A volatile organic compound recovery device based on electrode deep cooling and a system thereof

Abstract

The utility model provides a kind of volatile organic compound recovery device based on electrode cryogenic, including the cryogenic zone for condensing volatile organic compound, the heat dissipation zone located the two sides of cryogenic zone, it is connected between the cryogenic zone with the heat dissipation zone by semiconductor component piece area;The semiconductor component piece area includes cold end heat pipe plate, hot end heat pipe plate and multiple semiconductor electrode groups installed between the two;The hot end heat pipe plate is connected with the heat dissipation zone, and the cold end heat pipe plate is connected with cryogenic zone;The semiconductor component piece area is electrically connected with the gas detection equipment of waste gas pipeline, the signal output of the gas detection equipment to the semiconductor component piece area, the semiconductor component piece area receives the signal and controls the number of energized group of semiconductor electrode group according to the signal.

Description

Technical Field

[0001] This utility model relates to the field of volatile organic compound (VOC) gas purification and separation, and in particular to a VOC recovery device and system based on electrode cryogenicity. Background Technology

[0002] Volatile organic compounds (VOCs) are a collective term for a series of volatile, flammable, and toxic organic compounds. VOC emissions pollute the surrounding atmosphere and are a major cause of smog and PM2.5. To ensure air quality, it is necessary to strengthen the recovery and treatment of VOC gases to ensure that exhaust emissions meet standards.

[0003] Common treatment technologies include condensation technology, combustion treatment, activated carbon adsorption, and solvent absorption. Condensation technology, in particular, has been a focus of research due to its ability to recover usable solvents. Common condensation technologies include vapor compression refrigeration, vapor absorption refrigeration, vapor jet refrigeration, and absorption refrigeration. These commonly used technologies can handle conditions with stable waste gas volumes and relatively stable VOC concentrations, but they cannot adjust the required refrigeration temperature and power in a timely manner according to the waste gas volume, type, and concentration, resulting in poor regulation performance. However, some enterprises generate different types and concentrations of VOC waste gas during production due to changes in products and processes. Using refrigeration technologies that cannot adjust refrigeration efficiency and temperature may lead to increased operating costs and low recovery efficiency. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a volatile organic compound recovery device and system based on electrode cryogenics, which provides a hardware foundation for timely adjustment of refrigeration power and power consumption according to the amount and properties of waste gas, reduces operating costs and improves recovery efficiency.

[0005] To solve the above-mentioned technical problems, this utility model provides a volatile organic compound recovery device based on electrode cryogenicity, including a cryogenic zone for condensing volatile organic compounds, heat dissipation zones located on both sides of the cryogenic zone, and the cryogenic zone and the heat dissipation zones are connected by a semiconductor component chip area.

[0006] The semiconductor component area includes a cold-end heat pipe plate, a hot-end heat pipe plate, and a plurality of semiconductor electrode groups installed between the two; the hot-end heat pipe plate is connected to the heat dissipation area, and the cold-end heat pipe plate is connected to the cryogenic area;

[0007] The semiconductor component area is electrically connected to the gas detection device of the exhaust gas pipeline. The signal output of the gas detection device is sent to the semiconductor component area. The semiconductor component area receives the signal and controls the number of energized groups of the semiconductor electrode group according to the signal.

[0008] In some embodiments, the semiconductor electrode assembly is mounted between the cold-end heat pipe plate and the hot-end heat pipe plate via thermally conductive resin.

[0009] In some embodiments, the heat dissipation zone includes a heat dissipation zone heat exchanger, and the cryogenic zone includes a cryogenic zone heat exchanger; the hot-end heat conduction tube plate is connected to the heat dissipation zone heat exchanger, and the cold-end heat conduction tube plate is connected to the cryogenic zone heat exchanger.

[0010] In some embodiments, the heat dissipation zone also includes a fan.

[0011] In some embodiments, the cryogenic zone also includes a rectifier baffle.

[0012] In some embodiments, the heat exchanger in the heat dissipation zone and the heat exchanger in the cryogenic zone are finned heat exchangers.

