A substrate coating device for flexible circuit board bonding

Abstract

This utility model discloses a substrate adhesive application device for flexible circuit board bonding, including a support leg, a housing mounted on the top of the support leg, a nozzle mounted on the bottom of a conduit, a threaded rod mounted on one side of a servo motor, and a moving block mounted on the outer side of the threaded rod. This utility model utilizes a servo motor mounted on one side of a workbench. The servo motor's operation drives the threaded rod to rotate, which in turn moves the moving block. This movement of the moving block moves one end of a top-mounted moving plate, which in turn moves the circuit board at the top. After adhesive is sprayed onto the circuit board, it passes through a scraper, which smooths the adhesive. A first telescopic rod allows adjustment of the scraper's height. When a second telescopic rod needs to be fixed, a fixing screw can be tightened to secure it. This achieves the purpose of facilitating the smoothing of adhesive in the substrate adhesive application device for flexible circuit board bonding.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a substrate coating device for flexible circuit board bonding. Background Technology

[0002] Circuit boards are also known as ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed circuit boards, etc. Circuit boards make circuits miniaturized and more intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. When processing circuit boards, a flexible circuit board bonding substrate coating device is needed to coat the surface of the circuit board with adhesive.

[0003] To address this, patent publication CN222174659U discloses a substrate adhesive application device for flexible circuit board bonding. The device includes a housing with symmetrically mounted support plates on the top. A movable frame is slidably mounted on the top of the support plates. A square groove is formed on the crossbeam of the movable frame, and cylinders are symmetrically arranged inside the square grooves. N-shaped frames are mounted at both ends of the cylinders. A glue storage tank is mounted above the N-shaped frames, and a heating coil is installed inside the glue storage tank. Several glue spraying devices are symmetrically mounted on both sides of the N-shaped frames. The cylinders are slidably connected to the square grooves. An adhesive plate is installed inside the square plate, and several exhaust fans are located below the adhesive plate. The adhesive plate is used to adsorb dust and debris on the substrate and flexible circuit board, and the exhaust fans are used to remove dust and impurities from the substrate and flexible circuit board, preventing dust or impurities from affecting the quality and conductivity of the substrate and flexible circuit board, and reducing contamination of the substrate and circuit board.

[0004] The aforementioned flexible circuit board bonding substrate adhesive application device includes an exhaust fan to remove dust and impurities from the substrate and flexible circuit board, preventing dust or impurities from affecting the quality and conductivity of the substrate and flexible circuit board, and reducing contamination of the substrate and circuit board. However, during use, the device needs to smooth the adhesive on the top of the circuit board. Utility Model Content

[0005] The purpose of this invention is to provide a substrate coating device for flexible circuit board bonding, which solves the problem that existing substrate coating devices for flexible circuit board bonding are difficult to smooth out the adhesive.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a substrate adhesive coating device for flexible circuit board bonding, including support legs;

[0007] A housing is mounted on the top of the support leg, and a workbench is mounted on the top of the housing. A movable plate is mounted on one side of the top of the workbench.

[0008] The top of the workbench is equipped with a mounting frame, and the top of the mounting frame is equipped with a glue tank. The bottom of the glue tank is equipped with a pump body, and the bottom of the pump body is equipped with a conduit. The bottom of the conduit is equipped with a nozzle.

[0009] The workbench is equipped with a moving mechanism, which includes a servo motor mounted on one side of the workbench, a threaded rod mounted on one side of the servo motor, and a moving block mounted on the outside of the threaded rod.

[0010] In use, the lifting block and the bracket are first connected by a spring. The spring is elastic and will cause the lifting block to press down. The brush at the bottom of the lifting block can press on the top of the circuit board being processed. When the servo motor works, it drives the threaded rod to rotate and moves the moving plate. It will first pass through the brush, which will clean the surface of the circuit board to prevent dust from adhering to the surface of the circuit board. After the circuit board moves to the bottom of the nozzle, the glue tank is filled with glue. The pump will work to draw out the glue through the conduit and then spray it onto the surface of the circuit board through the nozzle.

