A stamping die for electronic connectors

Abstract

This utility model relates to the field of electronic connector technology, and provides a stamping die for electronic connectors, including a base, support rods fixed at the edges of the top of the base, a top plate fixed at the top of the support rods, guide structures fixed on both sides of the top of the base, and a cooling structure installed at the top of the base. This utility model, by incorporating a cooling structure, returns the cooled liquid after heat absorption to the storage chamber through a return water pipe, achieving coolant recycling, facilitating cooling of the formed workpiece, and improving work efficiency. Furthermore, the design of the sliding grooves on both sides of the die cavity and the "L"-shaped template allows for easy removal of the formed electronic connector workpiece. The operator can conveniently pull the template through the grooves, and the workpiece is carried out of the die cavity by the sliding of the template within the grooves, improving material handling efficiency.

Description

Technical Field

[0001] This utility model relates to the field of electronic connector technology, and in particular to a stamping die for electronic connectors. Background Technology

[0002] An electronic connector is an electromechanical component used in electronic devices to achieve reliable connections and signal transmission between circuits. It ensures stable contact between conductors through its mechanical structure, allowing current, signals, or data to flow efficiently between different circuit boards, cables, or modules. A stamping die for electronic connectors is a specialized mold used for the efficient and precise machining of the metal terminals of electronic connectors. It uses a stamping process to process metal strip into key components such as connector pins, contacts, and housings that meet electrical and mechanical performance requirements.

[0003] To address this, patent CN217834546U discloses a stamping die for electronic product connectors with a buffering effect, comprising a fixed base, a fixed die, and a moving die. Damping rods are located on the left and right sides of the fixed die, below a telescopic guide rod. The ends of the damping rods are rotatably mounted on a buffer guide plate via a rotating shaft with a torsion spring. Sliding balls on the surface of the buffer guide plate engage with the outer wall of the moving die to facilitate its movement. The buffer guide plate pushes the damping rods against the damping cylinder seat. The resistance generated by the damping rods against the damping cylinder seat provides a buffering effect on the downward movement of the moving die, reducing the impact force when the moving die and fixed die overlap. This reduces the likelihood of displacement and increased defect rates due to excessive impact force between the moving and fixed dies during injection molding of electronic product connectors, further improving the safety of product injection molding production. An injection tube is provided on the moving die, connecting to a screw seat on the cover plate. The injection material connected to the cover plate is directly discharged through the injection tube into the molding cavity of the fixed die, reducing the probability of injection material leakage.

[0004] The aforementioned electronic product connector stamping dies with buffering effect are not easy to cool during use. The stamped workpiece needs to be cooled naturally, which prolongs the production cycle. Furthermore, after stamping, external tools may be needed to remove the workpiece, which can easily cause workpiece damage or low material handling efficiency. Utility Model Content

[0005] The purpose of this invention is to provide a stamping die for electronic connectors to solve the problem that existing stamping dies for electronic product connectors with cushioning effects are not easy to cool.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a stamping mold for electronic connectors, including a base;

[0007] Each of the top edges of the base is fixed with a support rod, the top of the support rod is fixed with a top plate, and guide structures are fixed on both sides of the top of the base.

[0008] A cooling structure is installed at the top of the base. The cooling structure includes a water tank installed at the top of the base. The water tank has a water storage chamber inside, and a cooler is installed inside the water storage chamber. A water inlet pipe is fixed to one side of the water tank. A mold base is installed at the top of the water tank. A mold cavity is provided at the top of the mold base. A mold core is provided above the mold cavity. A cooling chamber is provided inside the mold base. A water pump is fixed to one side of the mold base. A water pumping pipe is fixed to the input end of the water pump. A water return pipe is fixed to the bottom end of the mold base.

[0009] Preferably, the guide structure includes a hydraulic push rod fixed at the middle position of the top of the top plate, a lifting plate installed at the bottom end of the hydraulic push rod below the top plate, guide plates fixed on both sides of the bottom end of the lifting plate, and fixing plates fixed on both sides of the top end of the base. The fixing plate has a guide groove inside, and a fixing rod is fixed at the top end of the base inside the guide groove. The guide plate outside the fixing rod has a sliding hole inside, a limit block is fixed at the top end of the fixing rod, and a spring is installed on the outside of the fixing rod at the bottom end of the guide plate. Both ends of the spring are fixed with reset plates.

[0010] Preferably, the guide plates are symmetrically distributed at the bottom of the lifting plate, and the fixing plates are symmetrically distributed at the top of the base. The guide plates and fixing plates correspond one-to-one, and the guide plates and fixing plates are slidably connected by guide grooves. The outer side of the guide plate is fitted into the inner side of the fixing plate.

