A semiconductor device detecting and slitting apparatus
By using a sliding device with a slide table and side clamps in conjunction with a milling cutter, the safety hazards and trajectory control problems in semiconductor device slitting operations have been solved, achieving safe and efficient linear slitting.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SICHUAN MOUNTEK ELECTRONIC TECH CO LTD
- Filing Date
- 2025-07-08
- Publication Date
- 2026-07-03
AI Technical Summary
Existing semiconductor device slitting operations pose safety hazards and are difficult to control the slitting trajectory, which can easily cause finger cuts and non-straight slitting trajectories.
It adopts a slide table and side clamping plate structure, uses a milling cutter for cutting, clamps semiconductor devices through the side clamping plate, and achieves linear cutting through the cooperation of the slide table and milling cutter, avoiding close contact between the operator and the milling cutter.
This improves the safety of the slitting operation and the straightness of the slitting trajectory, ensuring the effectiveness of the detection.
Smart Images
Figure CN224444686U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor device slitting devices, and particularly relates to a slitting device for semiconductor device testing. Background Technology
[0002] After semiconductor devices are packaged, a small number of products need to be slit through sampling to check for issues such as air bubbles inside the package, the stability of the connection between the leads and the base island, and whether the lead positions have changed. In current slitting operations, workers typically press the semiconductor device firmly with their fingers and push it towards the cutting saw to achieve the slitting purpose. This method poses significant safety hazards, easily causing finger injuries to operators, and makes it difficult to accurately control the slitting trajectory, which tends to exhibit a curved structure, affecting inspection and judgment. Utility Model Content
[0003] To address the shortcomings of existing technologies, this utility model provides a slitting device for semiconductor device testing, which can smoothly and safely slit semiconductor devices and ensure the straightness of the slitting trajectory.
[0004] In order to achieve the purpose of this utility model, the following solution is proposed:
[0005] A slitting device for testing semiconductor devices includes: a slide table that moves horizontally, and two movable side clamps on the slide table. The moving direction of the side clamps is parallel to the horizontal plane and perpendicular to the sliding direction of the slide table. The side clamps are both parallel to the sliding direction of the slide table, and the distance between the two side clamps is adjustable.
[0006] Both side plates have rectangular countersunk holes along their length on opposite sides. A pressure block is installed at the same end inside the rectangular countersunk hole, and the pressure block is movable along the length of the rectangular countersunk hole.
[0007] A vertical milling cutter is positioned between the two side clamping plates. The milling cutter is located at the lower end of a drive motor spindle, and the lower end of the milling cutter is lower than the lower side of the rectangular countersunk hole.
[0008] The beneficial effects of this utility model are as follows: This solution effectively avoids close contact between the operator and the milling cutter, improves the safety of the slitting process, and can accurately control the slitting trajectory, thereby ensuring the effectiveness of the detection structure. Attached Figure Description
[0009] The accompanying drawings described herein are merely illustrative of selected embodiments, not all possible implementations, and are not intended to limit the scope of this invention.
[0010] Figure 1 A schematic diagram of the overall structure of the preferred embodiment of this application is shown.
[0011] Figure 2 A schematic diagram of the side clamp is shown.
[0012] The markings in the diagram are: slide table-1, push rod-11, slide groove-12, side clamping plate-2, rectangular countersunk hole-21, slider-22, pressure block-3, milling cutter-4, drive motor-5, locking screw-6, adjusting screw-7, and double screw-8. Detailed Implementation
[0013] To make the objectives, technical solutions and advantages of the present utility model clearer, the implementation methods of the present utility model will be described in detail below with reference to the accompanying drawings. However, the embodiments described in the present utility model are only some embodiments of the present utility model, and not all embodiments.
[0014] like Figure 1 , Figure 2 As shown, a slitting device for testing semiconductor devices includes: a slide table 1 that moves horizontally, and two movable side clamps 2 on the slide table 1. The moving direction of the side clamps 2 is parallel to the horizontal plane and perpendicular to the sliding direction of the slide table 1. The side clamps 2 are both parallel to the sliding direction of the slide table 1. The distance between the two side clamps 2 is adjustable to accommodate semiconductor devices of different lengths or widths.
