A heat dissipation housing structure for an electric vehicle controller

Abstract

This utility model discloses a heat dissipation housing structure for an electric vehicle controller, belonging to the technical field of electric vehicle controllers. It includes a base plate with multiple copper pillars for fixing the motherboard; a top cover fixed to the base plate, which, together with the base plate, forms a housing for accommodating the motherboard; one end of the top cover has a cable outlet hole; an air inlet channel is provided between the motherboard and the base plate, and an air outlet channel is provided between the motherboard and the top cover; a heat dissipation module is installed inside the housing to create airflow from the air inlet channel to the air outlet channel. The heat dissipation module designed in this utility model guides external air to pass sequentially from the bottom and top of the motherboard, and a rubber baffle is designed to block excess gaps, preventing lateral air leakage. This ensures that the air inlet and outlet channels form a stable airflow path, allowing heat from the motherboard to be promptly dissipated through the heat-conducting block and preventing heat accumulation.

Description

Technical Field

[0001] This utility model relates to the field of electric vehicle controller technology, and specifically to a heat dissipation housing structure for an electric vehicle controller. Background Technology

[0002] As the core control component of an electric vehicle, the controller undertakes the critical tasks of energy conversion, signal processing, and motor drive. During operation, its power semiconductor devices and other electronic components generate a significant amount of heat. This heat accumulation is particularly pronounced under conditions of continuous high current output, frequent start-stop cycles, or high temperatures. Inadequate heat dissipation will lead to a rapid increase in device temperature, which can range from affecting controller performance and efficiency and shortening device lifespan to causing thermal failure, system malfunctions, and even safety hazards. Traditional electric vehicle controller housings employ passive cooling methods, which are insufficient for rapid heat dissipation. Utility Model Content

[0003] To address the aforementioned technical shortcomings, the purpose of this utility model is to provide a heat dissipation housing structure for an electric vehicle controller, which improves the heat dissipation effect of the motherboard by improving the heat dissipation airflow.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: The present invention provides a heat dissipation housing structure for an electric vehicle controller, comprising:

[0005] A base plate, wherein multiple copper pillars for fixing the motherboard are provided on the base plate;

[0006] The top cover is fixed to the base plate, and the top cover and the base plate cooperate to form a housing for accommodating the motherboard. One end of the top cover has a cable outlet hole.

[0007] The motherboard and the base plate are provided with an air intake channel, and the motherboard and the top cover are provided with an air outlet channel; a heat dissipation module is provided inside the housing to form an airflow from the air intake channel to the air outlet channel inside the housing.

[0008] Preferably, the heat dissipation module includes:

[0009] Multiple heat-conducting blocks are attached to the heat-generating components on the motherboard;

[0010] A limiting plate, located inside the upper cover, is used to press the heat-conducting block against the heating element;

[0011] A fan is installed inside the air intake channel. An air intake hole is provided on the base plate for air intake, and an air outlet hole is provided at the end of the top cover away from the outlet hole.

[0012] Preferably, the limiting plate is fixed in the upper cover by a plurality of limiting members, the limiting members including:

[0013] A locking pin is threaded onto the top cover. A retaining ring is fixed on the locking pin inside the top cover. The locking pin passes through the main board, and a groove is formed on the locking pin located on the side of the main board away from the spring.

[0014] A spring, which is sleeved on a locking post between the retaining ring and the main board;

[0015] A retaining ring, which is engaged in the retaining groove.

[0016] Preferably, the limiting plate has multiple limiting grooves, and the multiple limiting grooves respectively cooperate with multiple heat-conducting blocks.

[0017] Preferably, the heat-conducting block is provided with heat dissipation fins, and the direction of the heat dissipation fins is the same as the extension direction of the air outlet channel.

[0018] Preferably, rubber baffles are provided between the two sides of the motherboard and the end near the air vent and the inner wall of the top cover.

[0019] Preferably, the cross-section of the rubber baffle is U-shaped, and the edge of the motherboard is engaged in the groove of the rubber baffle.

[0020] Preferably, both the air inlet and the air outlet are equipped with dustproof nets.

[0021] Preferably, one end of the base plate protrudes from the top cover and has a connecting hole.

[0022] Preferably, a locking sleeve for securing the wire harness is provided at the wire outlet.

[0023] The beneficial effects of this utility model are as follows:

[0024] The heat dissipation module designed in this utility model can guide outside air to pass through the bottom and top of the motherboard sequentially, and the design of rubber baffles blocks excess gaps to prevent lateral air leakage, so that the air intake and exhaust channels form a stable airflow channel, which can cool both the top and bottom surfaces of the motherboard, allowing the heat on the motherboard to be discharged from the casing in time through the heat conduction block to avoid heat accumulation; the spring in the limiting component can provide continuous and adjustable pressure to ensure that the heat conduction block always maintains close contact with the heat-generating components on the motherboard under various operating conditions, avoiding increased thermal resistance and overheating caused by poor contact. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a three-dimensional view of the overall structure of a heat dissipation housing for an electric vehicle controller, provided as an embodiment of the present utility model.

