 from being illuminated, thereby improving the light leakage prevention effect. Optionally, the first light-shielding sheet 55 is made of PET material.
[0151] In some embodiments, the light-shielding member 53 surrounds the outside of the stepped portion 521, simultaneously preventing light from escaping from the side of the stepped portion 521. Combined with the first light-shielding sheet 55 to prevent light from escaping from the front of the stepped portion 521, this provides a better light leakage prevention effect. Furthermore, when the housing assembly 50 is thin, or made of light-colored, semi-transparent, or transparent materials, light leakage is less likely to occur around the periphery of the embedded portion 520. Optionally, the light-shielding member 53 abuts between the housing assembly 50 and the control circuit board 51, allowing light to only travel from the lamp bead 510 to the light guide member 52, preventing light from escaping from other parts of the housing assembly 50 and improving the light leakage prevention effect. Optionally, the light-shielding element 53 is made of an elastic material, such as foam. When the end face it abuts has grooves or protrusions, the light-shielding element 53 will undergo elastic deformation, thereby filling the grooves or covering the protrusions, thus improving the light-shielding effect. For example, there may be electronic components or circuits on the surface of the control circuit board 51. The light-shielding element 53 can better cover the electronic components and circuits, preventing light leakage gaps. In addition, the light-shielding element 53 can also improve the firmness of the connection between the light guide element 52 and the housing assembly 50, providing resistance to prevent the light guide element 52 from retracting into the housing assembly 50 under force.
[0152] In some embodiments, for example Figures 15 to 19In the illustrated embodiment, the embedded portion 520 is strip-shaped to make the light indication more prominent, and the inner contour of the light shield 53 is configured to conform to the shape of the step portion 521 to cover the outside of the step portion 521.
[0153] In some embodiments, such as Figure 17 , Figure 18 and Figure 20 As shown, the housing assembly 50 has a first support boss 503 protruding inwards, and a stepped portion 521 is correspondingly provided with the first support boss 503. The first support boss 503 can increase the thickness of the housing assembly 50 in this part, thereby reducing the light transmittance of this part and improving the light leakage prevention effect. Even if some light shines on the first support boss 503, light leakage is not likely to occur. At the same time, it can increase the contact area with the embedded portion 520 and improve the connection strength between the housing assembly 50 and the light guide 52.
[0154] In some embodiments, such as Figure 17 , Figure 18 and Figure 20 As shown, the housing assembly 50 has a second support boss 504 protruding inwards. The protrusion height D1 of the second support boss 504 is less than the protrusion height D2 of the first support boss 503. The light-shielding member 53 surrounds the outside of the first support boss 503 and its two ends abut against the second support boss 504 and the control circuit board 51, respectively. The provision of the second support boss 504 further increases the thickness of the portion of the housing assembly 50 corresponding to the lamp bead 510, reduces the light transmittance of this portion, and thus further improves the light leakage prevention effect.
[0155] In some embodiments, such as Figures 21 to 25 As shown, the light guide 52 includes a column portion 522 connected to the stepped portion 521. The column portion 522 extends toward the side where the lamp bead 510 is located and extends into the light shield 53. This can further shorten the distance between the light guide 52 and the lamp bead 510, increasing the brightness of the light guide 52.
[0156] In addition to surrounding the exterior of the stepped portion 521 and abutting against the housing assembly 50 and the control circuit board 51 at both ends, the light-shielding member 53 can also abut between the stepped portion 521 and the control circuit board 51. Figures 22 to 24As shown, the light-shielding member 53 surrounds the outside of the column portion 522, and its two ends abut against the step portion 521 and the control circuit board 51, respectively. Optionally, a second light-shielding sheet 56 is provided on the surface of the step portion 521 facing the control circuit board 51, the second light-shielding sheet 56 surrounds the outside of the column portion 522, and the light-shielding member 53 abuts against the second light-shielding sheet 56. The second light-shielding sheet 56 is used to prevent light from escaping from the surface of the step portion 521 toward the control circuit board 51, thereby better preventing light leakage. Optionally, the outer edge of the second light-shielding sheet 56 extends beyond the outer edge of the step portion 521, thereby further improving the light leakage prevention effect.
[0157] Optionally, the housing assembly 50 is provided with an inwardly protruding annular boss 505, and a stepped portion 521 is disposed within the annular boss 505. The annular boss 505 can block light from escaping from the side of the stepped portion 521, thereby improving the light leakage prevention effect. Optionally, the outer edge of the second light-shielding plate 56 is disposed opposite to the side of the stepped portion 521. Optionally, the housing assembly 50 is also provided with a first support boss 503, and the annular boss 505 is disposed on the first support boss 503 to further improve the light leakage prevention effect.
[0158] In some embodiments, the cross-sectional area of the column portion 522 is smaller than the cross-sectional area of the stepped portion 521, and the light-shielding member 53 surrounds the outside of the column portion 522, its inner contour being contoured to the column portion 522 to reduce its size. Figure 24 and Figure 25 As shown, the embedded part 520 is strip-shaped, the column part 522 is cylindrical, the cross-sectional area of the column part 522 is smaller than the cross-sectional area of the stepped part 521, and the light-shielding member 53 is annular, its size being relative to... Figure 19 The smaller size of the light-shielding element 53 reduces the space occupied inside the housing assembly 50, making it easier to arrange the electronic components on the control circuit board 51.
[0159] In some embodiments, such as Figure 15 , Figure 16 and Figure 22 As shown, the ear hook 62 includes an adhesive layer 620 covering a portion of the outer surface of the housing assembly 50. The material of the adhesive layer 620 can be, for example, silicone, which enhances the firmness of the connection between the ear hook 62 and the housing assembly 50. The insert portion 520 is exposed from the surface of the housing assembly 50 not covered by the adhesive layer 620, eliminating the need for openings in the adhesive layer 620 and reducing manufacturing complexity.
[0160] It is understandable that the LED 510, light guide 52, light shield 53, first light shield 55 and second light shield 56 mentioned above all belong to the headphone's light indicator unit.
[0161] The following section provides examples illustrating the button structure of the earphone head.
[0162] like Figure 26 As shown, the bone conduction headphones include a button module 70. The button module 70 can be installed on both earpieces 60 of the bone conduction headphones, or it can be installed on only one earpiece 60. Optionally, the button module 70 is installed on the earpiece 60 without a microphone 2 to reduce the impact of button operation on the sound pickup effect of the earpiece 60, and at the same time, it can make more reasonable use of the internal space of the two earpieces 60 for the arrangement of components.
[0163] The earphone head 60 has a contact surface that comes into contact with human skin when worn. Vibrations are transmitted to the human body through the contact surface, thereby achieving bone conduction sound transmission. The earphone head 60 includes at least two button modules 70, both of which are located on the back of the earphone head 60 and electrically connected to the circuit board. The back of the earphone head 60 is the side opposite to its contact surface with the human body. Figures 26 to 28 In the illustrated embodiment, the earphone head 60 has two, three, and four button modules 70 respectively on its back.
[0164] like Figures 29 to 31 As shown, the cover 600 of the earphone head 60 and the substrate 12 are disposed opposite to each other. The cover 600 has a contact surface 6004 that comes into contact with the human body when worn. The circuit board 32 and the substrate 12 are disposed opposite to each other. The button modules 70 are all disposed on the substrate 12 and are electrically connected to the circuit board.
[0165] By setting at least two button modules 70 on the earphone head 60, more diverse function controls can be achieved, and operating the button modules 70 on the base plate 12 of the earphone head 60 is more convenient. Using at least two button modules 70 allows for the allocation and arrangement of the functions of the button modules 70, increasing the total number of functions that can be implemented, while reducing the number of functions that a single button module 70 needs to perform (such as reducing complex operations such as "four-click" or "long press for N seconds"), thus reducing the difficulty of operation.
[0166] Optionally, all the button modules 70 of the headphones are located on the same headphone head 60, so that all operations can be completed on one headphone head 60, making it more convenient to use.
[0167] Optionally, the button module 70 can be a mechanical button or a sensor button. The sensor button can be, for example, a pressure sensor button, a capacitive sensor button, an optical sensor button, or an accelerometer button. Different types of button modules 70 can be provided on the earphone head 60. For example, when there are two button modules 70, each module can be a mechanical button and a sensor button, or both can be sensor buttons. When both are sensor buttons, the types of sensor buttons can be different. Combining different button types can enrich the interaction methods and improve the user experience. Optionally, different buttons can be responsible for different control functions, thereby further enhancing the user experience. In other embodiments, the button modules 70 on the earphone head 60 can also be of the same type, for example, all can be mechanical buttons, or they can be the same type of sensor buttons.
[0168] In some embodiments, the area of the operating area 700 of the smallest button module 70 is not less than 4 square millimeters, and / or the ratio of the area of the operating area 700 of the smallest button module 70 to the area enclosed by the outer contour 128 of the substrate 12 is not less than 10%, to prevent inconvenience or easy misoperation due to excessively small area. Further optionally, the operating area 700 refers to the area of the button module 70 that can be operated, in which the button module 70 can recognize human hand operations. For a button module 70 with a pressing panel, the area of the operating area 700 is the area enclosed by the outer contour of the pressing panel. For a button module 70 without a pressing panel, such as a capacitive sensor button or an optical sensor button, it refers to the effective working area of the sensor. The smallest button module 70 refers to the button module 70 with the smallest operating area 700 among all button modules 70.
[0169] In some embodiments, at least one button module 70 is a mechanical button. In other embodiments, at least one button module 70 is a sensor button. In still other embodiments, all button modules 70 have both mechanical buttons and sensor buttons.
[0170] Optionally, among all the button modules 70, at least one button module 70 is a mechanical button, and at least one button module 70 is a sensor button. Optionally, the mechanical button serves as the power button, capable of one or more functions such as power on / off, answering / hanging up calls, and play / pause. Its operation frequency is higher, and it provides a better tactile feel. The sensor button serves as the volume button, at least adjusting the volume, and its usage frequency is relatively lower. Because the operating methods or tactile feel of mechanical buttons and sensor buttons differ, the control methods used are usually different, thus reducing the risk of accidental operation. In some embodiments, the headphones include two button modules 70, one of which is a mechanical button, and the other is a sensor button. Figure 30 In the illustrated embodiment, the left button module 70 is a sensor button, and the right button module 70 is a mechanical button. Of course, depending on the product definition and the intended function, the left button module 70 can also be a mechanical button, and the right button module 70 a sensor button. In some embodiments, the sensor button is a pressure sensor button, where pressing the operating area 700 of the sensor button increases or decreases the volume. In other embodiments, the sensor button is a capacitive sensor button or an optical sensor button, where sliding towards both ends of the operating area 700 of the sensor button increases or decreases the volume. Optionally, the operating area 700 of the sensor button is strip-shaped to increase the travel distance and facilitate accurate operation recognition.
[0171] like Figure 29 and Figure 30 As shown, the earphone head 60 is equipped with a mechanical button 71 and a pressure sensor button 72. The combination of the mechanical button 71 and the pressure sensor button 72 facilitates operation, such as by pressing or tapping, and reduces the likelihood of accidental operation. Optionally, the mechanical button 71 can be used as the power button, and the pressure sensor button 72 can be used as the volume button. The functions of the power button and volume button are described above.