[0011] Furthermore, a cleaning structure is installed on one side of the top of the workbench. The cleaning structure includes a bracket installed on one side of the top of the workbench, a guide rod installed at the top of the bracket, a lifting block installed at the bottom of the guide rod, a brush installed at the bottom of the lifting block, and a spring installed at the top of the lifting block. The cleaning structure can clean the surface of the circuit board.

[0012] Furthermore, the spring is helical in shape, and the spring and the lifting block form an elastic connection, giving the spring elasticity.

[0013] Furthermore, a limiting structure is installed at the top of the movable plate, and the limiting structure includes a rotating block installed on one side of the movable plate, and a screw installed on one side of the rotating block. A limiting plate is installed at the top of the screw, and the limiting structure can limit the circuit board.

[0014] Furthermore, the outer side wall of the screw is uniformly provided with external threads, and the inner side wall of the limiting plate is uniformly provided with internal threads that cooperate with the external threads. The screw and the limiting plate are threadedly connected, and the rotation of the screw will drive the limiting plate to move.

[0015] Furthermore, the moving mechanism includes a support frame mounted on one side of the top of the workbench, a first telescopic rod mounted on the bottom of the support frame, a second telescopic rod mounted on the bottom of the first telescopic rod, a scraper mounted on the bottom of the second telescopic rod, and a fixing screw mounted on one end of the first telescopic rod. The moving mechanism can drive the moving plate to move.

[0016] Furthermore, the first telescopic rod has a sliding groove inside, and the top of the second telescopic rod has a slider. The first telescopic rod and the second telescopic rod form a sliding structure, and the second telescopic rod can slide inside the first telescopic rod.

[0017] The advantages of the flexible circuit board bonding substrate gluing device provided by this utility model are as follows: during use, the moving mechanism can drive the moving plate and the circuit board material at the top to move, the limiting structure can fix the circuit board material at the top of the moving plate to prevent the circuit board from shifting, and the cleaning structure can clean the dust on the surface of the circuit board.

[0018] A servo motor is installed on one side of the workbench. The servo motor drives the threaded rod to rotate, which in turn moves the moving block. The moving block moves one end of the top moving plate, which in turn moves the circuit board at the top. After the circuit board is sprayed with glue, it can pass through a scraper. The scraper can smooth out the glue. The height of the scraper can be adjusted by sliding the first telescopic rod. When the second telescopic rod needs to be fixed, the fixing screws can be tightened to fix the second telescopic rod. This achieves the purpose of making the glue application device for flexible circuit board bonding easy to smooth out the glue.

[0019] By installing a screw inside the movable plate, the screw can rotate. Grasping the rotating block can drive the screw to rotate. The screw and the limiting plate form a threaded connection. The threads on the screw are symmetrically distributed about the central axis of the screw. The rotation of the screw will drive the limiting plate to move in the opposite direction. The movement of the limiting plate will clamp the circuit board in the middle, which can prevent the circuit board from shifting. This achieves the purpose of the flexible circuit board bonding substrate adhesive device to facilitate the limiting of the circuit board. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0021] Figure 2 This is a frontal cross-sectional view of the present invention.

[0022] Figure 3 This is a front view cross-sectional diagram of the limiting structure of this utility model;

[0023] Figure 4 This is a partial three-dimensional structural diagram of the cleaning structure of this utility model;

[0024] Figure 5 This is a partial three-dimensional structural diagram of the moving mechanism of this utility model.

[0025] The following are the annotations in the diagram: 1. Workbench; 2. Box; 3. Moving plate; 4. Limiting structure; 401. Rotating block; 402. Screw; 403. Limiting plate; 5. Support leg; 6. Moving mechanism; 601. Servo motor; 602. Threaded rod; 603. Moving block; 604. Support frame; 605. Scraper; 606. First telescopic rod; 607. Second telescopic rod; 608. Fixing screw; 7. Mounting bracket; 8. Glue tank; 9. Pump body; 10. Conduit; 11. Nozzle; 12. Cleaning structure; 1201. Bracket; 1202. Lifting block; 1203. Brush; 1204. Spring; 1205. Guide rod. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figures 1-5 One embodiment of this utility model is a substrate adhesive coating device for flexible circuit board bonding, including a support leg 5.

