A type of repair equipment

Abstract

This utility model provides a rework equipment, relating to the field of Mini LED rework technology, comprising: a frame on which a first Y-direction crossbeam, a second Y-direction crossbeam, and a first X-direction crossbeam are configured; a feeding end is located at one end of the frame near the first Y-direction crossbeam; a defect identification module, a packaging layer removal module, a die removal module, a soldering module, and a soldering module are configured on one side of the first X-direction crossbeam; a material carrier assembly is configured on the side of the first X-direction crossbeam away from the die removal module, and a chip mounting module is configured on the side away from the feeding end; a rework platform is movably configured on the frame along the X and Y directions to carry rework products and transport them to the working positions of each functional module; the packaging layer removal module can be selectively activated according to the packaging state of the rework product for removing the packaging layer of the packaged product. Thus, it has the advantage of being applicable to both post-reflow products without packaging layers and semi-finished / finished products with packaging layers.

Description

Technical Field

[0001] This utility model relates to the field of Mini LED repair technology, and in particular to a repair device. Background Technology

[0002] Mini LED, as a new type of display device, is widely used in high-precision display fields such as consumer electronics, automotive, and commercial displays. Its packaging forms mainly include two categories: one is the post-reflow product formed after reflow soldering (i.e., without a packaging layer), and the other is the encapsulated semi-finished / finished product (i.e., with a packaging layer).

[0003] During the manufacturing and testing of Mini LEDs, chips may become defective due to various reasons (such as missing chips, tilting, or poor soldering), requiring replacement using rework equipment. However, existing rework equipment typically suffers from poor adaptability to different packaging forms, specifically falling into two categories: one type of rework equipment is only suitable for products without a packaging layer after the reflow oven. While it can perform chip defect identification, die removal, soldering, component placement, and soldering, it is not applicable to pre-packaged semi-finished or finished products. The other type of rework equipment is specifically designed for reworking semi-finished or finished products with a packaging layer, but this type of equipment has a complex structure and poor versatility, often making it unsuitable for reworking products without a packaging layer after the reflow oven.

[0004] Therefore, a rework equipment that can be applied to both unencapsulated post-furnace products and encapsulated semi-finished / finished products needs to be designed. Utility Model Content

[0005] The purpose of this utility model is to provide a rework equipment that addresses the defects and deficiencies of the existing technology, thereby solving at least one of the aforementioned technical problems. It has the advantage of being applicable to both post-furnace products without encapsulation layers and semi-finished / finished products with encapsulation layers.

[0006] To achieve the above objectives, this utility model provides a rework equipment, comprising:

[0007] The frame is equipped with a first Y-direction crossbeam, a second Y-direction crossbeam, and a first X-direction crossbeam, and has a feed end at the end near the first Y-direction crossbeam;

[0008] A defect identification module, a packaging layer removal module, a die removal module, a soldering module, and a welding module are configured on one side of the first X-direction crossbeam;

[0009] The chip mounting module includes a material carrier assembly disposed on the side of the first X-direction crossbeam away from the die-removing module, and a material pick-up and mounting assembly disposed on the side away from the feed end.

[0010] The rework platform, which can be moved along the X and Y directions, is configured on the frame to carry rework products and transport them to the working positions of each functional module.

[0011] The encapsulation layer removal module can be selectively activated according to the encapsulation status of the returned product, and is used to remove the encapsulation layer of the encapsulated product.

[0012] Optionally, the material carrier assembly includes a material carrier turntable for carrying the crystal disk;

[0013] The material handling and mounting assembly includes:

[0014] A chip positioning camera is configured above the material carrier turntable for locating and identifying target chips;

[0015] The ejector assembly, located below the material carrier turntable, is used to lift the target chip from the die disk;

[0016] A good product recognition camera is configured on one side of the material-carrying turntable;

[0017] The placement head, movable along the Y direction on the second Y-direction crossbeam, includes a placement nozzle and a rotary drive assembly for driving the placement nozzle to rotate; it is used to pick up the required chip, send it to the good product recognition camera for quality inspection, and place the qualified chip onto the solder pad after soldering.