[0172] In some embodiments, the area of the operating area 700 of the mechanical button 71 is larger than the area of the operating area 700 of the pressure sensor button 72. This makes it easier to operate the mechanical button 71. Optionally, the width B1 of the operating area 700 of the mechanical button 71 is greater than the width B2 of the operating area 700 of the pressure sensor button 72, and the length L2 of the operating area 700 of the mechanical button 71 is less than or equal to the length L3 of the operating area 700 of the pressure sensor button 72. The two button modules 70 are more rationally arranged on the substrate 12, which facilitates the operation of both the mechanical button 71 and the pressure sensor button 72. Optionally, the ratio of width B2 to width B1 is 0.4 to 0.8, and more preferably 0.5 to 0.7. The ratio of length L2 to length L3 is 0.5 to 1, and more preferably 0.7 to 1, so that the sizes of the operating areas 700 of the mechanical button 71 and the pressure sensor button 72 are more suitable, more ergonomic and finger-operated, ensuring operational comfort, while also taking into account the arrangement of components and the accuracy of operation.
[0173] like Figure 31As shown, the mechanical button 71 includes a first pressing panel 710, and the area enclosed by the outer contour of the projection of the first pressing panel 710 along the thickness direction of the substrate 12 onto a plane perpendicular to the thickness direction is the area of the operating area 700 of the mechanical button 71. The pressure sensor button 72 includes a second pressing panel 720, and the area enclosed by the outer contour of the projection of the second pressing panel 720 along the thickness direction of the substrate 12 onto a plane perpendicular to the thickness direction is the area of the operating area 700 of the pressure sensor button 72. Figure 31 In the embodiment shown, the thickness direction of the substrate 12 is consistent with the pressing direction of the first pressing panel 710 and the second pressing panel 720, and the thickness direction of the substrate 12 is also consistent with the thickness direction of the earphone head 60.
[0174] In some embodiments, such as Figure 32 As shown, Figure 32 A schematic diagram of the housing 1 viewed directly from the substrate 12 is shown. The length L4 of the substrate 12 is greater than its width B3. The mechanical button 71 and the pressure sensor button 72 are spaced apart along the width direction of the substrate 12. The arrangement of the two button modules 70 is more reasonable, facilitating the acquisition of a longer pressure sensor button 72. Optionally, in the width direction of the substrate 12, the length of one end of the substrate 12 is greater than the length of the other end. Figure 32 In the middle, the length L4 of the left end of the substrate 12 is longer than the length of its right end, and the first pressing panel 710 covers the relatively shorter end of the substrate 12. Figure 30 and Figure 32 The second pressing panel 720 covers the relatively longer end of the substrate 12 (left end). Figure 30 and Figure 32 (at the right end of the middle), so that the overall length of the second pressing panel 720 can be longer.
[0175] Optional, such as Figure 32 and Figure 33 As shown, the length L6 of the shell 1 is greater than its width B4. The length L6 of the shell 1 is the length of the outer edge 1b of the opening end where the shell 1 and the cover 600 connect. The width B4 of the shell 1 refers to the width of the outer edge 1b of the opening end where the shell 1 and the cover 600 connect. The width and length directions of the shell 1 are consistent with the width and length directions of the substrate 12, respectively. In the width direction of the shell 1, the length of one end of the shell 1 is greater than the length of the other end, and the relatively longer end of the shell 1 corresponds to the relatively longer end of the substrate 12, that is, the relatively longer end of the shell 1 and the relatively longer end of the substrate 12 are located at the same end. Figure 30 and Figure 32In the illustrated embodiments, all are located at the left end. This allows for the substrate 12 to be formed adaptively to the shape of the housing 1, which facilitates obtaining a larger substrate 12 and reduces structural complexity. In the embodiments described in this specification, the length L6 and width B4 of the housing 1 are the same as the length and width of the housing assembly.
[0176] In some embodiments, the entire assembly of the pressing panels of all button modules 70 is configured to conform to the outer contour of the substrate 12, such as... Figure 29 and Figure 30 As shown, the overall shape of the first pressing panel 710 and the second pressing panel 720 is basically consistent with the outer contour of the substrate 12, which can improve the space utilization of the substrate 12 surface, maximize the area of the operating area 700, and improve the comfort and accuracy of operation.
[0177] In some embodiments, such as Figure 31 and Figure 34 As shown, the housing assembly and the cover 600 have a button groove 16 on their opposite sides (i.e., the back side). The base plate 12 is located at the bottom of the button groove 16. All the button modules 70's pressing panels are fitted with the button groove 16 with a clearance. On the one hand, the button groove 16 can play a positioning and guiding role, making it easy to operate the pressing panel. On the other hand, the pressing panel protrudes less from the earphone head 60, making it less likely to be damaged or removed, and it is more aesthetically pleasing.
[0178] In some embodiments, such as Figures 31 to 36 As shown, the substrate 12 has a button hole 122. The mechanical button 71 includes a micro switch 711 connected to the circuit board 32, a first pressing panel 710 located on the outside of the substrate 12, an abutment member 712 connected to the first pressing panel 710 and disposed opposite to the micro switch 711, and a flexible layer 713 connecting the substrate 12 and the abutment member 712. The flexible layer 713 and the abutment member 712 together seal the button hole 122 to improve waterproof performance. The outer edge of the flexible layer 713 is connected to the substrate 12, and the inner edge is connected to the outer surface of the abutment member 712. The first pressing panel 710 has a connecting rod 7100 passing through the abutment member 712. The connection between the connecting rod 7100 and the abutment member 712 can achieve positioning and increase the connection force. The abutment member 712 has an abutment portion 7120 protruding towards the circuit board 32, and the abutment portion 7120 is disposed opposite to the micro switch 711. When the first pressing panel 710 is pressed, the first pressing panel 710 causes the flexible layer 713 to deform, causing the abutment 712 to move down, and the abutment part 7120 presses down the micro switch 711, thereby triggering the micro switch 711.
[0179] Optionally, the outer surface of the substrate 12 is provided with a groove 123, and the flexible layer 713 is embedded in the groove 123. In the thickness direction of the substrate 12, the outer contour of the projection area of the button hole 122 is located within the outer contour of the projection area of the groove 123. By embedding the flexible layer 713 in the groove 123, the connection between the flexible layer 713 and the substrate 12 can be improved, while reducing the space occupied in the thickness direction, making the overall structure more compact, and also improving the waterproof effect. Further optionally, the flexible layer 713 is partially fitted with the hole wall of the button hole 122, and it is provided with a ring 7130 that fits with the hole wall of the button hole 122 to further improve the connection strength with the substrate 12 and the waterproof effect.
[0180] In some embodiments, a plurality of blind holes 1231 are provided on the bottom surface 1230 of the groove 123, and the flexible layer 713 is embedded in the blind holes 1231, which can further increase the connection and sealing of the flexible layer 713 and the substrate 12, so as to ensure that the assembled headphone assembly has good deep waterproof performance.
[0181] In some embodiments, such as Figures 37 to 39 As shown, the pressure sensor button 72 includes a flexible circuit board 721 connected to the circuit board 32 and a second pressing panel 720 located outside and connected to the substrate 12. The flexible circuit board 721 includes a first portion 7210 attached to the surface of the substrate 12 facing the circuit board 32, a second portion 7214 connected to the circuit board 32, and a third portion 7215 connecting the first portion 7210 and the second portion 7214. The first portion 7210 is equipped with a pressure sensor 7211, and the second portion 7214 is connected to the side of the circuit board 32 away from the substrate 12. When the second pressing panel 720 is pressed, its pressure is transmitted to the pressure sensor 7211, causing the pressure sensor 7211 to sense a pressure signal. When the pressure reaches a preset threshold, the control circuit board 51 controls the headphones to execute the corresponding control command. The pressure sensor 7211 may include, for example, a strain gauge. When the substrate 12 is deformed by pressure, it generates a change in resistance, and the magnitude of the pressure is determined based on the change in resistance.
[0182] like Figure 34 , Figure 40 and Figure 41As shown, the second pressing panel 720 includes a fixing part 7201 connected to the substrate 12 and a cantilever 7202 connected to the fixing part 7201. The fixing part 7201 is connected to the substrate 12, and the cantilever 7202 is spaced apart from the substrate 12 to facilitate deformation toward the substrate 12 after being pressed. Optionally, the fixing part 7201 protrudes toward the side where the substrate 12 is located to increase the distance between the cantilever 7201 and the substrate 12, facilitating elastic deformation. Optionally, a protruding bump 127 is provided on the substrate 12, the position of which corresponds to the fixing part 7201, and the two abut against each other to further increase the distance between the cantilever 7201 and the substrate 12. It can be understood that when the distance between the cantilever 7201 and the substrate 12 is appropriate, only the fixing part 7201 or only the bump 127 can be retained. The cantilever 7202 is provided with a protrusion 7203 that corresponds to the position of the pressure sensor 7211 and protrudes toward the pressure sensor 7211. The protrusion 7203 is used to apply pressure to the substrate 12. Since the cross-sectional area of the protrusion 7203 is relatively small, it is easier to deform the substrate 12.
[0183] In some embodiments, the projected area of all protrusions 7203 on the projection plane perpendicular to the pressing direction is 0.4 mm² to 2.5 mm². This area is more suitable for ensuring structural strength and facilitating deformation of the substrate 12. Further optionally, the projected area is 0.6 mm² to 2 mm² to achieve a balance between ensuring structural strength and facilitating deformation of the substrate 12. In some embodiments, the ratio of the projected area of all protrusions 7203 on the projection plane perpendicular to the pressing direction to the projected area of the second pressing panel 720 on that projection plane is 0.3% to 2%. This effectively ensures the accuracy of pressing and the comfort of the feel, conforming to ergonomic design and functional accuracy. More preferably, the ratio ranges from 0.5% to 1% to further guarantee the effect.
[0184] To facilitate elastic deformation of the second pressing panel 720, the second pressing panel 720 includes a groove 7205 extending along its width direction and penetrating both ends of the second pressing panel 720 in the width direction. The groove 7205 is located between the protrusion 7203 and the fixing part 7201. The groove 7205 makes the thickness of the corresponding part of the second pressing panel 720 thinner, which facilitates the elastic deformation of its cantilever 7202, thereby applying pressure to the substrate 12. Optionally, the groove 7205 and the second pressing panel 720 are connected by a curved surface (e.g., an arc surface), which can reduce stress concentration and prevent the cantilever 7202 from breaking. Further, the groove 7205 is located on the inner surface 7209 of the second pressing panel 720 facing the substrate 12 to further prevent the cantilever 7202 from breaking.
[0185] Optionally, an elastic pad 7204 is provided between the protrusion 7203 and the substrate 12. The material of the elastic pad 7204 can be, for example, silicone. The elastic pad 7204 separates the protrusion 7203 and the substrate 12 and transmits pressure, protecting the substrate 12 and preventing damage from direct contact and hard compression. The two ends of the elastic pad 7204 abut against the substrate 12 and the protrusion 7203 respectively. After the cantilever 7201 deforms, the elastic pad 7204 can transmit pressure to the substrate 12 more quickly, further improving sensitivity. In some embodiments, the thickness D5 of the elastic pad 7204 is 0.2mm to 0.8mm. The thickness D5 of the elastic pad 7204 is the distance between the protrusion 7203 and the substrate 12. The thickness D5 of the elastic pad 7204 determines the downward pressure range of the cantilever 7201. Too large a thickness D5 will result in an excessively long pressing stroke, leading to insensitive pressing; too small a thickness D5 will result in poor tactile feedback. Setting the thickness D5 to 0.2mm to 0.8mm can improve operational comfort and sensitivity. Alternatively, the thickness D5 of the elastic pad 7204 can be set to 0.3mm to 0.5mm to further ensure effectiveness.
