A polycrystalline silicon crushing and ingot splitting device

The polycrystalline silicon crushing and ingot-disassembly device, which combines multi-stage diamond wire cutting and multi-stage crushing, solves the problems of component damage and metal impurity contamination during polycrystalline silicon crushing, and achieves efficient and high-purity polycrystalline silicon production.

CN224443229UActive Publication Date: 2026-07-03XINJIANG CENT HESHENG SILICON IND CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
XINJIANG CENT HESHENG SILICON IND CO LTD
Filing Date
2025-07-11
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

In existing technologies, when blocky polycrystalline silicon is directly crushed, the internal components of the crusher are easily damaged, the crushing efficiency is low, and metal impurities contaminate the finished product, resulting in poor product quality.

Method used

The method employs multi-stage diamond wire cutting and multi-stage crushing to cut polycrystalline silicon blocks into sheets and strips through transverse and longitudinal cutting lines, and then uses coarse and fine extrusion rollers for multi-stage crushing, thereby reducing stress on mechanical parts and the introduction of metal impurities.

Benefits of technology

It improves the purity and quality of polycrystalline silicon products, reduces the probability of damage to internal mechanical parts of the crusher, and increases the working stability and service life of the equipment.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224443229U_ABST
    Figure CN224443229U_ABST
Patent Text Reader

Abstract

This application discloses a polycrystalline silicon crushing and ingot-breaking device, belonging to the technical field of raw material pretreatment equipment. It provides a polycrystalline silicon crushing and ingot-breaking device with good operational stability and low risk of introducing metal impurities. The device includes a feeding chamber, with a movable transverse cutting line below the feeding chamber and a guide chamber fixedly connected below it. A movable longitudinal cutting line is located above the guide chamber, below the transverse cutting line. A primary crusher is fixedly connected to the bottom of the guide chamber, and a secondary crusher is fixedly connected to the bottom of the primary crusher. This application achieves precise control of gravity during the polycrystalline silicon ingot-breaking process by introducing multi-stage diamond wire cutting and multi-stage crushing, reducing the probability of damage to internal mechanical components of the crusher, thereby reducing the introduction of metal impurities and resulting in better quality polycrystalline silicon products. The components within the device experience less force, leading to higher operational stability and a longer service life.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of raw material pretreatment equipment technology, and in particular to a polycrystalline silicon crushing and ingot-disassembling device. Background Technology

[0002] Refining blocky polycrystalline silicon directly will subject the crushing structure inside the crusher to a large reaction force, which will not only easily damage the working parts inside the crusher, but also result in low crushing efficiency. The metal shavings generated by the breakage and damage of the internal parts of the crusher will also degrade the quality of the finished product. Summary of the Invention

[0003] The purpose of this application is to provide a polycrystalline silicon crushing and ingot splitting device with good working stability and low susceptibility to introducing metallic impurities.

[0004] To achieve the above objectives, this application provides a polycrystalline silicon crushing and ingot-breaking device: including a feeding chamber, a movable transverse cutting line arranged below the feeding chamber, a guide chamber fixedly connected below the feeding chamber, a movable longitudinal cutting line arranged above the guide chamber, the longitudinal cutting line being located below the transverse cutting line, a primary crusher fixedly connected to the bottom of the guide chamber, and a secondary crusher fixedly connected to the bottom of the primary crusher. Through two-stage cutting and two-stage refinement, the stress on mechanical parts can be effectively reduced, and the metal contamination caused by mechanical damage to the material can be reduced.

[0005] As a preferred embodiment, the feeding chamber includes a feeding hopper, the lower end of which is fixedly connected to an upper guide chamber. An upper configuration frame is movably connected to one of the opposite outer sides of the upper guide chamber via an upper telescopic rod. Several transverse cutting lines are fixedly connected between the opposite inner walls of the upper configuration frame. These transverse cutting lines are arranged parallel and equidistantly in the same plane for cutting polycrystalline silicon blocks into multi-layer polycrystalline silicon wafers.