[0018] Optionally, the second Y-direction crossbeam is provided with a first linear module extending along the Y direction, and the mounting head is mounted on the slide of the first linear module via a Z-axis moving part;

[0019] The placement head also includes a placement fixing base, and the placement nozzle is rotatably mounted in the placement fixing base via a bearing;

[0020] The rotary drive assembly includes: a first drive motor mounted on the mounting base, a drive pulley connected to the first drive motor, a driven pulley sleeved around the periphery of the mounting nozzle, and a synchronous belt wound around the periphery of the drive pulley and the driven pulley.

[0021] Optionally, a waste bin is also provided on one side of the good product recognition camera, and a vertically arranged cleaning brush is also provided in the waste bin.

[0022] Optionally, the material loading assembly further includes:

[0023] A turntable fixing bracket is provided, on which a second drive motor is mounted to drive the material-carrying turntable to rotate.

[0024] A turntable XY moving module is configured on the frame and is used to drive the turntable fixed bracket to move along the X and Y directions;

[0025] The ejector pin assembly includes:

[0026] Adsorption head, used to adsorb crystal disks;

[0027] A push pin is disposed inside the adsorption head;

[0028] An adsorption lifting assembly, connected to the ejector pin, is used to drive the ejector pin upward to lift the target chip on the crystal disk.

[0029] Optionally, the rework platform includes:

[0030] The rework lifting frame has a synchronous belt for moving rework products on both sides of the flange, and a lifting component is installed in the middle. The positioning fixture for carrying the products after the furnace or the lighting positioning fixture for carrying the packaged products is installed on the lifting component.

[0031] A rework moving module, configured on the frame, is used to drive the rework lifting frame to move along the X and Y directions.

[0032] Optionally, the lifting assembly includes:

[0033] The lifting cylinder is mounted on the rework lift, and its piston rod is arranged in a horizontal direction.

[0034] A limiting cover plate is installed on the repair lifter, covering at least part of the piston rod, and has an inclined upward limiting slide hole on one side.

[0035] Several guide columns are vertically arranged on the repair frame and are provided with vertical guide holes;

[0036] A slide bar is movably disposed in the guide hole;

[0037] The lifting block is connected to the piston rod via a connecting post passing through the limiting sliding hole;

[0038] The lifting assembly plate is installed on the upper surface of the guide column and the lifting block, and is used to install the positioning fixture and the lighting positioning jig, and to move up and down under the drive of the lifting cylinder.

[0039] Optionally, the repair equipment also includes a second X-direction crossbeam installed on the first Y-direction crossbeam and the second Y-direction crossbeam;

[0040] The defect identification module includes: a defect identification bracket, a first lifting component installed on the first X-direction crossbeam for driving the defect identification bracket to move up and down, an identification and positioning module installed on the defect identification bracket, and a contact height measuring probe installed on the defect identification bracket via a second lifting component and located on one side of the identification and positioning module.

[0041] The encapsulation layer removal module includes: an encapsulation layer removal laser body mounted on the second X-direction crossbeam, an encapsulation layer removal laser head disposed on the encapsulation layer removal laser body and extending toward the first X-direction crossbeam, and an encapsulation layer removal air blowing component disposed on one side of the encapsulation layer removal laser head for blowing away encapsulation layer residue.

[0042] The die removal module includes: a die removal head, a third lifting component for driving the die removal head to move along the Z direction, and a pad air blowing component disposed on both sides of the die removal head for cleaning pad residues;

[0043] The soldering module includes: a soldering head mounted on the third lifting assembly via a fourth lifting assembly, and a solder paste tray disposed on one side of the soldering head;

[0044] The welding module includes a welding head mounted on the defect identification bracket.

[0045] Optionally, the rework equipment further includes a solder scraping mechanism disposed on the first X-direction crossbeam and on the same side as the soldering module.