[0186] Optionally, the substrate 12 is provided with a protruding limiting ring 124, and an elastic pad 7204 is disposed within the limiting ring 124, which limits the movement. Further optionally, the limiting ring 124 is disposed on the bottom surface of the groove 123, and the flexible layer 713 simultaneously covers the periphery of the limiting ring 124, which can further improve the connection strength between the flexible layer 713 and the substrate 12 and prevent detachment.
[0187] In some embodiments, the second pressing panel 720 is provided with a connecting post 7206 extending toward the circuit board 32, and the connecting post 7206 is located on the fixing part 7201. The substrate 12 is provided with a connecting hole 125 connected to the connecting post 7206. Through the cooperation of the connecting post 7206 and the connecting hole 125, the second pressing panel 720 can be positioned, and the connection force between the second pressing panel 720 and the substrate 12 can be improved. Optionally, the connecting post 7206 also passes through the first part 7210 to simultaneously position the first part 7210. Further optionally, the connecting post 7206 abuts against the circuit board 32 and is supported by the circuit board 32. When a finger presses the position of the second pressing panel 720 corresponding to the connecting post 7206, it is not easy to drive the substrate 12 to deform, thereby reducing the risk of misoperation.
[0188] Optional, such as Figure 39 , Figure 40 and Figure 42As shown, the substrate 12 has a positioning post 126 protruding outward toward the side where the circuit board 32 is located. The first part 7210 of the flexible circuit board 721 has a positioning groove 7212 adapted to the positioning post 126. The positioning of the first part 7210 is achieved through the cooperation of the positioning post 126 and the positioning groove 7212, so that the pressure sensor 7211 can be accurately aligned with the protrusion 7203. Optionally, the positioning groove 7212 is located at the end of the first part 7210. Further optionally, both ends of the first part 7210 are provided with positioning grooves 7212.
[0189] In some embodiments, such as Figure 40 and Figure 42 As shown, the housing 1 is provided with an inner groove 17 on the side of the substrate 12 facing the inside of the housing assembly. The first part 7210 is provided in the inner groove 17. On the one hand, it can reduce the space occupied in the thickness direction, making the overall structure more compact. On the other hand, it can further reduce the thickness of the substrate 12, making the substrate 12 easier to deform.
[0190] In some embodiments, the first portion 7210 includes two pressure sensors 7211 located on opposite sides of the fixing portion 7201, and the second pressing panel 720 includes two protrusions 7203 corresponding to the positions of the pressure sensors 7211. Pressing an end of the second pressing panel 720 triggers the pressure sensor 7211 corresponding to that end. The two pressure sensors 7211 can perform different functions; for example, one pressure sensor 7211 can increase the volume, and the other pressure sensor 7211 can decrease the volume.
[0191] The second pressing panel 720 is strip-shaped, and two pressure sensors 7211 are spaced apart along the length of the second pressing panel 720. In this way, the distance between the two pressure sensors 7211 is relatively larger, and the finger has more operating space to accurately trigger one of the pressure sensors 7211, making it less likely to cause misoperation.
[0192] Optionally, the distance between the two protrusions 7203 and the fixing part 7201 is equal, and the two protrusions 7203 are symmetrically arranged on both sides of the fixing part 7201, so that the two ends of the second pressing panel 720 can be operated with a basically consistent pressing force, making it more convenient to use. The micro switch 711 is centered relative to the first pressing panel 710 to facilitate the operation of the first pressing panel 710.
[0193] Optionally, in a viewing direction directly above the substrate 12, the projection of the micro switch 711 along the width direction of the first pressing panel 710 is located in the middle of the second pressing panel 720. This position of the micro switch 711 is closer to the middle of the second pressing panel 720 and relatively farther from the pressure sensor 7211, making it less likely to accidentally activate the second pressing panel 720 when pressing the first pressing panel 710. Further optional, refer to... Figure 43 When viewed from the front of the substrate 12, the center distance D4 between the micro switch 711 and the two pressure sensors 7211 is equal.
[0194] In some embodiments, such as Figure 39 and Figure 40 As shown, the flexible circuit board 721 also includes a reinforcing layer 7213 bonded to the first portion 7210, and the reinforcing layer 7213 is bonded to the substrate 12. The reinforcing layer 7213 may be made of stainless steel, for example. The reinforcing layer 7213 helps to make the first portion 7210 flatter and can provide elastic recovery force, increase the amount of deformation, and help ensure the reliability of the pressing operation.
[0195] In some embodiments, such as Figures 44 to 46 As shown, the second pressing panel 720 has a protrusion 7200 protruding towards the side opposite to the substrate 12. By touching the protrusion 7200, the position of the second pressing panel 720 can be accurately identified, improving operational comfort. Furthermore, the first pressing panel 710 has an outer surface 7101 for manual pressing. The distance between the protrusion 7200 and the substrate 12 is greater than the distance between the outer surface 7101 and the substrate 12. The protrusion 7200 is more outwardly convex than the first pressing panel 710, thus reducing the risk of accidentally pressing down the first pressing panel 710 when pressing the protrusion 7200, improving operational accuracy. The protrusion 7200 can be cylindrical or cuboid, etc. Optionally, the protrusion 7200 is prismatic, including a portion extending along the length direction of the second pressing panel 720 to increase its length and facilitate operation. The length direction of the second pressing panel 720 is also the arrangement direction of the two pressure sensors 7211. Optionally, the two ends of the protrusion 7200 extend to both ends near the length of the second pressing panel 720. Further, the protrusion 7200 is continuous, and its length L7 along the length of the second pressing panel 720 is greater than or equal to half the length L3 of the second pressing panel 720, to facilitate identification of the protrusion 7200 and operation. Further, the length L7 is greater than or equal to two-thirds of the length L3; even further, the length L7 is greater than or equal to three-quarters of the length L3, to further ensure effectiveness.
[0196] The protrusion 7200 can be provided as one, two, or more. Optionally, the number and position of the protrusions 7200 correspond to the pressure sensor 7211, so that pressing the protrusion 7200 will press down the corresponding pressure sensor 7211. The protrusions 7200 can be continuous or discontinuous. In some embodiments, such as... Figure 46 As shown, the protrusions 7200 are continuous, forming a continuous ridge shape, to give the second pressing panel 720 better structural strength. In other embodiments, the ridged protrusions 7200 are discontinuous, with each protrusion 7200 corresponding to a pressure sensor 7211, making it easier for the finger to identify the position corresponding to the pressure sensor 7211 and trigger the corresponding control command. Figure 47 In the illustrated embodiment, the second pressing panel 720 is provided with two spaced protrusions 7200, both of which are prismatic, to indicate two pressing positions corresponding to two pressure sensors 7211 respectively. When a finger presses a certain protrusion 7200, it can press down to trigger the corresponding pressure sensor 7211.
[0197] Optionally, the projection of the protrusion 7200 along the pressing direction of the second pressing panel 720 is located on the pressure sensor 7211, so that the pressure is transmitted more directly to the pressure sensor 7211. When there is more than one pressure sensor 7211, optionally, the projections of all the protrusions 7200 along the pressing direction fall on all the pressure sensors 7211, and there are no pressure sensors 7211 that are not covered by the projection, so that each pressure sensor 7211 can reliably sense the pressure. For example, when the protrusion 7200 is in the form of a continuous ridge, the projections of the protrusions 7200 along the pressing direction of the second pressing panel 7200 fall on all the pressure sensors 7211 simultaneously. As another example, when there are multiple protrusions 7200 (including two), the projections of all the protrusions 7200 fall on all the pressure sensors 7211 simultaneously. Optionally, the protrusions 7200 and the pressure sensors 7211 correspond one-to-one. Alternatively, the projection portion of the protrusion 7200 along the pressing direction of the second pressing panel 720 is located on the protrusion 7203. When the protrusion 7200 is pressed, the force can be transmitted to the substrate 12 more directly and efficiently through the protrusion 7203 and sensed by the pressure sensor 7211, which helps to make the operation of the second pressing panel 720 more sensitive.
[0198] In some embodiments, the protrusion 7200 is prismatic, and the second pressing panel 720 includes a first surface 7207 and a second surface 7208 located on both sides of the protrusion 7200. Both the first surface 7207 and the second surface 7208 face outwards for pressing by hand. The first surface 7207 is closer to the first pressing panel 710 than the second surface 7208. Both the first surface 7207 and the second surface 7208 extend from the protrusion 7200 toward the side closer to the substrate 12 to form a ridge (i.e., the protrusion 7200) at their junction. It is understood that the junction of the first surface 7207 and the second surface 7208 can be transitioned by a curve (e.g., an arc) or other means to improve touch comfort. In this case, the transition portion forms the protrusion 7200. The first surface 7207 and the second surface 7208 can be inclined surfaces or curved surfaces. Optionally, both the first surface 7207 and the second surface 7208 are curved surfaces, with the first surface 7207 being an inwardly concave curved surface and the second surface 7208 being an outwardly convex curved surface. This not only makes it easier to identify the protrusion 7200, but also, since the second surface 7208 is more convex than the first surface 7207, when pressing, the finger can mainly contact the second surface 7208, reducing the risk of misoperation caused by the finger contacting the first pressing panel 710.
[0199] In some embodiments, the protrusion height of the protrusion 7200 relative to the edge of the second pressing panel 720 along the pressing direction is 0.4mm to 2mm, such as... Figure 44 As shown, the protrusion 7200 and the edge of the second pressing panel 720 have a minimum distance D6 and a maximum distance D7. The protrusion height of 0.4mm to 2mm means that the minimum distance D6 and the maximum distance D7 must be within the range of 0.4mm to 2mm simultaneously. The thickness of the outer edge of the second pressing panel 720 ranges from 0.5mm to 1.5mm. Figure 44 As shown, when the outer edge of the second pressing panel 720 has different thicknesses, the thickness B5 at its thinnest point and the thickness L8 at its thickest point both need to be within the range of 0.5mm to 1.5mm. This setting effectively utilizes the entire space, is more ergonomic, and makes it easier for the user to find the pressing position, thus facilitating pressing control. Alternatively, the protrusion height can be 0.5mm to 1.5mm, and the outer edge thickness of the second pressing panel 720 can be within the range of 0.5mm to 1mm, to further ensure the effect.
[0200] The first pressing panel 710 has an outer surface 7101 for pressing by hand, and the first surface 7207 of the second pressing panel 720 has a second end 72070 adjacent to the first end 71010 of the outer surface 7101. Optionally, the distance between the second end 72070 and the substrate 12 is ( Figure 44In this context, the distance (i.e., the thickness L8 at the thickest point of the outer edge of the second pressing panel 720) is greater than or equal to the distance L9 between the first end 71010 and the substrate 12. The first end 71010 is the highest point of the outer surface 7101 (the position with the greatest distance from the substrate 12). For example, the distance between the outer surface 7101 and the substrate 12 gradually decreases from the first end 71010. In this way, the overall height of the first surface 7207 is higher than the outer surface 7101 of the first pressing panel 710, which is more conducive to the accurate operation of the second pressing panel 720. Optionally, the first surface 7207 and the outer surface 7101 have a smooth transition. Further optionally, the outer surface 7101 has a concave curved surface.
[0201] In some embodiments, such as Figure 29 , Figure 48 and Figure 49 As shown, the housing assembly is provided with an air balance hole 18 that connects its inner and outer sides. The air balance hole 18 is used to balance the air pressure inside and outside the housing assembly so that the first pressing panel 710 can be reliably pressed down and the pressing operation is not easily affected by the external air pressure.