[0027] Figure 2 This is a perspective view of the overall structure of this utility model from a bottom angle.

[0028] Figure 3 This is a top view of the overall structure of this utility model.

[0029] Figure 4 for Figure 3 Sectional view at point AA.

[0030] Figure 5 for Figure 4 A magnified view of a portion of point A in the middle.

[0031] Figure 6 This is a schematic diagram of the overall structure of the present invention after the top cover is removed.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Base plate, 2. Top cover, 3. Main board, 4. Heating element, 5. Air inlet channel, 6. Air outlet channel, 7. Heat conduction block, 8. Limiting plate, 9. Fan, 10. Air inlet hole, 11. Air outlet hole, 12. Locking post, 13. Retaining ring, 14. Spring, 15. Slot, 16. Retaining ring, 17. Limiting groove, 18. Rubber retaining strip. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] Example 1

[0036] like Figures 1 to 6As shown in the figure, Embodiment 1 of this utility model provides a heat dissipation housing structure for an electric vehicle controller, including a base plate 1 and a top cover 2. The base plate 1 and the top cover 2 adopt a split design, and the two are detachably connected by multiple screws to form a housing for accommodating the main board 3. This connection method not only facilitates the assembly of the device, but also provides convenience for later maintenance and repair. Multiple copper pillars are fixedly installed on the base plate 1, and the main board 3 is fastened to the copper pillars by screws, ensuring a firm installation and preventing loosening. A cable outlet hole is opened at one end of the top cover, through which the wire harness on the main board passes. To prevent the wire harness from loosening, a locking sleeve can be installed at the cable outlet hole; the locking sleeve can be an existing plastic cable fixing connector. The end of the base plate near the cable outlet hole protrudes from the top cover, and two connection holes for positioning are opened at this end, facilitating the fixing of the controller to the vehicle.

[0037] To effectively dissipate the heat generated by high-heat components (hereinafter referred to as heat-generating components) on the motherboard during operation, a heat dissipation module is installed on the base plate 1. An air intake channel 5 is provided between the motherboard 3 and the base plate 1, and an air exhaust channel 6 is provided between the motherboard 3 and the top cover 2. The heat dissipation module includes multiple heat-conducting blocks 7, a limiting plate 8, and a fan 9. The multiple heat-conducting blocks 7 are made of materials with high thermal conductivity, such as copper or aluminum. They are tightly attached to the heat-generating components 4 using thermally conductive silicone, enabling rapid heat conduction from the heat-generating components 4. Multiple heat dissipation fins are also provided on the heat-conducting blocks, with the fins aligned with the airflow direction in the exhaust channel, ensuring sufficient contact between the airflow and the heat dissipation fins. The limiting plate 8 is located inside the top cover 2, its function being to firmly press the heat-conducting blocks 7 against the heat-generating components 4, ensuring good contact between the heat-conducting blocks 7 and the heat-generating components 4, thereby guaranteeing efficient heat conduction.

[0038] The fan 9 is housed within the air intake channel 5. An air intake hole 10 is provided on the base plate 1 for air intake; the air intake hole 10 can be circular or elongated. An air outlet hole 11 is provided at one end of the top cover 2, and its position is adapted to the airflow direction of the air intake channel 5 and the air outlet channel 6. Both the air intake hole 10 and the air outlet hole 11 are equipped with dust filters to reduce dust entering the housing. When the fan 9 operates, cool outside air enters the air intake channel 5 through the air intake hole 10, then flows towards the air outlet channel 6 under the drive of the fan 9, finally carrying heat and being expelled from the air outlet hole 11, forming a complete heat dissipation cycle.

[0039] Example 2

[0040] Based on Embodiment 1, Embodiment 2 provides a more detailed design for the fixing method and structure of the limiting plate 8. Other structures are the same as in Embodiments 1 and 2, and will not be described again here.

[0041] The limiting plate 8 is fixed in the upper cover 2 by four limiting components, including a locking pin 12, a spring 14, and a retaining ring 16. The outer surface of the locking pin 12 is provided with external threads, and the upper cover 2 has an internal threaded hole that matches these external threads. The locking pin 12 is installed on the upper cover 2 through a threaded fit. A retaining ring 13 is fixed to the locking pin 12 inside the upper cover 2. The retaining ring 13 and the locking pin 12 can be integrally formed or fixedly connected by welding or other methods. The locking pin 12 passes through the main plate 3, and a retaining groove 15 is formed on the locking pin 12 located on the side of the main plate 3 away from the spring 14. The retaining groove 15 is an annular groove. Spring 14 is sleeved on locking post 12 between retaining ring 13 and main board 3. When limit plate 8 is fixed, spring 14 is in a compressed state, which can generate an elastic force on the main board, so that limit plate 8 can always press heat conduction block 7 against heat generation device 4. Even if the equipment vibrates during operation or thermal expansion and contraction occurs due to temperature changes, good contact between heat conduction block 7 and heat generation device 4 can be guaranteed, ensuring the stability of heat dissipation effect.