[0015] Specifically, such as Figure 2 As shown, rectangular countersunk holes 21 are provided on the opposite sides of the two side plates 2 along the length direction. It can also be understood that the length direction of the rectangular countersunk holes 21 is consistent with the sliding direction of the slide table 1, which is used to accommodate the end of the semiconductor device. The same end of the rectangular countersunk holes 21 is equipped with pressure blocks 3. The pressure blocks 3 are moved along the length direction of the rectangular countersunk holes 21 to press the side of the end of the semiconductor device.
[0016] Preferred, such as Figure 1 As shown, a vertical milling cutter 4 is provided between the two side clamping plates 2. The milling cutter 4 can be a double-edged or multi-edged straight flute milling cutter. The milling cutter 4 is located at the lower end of the spindle of a drive motor 5. The lower end of the milling cutter 4 is lower than the lower side of the rectangular countersunk hole 21 to ensure that the length of the milling cutter 4 covers the overall thickness of the semiconductor device. The lower side referred to here is the side of the rectangular countersunk hole 21 that is horizontal and facing upwards. Because the rectangular countersunk hole 21 is opened on the side of the side clamping plate 2, the bottom surface of the rectangular countersunk hole 21 is in a vertical state, while the upper and lower sides are in a horizontal state, and the other two sides are in a vertical state.
[0017] Before slitting, move the two side clamps 2 outward to increase the distance between them, and place the semiconductor device between the two side clamps 2. Then move the two side clamps 2 towards the middle so that the two ends of the semiconductor device are inserted into the two rectangular countersunk holes 21 respectively. Move the pressure block 3 towards the semiconductor device and use the pressure block 3 to press the semiconductor device against the side of the rectangular countersunk hole 21 opposite to the pressure block 3. Finally, adjust the position of the two side clamps 2 on the slide table 1 simultaneously so that the predetermined slitting trajectory of the semiconductor device is aligned with the milling cutter 4, and fix the side clamps 2 on the slide table 1. At this time, the milling cutter 4 is located outside one side of the semiconductor device.
[0018] During the slitting process, the drive motor 5 is started to drive the milling cutter 4 to rotate. Then, the slide table 1 is moved, and the side clamping plate 2 is used to move the semiconductor device toward the milling cutter 4. When the semiconductor device comes into contact with the milling cutter 4, the milling cutter 4 uses its cutting edge to slit the semiconductor device. The specific slitting depth is controlled by the distance of the slide table 1. The milling cutter 4 can also be used to completely cut off the semiconductor device. After cutting, the ends of the two semiconductor devices are still clamped in the rectangular countersunk hole 21 to prevent the semiconductor device from flying out or falling.
[0019] The above process avoids close contact between the operator's fingers and the milling cutter 4, which helps to improve the safety of the slitting operation and can effectively ensure the straightness of the slitting trajectory.
[0020] Preferred, such as Figure 1 As shown, the slide table 1 is slidably mounted on a horizontal track on the top surface of a base. The slide table 1 is manually pushed. Preferably, each end of the slide table 1 is provided with a push rod 11 for easy manual pushing.
[0021] Preferred, such as Figure 1 As shown, a cantilever is provided on the top of the base, and the position of the cantilever is higher than the top surface of the side clamp 2. The drive motor 5 is located on the cantilever.
[0022] Preferred, such as Figure 1 and Figure 2 As shown, the top surface of the slide table 1 is provided with a pair of parallel slide grooves 12, which are perpendicular to the sliding direction of the slide table 1. The lower end of the side clamp plate 2 is provided with a slider 22, which is slidably disposed in the slide groove 12. As a preferred structure, the cross sections of the slide groove 12 and the slider 22 are both inverted T-shaped structures.
[0023] Preferred, such as Figure 1 , Figure 2 As shown, each side clamp 2 has at least one slider 22 with a locking screw 6 for fixing the slider 22 in the groove 12, thereby achieving the purpose of fixing the side clamp 2.
[0024] Preferred, such as Figure 2As shown, the upper end of the opposite sidewall of the rectangular countersunk hole 21 and the pressure block 3 is a slope, which is inclined towards the lower part of the middle of the rectangular countersunk hole 21. This structure uses the slope to generate downward pressure on the semiconductor device to improve the pressing effect on the semiconductor device.