[0202] Optionally, the air balance hole 18 is located on the cover 600 to make reasonable use of the internal space of the housing assembly and reduce the complexity of the housing 1 structure. The cover 600 has a plate 6000 for contact with facial skin and an outer frame 6001 connected to the plate 6000. The air balance hole 18 is located on the outer frame 6001 to reduce the risk of the air balance hole 18 being blocked by the skin, affecting button operation. Optionally, the distance D3 between the center line of the air balance hole 18 and the surface (contact surface 6004) of the plate 6000 is not less than 1.5mm to further reduce the risk of the air balance hole 18 being covered by the skin when the headphones are worn. Further optionally, the distance D3 is not greater than 2.5mm to prevent the air balance hole 18 from being too close to the connection end of the cover 600 and the housing 1, ensuring the structural strength of the cover 600 and facilitating the installation of the protective mesh 19 described below.
[0203] like Figure 48 and Figure 49As shown, the earphone head 60 also includes a protective mesh 19 covering the air balance hole 18. The outer frame 6001 is provided with a receiving groove 6002 for installing the protective mesh 19. The protective mesh 19 can be, for example, a dustproof mesh, which can prevent external dust from entering the earphone head 60. The protective mesh 19 can also be a waterproof and breathable mesh, which can prevent dust and moisture from entering the earphone head 60, further improving the reliability of the earphone head 60. Optionally, the cover 600 is provided with an inwardly protruding rib 6003, which surrounds the periphery of the receiving groove 6002 to improve the structural strength at that location. Further optionally, the receiving groove 6002 is directly connected to the plate 6000, and the rib 6003 is in a semi-enclosed shape, cooperating with the plate 6000 to form the receiving groove 6002. Compared with the rib 6003 being directly annular, this helps to reduce molding difficulty and cost.
[0204] The earphone head 60 is equipped with a bone conduction sound device 8, and the receiving slot 6002 is arranged on the side facing the bone conduction sound device 8.
[0205] The bone conduction sound generator 8 is connected to the cover 600, specifically to the plate 6000 of the cover 600. The bone conduction sound generator 8 can generate vibrations, which are transmitted to the human body through the plate 6000, thus realizing bone conduction sound transmission.
[0206] The following section provides examples of the relevant content of the bone conduction sound generating device 8.
[0207] The bone conduction sound generator 8 generates vibrations to drive the shell assembly to vibrate. When the headphones are worn, the shell assembly contacts the skin of the head, and the vibrations are transmitted to the skin, allowing the person to hear sound. The performance of the bone conduction sound generator 8 determines the sound quality of the headphones. The following describes the structures of several feasible bone conduction sound generators 8.
[0208] Example 1 of bone conduction sound generation device
[0209] See Figures 50 to 52 This embodiment discloses a bone conduction sound generating device, including a bracket 810, a vibrator assembly 820 and a stator assembly 830.
[0210] The oscillator assembly 820 is movably disposed inside the bracket 810. The oscillator assembly 820 includes a magnetic circuit assembly. The magnetic circuit assembly has a first magnetic pole portion 82011, a second magnetic pole portion 82021, and a third magnetic pole portion 82031 formed at least at its outer edge along a first direction. The first magnetic pole portion 82011 and the second magnetic pole portion 82021 are respectively located at both ends of the magnetic circuit assembly along the first direction, and the third magnetic pole portion 82031 is located between the first magnetic pole portion 82011 and the second magnetic pole portion 82021. It can be understood that the "outer edge" of the magnetic circuit assembly refers to the outer peripheral edge of the magnetic circuit assembly.
[0211] The first magnetic pole portion 82011 and the second magnetic pole portion 82021 have the same polarity, while the third magnetic pole portion 82031 has the opposite polarity to the first magnetic pole portion 82011.
[0212] The stator assembly 830 is fixedly disposed inside the bracket 810. The stator assembly 830 includes a first coil 8301, which surrounds the outside of the magnetic circuit assembly. A second magnetic guide bracket 8302 and a first magnetic guide bracket 8303 are respectively disposed at both ends of the first coil 8301 along a first direction. The second magnetic guide bracket 8302 and the first magnetic guide bracket 8303 also surround the outside of the magnetic circuit assembly. It can be understood that the first coil 8301, the second magnetic guide bracket 8302 and the first magnetic guide bracket 8303 are all fixed.
[0213] The second magnetic guide bracket 8302 is used to generate a first magnetic force with the first magnetic pole portion 82011 when the first coil 8301 is energized, and to generate a second magnetic force with the third magnetic pole portion 82031.
[0214] The first magnetic guide bracket 8303 is used to generate a second magnetic force with the second magnetic pole portion 82021 and a first magnetic force with the third magnetic pole portion 82031 when the first coil 8301 is energized.
[0215] The first magnetic force is either a repulsive force or an attractive force; the second magnetic force is either an attractive force or a repulsive force. That is, when the first magnetic force is a repulsive force, the second magnetic force is an attractive force; when the first magnetic force is an attractive force, the second magnetic force is a repulsive force.
[0216] Both the first and second magnetic forces have a component force parallel to the first direction.
[0217] The first direction is the vibration direction of the oscillator assembly 820. After the first coil 8301 is energized, the oscillator assembly 820 will reciprocate relative to the stator assembly 830 along the first direction. In use, the first coil 8301 is energized with alternating current.
[0218] Understandably, when the first coil 8301 is energized, it will experience an Ampere force in the magnetic field formed by the magnetic circuit assembly. For example, the first coil 8301 is wrapped around the outside of the third magnetic pole portion 82031 and is positioned opposite to the third magnetic pole portion 82031. The magnetic field lines of the third magnetic pole portion 82031 can pass through the first coil 8301 relatively concentratedly, causing the first coil 8301 to generate an Ampere force. Since the first coil 8301 is connected to the support 810 and remains fixed, according to the principle of action and reaction, the oscillator assembly 820 is subjected to a force equal in magnitude and opposite in direction to the aforementioned Ampere force. The direction of the reaction force F1 of this Ampere force is parallel to the first direction. When the first coil 8301 is energized (alternating current), it will magnetize the second magnetic guide support 8302 and the first magnetic guide support 8303, forming alternating magnetic poles on their inner edges. These alternating magnetic poles will interact with the first magnetic field of the magnetic circuit assembly. The interaction of the pole portion 82011, the second magnetic pole portion 82021, and the third magnetic pole portion 82031 generates a resultant magnetic force F2. This resultant magnetic force F2 has a component parallel to the first direction. Driven by the combined reaction force F1 of the Ampere force and the resultant magnetic force F2, the oscillator assembly 820 will move relative to the stator assembly 830 along the first direction. Since the first coil 8301 is energized by alternating current, the oscillator assembly 820 also experiences an alternating driving force, causing it to oscillate up and down in the first direction. It is understandable that because the first coil 8301, the second magnetic guide bracket 8302, and the first magnetic guide bracket 8303 are all surrounding the magnetic circuit assembly, the component of the force perpendicular to the first direction between the alternating magnetic poles and the pole portions is canceled out, making it less likely for the oscillator assembly 820 to sway.
[0219] The aforementioned structure significantly improves magnetic field utilization. Compared to existing technologies that rely solely on the reaction force of the Ampere force to drive the oscillator assembly 820, this embodiment allows the oscillator assembly 820 to vibrate under the combined drive of the reaction force F1 of the Ampere force and the resultant magnetic force F2. This effectively increases the driving force, thereby greatly enhancing the vibration intensity of the oscillator assembly 820. Sensitivity is positively correlated with the driving force; the increase in driving force also effectively improves the sensitivity of the bone conduction sound generator within its effective frequency range (less than 5000Hz), thus increasing the loudness of the bone conduction sound generator.
[0220] In some preferred embodiments, see Figures 51 to 52 The inner edge of the second magnetic support 8302 protrudes from the inner wall of the first coil 8301 to form a second protrusion 83021, and the inner edge of the first magnetic support 8303 also protrudes from the inner wall of the first coil 8301 to form a first protrusion 83031.
[0221] Alternatively, the inner edge of the second magnetic guide 8302 may protrude from the inner wall of the first coil 8301 to form a second protrusion 83021; or the inner edge of the first magnetic guide 8303 may protrude from the inner wall of the first coil 8301 to form a first protrusion 83031.
[0222] By setting the second protrusion 83021 and the first protrusion 83031, on the one hand, the oscillator assembly 820 can be prevented from hitting the first coil 8301 when the device falls, and on the other hand, the magnetic lines of force generated by the first coil 8301 can be guided to the side of the oscillator assembly 820, thereby enhancing the interaction force between the stator assembly 830 and the oscillator assembly 820.
[0223] Understandably, in some configurations, the inner edge of the second magnetic support 8302 and the inner edge of the first magnetic support 8303 may not protrude from the inner wall of the first coil 8301.
[0224] In some embodiments, the magnetic circuit assembly includes a main magnetic conductive plate 8203, on which a third magnetic pole portion 82031 is formed. A first magnet 8204 is disposed at one end of the main magnetic conductive plate 8203 along a first direction, and a second magnet 8205 is disposed at the other end. The magnetization directions of the first magnet 8204 and the second magnet 8205 are opposite. For example, the magnetization direction of the first magnet 8204 can be the positive direction of the first direction, and the magnetization direction of the second magnet 8205 can be the opposite direction of the first direction. In a specific example, the upper part of the first magnet 8204 is the N pole and the lower part is the S pole, and the upper part of the second magnet 8205 is the S pole and the lower part is the N pole. In this case, the outer peripheral edge (i.e., the outer edge) of the main magnetic conductive plate 8203 is magnetized into an S pole by the magnets at both ends, which is the third magnetic pole portion 82031.
[0225] When the oscillator assembly 820 is in the equilibrium position, the first coil 8301 is wrapped around the outside of the main magnetic plate 8203, the second magnetic support 8302 is wrapped around the outside of the first magnet 8204, and the first magnetic support 8303 is wrapped around the outside of the second magnet 8205. It can be understood that the above equilibrium position is the position where the magnetic force between the oscillator assembly 820 and the stator assembly 830 is zero, which can be the initial position of the oscillator assembly 820 when the coil is not energized.
[0226] Furthermore, the first magnet 8204 has a first magnetic plate 8201 at the end away from the main magnetic plate 8203, and a first magnetic pole portion 82011 is formed on the outer edge of the first magnetic plate 8201. The second magnet 8205 has a second magnetic plate 8202 at the end away from the main magnetic plate 8203, and a second magnetic pole portion 82021 is formed on the outer edge of the first magnetic plate 8201. For example, if the first magnetic pole portion 82011 on the upper first magnetic plate 8201 is an N pole, then the second magnetic pole portion 82021 on the lower second magnetic plate 8202 is also an N pole.
[0227] In some embodiments, when the oscillator assembly 820 is in the balanced position, in a first direction, the first magnetic plate 8201 is at least partially located inside the second magnetic support 8302, and the second magnetic plate 8202 is at least partially located inside the first magnetic support 8303; or only the first magnetic plate 8201 is at least partially located inside the second magnetic support 8302; or only the second magnetic plate 803 is at least partially located inside the first magnetic support 8303.