[0006] As a preferred embodiment, the upper end of the upper telescopic rod is rotatably connected to the outer side of the upper guide compartment, and the lower end of the upper telescopic rod is rotatably connected to the edge of the upper configuration frame, so that the upper telescopic rod can swing adaptively when the upper configuration frame is driven.

[0007] As a preferred embodiment, the material guide chamber includes a lower guide chamber, and a lower configuration frame is movably connected to one of the opposite sides of the lower guide chamber via a lower telescopic rod. A plurality of longitudinal cutting lines are fixedly connected between the opposite inner walls of the lower configuration frame. These longitudinal cutting lines are parallel and equidistantly arranged in the same plane. The transverse cutting lines are perpendicular to the longitudinal cutting lines and cut the polycrystalline silicon material along different directions.

[0008] As a preferred embodiment, the lower end of the lower telescopic rod is rotatably connected to the outer side of the lower guide chamber, and the upper end of the lower telescopic rod is rotatably connected to the edge of the lower configuration frame; the corner of the lower guide chamber has an upwardly extending support column, and the hopper is fixedly connected to the upper ends of all the support columns to ensure the stable configuration of the feeding chamber.

[0009] As a preferred embodiment, the primary crusher includes an upper chamber, in which at least two coarse extrusion rollers are rotatably connected. All the coarse extrusion rollers have parallel axes. A primary drive is provided on the outer side of the upper chamber to drive all the coarse extrusion rollers to rotate, for crushing polycrystalline silicon strips into polycrystalline silicon particles.

[0010] As a preferred embodiment, the secondary crusher includes a lower chamber, on which at least two fine extrusion rollers are rotatably connected. A secondary drive is provided on the outer side of the lower chamber, suitable for driving all the fine extrusion rollers to rotate. The axis of the fine extrusion rollers is perpendicular to the axis of the coarse extrusion rollers, which is used to better apply crushing force to the polycrystalline silicon particles.

[0011] As a preferred embodiment, a bracket is fixedly connected to the outer side of the upper chamber, a connecting plate is provided at the lower end of the upper chamber, the upper end of the lower chamber is fixedly connected to the connecting plate, and a discharge funnel is also fixedly connected to the lower end of the lower chamber for gathering and discharging polycrystalline silicon powder.

[0012] Compared with the prior art, the beneficial effects of this application are as follows:

[0013] (1) By introducing multi-stage diamond wire cutting and multi-stage crushing, the gravity during the polycrystalline silicon ingot breaking process is precisely controlled, reducing the probability of damage to the internal mechanical parts of the crusher, thereby reducing the introduction of metal impurities and making the obtained polycrystalline silicon product with higher purity and better quality.

[0014] (2) Because the device decomposes and refines polycrystalline silicon raw materials in multiple stages, the working parts inside the device are subjected to less reaction force during operation, resulting in higher working stability and longer service life. Attached Figure Description

[0015] Figure 1 This is a first three-dimensional schematic diagram of the overall structure of the polycrystalline silicon crushing and ingot-disassembling device.

[0016] Figure 2 This is a second three-dimensional schematic diagram of the overall structure of the polycrystalline silicon crushing and ingot-disassembling device.

[0017] Figure 3 This is a three-dimensional structural diagram showing the connection between the feed chamber and the guide chamber of the polycrystalline silicon crushing and ingot-dissolving device and the crusher.

[0018] Figure 4 This is a three-dimensional structural diagram of the feed chamber of the polycrystalline silicon crushing and ingot-disassembling device.

[0019] Figure 5 This is a three-dimensional structural diagram of the feed chamber of the polycrystalline silicon crushing and ingot-disassembling device.

[0020] Figure 6 This is a three-dimensional structural diagram showing the connection between the crusher and the discharge hopper of the polycrystalline silicon crushing and ingot-dissolving device.