[0025] Preferred, such as Figure 2 As shown, the upper end of the side of the pressure block 3 that contacts the semiconductor device is provided with an inclined block. The inclined surface of the inclined block is inclined towards the lower part of the middle of the rectangular countersunk hole 21. When pressing the semiconductor device, the inclined surface of the inclined block is used to press the semiconductor device, which can generate downward pressure on the semiconductor device, further improving the pressing effect. In addition, this structure can also adapt to clamping semiconductor devices of different thicknesses.
[0026] Preferred, such as Figure 1 , Figure 2 As shown, the slider 22 is equipped with an adjusting screw 7. The adjusting screw 7 is parallel to the moving direction of the pressure block 3. The adjusting screw 7 passes through the side wall of the rectangular countersunk hole 21. By rotating the adjusting screw 7, the movement of the pressure block 3 can be controlled, and the self-locking function of the thread can be used to fix the position of the pressure block 3 and press it tightly.
[0027] Preferred, such as Figure 1 As shown, two side clamps 2 are respectively connected to the two ends of a bidirectional screw 8. The threads at the two ends of the bidirectional screw 8 are in opposite directions. By rotating the bidirectional screw 8, the distance between the two side clamps 2 can be adjusted, and the two side clamps 2 can be moved at the same time to speed up the adjustment.
[0028] The above description is merely a preferred embodiment of this utility model and does not imply its uniqueness or limitation. Those skilled in the art should understand that various changes or equivalent substitutions made to this utility model without departing from its scope are all within the protection scope of this utility model.
Claims
1. A slitting apparatus for testing semiconductor devices, characterized in that, include: A slide (1) is set to move horizontally. Two side clamps (2) are set on the slide (1). The moving direction of the side clamps (2) is parallel to the horizontal plane and perpendicular to the sliding direction of the slide (1). The side clamps (2) are parallel to the sliding direction of the slide (1). The distance between the two side clamps (2) is adjustable. Both side plates (2) have rectangular countersunk holes (21) along their length on opposite sides. There are pressure blocks (3) at the same end inside the rectangular countersunk holes (21). The pressure blocks (3) are moved along the length of the rectangular countersunk holes (21). A vertical milling cutter (4) is provided between the two side clamping plates (2). The milling cutter (4) is located at the lower end of the spindle of a drive motor (5). The lower end of the milling cutter (4) is lower than the lower side of the rectangular countersunk hole (21).
2. The slitting apparatus for semiconductor device inspection according to claim 1, wherein The slide (1) is slidably mounted on a horizontal track on the top surface of a base. The slide (1) is manually pushed.
3. The slitting apparatus for semiconductor device inspection according to claim 2, wherein A cantilever is provided on the top of the base, and the position of the cantilever is higher than the top surface of the side clamp (2). The drive motor (5) is located on the cantilever.
4. The slitting apparatus for semiconductor device inspection according to claim 1, wherein The top surface of the slide table (1) is provided with a pair of parallel slide grooves (12), the slide grooves (12) are perpendicular to the sliding direction of the slide table (1), and the lower end of the side clamp (2) is provided with a slider (22), which slides in the slide groove (12).
5. The slitting apparatus for semiconductor device inspection according to claim 4, wherein Each side plate (2) has at least one slider (22) with a locking screw (6) for fixing the position of the slider (22) in the groove (12).
6. The slitting apparatus for semiconductor device inspection according to claim 1, wherein The upper end of the opposite side wall of the rectangular countersunk hole (21) and the pressure block (3) is a slope, and the slope is inclined towards the lower part of the middle of the rectangular countersunk hole (21).
7. The slitting apparatus for semiconductor device inspection according to claim 1 or 6, wherein The upper end of the side of the pressure block (3) that contacts the semiconductor device is provided with an inclined block, and the inclined surface of the inclined block is inclined towards the lower part of the middle of the rectangular countersunk hole (21).
8. The slitting apparatus for semiconductor device inspection according to claim 1, wherein The slider (22) is equipped with an adjusting screw (7) that is parallel to the moving direction of the pressure block (3). The adjusting screw (7) passes through the side wall of the rectangular countersunk hole (21).
9. The slitting apparatus for semiconductor device inspection according to claim 1, wherein Two side plates (2) are respectively connected to the two ends of a double-acting screw (8), and the threads at the two ends of the double-acting screw (8) are opposite.