A vibration suppression device for a bonding device

Abstract

This application relates to a vibration suppression device for a bonding apparatus, specifically in the field of crystal bonding apparatus technology. It includes a vibration suppression component disposed on the surface of the bonding platform of the bonding apparatus. The vibration suppression component includes a balance guide rail, a plurality of balance sliders, a balance moving block, and a balance motor. The balance guide rail is disposed on the surface of the bonding platform and is arranged along the Y-axis working range of the bonding apparatus. The plurality of balance sliders are slidably connected to the balance guide rail. The balance moving block is disposed on the surface of the balance slider and the balance motor is disposed on the surface of the balance moving block. The balance motor drives the balance sliders to slide along the length direction of the balance guide rail. The direction of movement of the balance sliders during the operation of the bonding apparatus is opposite to the direction of movement of the bonding head along the Y-axis. This application effectively counteracts the vibration generated by the reciprocating motion of the bonding head along the Y-axis, improving the overall safety of the bonding equipment.

Description

Technical Field

[0001] This application relates to the field of crystal bonding apparatus technology, and more particularly to a vibration suppression device for a bonding apparatus. Background Technology

[0002] Bonding devices are key equipment in semiconductor manufacturing and micro / nanoelectronics. Their core function is to achieve stable connections between different materials (such as silicon wafers, glass, metals, polymers, etc.) at the atomic or molecular level through physical or chemical methods. These connections must meet requirements such as high strength, high reliability, and low loss to support high-end applications such as chip packaging, MEMS device manufacturing, and optical communication. In existing technologies, bonding devices include a bonding head and a moving mechanism that drives the bonding head to move in the XYZ three-axis directions. Since the working range in the Y direction is the largest during the bonding process, the Y-axis moving guide rail is longer than the X-axis and Z-axis moving guide rails. Therefore, the bonding head will reciprocate in the Y direction. This reciprocating motion will cause significant vibration to the entire device, affecting the safety of the bonding device during operation, and therefore needs to be improved. Utility Model Content

[0003] In order to counteract the vibration generated by the reciprocating motion of the bonding head in the Y-axis direction and improve the overall safety of the bonding equipment, this application provides a vibration suppression device for the bonding device.

[0004] The vibration suppression device for a bonding apparatus provided in this application adopts the following technical solution:

[0005] A vibration suppression device for a bonding apparatus includes a vibration suppression component disposed on the bonding platform surface of the bonding apparatus. The vibration suppression component includes a balance guide rail, a plurality of balance sliders, a balance moving block, and a balance motor. The balance guide rail is disposed on the bonding platform surface and is arranged along the Y-axis working range of the bonding apparatus. The plurality of balance sliders are slidably connected to the balance guide rail. The balance moving block is disposed on the surface of the balance slider and the balance motor is disposed on the surface of the balance moving block. The balance motor is used to drive the balance sliders to slide along the length direction of the balance guide rail. The direction of movement of the balance sliders during the operation of the bonding apparatus is opposite to the direction of movement of the bonding head along the Y-axis.

[0006] By adopting the above technical solution, the working range of the bonding device in the Y direction is the largest during the bonding process. Therefore, the Y-direction guide rail is longer than the X-direction and Z-direction guide rails. As a result, the bonding head will reciprocate in the Y direction. This reciprocating motion will cause significant vibration to the entire device. By setting a vibration suppression component, the balance moving block moves in the opposite direction to the bonding head during operation, thereby offsetting the vibration generated by the reciprocating motion and improving the safety of the bonding device of this application.

[0007] Preferably, the balancing motor is provided with a heat dissipation system, which includes a cooling fan, a mounting bracket, and a mounting plate. The mounting plate is disposed on the surface of the balancing motor, the mounting bracket is connected to the surface of the mounting plate, and the cooling fan is disposed above the mounting bracket.

[0008] By adopting the above technical solution, during the operation of the balancing motor, the motor mover of the balancing motor continuously dissipates heat as a heat source, which poses a safety hazard to the operation of the vibration suppression component. By setting up a heat dissipation system and adopting a cooling fan, the heat dissipation efficiency of the motor mover is improved, thereby maintaining the operational safety of the balancing motor, the vibration suppression component, and the overall bonding device.

[0009] Preferably, the mounting plate is detachably connected to the balancing motor.