[0013] In some embodiments, the lower end of the cryogenic zone is provided with a funnel-shaped outlet.

[0014] In some embodiments, the semiconductor electrode assembly includes N-type semiconductors and P-type semiconductors, which are connected by a metal conductor to form a thermocouple and are mounted between ceramic plates.

[0015] The present invention also provides a volatile organic compound recovery system based on electrode cryogenicity, characterized in that it includes the above-mentioned volatile organic compound recovery device based on electrode cryogenicity, and further includes a solvent storage tank, wherein the solvent storage tank is connected to the condensate outlet of the cryogenic zone through a conveying device.

[0016] In some embodiments, a heat recovery device is also included, the exhaust gas pipeline is connected to the heat recovery device and the volatile organic compound recovery device, and the gas outlet of the cryogenic zone is connected to the heat recovery device for pre-cooling the exhaust gas.

[0017] In some embodiments, an adsorption tower is also included, which is connected to the gas outlet of the cryogenic zone via a heat recovery device for adsorbing uncondensed volatile organic compounds.

[0018] Compared to existing technologies, this invention sets up a heat dissipation zone and a deep cooling zone, and connects the two through a semiconductor component area. It uses semiconductor refrigeration technology to condense volatile organic compounds, and connects the gas detection device on the exhaust gas pipeline to the semiconductor component area electrically. This allows the number of semiconductor electrode groups in the semiconductor component area to be energized by the exhaust gas volume and exhaust gas property parameters detected by the gas detection device, thereby controlling the refrigeration efficiency. Attached Figure Description

[0019] Figure 1 This is a schematic diagram showing the positional relationship of the volatile organic compound recovery device based on electrode cryogenicity according to this utility model;

[0020] Figure 2 This is a schematic diagram of the volatile organic compound recovery system based on electrode cryogenicity of this utility model. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed", "equipped with", "sleeved / connected", "connected", etc., should be interpreted broadly. For example, "connection" can be a wall-mounted connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0024] Reference Figure 1-2This embodiment provides a volatile organic compound (VOC) recovery system based on electrode cryogenicity, including a cryogenic system composed of a VOC recovery device based on electrode cryogenicity, a solution storage tank, and an adsorption tower. More than 95% of the VOCs condensed by the cryogenic system enter the solution storage tank in the form of condensate, and the remaining uncondensed gas is further adsorbed by the adsorption tower to ensure that the waste gas can meet the emission standards.

[0025] Furthermore, the volatile organic compound recovery device based on electrode cryogenicity includes a cryogenic zone for condensing volatile organic compounds, heat dissipation zones located on both sides of the cryogenic zone, and the cryogenic zone and the heat dissipation zones are connected by a semiconductor component chip area.

[0026] Specifically, the semiconductor component area includes a cold-end heat pipe plate, a hot-end heat pipe plate, and multiple semiconductor electrode groups installed between them. The semiconductor component is composed of N-type and P-type semiconductor particles arranged alternately. The N-type and P-type semiconductors are connected by copper and aluminum metal conductors to form a thermocouple, which is installed between ceramic sheets, providing insulation and good thermal conductivity. To install the semiconductor electrode groups between the cold-end and hot-end heat pipe plates, the semiconductor electrode groups are installed between the cold-end and hot-end heat pipe plates using thermally conductive resin. The thermally conductive resin material can be polycarbonate resin, polybutylene terephthalate resin, polyacetal resin, nylon resin, etc. When a direct current passes through the thermocouple composed of P-type and N-type semiconductor materials, a heating and cooling phenomenon is generated at both ends. The cold end is connected to the cold-end heat pipe plate, and the hot end is connected to the hot-end heat pipe plate.