[0228] In other embodiments, when the oscillator assembly 820 is in the equilibrium position, in the first direction, the first magnetic plate 8201 can be completely located above the outside of the second magnetic support 8302, and the second magnetic plate 8202 can be completely located below the outside of the first magnetic support 8303. It is understood that the distance between the first magnetic plate 8201 and the second magnetic support 8302 in the first direction should not be too large. Similarly, the distance between the second magnetic plate 8202 and the first magnetic support 8303 in the first direction should also not be too large, so as to better ensure the magnetic force between the corresponding magnetic pole part and the magnetic support.
[0229] Specifically, such as Figure 51 As shown, Figure 51 The solid arrows in the middle show the approximate directions of the magnetic forces from the stator assembly 830 acting on the oscillator assembly 820, while the dashed arrows show the approximate directions of the reaction forces of the Ampere force.
[0230] When the upper part of the first magnet 8204 at the top is an N pole and the lower part is an S pole, and the upper part of the second magnet 8205 at the bottom is an S pole and the lower part is an N pole, then the outer periphery of the main magnetic plate 8203 in the middle is magnetized into an S pole - third magnetic pole part 82031. At the same time, the outer periphery of the first magnetic plate 8201 at the top is magnetized into an N pole - first magnetic pole part 82011 by the adjacent first magnet 8204, and the outer periphery of the second magnetic plate 8202 at the bottom is magnetized into an N pole - second magnetic pole part 82021 by the adjacent first magnet 8204. The magnetic poles generated after the main magnetic plate 8203, the first magnetic plate 8201 and the second magnetic plate 8202 in the oscillator assembly 820 are magnetized by the magnets are fixed magnetic poles, that is, the polarity of the magnetic poles no longer changes.
[0231] When the first coil 8301 is energized... Figure 51 When the current flows in the indicated direction, the edge of the second magnetic support 8302 at the upper part of the first coil 8301 is magnetized as the N pole, and the edge of the first magnetic support 8303 at the lower part is magnetized as the S pole; at this time, a first magnetic force (repulsive force) is generated between the second magnetic support 8302 (N pole) and the first magnetic pole portion 82011 (N pole) of the first magnetic plate 8201, and a second magnetic force (attractive force) is generated with the third magnetic pole portion 82031 (S pole) of the main magnetic plate 8203; and the first magnetic... A second magnetic force (attraction force) is generated between the support 8303 (S pole) and the second magnetic pole portion 82021 (N pole) of the second magnetic plate 8202, and a first magnetic force (repulsion force) is generated with the third magnetic pole portion 82031 (S pole) of the main magnetic plate 8203. The above-mentioned magnetic forces on the oscillator assembly 820 all have an upward component force along the first direction. The resultant force of the above-mentioned magnetic forces is the resultant magnetic force F2. Therefore, the resultant magnetic force F2 on the oscillator assembly 820 also has an upward component force along the first direction.
[0232] At the same time, when the first coil 8301 is energized Figure 51 When the current is applied in the direction shown, the first coil 8301 will be subjected to an Ampere force downward in the first direction in the magnetic field generated by the magnetic circuit assembly, and the reaction force F1 of the Ampere force is upward in the first direction.
[0233] The reaction force F1 of the Ampere force and the upward component of the resultant force F2 of the magnetic force together constitute an upward driving force. Under the action of this joint driving force, the oscillator assembly 820 will move upward relative to the stator assembly 830 in the first direction.
[0234] Similarly, when the first coil 8301 is connected to... Figure 51 When the current flows in opposite directions as shown, the edge of the second magnetic support 8302 at the top of the first coil 8301 is magnetized as the S pole, and the edge of the first magnetic support 8303 at the bottom is magnetized as the N pole. At this time, the reaction force F1 of the Ampere force and the upward component of each magnetic force along the first direction are both downward, which together constitute a downward driving force. Under the action of this driving force, the oscillator assembly 820 will move downward relative to the stator assembly 830 along the first direction. Therefore, after the first coil 8301 is energized with alternating current, the oscillator assembly 820 will reciprocate up and down.
[0235] In some embodiments, an elastic element 840 is provided at one end of the oscillator assembly 820, or an elastic element 840 may be provided at both ends of the oscillator assembly 820.
[0236] The oscillator assembly 820 is connected to the bracket 810 via an elastic element 840. The elastic element 840 is located on the vibration path of the oscillator assembly 820, so as to better drive the oscillator assembly 820 to reset. In addition to the reset function mentioned above, the elastic element 840 can also limit the vibration stroke of the oscillator assembly 820 to control the magnitude of its vibration stroke; especially when the first coil 8301 is de-energized, the oscillator assembly 820 can be smoothly reset under the elastic force of the elastic element 840.
[0237] Preferred, such as Figures 53 to 55 As shown, both ends of the oscillator assembly 820 are connected to the bracket 810 through elastic elements 840, so that the oscillator assembly 820 is more stable when vibrating.
[0238] The aforementioned elastic element 840 can be a spring or a sheet, etc. The elastic element 840 can be fixed to the bracket 810 by welding, gluing or riveting, or it can be connected to the oscillator assembly 820 in the same way.
[0239] In some implementations, such as Figure 54 and Figure 55 As shown, one end of the bracket 810 is connected to a crash cover 850, or crash covers 850 can be connected to both ends of the bracket 810; the crash covers 850 are all located on the vibration path of the oscillator assembly 820 and are spaced apart from the oscillator assembly 820.
[0240] The anti-collision cover 850 serves two purposes: firstly, it prevents the vibrator assembly 820 from impacting other parts during use; secondly, it limits the displacement of the vibrator assembly 820 to prevent excessive deformation of the elastic element 840, which could lead to failure. For example, when the aforementioned vibration device is installed in headphones, the anti-collision cover 850 effectively prevents the vibrator assembly 820 from impacting important components such as the circuit board corresponding to the headphone head, avoiding circuit damage. If the aforementioned vibration device has components located close together above and / or below the headphone head, the anti-collision cover 850 is required. Even if there are no components above or below, but sufficient space, the anti-collision cover 850 is still necessary to limit the displacement of the vibrator assembly 820. Figure 48 As shown, the anti-collision cover 850 is located at the end of the bone conduction sound device facing the circuit board 32 to prevent the vibrator assembly 820 from impacting the circuit board 32 and causing damage to the circuit board 32.
[0241] The aforementioned anti-collision cover 850 can be fixed to the bracket 810 by welding, gluing or riveting.
[0242] Preferred, such as Figure 52As shown, the outer edge of the first magnetic plate 8201 protrudes from the outer wall of the first magnet 8204 to form a third protrusion 82012, and the outer edge of the second magnetic plate 8202 protrudes from the outer wall of the second magnet 8205 to form a fourth protrusion 82022.
[0243] When the first coil 8301 is de-energized and the oscillator assembly is in a state deviating from its equilibrium position, there is an inherent magnetic attraction between the oscillator assembly and the stator assembly. The direction of this magnetic attraction is the same as the direction of the oscillator displacement; that is, the magnetic attraction is in the direction the oscillator shifts. To overcome this inherent magnetic attraction and allow the oscillator assembly to return to its equilibrium position, the elastic element 840 needs to have a greater elastic force, thus placing higher demands on the performance of the elastic element 840. The aforementioned protruding design increases the distance between the magnet and the magnetic guide support of the stator assembly, thereby reducing the aforementioned magnetic attraction and lessening the design burden on the elastic element 840. This avoids using an elastic element 840 with excessive elasticity, as an elastic element 840 with excessive elasticity is more prone to fatigue damage, has a shorter lifespan, and is more likely to detach and fail. In addition, it allows for more reliable magnetization of the outer edges of the first magnetic plate 8201 and the second magnetic plate 8202 to form magnetic poles.
[0244] In some embodiments, only the outer edge of the first magnetic plate 8201 may protrude from the outer wall of the first magnet 8204 to form a third protrusion 82012; or only the outer edge of the second magnetic plate 8202 may protrude from the outer wall of the second magnet 8205 to form a fourth protrusion 82022.
[0245] In some embodiments, the outer edges of the main magnetic plate 8203 protrude from the outer walls of the first magnet 8204 and the second magnet 8205 to form a fifth protrusion 82032.
[0246] In some embodiments, the support 810 is made of a magnetic conductor (i.e., made of a magnetic material), and the second magnetic support 8302 and the support 810 are integrally formed, or the first magnetic support 8303 and the support 810 are integrally formed; or the second magnetic support 8302, the first magnetic support 8303 and the support 810 can be integrally formed, or the three can be connected separately.
[0247] If the aforementioned bracket 810 is made of a magnetic conductor, in addition to its fixing function, it will also be magnetized by the current of the first coil 8301, shortening the path of the magnetic lines of force to reduce the magnetic resistance in the magnetic circuit, increasing the magnetic field strength in the magnetic gap, thereby increasing the alternating driving force on the oscillator assembly 820 and further enhancing the driving effect.
[0248] In some embodiments, the bracket 810 may also be made of a non-magnetic material (i.e., made of a non-magnetic material), in which case the second magnetic bracket 8302 or the first magnetic bracket 8303 can be directly connected to the bracket 810. The non-magnetic bracket 810 then only serves a supporting and fixing function.
[0249] Furthermore, the bracket 810 includes a non-magnetic radial support portion 8101, which allows the second magnetic bracket 8302 to be connected to the radial support portion 8101; or, allows the first magnetic bracket 8303 to be connected to the radial support portion 8101; or, allows both the second magnetic bracket 8302 and the first magnetic bracket 8303 to be connected to the radial support portion 8101, so as to ensure reliable support.
[0250] In some implementations, such as Figure 60 As shown, a channel 8206 is provided in the middle of the oscillator assembly 820. The channel 8206 extends from one end of the oscillator assembly 820 to the other end along a first direction. The channel 8206 is a through hole or a blind hole. The channel 8206 can pass through the elastic member 840.
[0251] The aforementioned channel 8206 can be used to embed components to increase product reliability, and one or more channels 8206 can be provided as needed.
[0252] For example, in this embodiment, the first magnet 8204 and the second magnet 8205 are like poles and repel each other. When the main magnetic conductive plate 8203 in the middle is particularly thin, the first magnet 8204 will be subjected to the repulsive force of the second magnet 8205. This may cause the components of the oscillator assembly to separate and lead to the destruction of the oscillator assembly. However, by setting a channel 8206 and gluing, riveting or welding a part through the oscillator assembly in the channel 8206 to make it part of the oscillator assembly, the connection force in the vibration direction can be increased, making it difficult for the components in the oscillator assembly to separate, so that the components in the oscillator assembly can be firmly combined together.
[0253] In addition, during assembly, by setting a channel 8206 and placing a part that penetrates the oscillator assembly inside, this part can also act as a positioning post, which will facilitate the assembly and positioning of the various components of the oscillator assembly. At this time, the part that plays a positioning role does not need to be fixed together with the oscillator assembly, but is only used during assembly and positioning.
[0254] In some other ways, the oscillator assembly 820 may not have the channel 8206 provided.
[0255] The cross-section of the first magnetic plate 8201 can be cylindrical, T-shaped, or conical, or other shapes. The cross-section of the first magnetic plate 8201 refers to the surface obtained by cutting through a plane passing through its axis. For example... Figure 56 and Figure 57In the embodiment shown, the cross-section of the first magnetic plate 8201 is T-shaped, and similarly, the cross-section of the second magnetic plate 8202 can also be cylindrical, T-shaped or conical.