[0021] Figure 7 This is a schematic diagram of the first three-dimensional structure connecting the primary and secondary crushers of the polycrystalline silicon crushing and ingot-dissolving device.

[0022] Figure 8 This is a schematic diagram of the second three-dimensional structure of the polycrystalline silicon crushing and ingot-dissolving device, showing the connection between the primary crusher and the secondary crusher.

[0023] In the diagram: 1. Feeding hopper; 101. Discharge hopper; 102. Upper guide hopper; 103. Upper telescopic rod; 104. Upper configuration frame; 105. Transverse cutting line; 2. Guide hopper; 201. Lower guide hopper; 202. Support column; 203. Lower telescopic rod; 204. Lower configuration frame; 205. Longitudinal cutting line; 3. Primary crusher; 301. Upper machine chamber; 302. Connecting plate; 303. Primary drive; 304. Coarse extrusion roller; 4. Secondary crusher; 401. Lower machine chamber; 402. Secondary drive; 403. Fine extrusion roller; 5. Discharge funnel; 6. Support frame. Detailed Implementation

[0024] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0025] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0026] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0027] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0028] like Figure 1-8 The polycrystalline silicon crushing and ingot-breaking device shown includes a top-mounted feeding chamber 1, with an inlet at the top and a outlet at the bottom. A movable transverse cutting line 105, made of diamond, is located below the feeding chamber 1 to cut the blocky polycrystalline silicon raw material into multi-layered structures. The feeding chamber 1 includes a discharge hopper 101, wider at the top and narrower at the bottom. A rectangular upper guide chamber 102 is fixedly connected to the lower end of the discharge hopper 101. An upper mounting frame 104 is movably connected to one of the opposite outer surfaces of the upper guide chamber 102 via an upper telescopic rod 103. The upper telescopic rod 103 is a hydraulic system capable of withstanding large loads. The upper end of the upper telescopic rod 103 is rotatably connected to the outer side of the upper guide chamber 102, and the lower end of the upper telescopic rod 103 is rotatably connected to the edge of the upper configuration frame 104. There are usually four upper telescopic rods 103, two in a group. The two upper telescopic rods 103 in a group are located on the same side of the upper guide chamber 102. Several transverse cutting lines 105 are fixedly connected between opposite inner walls of the upper configuration frame 104. The extension direction of the transverse cutting lines 105 is parallel to the swing plane of the upper telescopic rod 103, and these transverse cutting lines 105 are arranged parallel and equidistantly in the same plane, which can cut the block polycrystalline silicon raw material into sheets of uniform thickness.

[0029] Below the feeding chamber 1, a guide chamber 2 is fixedly connected. Above the guide chamber 2, a movable longitudinal cutting line 205 is provided. The longitudinal cutting line 205 is also a diamond cutting line, used to further cut the sheet-like polycrystalline silicon material into strips. The guide chamber 2 includes a lower guide chamber 201. The corner of the lower guide chamber 201 has an upwardly extending support column 202. The feeding hopper 101 is fixedly connected to the upper end of all the support columns 202, thereby maintaining the stability of the feeding chamber 1 relative to the guide chamber 2. At the same time, it can effectively avoid the movement interference between the support columns 202 and the transverse cutting line 105 and the longitudinal cutting line 205. The lower guide chamber 201 is connected to a lower telescopic rod on one opposite side. The lower configuration frame 204 is connected to the lower telescopic rod 203. The lower telescopic rod 203 is also a hydraulic cylinder that can withstand a large load. The lower end of the lower telescopic rod 203 is rotatably connected to the outer side of the lower guide chamber 201, and the upper end of the lower telescopic rod 203 is rotatably connected to the edge of the lower configuration frame 204. There are usually four lower telescopic rods 203, which are in groups of two. The two lower telescopic rods 203 in the same group are located on the same side of the lower guide chamber 201. Several longitudinal cutting lines 205 are fixedly connected between the inner walls of the lower configuration frame 204. These longitudinal cutting lines 205 are parallel and equidistant in the same plane and are used to cut the sheet-like polycrystalline silicon raw material into strips of approximately the same size.