[0028] A housing 2 is mounted on the top of the support leg 5, and a workbench 1 is mounted on the top of the housing 2. A cleaning structure 12 is mounted on one side of the top of the workbench 1. The cleaning structure 12 includes a bracket 1201 mounted on one side of the top of the workbench 1. A guide rod 1205 is mounted on the top of the bracket 1201. A lifting block 1202 is mounted on the bottom of the guide rod 1205. A brush 1203 is mounted on the bottom of the lifting block 1202. A spring 1204 is mounted on the top of the lifting block 1202. The spring 1204 is spiral in shape. The spring 1204 and the lifting block 1202 form an elastic connection.

[0029] See attached document Figure 1-2 and attached Figure 5As shown, the lifting block 1202 and the bracket 1201 are connected by a spring 1204. The spring 1204 is elastic, and the elasticity of the spring 1204 will cause the lifting block 1202 to press down. The brush 1203 at the bottom of the lifting block 1202 can press on the top of the circuit board being processed. The guide rod 1205 can prevent the lifting block 1202 from shifting. When the servo motor 601 works to drive the threaded rod 602 to rotate and drive the moving plate 3 to move, it will first pass through the brush 1203. The brush 1203 will clean the surface of the circuit board to prevent dust from adhering to the surface of the circuit board. After the circuit board moves to the bottom of the nozzle 11, the glue tank 8 is filled with glue. The pump body 9 works to draw out the glue through the conduit 10 and then spray it onto the surface of the circuit board through the nozzle 11.

[0030] A movable plate 3 is installed on one side of the top of the workbench 1. A limiting structure 4 is installed on the top of the movable plate 3. The limiting structure 4 includes a rotating block 401 installed on one side of the movable plate 3. A screw 402 is installed on one side of the rotating block 401. External threads are evenly arranged on the outer side wall of the screw 402. Internal threads that cooperate with the external threads are evenly arranged on the inner side wall of the limiting plate 403. The screw 402 and the limiting plate 403 are threadedly connected. The limiting plate 403 is installed on the top of the screw 402.

[0031] See attached document Figure 1-3 As shown, the screw 402 can rotate. Grasping the rotating block 401 can drive the screw 402 to rotate. The screw 402 and the limiting plate 403 form a threaded connection. The threads on the screw 402 are symmetrically distributed about the central axis of the screw 402. The rotation of the screw 402 will drive the limiting plate 403 to move in the opposite direction. The movement of the limiting plate 403 will clamp the circuit board in the middle, which can prevent the circuit board from shifting.

[0032] A mounting bracket 7 is installed at the top of the workbench 1, and a glue tank 8 is installed at the top of the mounting bracket 7. A pump body 9 is installed at the bottom of the glue tank 8, and a conduit 10 is installed at the bottom of the pump body 9. A nozzle 11 is installed at the bottom of the conduit 10.

[0033] The workbench 1 is equipped with a moving mechanism 6. The moving mechanism 6 includes a support frame 604 installed on one side of the top of the workbench 1. A first telescopic rod 606 is installed at the bottom of the support frame 604. The first telescopic rod 606 has a sliding groove inside. A slider is installed at the top of the second telescopic rod 607. The first telescopic rod 606 and the second telescopic rod 607 form a sliding structure.

[0034] A second telescopic rod 607 is installed at the bottom end of the first telescopic rod 606, a scraper 605 is installed at the bottom end of the second telescopic rod 607, and a fixing screw 608 is installed at one end of the first telescopic rod 606.