[0256] Preferably, the cross-section of either the first magnetic plate 8201 or the second magnetic plate 8202 is T-shaped or conical, which is more conducive to reducing the initial magnetic attraction force on the oscillator assembly 820, facilitating assembly, and extending the life of the elastic element 840. Furthermore, the first magnetic plate 8201 is configured such that the width of its cross-section near the end adjacent to the first magnet 8204 is greater than the width of its cross-section away from the first magnet 8204, and the second magnetic plate 8202 is configured such that the width of its cross-section near the end adjacent to the second magnet 8205 is greater than the width of its cross-section away from the second magnet 8205, in order to reduce the interference of the magnetic plates on the elastic arm of the elastic element 840 during vibration.
[0257] The first magnetic plate 8201, the second magnetic plate 8202, and the main magnetic plate 8203 can each be manufactured as a combination component or a single piece.
[0258] The aforementioned second magnetic guide 8302 and first magnetic guide 8303 can both be ring-shaped, and can be circular, elliptical, racetrack-shaped, or other ring-shaped forms.
[0259] In this embodiment, both the second magnetic guide bracket 8302 and the first magnetic guide bracket 8303 can be fixed to the bracket 810 by welding, gluing or riveting.
[0260] Figure 61 This is a comparison diagram of the frequency response curves of the bone conduction sound generating device of this embodiment and the bone conduction sound generating device of the prior art. Figure 61 In the diagram, the solid line represents the frequency response curve of the bone conduction sound device of this embodiment, while the dashed line represents the frequency response curve of a prior art bone conduction sound device. In the frequency band below 5000Hz, the frequency response curve of the bone conduction sound device of this embodiment is higher than that of existing bone conduction sound devices, indicating an overall improvement in sensitivity and thus an increase in loudness. Since bone conduction headphones primarily operate within the 5000Hz frequency range for both calls and playback, the sound pressure level within the effective operating range is significantly improved.
[0261] The bone conduction sound generating device of the above embodiment effectively improves the utilization rate of the magnetic circuit structure, enabling the vibrator assembly to vibrate under the dual drive of magnetic force and Ampere force reaction force, thereby effectively improving the driving force. Under the same power consumption, it effectively improves the electromechanical conversion efficiency, greatly improves the vibration sensitivity of the vibrator assembly, and thus improves the loudness of the bone conduction sound generating device, which means that the loudness heard by the human ear is increased; and under the same loudness conditions, it can reduce the power consumption of the bone conduction microphone.
[0262] Example 2 of bone conduction sound generation device
[0263] The main difference between this embodiment and Implementation 1 is that the magnetic circuit assembly does not include a first magnetic plate 8201 and a second magnetic plate 8202. Instead, the magnetic circuit assembly only includes a main magnetic plate 8203, a first magnet 8204, and a second magnet 8205. A third magnetic pole portion 82031 is formed on the main magnetic plate 8203. The first magnet 8204 is provided at one end of the main magnetic plate 8203, and the second magnet 8205 is provided at the other end. The magnetization directions of the first magnet 8204 and the second magnet 8205 are opposite. For example, the magnetization direction of the first magnet 8204 can be the positive direction of the first direction, and the magnetization direction of the second magnet 8205 can be the direction of the first direction. Specifically, the upper part of the first magnet 8204 is the N pole and the lower part is the S pole, and the upper part of the second magnet 8205 is the S pole and the lower part is the N pole. At this time, the outer periphery of the main magnetic plate 8203 is magnetized into the S pole by the magnets at both ends, which is the third magnetic pole part 82031.
[0264] Understandably, at this time, the upper magnetic pole of the first magnet 8204 at the top is used as the first magnetic pole part 82011, and the lower magnetic pole of the second magnet 8205 at the bottom is used as the second magnetic pole part 82021. The first magnetic pole part 82011 and the second magnetic pole part 82021 are both N poles or both S poles.
[0265] Example 3 of bone conduction sound generation device
[0266] like Figure 58 and Figure 59 As shown, the main difference between this embodiment and the above embodiments is that the stator assembly 830 also includes an external magnetic guide bracket 8304, which is located outside the first coil 8301.
[0267] Preferably, one end of the outer magnetic guide bracket 8304 is connected to the second magnetic guide bracket 8302 at one end of the first coil 8301, and the other end is connected to the first magnetic guide bracket 8303 at the other end of the first coil 8301, so as to better reduce magnetic resistance. The magnetized magnetic lines generated by the first coil 8301 will flow more from the second magnetic guide bracket 8302 through the first magnetic guide bracket 8303 to the outer magnetic guide bracket 8304, shortening the closed magnetic circuit route and making the magnetic field strength of the magnetic pole stronger.
[0268] In some ways, such as Figure 58 As shown, the outer magnetic guide bracket 8304 can be located between the second magnetic guide bracket 8302 and the first magnetic guide bracket 8303, with the second magnetic guide bracket 8302 located above the outer magnetic guide bracket 8304 and the first magnetic guide bracket 8303 located below the outer magnetic guide bracket 8304.
[0269] In other ways, such as Figure 59 As shown, the second magnetic guide 8302 and the first magnetic guide 8303 can both be located inside the outer magnetic guide 8304.
[0270] The outer magnetic guide bracket 8304 can be connected to the second magnetic guide bracket 8302 by welding, gluing or riveting, or it can be connected to the first magnetic guide bracket 8303 in the same way.
[0271] The aforementioned peripheral magnetic support 8304 can be ring-shaped, and can be a circular ring, an elliptical ring, a racetrack ring, or other ring-shaped forms.
[0272] In some embodiments, the support 810 is made of a magnetic conductor, and the second magnetic support 8302 and the support 810 are integrally formed, or the first magnetic support 8303 and the support 810 are integrally formed; the second magnetic support 8302, the first magnetic support 8303 and the support 810 can also be integrally formed, or the three can be connected separately.
[0273] In some embodiments, the bracket 810 may also be made of a non-magnetic material, in which case the second magnetic bracket 8302 or the first magnetic bracket 8303 can be directly connected to the bracket 810. The non-magnetic bracket 810 then only serves a supporting and fixing function.
[0274] Furthermore, such as Figure 59 As shown, the bracket 810 may include a non-magnetic radial support portion 8101, which may connect the second magnetic bracket 8302 to the radial support portion 8101; or, connect the first magnetic bracket 8303 to the radial support portion 8101; or, connect both the second magnetic bracket 8302 and the first magnetic bracket 8303 to the radial support portion 8101 to ensure reliable support.
[0275] In some embodiments, the peripheral magnetic support 8304 may also be directly fixedly connected to the radial support 8101.
[0276] Example 4 of bone conduction sound generation device
[0277] See Figures 62 to 64 This embodiment discloses a bone conduction sound generating device, including a bracket 810, a vibrator assembly 820 and a stator assembly 830.
[0278] The oscillator assembly 820 is movably disposed inside the bracket 810. The oscillator assembly 820 includes a magnetic circuit assembly. At least at the edges of both ends of the magnetic circuit assembly along a first direction, a first magnetic pole portion 82011 and a second magnetic pole portion 82021 are respectively formed. The polarities of the first magnetic pole portion 82011 and the second magnetic pole portion 82021 are opposite. It can be understood that the "outer edge" of the magnetic circuit assembly refers to the outer edge of the magnetic circuit assembly.
[0279] The stator assembly 830 is fixedly disposed inside the bracket 810. The stator assembly 830 includes a first coil 8301 and a second coil 8307. The first coil 8301 and the second coil 8307 are spaced apart along a first direction. The current directions of the first coil 8301 and the second coil 8307 are opposite. The first coil 8301 and the second coil 8307 are both wrapped around the outside of the magnetic circuit assembly. A first magnetic guide bracket 8303 is disposed between the first coil 8301 and the second coil 8307.
[0280] The first coil 8301 is wrapped around the outside of the first magnetic pole portion 82011, and the second coil 8307 is wrapped around the outside of the second magnetic pole portion 82021. When both the first coil 8301 and the second coil 8307 are energized, a first magnetic force is generated between the first magnetic guide bracket 8303 and the first magnetic pole portion 82011, and a second magnetic force is generated between the first magnetic guide bracket 8303 and the second magnetic pole portion 82021.
[0281] The first magnetic force is either a repulsive force or an attractive force; the second magnetic force is either an attractive force or a repulsive force. That is, when the first magnetic force is a repulsive force, the second magnetic force is an attractive force; when the first magnetic force is an attractive force, the second magnetic force is a repulsive force.
[0282] Both the first and second magnetic forces have a component force parallel to the first direction.
[0283] The first direction is the vibration direction of the oscillator assembly 820. After both the first coil 8301 and the second coil 8307 are energized, the oscillator assembly 820 will reciprocate relative to the stator assembly 830 along the first direction. In use, both the first coil 8301 and the second coil 8307 are energized with alternating current, and the current directions are opposite.
[0284] Understandably, when the first coil 8301 and the second coil 8307 are energized, they will be subjected to Ampere force in the magnetic field formed by the magnetic circuit assembly. For example, the first coil 8301 and the second coil 8307 are respectively wrapped around the outside of the first magnetic pole portion 82011 and the second magnetic pole portion 2012, and are respectively arranged opposite to the first magnetic pole portion 82011 and the second magnetic pole portion 2012. Therefore, the magnetic field lines of the first magnetic pole portion 82011 and the second magnetic pole portion 2012 can pass through the corresponding coils more concentratedly, so that the energized coil generates Ampere force. Since each coil is connected to the support 810 and remains fixed, according to the principle of action and reaction, the oscillator assembly 820 is subjected to a force equal in magnitude and opposite in direction to the aforementioned Ampere force. The direction of the reaction force F1 of this Ampere force is parallel to the first direction. When each coil is energized (alternating current), it magnetizes the first magnetic support 8303 and forms alternating magnetic poles at its edge. These alternating magnetic poles interact with the first magnetic pole part 82011 and the second magnetic pole part 82021 of the magnetic circuit assembly to generate a magnetic resultant force F2. The magnetic resultant force F2 has a component parallel to the first direction. Therefore, under the combined drive of the reaction force F1 of the Ampere force and the magnetic resultant force F2, the oscillator assembly 820 will move relative to the stator assembly 830 along the first direction. Since the coil is energized by alternating current, the force on the oscillator assembly 820 is also an alternating driving force, and it will oscillate up and down in the first direction.
[0285] The aforementioned structure significantly improves magnetic field utilization. Compared to existing technologies that rely solely on the reaction force of the Ampere force to drive the oscillator assembly 820, this embodiment allows the oscillator assembly 820 to vibrate under the combined drive of the reaction force F1 of the Ampere force and the resultant magnetic force F2. This effectively increases the driving force, thereby greatly enhancing the vibration intensity of the oscillator assembly 820. Sensitivity is positively correlated with the driving force; the increase in driving force also effectively improves the sensitivity of the bone conduction sound generator within its effective frequency range (less than 5000Hz), thus increasing the loudness of the bone conduction sound generator.
[0286] In some implementations, see Figure 63 and Figure 64 The inner edge of the first magnetic guide bracket 8303 protrudes from the inner wall of the first coil 8301 and the second coil 8307 to form a first protrusion 83031; on the one hand, it can prevent the oscillator assembly 820 from hitting the coil when the device falls, and on the other hand, it can guide the magnetic lines of force generated by the coil to the side of the oscillator assembly 820, thereby enhancing the interaction force between the stator assembly 830 and the oscillator assembly 820.
[0287] In some embodiments, a second magnetic support 8302 is provided at the end of the first coil 8301 away from the first magnetic support 8303, and a third magnetic support 8305 is provided at the end of the second coil 8307 away from the first magnetic support 8303.