[0010] By adopting the above technical solution, the ease of assembly of the mounting plate can be effectively improved.

[0011] Preferably, the surface of the balancing motor is provided with a plurality of heat-conducting fins.

[0012] By adopting the above technical solution, the heat-conducting fins can further accelerate the heat dissipation speed of the motor actuator that balances the electrons, thereby improving the performance of the heat dissipation system.

[0013] Preferably, the mounting plate has a heat dissipation groove extending through its thickness direction for the heat-conducting fins to pass through.

[0014] By adopting the above technical solution, opening heat dissipation slots can effectively prevent the heat-conducting fins from being bent, thereby ensuring that the heat-conducting fins can better perform heat dissipation.

[0015] Preferably, the heat-conducting fins are made of copper.

[0016] By adopting the above technical solution, copper material has excellent thermal conductivity, which can further improve heat dissipation, heat dissipation performance and the safety of the bonding device of this application.

[0017] Preferably, the cooling fan is provided with fasteners, which pass through the outer frame and mounting bracket of the cooling fan in sequence and are connected to the mounting plate.

[0018] By adopting the above technical solution, fasteners can be installed to form a detachable connection between the cooling fan, mounting bracket and mounting plate, thereby improving the convenience of installation, disassembly and maintenance of the cooling system.

[0019] Preferably, the mounting plate is provided with limit shafts on both end faces perpendicular to the balance guide rail.

[0020] By adopting the above technical solution, setting a limit shaft can prevent the balancing motor from moving excessively, which could damage the balancing motor structure, thereby ensuring the structural safety and stability of the vibration suppression component.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] 1. During the bonding process, the working range of the bonding device is the largest in the Y direction. Therefore, the Y-direction guide rail is longer than the X-direction and Z-direction guide rails. As a result, the bonding head will reciprocate in the Y direction. This reciprocating motion will cause a large vibration to the entire device. By setting a vibration suppression component, the balance moving block moves in the opposite direction to the bonding head during operation, thereby offsetting the vibration generated by the reciprocating motion and improving the safety of the bonding device of this application.

[0023] 2. During the operation of the balancing motor, the motor mover of the balancing motor continuously dissipates heat as a heat source, which poses a safety hazard to the operation of the vibration suppression component. By setting up a heat dissipation system and adopting a cooling fan, the heat dissipation efficiency of the motor mover is improved, thereby maintaining the operational safety of the balancing motor, the vibration suppression component, and the overall bonding device. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of a vibration suppression device for a bonding apparatus according to an embodiment of this application.

[0025] Figure 2 This is an exploded structural diagram of the heat dissipation system according to an embodiment of this application.

[0026] Explanation of reference numerals in the attached drawings: 1. Bonding platform; 2. Vibration suppression component; 21. Balance guide rail; 22. Balance slider; 23. Balance moving block; 24. Balance motor; 3. Heat dissipation system; 31. Cooling fan; 311. Fastener; 32. Mounting bracket; 33. Mounting plate; 331. Heat dissipation groove; 332. Limiting shaft; 34. Heat-conducting fins. Detailed Implementation

[0027] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0028] This application discloses a vibration suppression device for a bonding apparatus. (Refer to...) Figure 1The device includes a vibration suppression component 2 disposed on the surface of the bonding platform 1 of the bonding apparatus. The vibration suppression component 2 includes two parallel balance guide rails 21, several balance sliders 22, a balance moving block 23, and a balance motor 24. Both balance guide rails 21 are disposed on the surface of the bonding platform 1 and are parallel to the Y-direction moving guide rail on the bonding platform 1. Several balance sliders 22 are slidably connected to the balance guide rails 21. The balance moving block 23 is connected to the balance sliders 22. The balance motor 24 is disposed on the balance moving block 23. The balance motor 24 is used to drive the balance sliders 22 to slide along the length direction of the balance guide rails 21. During the operation of the bonding apparatus, the movement direction of the balance sliders 22 is opposite to the movement state of the bonding head along the Y direction, so as to counteract the generated vibration.