[0011] With the above structure, the guide plate and guide groove provide a clear guiding path for the movement of the lifting plate during use, restricting the horizontal displacement of the lifting plate and ensuring that it can only move stably in the vertical direction. This ensures that the mold core can be accurately aligned with the mold cavity, thereby improving the accuracy of stamping.

[0012] Preferably, the fixing rods are evenly spaced inside the guide groove, the sliding holes are evenly spaced inside the guide plate, the fixing rods and sliding holes correspond one-to-one, the fixing rods and the guide plate are slidably connected through the sliding holes, the reset plate is arranged in a ring shape, and the guide plate and fixing rods are telescopically connected by springs.

[0013] With the above structure, the sliding engagement between the sliding hole and the fixed rod further constrains the movement trajectory of the guide plate during use, and causes the spring to compress and deform when the guide plate moves downward with the lifting plate. This allows the spring to absorb the impact force during the stamping process, reducing mold wear.

[0014] Preferably, the mold cavity has grooves on both sides, a template is provided inside the grooves, and a recess is provided on one side of the mold cavity.

[0015] Preferably, the mold cavities are evenly distributed at the top of the mold base, the outer side of the mold core is fitted into the inside of the mold cavity, and the top of the mold core is fixedly connected to the bottom of the lifting plate.

[0016] With the above structure, when the lifting plate moves down under the drive of the hydraulic push rod during use, all mold cores can be synchronously embedded into the corresponding mold cavity, ensuring that the material in each mold cavity is subjected to the same impact pressure and molding time. This effectively avoids product size and shape deviations caused by differences in the action of individual molds, and improves the quality uniformity of batch products.

[0017] Preferably, the output end of the water pump extends through one side of the mold base into the interior of the cooling chamber, one end of the water pump extends through one side of the water tank into the interior of the water storage chamber, and one end of the water return pipe extends through the top of the water tank into the interior of the water storage chamber.

[0018] With the above structure, when the water pump is started during use, the coolant in the water storage chamber can be pumped into the cooling chamber through the water pumping pipe. After absorbing the heat of the mold base and the stamped workpiece, it flows back to the water storage chamber through the return water pipe, realizing the recycling of coolant, avoiding waste of coolant, and reducing the cost of continuous cooling.

[0019] Preferably, the grooves are symmetrically distributed on both sides of the mold cavity, the template is arranged in an "L" shape, and the template and the mold base are slidably connected by the grooves.

[0020] With the above structure, during use, the "L"-shaped template can contact the electronic connector workpiece formed inside the mold cavity. After stamping and cooling, the operator pulls the template, causing it to slide along the symmetrically distributed grooves on both sides of the mold cavity. The movement of the template allows the formed workpiece to be easily removed from the mold cavity, avoiding deformation or damage that might occur if the workpiece is manually picked up, thus improving the convenience and efficiency of material handling.

[0021] The present invention provides a stamping die for electronic connectors, the advantages of which are:

[0022] By incorporating a guiding structure, the guide plate and the fixed plate are slidably connected via guide grooves, and the fixed rod cooperates with the sliding hole, forming a dual guiding and limiting mechanism. This limits the lateral displacement of the lifting plate, ensuring its precise vertical movement and guaranteeing accurate alignment of the die core and die cavity during stamping. This effectively avoids product dimensional deviations caused by misalignment and significantly improves the stamping precision of electronic connectors.

[0023] By incorporating a cooling structure, the cooled liquid, after absorbing heat, is returned to the storage chamber via a return water pipe, achieving coolant recycling. This facilitates cooling of the molded workpiece, improving work efficiency. Furthermore, the design of the sliding grooves on both sides of the mold cavity and the "L"-shaped template allows for easy removal of the molded electronic connector workpiece. Operators can conveniently pull the template through the grooves, and the workpiece is carried out of the mold cavity by the sliding of the template within the grooves, improving material handling efficiency. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0025] Figure 2 This is a three-dimensional structural schematic diagram of the present invention;

[0026] Figure 3 This is a three-dimensional cross-sectional structural diagram of the present invention;

[0027] Figure 4 This is a three-dimensional exploded view of the guide structure of this utility model;

[0028] Figure 5 This is a three-dimensional exploded view of the cooling structure of this utility model.

[0029] The following are the annotations in the diagram: 1. Base; 2. Support rod; 3. Top plate; 4. Guide structure; 401. Hydraulic push rod; 402. Lifting plate; 403. Guide plate; 404. Fixing plate; 405. Guide groove; 406. Fixing rod; 407. Sliding hole; 408. Limiting block; 409. Spring; 410. Reset plate; 5. Cooling structure; 501. Water tank; 502. Water storage chamber; 503. Refrigerator; 504. Water inlet pipe; 505. Mold base; 506. Mold cavity; 507. Mold core; 508. Cooling chamber; 509. Water pump; 510. Water extraction pipe; 511. Water return pipe; 512. Slide groove; 513. Template; 514. Groove. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Please see Figure 1-5 The present invention provides a stamping die for an electronic connector, including a base 1.