[0046] Compared with the prior art, the advantages of this application are:

[0047] Because the rework equipment is equipped with a packaging layer removal module, and this module can be selectively activated according to the packaging status of the rework product, it can achieve compatible rework of semi-finished / finished products with packaging layers and post-furnace products without packaging layers. This overcomes the limitation of traditional rework equipment being only applicable to a single product form and significantly improves the equipment's versatility and rework adaptability.

[0048] In addition, this equipment centrally arranges the defect identification module, encapsulation layer removal module, die removal module, soldering module, and welding module on one side of the first X-direction crossbeam, and sets the chip placement module on the other side away from the die removal module. The material picking and placement assembly is arranged in a position away from the feeding end, forming a compact and smooth operation process, avoiding functional interference and repeated handling, and effectively reducing the size of the equipment. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0050] Figure 1 This is a schematic diagram of the structure of the repair equipment according to an embodiment of the present utility model;

[0051] Figure 2for Figure 1 A magnified view of a section at point A in the middle;

[0052] Figure 3 This is a structural schematic diagram of the repair equipment from another perspective in an embodiment of this utility model;

[0053] Figure 4 This is a top view of the repair equipment according to an embodiment of the present invention;

[0054] Figure 5 This is a schematic diagram of the assembly structure of the patch module and the second Y-direction crossbeam in an embodiment of the present invention;

[0055] Figure 6 This is a schematic diagram of the material loading assembly according to an embodiment of the present invention;

[0056] Figure 7 This is a schematic diagram of the material handling and mounting assembly according to an embodiment of the present invention;

[0057] Figure 8 This is a schematic diagram of the ejector pin assembly according to an embodiment of the present invention;

[0058] Figure 9 This is a schematic diagram of the structure of the good product identification camera and the waste bin in an embodiment of this utility model;

[0059] Figure 10 This is a schematic diagram of the rework platform according to an embodiment of the present utility model, wherein a positioning clamp is mounted on the lifting component;

[0060] Figure 11 This is a schematic diagram of the rework lifting frame according to an embodiment of the present utility model, wherein a lit positioning fixture is mounted on the lifting assembly;

[0061] Figure 12 This is an exploded view of the rework platform according to an embodiment of the present invention, which includes a positioning fixture and a lighting positioning jig;

[0062] Figure 13 This is a schematic diagram of the lifting assembly according to an embodiment of the present invention;

[0063] Figure 14 This is a schematic diagram of the defect identification module and welding module in an embodiment of the present invention;

[0064] Figure 15 This is a schematic diagram of the encapsulation layer removal module according to an embodiment of the present invention;

[0065] Figure 16 This is a schematic diagram of the structure of the die-off module and the solder-applying module in an embodiment of this utility model;

[0066] Figure 17 This is a schematic diagram of the tin scraping mechanism in an embodiment of the present invention.

[0067] Explanation of reference numerals in the attached figures

[0068] 100 - Returned equipment;

[0069] 1-Frame; 11-First Y-direction crossbeam; 12-Second Y-direction crossbeam; 13-First linear module; 14-First X-direction crossbeam; 15-Second X-direction crossbeam; a-Feed end;

[0070] 2-Defect identification module; 21-Defect identification bracket; 22-First lifting assembly; 23-Identification and positioning module; 24-Contact height measuring probe; 25-Second lifting assembly;

[0071] 3-Encapsulation layer removal module; 31-Encapsulation layer removal laser body; 32-Encapsulation layer removal laser head; 33-Encapsulation layer removal air blowing component;

[0072] 4-De-die module; 41-De-die head; 42-Third lifting assembly; 43-Pad blowing component;

[0073] 5 - Soldering module; 51 - Soldering tip; 52 - Fourth lifting assembly;