[0288] Furthermore, the inner edge of the second magnetic guide 8302 protrudes from the inner wall of the first coil 8301 to form a second protrusion 83021, and the inner edge of the third magnetic guide 8305 protrudes from the inner wall of the second coil 8307 to form a sixth protrusion 83051.
[0289] Alternatively, the inner edge of the second magnetic guide 8302 may protrude from the inner wall of the first coil 8301 to form the second protrusion 83021; or the inner edge of the third magnetic guide 8305 may protrude from the inner wall of the second coil 8307 to form the sixth protrusion 83051.
[0290] The aforementioned second protrusion 83021 and sixth protrusion 83051 can, on the one hand, prevent the oscillator assembly 820 from hitting the corresponding coil when the device falls, and on the other hand, guide the magnetic lines of force generated by the corresponding coil to the side of the oscillator assembly 820, thereby enhancing the interaction force between the stator assembly 830 and the oscillator assembly 820.
[0291] Understandably, in some other ways, the inner edge of the first magnetic guide 8303 may not protrude from the inner wall of each coil; the inner edges of the second magnetic guide 8302 and the third magnetic guide 8305 may also not protrude from the inner wall of the corresponding coil.
[0292] In some embodiments, the magnetic circuit assembly includes a main magnet 8207, the upper end of which is located inside the first coil 8301 and the lower end of which is located inside the second coil 8307.
[0293] Furthermore, one end of the main magnet 8207 is connected to a first magnetic plate 8201, and the other end is connected to a second magnetic plate 8202. When the oscillator assembly is in a vibrating state, in a first direction, the first magnetic plate 8201 is at least partially located inside the first coil 8301, and the second magnetic plate 8202 is at least partially located inside the second coil 8307. A first magnetic pole portion 82011 is formed on the outer edge of the first magnetic plate 8201, and a second magnetic pole portion 82021 is formed on the outer edge of the second magnetic plate 8202. For example, if the first magnetic pole portion 82011 on the upper first magnetic plate 8201 is an N pole, then the second magnetic pole portion 82021 on the lower second magnetic plate 8202 is an S pole.
[0294] Specifically, such as Figure 63 As shown, Figure 63 The solid arrows in the middle show the approximate directions of the magnetic forces from the stator assembly 830 acting on the oscillator assembly 820, while the dashed arrows show the approximate directions of the reaction force of the Ampere force.
[0295] When the upper part of the main magnet 8207 is an N pole and the lower part is an S pole, the outer periphery of the first magnetic plate 8201 at the upper end is magnetized by the main magnet 8207 into an N pole - first magnetic pole part 82011, and the outer periphery of the second magnetic plate 8202 at the lower end is magnetized by the main magnet 8207 into an S pole - second magnetic pole part 82021. The magnetic poles generated by the first magnetic plate 8201 and the second magnetic plate 8202 in the oscillator assembly 820 after being magnetized by the magnet are fixed magnetic poles, that is, the polarity of the magnetic poles no longer changes.
[0296] Then when the first coil 8301 and the second coil 8307 are respectively connected... Figure 63 When the current is applied in the direction shown, the first coil 8301 and the second coil 8307 are supplied with current in opposite directions. At this time, the inner edge of the first magnetic support 8303 is magnetized as the S pole, the outer edge of the upper second magnetic support 8302 is magnetized as the N pole, and the inner edge of the lower third magnetic support 8305 is magnetized as the N pole. Then, a first magnetic force (attraction) is generated between the first magnetic support 8303 (S pole) and the first magnetic pole portion 82011 (N pole) of the first magnetic plate 8201, and the upper second magnetic support 8302 (N pole) and the first magnetic pole portion 82011 of the first magnetic plate 8201... A second magnetic force (repulsive force) is generated between 2011 (N pole); and a second magnetic force (repulsive force) is generated between the first magnetic guide support 8303 (S pole) and the second magnetic pole portion 82021 (S pole) of the second magnetic guide plate 8202. A first magnetic force (attractive force) is generated between the lower third magnetic guide support 8305 (N pole) and the second magnetic pole portion 82021 (S pole) of the second magnetic guide plate 8202. The above-mentioned magnetic forces on the oscillator assembly 820 each have a component force downward along the first direction. The resultant force of the above-mentioned magnetic forces is the resultant force F2. The resultant force F2 on the oscillator assembly 820 also has a component force downward along the first direction.
[0297] At the same time, the first coil 8301 will be subjected to an upward Ampere force in the magnetic field of the magnetic circuit assembly, and the second coil 8307 will also be subjected to an upward Ampere force in the magnetic field of the magnetic circuit assembly. The direction of the reaction force of each Ampere force is downward in the first direction, so the direction of the resultant force F1 of the reaction forces of each Ampere force is also downward in the first direction.
[0298] The reaction force F1 of the Ampere force and the upward component of the resultant force F2 of the magnetic force together constitute a downward driving force. Under the action of this combined driving force, the oscillator assembly 820 will move downward relative to the stator assembly 830 in the first direction.
[0299] Similarly, when the first coil 8301 and the second coil 8307 are respectively connected to... Figure 63When the current flows in the opposite direction as shown, the edge of the first magnetic support 8303 is magnetized as the N pole, the edge of the upper second magnetic support 8302 is magnetized as the S pole, and the edge of the lower third magnetic support 8305 is also magnetized as the S pole. At this time, the direction of the reaction force of the Ampere force on each coil is upward along the first direction. Therefore, the resultant force F1 of the reaction force of the Ampere force is also upward along the first direction. Moreover, the upward component of each magnetic force on the oscillator assembly 820 along the first direction is also upward. That is, the upward component of the reaction force F1 of the Ampere force and the resultant force F2 of each magnetic force is upward, which together constitutes an upward driving force. Under the action of this driving force, the oscillator assembly 820 will move upward relative to the stator assembly 830 along the first direction. Therefore, after the corresponding alternating current is applied to each coil, the oscillator assembly 820 will reciprocate up and down. Understandably, since each coil and magnetic support is surrounded outside the magnetic circuit assembly, the component force perpendicular to the first direction between the alternating magnetic poles and the magnetic pole section is canceled out, making it less likely to cause the oscillator assembly to wobble.
[0300] In some embodiments, an elastic element 840 is provided at one end of the oscillator assembly 820, or an elastic element 840 may be provided at both ends of the oscillator assembly 820.
[0301] The oscillator assembly 820 is connected to the bracket 810 via an elastic element 840. The elastic element 840 is located on the vibration path of the oscillator assembly 820, allowing for better drive of the oscillator assembly 820 to reset. Besides its reset function, the elastic element 840 also limits the vibration stroke of the oscillator assembly 820, controlling its magnitude; especially when the coils are de-energized, the oscillator assembly 820 can smoothly reset under the elastic force of the elastic element 840. The equilibrium position is understood to be the position where the magnetic force between the oscillator assembly 820 and the stator assembly 830 is zero, which can be considered the initial position of the oscillator assembly 820 when none of the coils are energized.
[0302] Preferably, both ends of the oscillator assembly 820 are connected to the bracket 810 through elastic elements 840, so that the oscillator assembly 820 is more stable when vibrating.
[0303] The aforementioned elastic element 840 can be a spring or a sheet, etc. The elastic element 840 can be fixed to the bracket 810 by welding, gluing or riveting, or it can be connected to the oscillator assembly 820 in the same way.
[0304] In some embodiments, one end of the bracket 810 is connected to a crash cover 850, or crash covers 850 can be connected to both ends of the bracket 810; the crash covers 850 are all located on the vibration path of the oscillator assembly 820 and are spaced apart from the oscillator assembly 820.
[0305] The anti-collision cover 850 serves two purposes: firstly, it prevents the vibrator assembly 820 from impacting other parts during use; secondly, it limits the displacement of the vibrator assembly 820 to prevent excessive deformation of the elastic element 840, which could lead to failure. For example, when the aforementioned vibration device is installed in headphones, the anti-collision cover 850 effectively prevents the vibrator assembly 820 from impacting important components such as the circuit board corresponding to the headphone head, avoiding circuit damage. If the aforementioned vibration device has components located close together above and / or below the headphone head, the anti-collision cover 850 is required. Even if there are no components above or below, but sufficient space, the anti-collision cover 850 is still necessary to limit the displacement of the vibrator assembly 820. Figure 48 As shown, the anti-collision cover 850 is located at the end of the bone conduction sound device facing the circuit board 32 to prevent the vibrator assembly 820 from impacting the circuit board 32 and causing damage to the circuit board 32.
[0306] The aforementioned anti-collision cover 850 can be fixed to the bracket 810 by welding, gluing or riveting.
[0307] In some implementations, see Figure 63 and Figure 64 The outer edge of the first magnetic plate 8201 protrudes from the outer wall of the main magnet 8207 to form a third protrusion 82012, and the outer edge of the second magnetic plate 8202 protrudes from the outer wall of the main magnet 8207 to form a fourth protrusion 82022. A first magnetic pole portion 82011 is formed on the third protrusion 82012, and a second magnetic pole portion 82021 is formed on the fourth protrusion 82022.
[0308] Alternatively, the outer edge of the first magnetic plate 8201 may protrude from the outer wall of the main magnet 8207 to form a third protrusion 82012; or the outer edge of the second magnetic plate 8202 may protrude from the outer wall of the main magnet 8207 to form a fourth protrusion 82022.
[0309] When the coils are de-energized and the oscillator assembly is in a state deviating from its equilibrium position, there is an inherent magnetic attraction between the oscillator assembly and the stator assembly. The direction of this magnetic attraction is the same as the direction of the oscillator displacement; that is, the magnetic attraction is in the direction the oscillator shifts. To overcome this inherent magnetic attraction and allow the oscillator assembly to return to its equilibrium position, the elastic element 840 needs to have a greater elastic force, thus placing higher demands on its performance. The design of the third protrusion 82012 and the fourth protrusion 82022 increases the distance between the main magnet and the magnetic guide support of the stator assembly, thereby reducing the aforementioned magnetic attraction and lessening the design burden on the elastic element 840. This avoids using an elastic element 840 with excessive elasticity, as such elements are more prone to fatigue damage, have a shorter lifespan, and are more likely to detach and fail. Furthermore, this design allows for more reliable magnetization of the outer edges of the first magnetic plate 8201 and the second magnetic plate 8202, forming magnetic pole portions.
[0310] In some embodiments, the bracket 810 is made of a magnetic conductor, and a first magnetic conductor bracket 8303 is formed on the bracket 810. That is, the bracket 810 and the first magnetic conductor bracket 8303 are integrally formed, or the two can be connected separately.
[0311] If the aforementioned bracket 810 is made of a magnetic conductor, in addition to its fixing function, it will also be magnetized by the coil current, shortening the path of the magnetic lines of force to reduce the magnetic resistance in the magnetic circuit, increasing the magnetic field strength in the magnetic gap, thereby increasing the alternating driving force on the oscillator assembly 820 and further enhancing the driving effect.
[0312] In some embodiments, the support 810 may also be made of a non-magnetic material. In this case, the first magnetic support 8303 can be connected to the support 810. The non-magnetic support 810 then only serves a supporting and fixing function.
[0313] In some implementations, such as Figure 66 and Figure 67 As shown, a channel 8206 is provided in the middle of the oscillator assembly 820. The channel 8206 extends from one end of the oscillator assembly 820 to the other end along a first direction. The channel 8206 is a through hole or a blind hole. The channel 8206 can pass through the elastic member 840.
[0314] The aforementioned channel 8206 can be used to embed components for easier assembly and positioning. One or more channels 8206 can be provided as needed.