[0030] In order to obtain the above-mentioned strip-shaped polycrystalline silicon material, the longitudinal cutting line 205 needs to be located below the transverse cutting line 105, and the transverse cutting line 105 and the longitudinal cutting line 205 need to be perpendicular to each other. In this way, the cross-section of the strip-shaped polycrystalline silicon material will be roughly rectangular.

[0031] A primary crusher 3 is fixedly connected to the bottom of the feed chamber 2 to perform preliminary crushing of the strip-shaped polycrystalline silicon material. The primary crusher 3 includes a rectangular upper chamber 301. A support 6 is fixedly connected to the outer side of the upper chamber 301. The upper chamber 301 is fixed to the ground or frame through the support 6 to maintain the stability of the entire device. At least two coarse extrusion rollers 304 are rotatably connected inside the upper chamber 301 to crush the strip-shaped polycrystalline silicon material into larger particles. All the coarse extrusion rollers 304 have parallel axes. A primary drive 303 is provided on the outer side of the upper chamber 301 to drive all the coarse extrusion rollers 304 to rotate. In this embodiment, the two coarse extrusion rollers 304 rotate downward relative to each other, which can crush the strip-shaped polycrystalline silicon material while pushing it downward.

[0032] A secondary crusher 4 is fixedly connected to the bottom of the primary crusher 3, further refining the coarse-grained polycrystalline silicon material. The secondary crusher 4 also includes a cuboid lower chamber 401. The upper ends of both the primary crusher 3 and the secondary crusher 4 are feed inlets, and the lower ends are discharge outlets. The lower end of the upper chamber 301 has an outwardly extending connecting plate 302, and the upper end of the lower chamber 401 is fixedly connected to the connecting plate 302. Therefore, the discharge outlet of the primary crusher 3 and the feed inlet of the secondary crusher 4 are directly opposite each other. At least two fine extrusion rollers 403 are rotatably connected to the lower chamber 401. In this embodiment, three fine extrusion rollers 403 are provided, and the axes of the three fine extrusion rollers 403 are parallel in the same plane. A secondary drive 402 is provided on the outer side of the lower chamber 401 to drive all the fine extrusion rollers 403 to rotate synchronously, so that adjacent fine extrusion rollers 403 rotate relative to each other, which can more fully refine the polycrystalline silicon particles.

[0033] It should be noted that the axis of the fine extrusion roller 403 is also perpendicular to the axis of the coarse extrusion roller 304, which can apply extrusion crushing force in different directions to the polycrystalline silicon particles, thereby improving the fineness of the polycrystalline silicon. The lower end of the lower chamber 401 is also fixedly connected to the discharge funnel 5. The larger upper end of the discharge funnel 5 is aligned with the discharge end of the secondary crusher 4, and the lower end of the discharge funnel 5 is narrowed, which gathers the refined material in the middle, making it easier to collect.

[0034] Working principle: During use, the block-shaped polycrystalline silicon block is fed into the upper guide chamber 102 from the upper end of the feed chamber 1. The two sets of upper telescopic rods 103 extend and retract alternately, causing the upper configuration frame 104 to swing back and forth. Under its own gravity, the polycrystalline silicon block is cut into multi-layer sheet structures by the transverse cutting line 105. The sheet-shaped polycrystalline silicon sheets continue to descend and are further cut into strips by the longitudinal cutting line 205, which is driven by the lower telescopic rod 203 to swing back and forth. The strip-shaped polycrystalline silicon strips continue to descend into the primary crusher 3, where they are crushed into coarser polycrystalline silicon particles by the relatively moving coarse extrusion roller 304. The coarser polycrystalline silicon particles continue to descend into the secondary crusher 4, where they are compressed into finer polycrystalline silicon powder by the relatively moving fine extrusion roller 403. Finally, the polycrystalline silicon crushing and ingot dismantling device is discharged from the discharge funnel 5.