[0032] Reference Figures 1-4As shown, support rods 2 are fixed at the edge of the top of the base 1, and a top plate 3 is fixed at the top of the support rods 2. Guide structures 4 are fixed on both sides of the top of the base 1. The guide structures 4 include a hydraulic push rod 401 fixed at the middle of the top of the top of the top plate 3. A lifting plate 402 is installed at the bottom of the hydraulic push rod 401 below the top plate 3. Guide plates 403 are fixed on both sides of the bottom of the lifting plate 402. Fixing plates 404 are fixed on both sides of the top of the base 1. A guide groove 405 is provided inside the fixing plate 404. A fixing rod 406 is fixed at the top of the base 1 inside the guide groove 405. A sliding hole 407 is provided inside the guide plate 403 outside the fixing rod 406. A limit block 408 is fixed at the top of the fixing rod 406. A spring 409 is installed on the outside of the fixing rod 406 at the bottom of the guide plate 403. Both ends of the spring 409 are fixed with reset plates 410. The guide plates 403 are symmetrically distributed at the bottom of the lifting plate 402, and the fixing plates 404 are symmetrically distributed at the top of the base 1. The guide plates 403 and the fixing plates 404 correspond one-to-one. The guide plates 403 and the fixing plates 404 are slidably connected through the guide grooves 405. The outer side of the guide plates 403 is fitted into the inside of the fixing plates 404. The fixing rods 406 are evenly distributed inside the guide grooves 405. The sliding holes 407 are evenly distributed inside the guide plates 403. The fixing rods 406 and the sliding holes 407 correspond one-to-one. The fixing rods 406 and the guide plates 403 are slidably connected through the sliding holes 407. The reset plate 410 is arranged in a ring shape. The guide plates 403 and the fixing rods 406 are telescopically connected through the springs 409.

[0033] The lifting plate 402 is driven to move up and down by activating the hydraulic push rod 401. When the lifting plate 402 moves down, the guide plates 403 on both sides of its bottom end are embedded in the guide grooves 405 inside the fixed plate 404. Through sliding cooperation, the lateral displacement of the lifting plate 402 is limited, ensuring its stable movement in the vertical direction. When the guide plate 403 moves down, the fixed rod 406 slides through the sliding hole 407 inside the guide plate 403, while simultaneously pressing the reset plate 410. After being subjected to force, the reset plate 410 compresses the spring 409 on the outside of the fixed rod 406, thereby allowing the elastic deformation of the spring 409 to absorb the impact force during the stamping process, reducing the wear of the mold caused by excessive instantaneous force, and extending its service life. The limit block 408 prevents the guide plate 403 from disengaging from the fixed rod 406, ensuring structural stability.

[0034] Reference Figure 1 , Figure 2 , Figure 3 and Figure 5As shown, a cooling structure 5 is installed at the top of the base 1. The cooling structure 5 includes a water tank 501 installed at the top of the base 1. The water tank 501 has a water storage chamber 502 inside, and a cooler 503 is installed inside the water storage chamber 502. A water inlet pipe 504 is fixed to one side of the water tank 501. A mold base 505 is installed at the top of the water tank 501. A mold cavity 506 is provided at the top of the mold base 505. A mold core 507 is provided above the mold cavity 506. A cooling chamber 508 is provided inside the mold base 505. A water pump 509 is fixed to one side of the mold base 505. A water pump pipe 510 is fixed to the input end of the water pump 509. A water return pipe 511 is fixed to the bottom end of the mold base 505. Slide grooves 512 are provided on both sides inside the mold cavity 506. A template 513 is provided, and a groove 514 is provided on one side of the mold cavity 506. The mold cavities 506 are evenly distributed at the top of the mold base 505. The outer side of the mold core 507 is fitted into the inside of the mold cavity 506. The top of the mold core 507 is fixedly connected to the bottom of the lifting plate 402. The output end of the water pump 509 extends through one side of the mold base 505 to the inside of the cooling cavity 508. One end of the water pump pipe 510 extends through one side of the water tank 501 to the inside of the water storage cavity 502. One end of the water return pipe 511 extends through the top of the water tank 501 to the inside of the water storage cavity 502. The sliding groove 512 is symmetrically distributed on both sides of the mold cavity 506. The template 513 is set in an "L" shape. The template 513 and the mold base 505 are slidably connected through the sliding groove 512.