[0027] The semiconductor component area is also electrically connected to a gas detection device in the exhaust gas pipeline. This gas detection device can detect the volume, concentration, and type of exhaust gas in the pipeline and output a signal to the semiconductor component area. The semiconductor component area receives the signal and controls the number of energized groups of the semiconductor electrode array accordingly, thereby controlling the cooling area of ​​the cold-end heat pipe plate. The cold-end heat pipe plate is connected to the cryogenic zone for cooling. The cryogenic zone includes a liquid-cooled heat exchanger, which is a finned heat exchanger to increase the heat exchange area. The fins of the heat exchanger are transverse fins and can be in the form of corrugated plates, louvers, etc. The cold-end heat pipe plates on both sides of the cryogenic zone are connected to the liquid-cooled heat exchanger. Exhaust gas entering the cryogenic zone is condensed upon contact with the fins, forming condensate. To further improve heat transfer efficiency, the cryogenic zone also includes a rectifier baffle.

[0028] The waste gas volume and properties are detected by the gas detection equipment in the waste gas pipeline. Based on the signal from the detection results, the number of energized groups of the semiconductor electrode assembly is controlled. The cooling power can be adjusted by using series and parallel connection of similar electrode stacks. The range of working semiconductors can be adjusted in a timely manner according to the processing conditions, ranging from a few milliwatts to tens of thousands of watts. The temperature adjustment range can be from positive temperature 90℃ to negative temperature 130℃.

[0029] When processing low-volume, low-concentration exhaust gases, the number of energized semiconductor electrode arrays can be reduced to decrease cooling efficiency and thus lower operating costs. Conversely, when processing high-volume, high-concentration exhaust gases, the number of energized semiconductor electrode arrays can be increased to improve cooling efficiency.

[0030] When the semiconductor component area is energized, the semiconductor electrode assembly generates a hot end. To dissipate the heat from this hot end, a heat pipe plate is connected to the heat dissipation area. The heat dissipation area includes a heat exchanger, which is a finned heat exchanger to increase the heat exchange area. The finned heat exchanger consists of finned tubes, a tube box, and a frame. The connection between the pipes and fins is welded, significantly reducing operating costs. The finned tubes can be straight fins, corrugated fins, louvered fins, or spiral fins. The finned tubes in the heat dissipation area are transversely shaped. Aluminum fins can be connected to the main tube and bent into various shapes. The heat pipe plate is connected to the heat exchanger in the heat dissipation area to dissipate heat from the hot end of the semiconductor electrode assembly. To further increase heat exchange efficiency and dissipate heat from the heat dissipation area, a fan is also included.

[0031] To facilitate the discharge of condensate from the cryogenic zone into the solvent storage tank, a funnel-shaped outlet is provided at the lower end of the cryogenic zone and connected to the solvent storage tank via a conveying device. This allows the condensed condensate to be pumped to the solvent storage tank in a timely manner. The adsorption tower is filled with activated carbon to adsorb uncondensed volatile organic compounds. The adsorbent is replaced periodically after adsorption saturation.

[0032] In order to further reduce the operating energy consumption of the cryogenic system, the recovery system also includes a heat recovery device. The exhaust gas pipeline is connected to the cryogenic system through the heat recovery device, and the gas outlet of the cryogenic zone is connected to the adsorption tower through the heat recovery device.

[0033] The waste gas entering the heat recovery device from the exhaust gas pipeline exchanges heat with the gas entering the heat recovery device from the gas outlet of the cryogenic zone, thereby pre-cooling the waste gas entering the exhaust gas pipeline and reducing the energy consumption of the waste gas during condensation operation in the cryogenic system. The portion of the waste gas that has undergone heat exchange enters the adsorption tower for adsorption. The heat recovery device uses a plate-fin heat exchanger.

[0034] The operation process of the recycling system in this embodiment is as follows:

[0035] The exhaust gas generated in the workshop is pre-cooled by the induced draft fan and then enters the heat recovery device. After passing through the rectifier baffle, the airflow enters the deep cooling zone of the recovery device evenly. After treatment, more than 95% of the VOCs are condensed into the solvent storage tank in the form of condensate. Some of the uncondensed VOCs enter the heat recovery device for heat exchange and then pass through the adsorption tower for further adsorption, ensuring that the VOCs in the wastewater can meet the emission standards.