[0074] 6-Surface Mount Module; 61-Material Carrier Assembly; 611-Material Carrier Turntable; 612-Turntable Mounting Bracket; 613-Second Drive Motor; 614-Turntable XY Movement Module; 62-Material Pickup and Placement Assembly; 621-Chip Positioning Camera; 622-Camera Mounting Bracket; 63-Ejector Pin Assembly; 631-Suction Head; 632-Ejector Pin; 633-Suction Lifting Assembly; 64-Good Product Recognition Camera; 65-Waste Bin; 66-Cleaning Brush; 67-Placement Head; 671-Placement Nozzle; 672-Placement Mounting Base; 673-Bearing; 68-Rotary Drive Assembly; 681-First Drive Motor; 682-Drive Pulley; 683-Driven Pulley; 684-Synchronous Belt; 69-Z-Axis Moving Component;

[0075] 7-Welding module; 71-Welding head;

[0076] 8-Repair platform; 81-Repair lifting frame; 811-Repair product moving synchronous belt; 82-Lifting assembly; 821-Lifting cylinder; 822-Limit cover plate; o1-Limit sliding hole; 823-Guide column; o3-Guide hole; 824-Slide rod; 825-Lifting block; 826-Connecting column; 827-Lifting assembly plate; 83-Positioning fixture; 831-Lower pressure frame; 832-Upper top seat; 84-Illumination positioning fixture; 841-Illumination interface; 85-Repair moving module;

[0077] 9-Soldering mechanism; 91-Solder pool; 92-Rotating assembly; 93-Push rod motor;

[0078] 200 - Post-furnace products;

[0079] 300-Crystal disk. Detailed Implementation

[0080] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0081] It should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," "back," "side," and "circumferential" used in this utility model to indicate the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used to distinguish multiple parts or structures with the same or similar structures, and do not indicate any special limitation on the arrangement order or connection relationship.

[0082] Please refer to Figures 1 to 17 This utility model embodiment provides a rework equipment 100, applicable to Mini LED products with different packaging types. The rework equipment 100 includes: a frame 1, a defect identification module 2, a packaging layer removal module 3, a die removal module 4, a soldering module 5, a chip mounting module 6, a soldering module 7, and a rework platform 8.

[0083] The frame 1 serves as the overall support structure for the rework equipment 100, providing installation and operating space for each functional module. The frame 1 is equipped with a first Y-direction crossbeam 11, a second Y-direction crossbeam 12, and a first X-direction crossbeam 14. Specifically, the first Y-direction crossbeam 11 and the second Y-direction crossbeam 12 are gantry frames respectively located on both sides of the frame 1; the first X-direction crossbeam 14 laterally connects the two Y-direction crossbeams. Of course, in other embodiments, the structures of the first Y-direction crossbeam 11, the second Y-direction crossbeam 12, and the first X-direction crossbeam 14 can be configured in other ways, and no specific limitations are imposed here.

[0084] In this embodiment, please refer to Figure 1 The extension direction of the first X-direction crossbeam 14 is defined as the X-direction, the extension direction of the first Y-direction crossbeam 11 is defined as the Y-direction, and the direction perpendicular to the XY plane is defined as the Z-direction. A feed end a is provided near one end of the first Y-direction crossbeam 11 for feeding the product to be repaired into the equipment.

[0085] The defect identification module 2 is used to identify defects on the rework product; the package layer removal module 3 is used to remove the package layer from the rework product; the die removal module 4 is used to remove defective dies from the rework product; the soldering module 5 is used to apply solder paste to the pads of the rework product; and the soldering module 7 is used to solder the mounted new chip onto the pads. In this embodiment, the defect identification module 2, the package layer removal module 3, the die removal module 4, the soldering module 5, and the soldering module 7 are all configured on one side of the first X-direction crossbeam 14.

[0086] The chip mounting module 6 includes a material carrier assembly 61 and a pick-and-place assembly 62. The material carrier assembly 61 is located on the side of the first X-direction crossbeam 14 away from the die-removal module 4 and is used to hold new chips. The pick-and-place assembly 62 is located on the side away from the feed end a and is used to pick up new chips from the material carrier assembly 61 and mount them onto the solder pads after soldering.