[0315] During assembly, by setting a channel 8206 and placing a part that penetrates the oscillator assembly inside, this part can act as a positioning post, which will facilitate the assembly and positioning of the various components of the oscillator assembly. At this time, the positioning part does not need to be fixed together with the oscillator assembly, but is only used during assembly and positioning.
[0316] Alternatively, a part that passes through the oscillator assembly can be directly fixed in the channel 8206. The fixing method can be gluing, riveting, or welding, making it part of the oscillator assembly. This allows the components in the oscillator assembly to be firmly connected together, thereby improving the reliability of the connection.
[0317] In some other ways, the oscillator assembly 820 may not have the channel 8206 provided.
[0318] The cross-section of the first magnetic plate 8201 can be cylindrical, T-shaped, or conical, or other shapes. The cross-section of the first magnetic plate 8201 refers to the surface obtained by cutting through a plane passing through its axis. Similarly, the cross-section of the second magnetic plate 8202 can also be cylindrical, T-shaped, or conical.
[0319] Preferably, the cross-section of the first magnetic plate 8201 or the second magnetic plate 8202 is T-shaped or conical, which is more conducive to reducing the initial magnetic attraction force on the oscillator assembly 820, facilitating assembly, and extending the life of the elastic element 840. For example, the first magnetic plate 8201 is configured such that the width of its cross-section near the end of the main magnet 8207 is greater than the width of its cross-section away from the main magnet 8207, and the second magnetic plate 8202 is configured such that the width of its cross-section near the end of the main magnet 8207 is greater than the width of its cross-section away from the main magnet 8207, so as to reduce the interference of the magnetic plates on the elastic arm of the elastic element 840 during vibration.
[0320] The first magnetic plate 8201 and the second magnetic plate 8202 can each be manufactured as a combination component or a single piece.
[0321] The first magnetic guide support 8303, the second magnetic guide support 8302 and the third magnetic guide support 8305 mentioned above can all be ring-shaped, and can be circular ring, elliptical ring, racetrack ring or other ring-shaped forms.
[0322] In this embodiment, the first magnetic guide bracket 8303, the second magnetic guide bracket 8302, and the third magnetic guide bracket 8305 can all be fixed to the bracket 810 by welding, gluing, or riveting.
[0323] Figure 68 This is a comparison diagram of the frequency response curves of the bone conduction sound generating device of this embodiment and the bone conduction sound generating device of the prior art. Figure 68In the diagram, the solid line represents the frequency response curve of the bone conduction sound device of this embodiment, while the dashed line represents the frequency response curve of a prior art bone conduction sound device. In the frequency band below 5000Hz, the frequency response curve of the bone conduction sound device of this embodiment is higher than that of existing bone conduction sound devices, indicating an overall improvement in sensitivity and thus increasing the loudness of the bone conduction sound device. Since bone conduction headphones primarily operate within the 5000Hz frequency band for both calls and playback, the sound pressure level within the effective operating range is significantly improved. The bone conduction sound device of the above embodiment effectively improves the utilization rate of the magnetic circuit structure, allowing the vibrator assembly to vibrate under the dual drive of magnetic force and Ampere force reaction force. This effectively increases the driving force, improves the electromechanical conversion efficiency under the same power consumption, and greatly enhances the vibration sensitivity of the vibrator assembly, thereby increasing the loudness of the bone conduction sound device, which in turn increases the loudness perceived by the human ear. Furthermore, under the same loudness conditions, the power consumption of the bone conduction microphone can be reduced.
[0324] Example 5 of bone conduction sound generation device
[0325] The main difference between this embodiment and Embodiment 1 is that the first magnetic plate 8201 and the second magnetic plate 8202 are not provided in the magnetic circuit assembly. The magnetic circuit assembly includes a main magnet 8207, one end of which is located inside the first coil 8301 and the other end is located inside the second coil 8307.
[0326] Understandably, at this time, the upper magnetic pole of the main magnet 8207 serves as the first magnetic pole part 82011, and the lower magnetic pole serves as the second magnetic pole part 82021. The polarities of the first magnetic pole part 82011 and the second magnetic pole part 82021 are opposite. If the first magnetic pole part 82011 is the N pole, then the second magnetic pole part 82021 is the S pole, or if the first magnetic pole part 82011 is the S pole, then the second magnetic pole part 82021 is the N pole.
[0327] Example 6 of bone conduction sound generation device
[0328] See Figure 65 The main difference in the above embodiments is that the stator assembly 830 further includes an external magnetic guide bracket 8304. The external magnetic guide bracket 8304 is provided on the outside of the first coil 8301 and the second coil 8307, and the external magnetic guide bracket 8304 is connected to the first magnetic guide bracket 8303.
[0329] The outer magnetic guide bracket 8304 can be connected to the first magnetic guide bracket 8303 by welding, gluing or riveting.
[0330] In some implementations, when the stator assembly 830 is provided with a second magnetic guide 8302 and a third magnetic guide 8305, one end of the peripheral magnetic guide 8304 surrounding the first coil 8301 is connected to the first magnetic guide 8303, and the other end can also be connected to the second magnetic guide 8302; one end of the peripheral magnetic guide 8304 surrounding the second coil 8307 is connected to the first magnetic guide 8303, and the other end can also be connected to the third magnetic guide 8305.
[0331] Example 7 of bone conduction sound generation device
[0332] The main difference between this embodiment and the above embodiments is that only the first magnetic guide support 8303 is provided in the stator assembly 830, and the second magnetic guide support 8302 and the third magnetic guide support 8305 are not provided.
[0333] In some embodiments, the bracket 810 is made of a magnetic conductor, and a first magnetic conductor bracket 8303 is formed on the bracket 810. That is, the bracket 810 and the first magnetic conductor bracket 8303 are integrally formed, or the two can be connected separately.
[0334] In some embodiments, the support 810 may also be made of a non-magnetic material. In this case, the first magnetic support 8303 can be connected to the support 810. The non-magnetic housing then only serves a supporting and fixing function.
[0335] It is understandable that the aforementioned bone conduction sound generation device is not limited to use in headphones, but can also be used in eyeglasses, helmets, or other electronic devices.
[0336] It should be noted that, in the absence of conflict, the various embodiments described herein can be combined with each other to obtain more implementation schemes.
[0337] The above are merely specific embodiments of this utility model. Any improvements made based on the concept of this utility model shall be considered within the scope of protection of this utility model.
Claims
1. A bone conduction sound generating device, characterized in that: include, support; An oscillator assembly is movably disposed inside the support. The oscillator assembly includes a magnetic circuit assembly. At least at its outer edge, the magnetic circuit assembly has a first magnetic pole portion, a second magnetic pole portion, and a third magnetic pole portion located between the first and second magnetic pole portions along a first direction. The first and second magnetic pole portions are respectively located at both ends of the magnetic circuit assembly along the first direction. The first and second magnetic pole portions have the same polarity, and the third magnetic pole portion has the opposite polarity to the first magnetic pole portion. A stator assembly is fixedly disposed inside the bracket. The stator assembly includes a first coil, which surrounds the outside of the magnetic circuit assembly. A first magnetic guide bracket and a second magnetic guide bracket are respectively disposed at both ends of the first coil along a first direction. The first magnetic guide bracket and the second magnetic guide bracket also surround the outside of the magnetic circuit assembly. After the first coil is energized, the first coil is subjected to Ampere force, and magnetic force is generated between the magnetic circuit assembly, the first magnetic guide support, and the second magnetic guide support. The oscillator assembly vibrates along the first direction under the action of the reaction force of the Ampere force and the magnetic force.
2. The bone conduction sound production device of claim 1, wherein The second magnetic guide is used to generate a first magnetic force with the first magnetic pole portion and a second magnetic force with the third magnetic pole portion when the first coil is energized; the first magnetic guide is used to generate a second magnetic force with the second magnetic pole portion and a first magnetic force with the third magnetic pole portion when the first coil is energized. When the first magnetic force is a repulsive force, the second magnetic force is an attractive force; when the first magnetic force is an attractive force, the second magnetic force is a repulsive force.
3. The bone conduction sound production device of claim 1, wherein, The inner edge of the first magnetic guide bracket protrudes from the inner wall of the first coil to form a first protrusion, and / or the inner edge of the second magnetic guide bracket protrudes from the inner wall of the first coil to form a second protrusion.
4. The bone conduction sound production device of claim 1, wherein: The stator assembly also includes an external magnetic guide support, which is located outside the first coil. One end of the external magnetic guide support is connected to the first magnetic guide support, and the other end is connected to the second magnetic guide support.
5. The bone conduction sound production device of claim 1, wherein: The magnetic circuit assembly includes a main magnetic guide plate, the outer edge of which forms the third magnetic pole portion. A first magnet is disposed at one end of the main magnetic guide plate, and a second magnet is disposed at the other end. The magnetization directions of the first magnet and the second magnet are opposite. When the oscillator assembly is in the equilibrium position, the first coil is wrapped around the outside of the main magnetic guide plate, the second magnetic guide support is wrapped around the outside of the first magnet, and the first magnetic guide support is wrapped around the outside of the second magnet.
6. The bone conduction sound production device of claim 5, wherein: The first magnet has a first magnetic plate at the end away from the main magnetic plate, and the first magnetic pole portion is formed on the outer edge of the first magnetic plate. The second magnet has a second magnetic plate at the end away from the main magnetic plate, and the second magnetic pole portion is formed on the outer edge of the first magnetic plate.
7. The bone conduction sound production device of claim 6, wherein: When the oscillator assembly is in the balanced position, the first magnetic plate is at least partially located inside the second magnetic support, and / or the second magnetic plate is at least partially located inside the first magnetic support.
8. The bone conduction sound production device of claim 6, wherein: When the oscillator assembly is in the balanced position, the first magnetic plate is completely outside the second magnetic support, and the second magnetic plate is completely outside the first magnetic support.
9. The bone conduction sound generating device according to claim 6, characterized in that: The outer edge of the first magnetic plate protrudes from the outer wall of the first magnet to form a third protrusion, and / or the outer edge of the second magnetic plate protrudes from the outer wall of the second magnet to form a fourth protrusion.
10. The bone conduction sound production device of claim 5, wherein: The outer edges of the main magnetic plate protrude from the outer walls of the first and second magnets, forming a fifth protrusion.
11. The bone conduction sound generating device according to claim 1, characterized in that: The bracket is made of a magnetic conductor, and the first magnetic conductor bracket and / or the second magnetic conductor bracket are integrally formed with the bracket.
12. The bone conduction sound generating device according to claim 1, characterized in that: The support is made of a non-magnetic material.
13. The bone conduction sound generating device according to claim 12, characterized in that: The bracket includes a radial support portion, and the first magnetic support and / or the second magnetic support are connected to the radial support portion.
14. The bone conduction sound generating device according to claim 1, characterized in that: At least one end of the oscillator assembly is provided with an elastic element and is connected to the bracket through the elastic element, the elastic element being located on the vibration path of the oscillator assembly.
15. The bone conduction sound generating device according to claim 1, characterized in that: At least one end of the bracket is connected to a crash cover, which is located on the vibration path of the oscillator assembly and is spaced apart from the oscillator assembly.
16. The bone conduction sound generating device according to claim 1, characterized in that: The oscillator assembly has a channel in the middle, which extends from one end of the oscillator assembly to the other end along a first direction. The channel is a through hole or a blind hole.
17. A bone conduction headphone, characterized in that: Includes the bone conduction sound generating device as described in any one of claims 1-16.