[0036] The recovery system in this embodiment can adjust the range of working semiconductor electrode groups and adjust the cooling power in a timely manner according to the exhaust gas under different operating conditions. It requires no refrigerant, can operate continuously, has no pollution sources or rotating parts, does not produce a rotational effect, operates without vibration or noise, and has a long lifespan. High-precision temperature control can be achieved through input current control, and with the addition of temperature detection and control methods, remote control, programmable control, and computer control can be realized, greatly improving processing efficiency. The entire treatment process organically integrates recovery and compliant emission, is simple and efficient, has low overall treatment costs, and reduces operating costs through solvent recovery.

[0037] The above description is only a preferred embodiment of the present utility model, but the design concept of the present utility model is not limited thereto. Any non-substantial modifications made to the present utility model by those skilled in the art within the scope of the technology disclosed in the present utility model using this concept shall be deemed as an infringement of the protection scope of the present utility model.

Claims

1. A volatile organic compound recovery apparatus based on electrode deep cooling, characterized by, The device comprises a deep cooling area for condensing volatile organic compounds, heat dissipation areas on both sides of the deep cooling area, and a semiconductor component area connecting the deep cooling area and the heat dissipation areas; The semiconductor component area comprises a cold end heat conduction pipe plate, a hot end heat conduction pipe plate, and a plurality of semiconductor electrode groups installed between the two plates; the hot end heat conduction pipe plate is connected with the heat dissipation area, and the cold end heat conduction pipe plate is connected with the deep cooling area; The semiconductor component area is electrically connected with a gas detection device of the exhaust pipe, the signal of the gas detection device is output to the semiconductor component area, and the semiconductor component area receives the signal and controls the number of energized groups of semiconductor electrode groups according to the signal.

2. The cryogenic electrode-based volatile organic compound recovery apparatus of claim 1, wherein, The semiconductor electrode groups are installed between the cold end heat conduction pipe plate and the hot end heat conduction pipe plate through heat-conducting resin.

3. The cryogenic electrode-based volatile organic compound recovery apparatus of claim 1, wherein, The heat dissipation area comprises a heat dissipation area heat exchanger, and the deep cooling area comprises a deep cooling area heat exchanger; the hot end heat conduction pipe plate is connected with the heat dissipation area heat exchanger, and the cold end heat conduction pipe plate is connected with the deep cooling area heat exchanger.

4. The electrode-based deep cooling volatile organic compound recovery device according to claim 3, wherein The heat dissipation area further comprises a fan.

5. The cryo-electrode based volatile organic compound recovery apparatus of claim 3, wherein, The deep cooling area further comprises a rectifying baffle.

6. The cryo-electrode based volatile organic compound recovery apparatus of claim 3, wherein, The heat dissipation area heat exchanger and the deep cooling area heat exchanger are finned heat exchangers.

7. The cryo-electrode based volatile organic compound recovery apparatus of claim 1, wherein, The lower end of the deep cooling area is provided with a funnel-shaped outlet.

8. The cryogenic electrode-based volatile organic compound recovery apparatus of claim 1, wherein, The semiconductor electrode groups comprise N-type semiconductors and P-type semiconductors, which are connected by metal conductors to form thermocouples and are installed between ceramic sheets.

9. A volatile organic compound recovery system based on cryogenic cooling of electrodes, characterized in that, The electrode-based deep cooling volatile organic compound recovery device according to any one of claims 1-8 further comprises a solvent storage tank, which is connected with the condensate outlet of the deep cooling area through a conveying device.

10. The electrode-based deep cooling volatile organic compound recovery system according to claim 9, wherein The system further comprises a heat energy recovery device, the exhaust pipe is connected with the volatile organic compound recovery device through the heat energy recovery device, and the gas outlet of the deep cooling area is connected with the heat energy recovery device for pre-cooling the exhaust gas.

11. The cryogenic electrode-based volatile organic compound recovery system of claim 10, wherein, The system further comprises an adsorption tower, which is connected with the gas outlet of the deep cooling area through the heat energy recovery device for adsorbing uncondensed volatile organic compounds.

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