[0029] Reference Figure 1 and Figure 2 The motor rotor of the balancing motor 24 continuously dissipates heat as a heat source during operation. Therefore, a heat dissipation system 3 is provided on the balancing motor 24. The heat dissipation system 3 includes two cooling fans 31, a mounting bracket 32, and a mounting plate 33. The mounting plate 33 is detachably mounted on the surface of the motor rotor of the balancing motor 24 and can also serve as a load-bearing element. Several heat-conducting fins 34 are provided on the surface of the balancing motor 24. In this embodiment, the heat-conducting fins 34 are made of copper, which has excellent thermal conductivity. Several heat dissipation grooves 331 are provided along the thickness direction of the mounting plate 33 to allow the heat-conducting fins 34 to pass through, so as to ensure the heat dissipation fins 34... The heat dissipation efficiency is improved; the mounting bracket 32 ​​is provided with a mounting plate 33 surface, and the heat-conducting fins 34 are provided through the mounting bracket 32. Two cooling fans are both provided above the mounting bracket 32. Fasteners 311 are provided on the cooling fans. The fasteners 311 pass through the outer frame of the cooling fans and the mounting bracket 32 ​​in sequence and are connected to the mounting plate 33 to facilitate quick assembly and disassembly of the heat dissipation system 3 of this application. In this embodiment, the fasteners 311 are screws. The mounting plate 33 is provided with limit shafts 332 at both ends perpendicular to the balance guide rail 21 to prevent excessive movement and damage to the balance motor 24 due to collision.

[0030] The implementation principle of the vibration suppression device for a bonding apparatus according to an embodiment of this application is as follows: During the bonding process, the working range of the bonding apparatus in the Y direction is the largest. Therefore, the Y-direction guide rail is longer than the X-direction and Z-direction guide rails. As a result, the bonding head will reciprocate in the Y direction. This reciprocating motion will cause significant vibration to the entire apparatus. By setting the vibration suppression component 2, the balancing moving block 23 moves in the opposite direction to the bonding head during operation, thereby offsetting the vibration generated by the reciprocating motion and improving the safety of the bonding apparatus of this application. At the same time, a heat dissipation system 3 and heat-conducting fins 34 are set on the balancing motor 24, which can perform dual heat dissipation and improve the heat dissipation efficiency of the motor mover, thereby maintaining the working safety of the balancing motor 24, the vibration suppression component 2, and the overall bonding apparatus.

[0031] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A vibration suppression device for a bonding apparatus, characterized in that: The device includes a vibration suppression assembly disposed on the surface of the bonding platform of the bonding apparatus. The vibration suppression assembly includes a balance guide rail, a plurality of balance sliders, a balance moving block, and a balance motor. The balance guide rail is disposed on the surface of the bonding platform and is arranged along the Y-axis working range of the bonding apparatus. The plurality of balance sliders are slidably connected to the balance guide rail. The balance moving block is disposed on the surface of the balance slider and the balance motor is disposed on the surface of the balance moving block. The balance motor is used to drive the balance slider to slide along the length direction of the balance guide rail. The direction of movement of the balance slider during the operation of the bonding apparatus is opposite to the direction of movement of the bonding head along the Y-axis.

2. The vibration suppression device for a bonding apparatus according to claim 1, characterized in that: The balancing motor is equipped with a heat dissipation system, which includes a cooling fan, a mounting bracket, and a mounting plate. The mounting plate is disposed on the surface of the balancing motor, the mounting bracket is connected to the surface of the mounting plate, and the cooling fan is disposed above the mounting bracket.

3. The vibration suppression device for a bonding apparatus according to claim 2, characterized in that: The mounting plate is detachably connected to the balancing motor.

4. The vibration suppression device for a bonding apparatus according to claim 2, characterized in that: The surface of the balancing motor is provided with several heat-conducting fins.

5. The vibration suppression device for a bonding apparatus according to claim 4, characterized in that: The mounting plate has heat dissipation grooves extending through its thickness for heat-conducting fins to pass through.

6. The vibration suppression device for a bonding apparatus according to claim 4, characterized in that: The heat-conducting fins are made of copper.

7. The vibration suppression device for a bonding apparatus according to claim 2, characterized in that: The cooling fan is equipped with fasteners that pass through the outer frame and mounting bracket of the cooling fan in sequence and are connected to the mounting plate.

8. The vibration suppression device for a bonding apparatus according to claim 2, characterized in that: The mounting plate is provided with limit shafts on both ends of the end face perpendicular to the balance guide rail.

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