[0035] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A polycrystalline silicon crushing and ingot-splitting device, characterized in that: The device includes a feed hopper (1), a movable transverse cutting line (105) is provided below the feed hopper (1), a guide hopper (2) is fixedly connected below the feed hopper (1), a movable longitudinal cutting line (205) is provided above the guide hopper (2), the longitudinal cutting line (205) is located below the transverse cutting line (105), a primary crusher (3) is fixedly connected to the bottom of the guide hopper (2), and a secondary crusher (4) is fixedly connected to the bottom of the primary crusher (3).

2. The polycrystalline silicon crushing and ingot-splitting device as described in claim 1, characterized in that: The feeding chamber (1) includes a feeding hopper (101), and an upper guide chamber (102) is fixedly connected to the lower end of the feeding hopper (101). An upper configuration frame (104) is movably connected to one of the opposite outer sides of the upper guide chamber (102) via an upper telescopic rod (103). Several transverse cutting lines (105) are fixedly connected between one of the opposite inner walls of the upper configuration frame (104). These transverse cutting lines (105) are arranged parallel and equidistantly in the same plane.

3. The polycrystalline silicon crushing and ingot-splitting device as described in claim 2, characterized in that: The upper end of the upper telescopic rod (103) is rotatably connected to the outer side of the upper guide chamber (102), and the lower end of the upper telescopic rod (103) is rotatably connected to the edge of the upper configuration frame (104).

4. The polycrystalline silicon crushing and ingot-splitting device as described in claim 3, characterized in that: The guide chamber (2) includes a lower guide chamber (201). A lower configuration frame (204) is movably connected to one of the opposite sides of the lower guide chamber (201) via a lower telescopic rod (203). A plurality of longitudinal cutting lines (205) are fixedly connected between the opposite inner walls of the lower configuration frame (204). These longitudinal cutting lines (205) are parallel and equidistantly arranged in the same plane. The transverse cutting lines (105) are perpendicular to the longitudinal cutting lines (205) in opposite planes.

5. The polycrystalline silicon crushing and ingot-splitting device as described in claim 4, characterized in that: The lower end of the lower telescopic rod (203) is rotatably connected to the outer side of the lower guide chamber (201), and the upper end of the lower telescopic rod (203) is rotatably connected to the edge of the lower configuration frame (204); the lower guide chamber (201) has an upwardly extending support column (202) at the corner, and the hopper (101) is fixedly connected to the upper ends of all the support columns (202).

6. The polycrystalline silicon crushing and ingot-splitting apparatus according to any one of claims 1 to 5, characterized in that: The primary crusher (3) includes an upper chamber (301), in which at least two coarse extrusion rollers (304) are rotatably connected. All the coarse extrusion rollers (304) have parallel axes. A primary drive (303) is provided on the outer side of the upper chamber (301) to drive all the coarse extrusion rollers (304) to rotate.

7. The polycrystalline silicon crushing and ingot-splitting device as described in claim 6, characterized in that: The secondary crusher (4) includes a lower chamber (401), which is rotatably connected to at least two fine extrusion rollers (403). A secondary drive (402) is provided on the outer side of the lower chamber (401) to drive all the fine extrusion rollers (403) to rotate. The axis of the fine extrusion rollers (403) is perpendicular to the axis of the coarse extrusion rollers (304).

8. The polycrystalline silicon crushing and ingot-splitting device as described in claim 7, characterized in that: A bracket (6) is fixedly connected to the outer side of the upper machine compartment (301). A connecting plate (302) is provided at the lower end of the upper machine compartment (301). The upper end of the lower machine compartment (401) is fixedly connected to the connecting plate (302). A discharge funnel (5) is also fixedly connected to the lower end of the lower machine compartment (401).