[0035] The moving mechanism 6 includes a servo motor 601 mounted on one side of the worktable 1, a threaded rod 602 mounted on one side of the servo motor 601, and a moving block 603 mounted on the outer side of the threaded rod 602.

[0036] See attached document Figure 1-2 and attached Figure 4 As shown, the servo motor 601 drives the threaded rod 602 to rotate. The threaded rod 602 and the moving block 603 form a threaded connection. The rotation of the threaded rod 602 drives the moving block 603 to move. The movement of the moving block 603 drives one end of the moving plate 3 at the top. The movement of the moving plate 3 drives the circuit board at the top to move. After the circuit board is sprayed with glue, it can pass through the scraper 605. After the circuit board passes through the scraper 605, the scraper 605 can smooth the glue. The first telescopic rod 606 and the second telescopic rod 607 form a sliding structure. The second telescopic rod 607 can slide inside the first telescopic rod 606. The sliding of the first telescopic rod 606 can adjust the height of the scraper 605. When the lounge chair is fixed to the second telescopic rod 607, the fixing screw 608 can be tightened to fix the second telescopic rod 607.

[0037] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A substrate adhesive applicator for flexible circuit board bonding, comprising a support leg (5); Its features are: The top of the support leg (5) is fitted with a box (2), and the top of the box (2) is fitted with a workbench (1), and a movable plate (3) is fitted on one side of the top of the workbench (1). The top of the workbench (1) is equipped with a mounting frame (7), and the top of the mounting frame (7) is equipped with a glue tank (8). The bottom of the glue tank (8) is equipped with a pump body (9), and the bottom of the pump body (9) is equipped with a conduit (10). The bottom of the conduit (10) is equipped with a nozzle (11). The workbench (1) is equipped with a moving mechanism (6). The moving mechanism (6) includes a servo motor (601) installed on one side of the workbench (1), a threaded rod (602) installed on one side of the servo motor (601), and a moving block (603) installed on the outside of the threaded rod (602).

2. The substrate coating device for flexible circuit board bonding according to claim 1, characterized in that: A cleaning structure (12) is installed on one side of the top of the workbench (1). The cleaning structure (12) includes a bracket (1201) installed on one side of the top of the workbench (1). A guide rod (1205) is installed at the top of the bracket (1201). A lifting block (1202) is installed at the bottom of the guide rod (1205). A brush (1203) is installed at the bottom of the lifting block (1202). A spring (1204) is installed at the top of the lifting block (1202).

3. The substrate coating device for flexible circuit board bonding according to claim 2, characterized in that: The spring (1204) is spiral in shape, and the spring (1204) and the lifting block (1202) form an elastic connection.

4. The substrate coating device for flexible circuit board bonding according to claim 1, characterized in that: The top of the movable plate (3) is equipped with a limiting structure (4), and the limiting structure (4) includes a rotating block (401) installed on one side of the movable plate (3), and a screw (402) installed on one side of the rotating block (401), and a limiting plate (403) installed on the top of the screw (402).

5. The substrate coating apparatus for flexible circuit board bonding according to claim 4, characterized in that: The screw (402) has external threads uniformly arranged on its outer side wall, and the limiting plate (403) has internal threads uniformly arranged on its inner side wall that cooperate with the external threads. The screw (402) and the limiting plate (403) are connected by threads.

6. The substrate coating apparatus for flexible circuit board bonding according to claim 1, characterized in that: The moving mechanism (6) includes a support frame (604) installed on one side of the top of the workbench (1), a first telescopic rod (606) installed at the bottom of the support frame (604), a second telescopic rod (607) installed at the bottom of the first telescopic rod (606), a scraper (605) installed at the bottom of the second telescopic rod (607), and a fixing screw (608) installed at one end of the first telescopic rod (606).

7. The substrate coating apparatus for flexible circuit board bonding according to claim 6, characterized in that: The first telescopic rod (606) has a sliding groove inside, and the top of the second telescopic rod (607) has a slider. The first telescopic rod (606) and the second telescopic rod (607) form a sliding structure.

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