[0042] The retaining ring 16 is engaged in the retaining groove 15. The retaining ring 16 is made of elastic material and can be tightly engaged in the retaining groove 15, thereby restricting the limiting plate 8 between the spring 14 and the retaining ring 16 and preventing the limiting plate 8 from shifting during equipment operation.

[0043] Example 3

[0044] Based on Embodiment 1 and Embodiment 2, in order to further improve the limiting effect of the heat-conducting block 7, the present invention provides a plurality of limiting grooves 17 on the limiting plate 8, which respectively cooperate with a plurality of heat-conducting blocks 7. The shape and size of the limiting grooves 17 are adapted to the heat-conducting blocks 7, and a part of the heat-conducting block 7 is embedded in the limiting grooves 17. This can effectively prevent the heat-conducting block 7 from shifting during the operation of the equipment and ensure the relative position stability between the heat-conducting block 7 and the heating device 4.

[0045] Rubber baffles 18 are provided on both sides of the motherboard 3 and on the side near the air outlet 11 between the motherboard 3 and the inner wall of the top cover 2. The rubber baffles 18 are made of highly elastic rubber material, with a U-shaped cross-section and a groove structure, which can hold the edge of the motherboard in the groove. The rubber baffles 18 can fill the gap between the motherboard 3 and the inner wall of the top cover 2. On the one hand, it can prevent airflow from leaking through these gaps, ensuring that most of the airflow can flow from the air inlet channel 5 to the air outlet channel 6 according to the preset path, thereby improving heat dissipation efficiency. On the other hand, the rubber baffles 18 can also play a role in buffering and shock absorption, reducing the collision and vibration between the motherboard 3 and the top cover 2 during the operation of the equipment, and protecting the motherboard 3 and the components on it.

[0046] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. An electric vehicle controller heat dissipation housing structure, characterized by, include: A base plate, wherein multiple copper pillars for fixing the motherboard are provided on the base plate; The top cover is fixed to the base plate, and the top cover and the base plate cooperate to form a housing for accommodating the motherboard. One end of the top cover has a cable outlet hole. The motherboard and the base plate are provided with an air intake channel, and the motherboard and the top cover are provided with an air outlet channel; a heat dissipation module is provided inside the housing to form an airflow from the air intake channel to the air outlet channel inside the housing.

2. The electric vehicle controller heat dissipation housing structure of claim 1, wherein, The heat dissipation module includes: Multiple heat-conducting blocks are attached to the heat-generating components on the motherboard; A limiting plate, located inside the upper cover, is used to press the heat-conducting block against the heating element; A fan is installed inside the air intake channel. An air intake hole is provided on the base plate for air intake, and an air outlet hole is provided at the end of the top cover away from the outlet hole.

3. The electric vehicle controller heat sink housing structure of claim 2, wherein, The limiting plate is fixed in the upper cover by multiple limiting members, the limiting members including: A locking pin is threaded onto the top cover. A retaining ring is fixed on the locking pin inside the top cover. The locking pin passes through the main board, and a groove is formed on the locking pin located on the side of the main board away from the spring. A spring, which is sleeved on a locking post between the retaining ring and the main board; A retaining ring, which is engaged in the retaining groove.

4. The heat dissipation housing structure for an electric vehicle controller as described in claim 2, characterized in that, The limiting plate has multiple limiting grooves, and each of the multiple limiting grooves cooperates with a multiple heat-conducting block.

5. The heat dissipation housing structure for an electric vehicle controller as described in claim 2, characterized in that, The heat-conducting block is provided with heat dissipation fins, and the direction of the heat dissipation fins is the same as the extension direction of the air outlet channel.

6. The heat dissipation housing structure for an electric vehicle controller as described in claim 2, characterized in that, Rubber baffles are provided between the motherboard and the inner wall of the top cover on both sides and near the air vent.

7. The heat dissipation housing structure for an electric vehicle controller as described in claim 6, characterized in that, The rubber baffle has a U-shaped cross-section, and the edge of the motherboard is engaged in the groove of the rubber baffle.

8. The heat dissipation housing structure for an electric vehicle controller as described in claim 2, characterized in that, Dustproof nets are installed on both the air inlet and the air outlet.

9. The heat dissipation housing structure for an electric vehicle controller as described in claim 1, characterized in that, One end of the base plate protrudes from the top cover and has a connection hole.

10. The heat dissipation housing structure for an electric vehicle controller as described in claim 1, characterized in that, A locking sleeve for securing the wire harness is provided at the outlet hole.

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