[0035] Electronic connector raw materials are placed inside the mold cavity 506. When the lifting plate 402 moves down to the preset position, the mold core 507 at its bottom end is embedded in the mold cavity 506. The shape of the mold core 507 matches that of the mold cavity 506, completing the stamping and shaping of the raw material. After stamping, coolant is stored in the water storage chamber 502 inside the water tank 501, and the cooler 503 continuously cools the coolant. After the water pump 509 is started, the coolant is transported to the cooling chamber 508 inside the mold base 505 through the water pump pipe 510. It absorbs the heat of the mold base 505 and the formed workpiece through heat exchange, accelerating the cooling and solidification of the workpiece. The cooled coolant after absorbing heat flows back to the water storage chamber 502 through the return water pipe 511, realizing recycling and reducing energy consumption. After cooling, the template 513 is easily picked up through the groove 514, which then drives the template 513 to move inside the slide groove 512, thereby removing the formed workpiece from inside the mold cavity 506, thus facilitating material removal.

[0036] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A stamping die for an electronic connector, comprising a base (1); Its features are: A support rod (2) is fixed at the edge of the top of the base (1), a top plate (3) is fixed at the top of the support rod (2), and guide structures (4) are fixed on both sides of the top of the base (1). A cooling structure (5) is installed at the top of the base (1). The cooling structure (5) includes a water tank (501) installed at the top of the base (1). A water storage chamber (502) is provided inside the water tank (501). A cooler (503) is installed inside the water storage chamber (502). A water inlet pipe (504) is fixed on one side of the water tank (501). A mold base (505) is installed at the top of the water tank (501). A mold cavity (506) is provided at the top of the mold base (505). A mold core (507) is provided above the mold cavity (506). A cooling chamber (508) is provided inside the mold base (505). A water pump (509) is fixed on one side of the mold base (505). A water pump pipe (510) is fixed at the input end of the water pump (509). A return water pipe (511) is fixed at the bottom end of the mold base (505).

2. The press forming die for an electronic connector according to claim 1, wherein: The guide structure (4) includes a hydraulic push rod (401) fixed at the middle position of the top of the top plate (3). A lifting plate (402) is installed at the bottom end of the hydraulic push rod (401) below the top plate (3). Guide plates (403) are fixed on both sides of the bottom end of the lifting plate (402). Fixing plates (404) are fixed on both sides of the top of the base (1). A guide groove (405) is provided inside the fixing plate (404). A fixing rod (406) is fixed at the top of the base (1) inside the guide groove (405). A sliding hole (407) is provided inside the guide plate (403) on the outside of the fixing rod (406). A limit block (408) is fixed at the top of the fixing rod (406). A spring (409) is installed on the outside of the fixing rod (406) at the bottom end of the guide plate (403). A reset plate (410) is fixed at both ends of the spring (409).

3. The press forming die for an electronic connector according to claim 2, wherein: The guide plates (403) are symmetrically distributed at the bottom of the lifting plate (402), and the fixing plates (404) are symmetrically distributed at the top of the base (1). The guide plates (403) and the fixing plates (404) correspond one-to-one. The guide plates (403) and the fixing plates (404) are slidably connected by guide grooves (405). The outer side of the guide plate (403) is fitted into the interior of the fixing plate (404).

4. The press forming die for an electronic connector according to claim 2, wherein: The fixing rods (406) are evenly distributed inside the guide groove (405), and the sliding holes (407) are evenly distributed inside the guide plate (403). The fixing rods (406) and the sliding holes (407) correspond one-to-one. The fixing rods (406) and the guide plate (403) are slidably connected through the sliding holes (407). The reset plate (410) is arranged in a ring shape. The guide plate (403) and the fixing rods (406) are telescopically connected through the springs (409).

5. The press forming die for an electronic connector according to claim 1, wherein: The mold cavity (506) has a sliding groove (512) on both sides, and a template (513) is provided inside the sliding groove (512). A groove (514) is provided on one side of the mold cavity (506).

6. The press forming die for an electronic connector according to claim 2, wherein: The mold cavities (506) are evenly distributed at the top of the mold base (505), the outer side of the mold core (507) is fitted into the inside of the mold cavity (506), and the top of the mold core (507) is fixedly connected to the bottom of the lifting plate (402).

7. The press forming die for an electronic connector according to claim 1, wherein: The output end of the water pump (509) extends through one side of the mold base (505) to the interior of the cooling chamber (508), one end of the water pump (510) extends through one side of the water tank (501) to the interior of the water storage chamber (502), and one end of the return water pipe (511) extends through the top of the water tank (501) to the interior of the water storage chamber (502).

8. The press forming die for an electronic connector according to claim 5, wherein: The slide grooves (512) are symmetrically distributed on both sides of the mold cavity (506), the template (513) is arranged in an "L" shape, and the template (513) and the mold base (505) are slidably connected through the slide grooves (512).

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