[0087] The rework platform 8 is movable along the X and Y directions on the rack 1 to carry rework products and transport them to the working positions of each functional module. Specifically, the rework platform 8 can receive rework products from the feeding end a and transport them to the working positions of the defect identification module 2, the encapsulation layer removal module 3, the die removal module 4, the soldering module 5, the chip mounting module 6, and the soldering module 7 to facilitate the operation of each module.

[0088] The encapsulation layer removal module 3 can be selectively activated based on the encapsulation status of the rework product, and is used to remove the encapsulation layer of the encapsulated product. That is, when the rework object is a post-rework product 200 without an encapsulation layer, this module is not activated; when the rework object is a semi-finished product or finished product containing glue, the encapsulation layer removal module 3 will automatically start and perform the glue removal operation.

[0089] Because the rework equipment 100 is equipped with a packaging layer removal module 3, and this module can be selectively activated according to the packaging status of the rework product, it can achieve compatible rework of semi-finished / finished products with packaging layers and post-furnace products 200 without packaging layers. This overcomes the limitation that the traditional rework equipment 100 is only applicable to a single product form, and significantly improves the equipment's versatility and rework adaptability.

[0090] In addition, the defect identification module 2, the encapsulation layer removal module 3, the die removal module 4, the soldering module 5, and the welding module 7 are concentrated on one side of the first X-direction crossbeam 14. The chip placement module 6 is set on the other side away from the die removal module 4, and the material picking and placement assembly 62 is arranged at a position away from the feeding end a, forming a compact and smooth operation process, avoiding functional interference and repeated handling, and effectively reducing the size of the equipment.

[0091] The conventional pick-and-place assembly 62 includes a pick-up head for transferring new chips from the carrier assembly 61 to a transfer station for quality assessment, and a placement head 67 for placing chips that have passed quality assessment on the transfer station onto rework products. However, this structure is not only complex but also requires multiple steps, resulting in a high time consumption. To overcome this drawback, please refer to... Figures 5 to 9 In this embodiment, the material carrier assembly 61 includes a material carrier turntable 611 that carries the die disk 300. Specifically, the material pick-and-place assembly 62 includes: a chip positioning camera 621, a pin assembly 63, a good product recognition camera 64, and a placement head 67.

[0092] A chip positioning camera 621 is configured above the material transfer table 611 for locating and identifying target chips. Specifically, the chip positioning camera 621 is mounted on the second Y-axis crossbeam 12 via a camera mounting bracket 622. Understandably, the chip positioning camera 621 can determine a replaceable chip matching the target defect point based on the defect location information provided by the defect identification module 2.

[0093] The ejector assembly 63 is positioned below the material carrier turntable 611 and is used to lift the target chip from the die disk 300. Specifically, it can lift the identified target chip from below the die disk 300 upwards, causing it to detach from the die disk 300 for easier subsequent pick-up.

[0094] The good product recognition camera 64 is mounted on the frame 1 and located on one side of the material carrier turntable 611. It is used to perform image recognition and quality inspection on the chips that have been picked up, and to identify whether they meet the requirements.

[0095] The placement head 67 is movably mounted on the second Y-axis crossbeam 12. It includes a placement nozzle 671 and a rotary drive assembly 68. The rotary drive assembly 68 drives the placement nozzle 671 to rotate, cooperating with the product recognition camera 64 to achieve multi-angle quality inspection. The placement nozzle 671 picks up the required chip and delivers it to the product recognition camera 64 for quality inspection. If the inspection is successful, the chip is then placed onto the solder pads after soldering.

[0096] Because this technical solution eliminates the pick-up head and transfer station, the placement head 67 simultaneously performs the functions of chip pick-up, identification, and placement, greatly simplifying the equipment structure and reducing the number of chip transfer steps between different workstations. This not only reduces mechanical complexity but also improves rework efficiency.

[0097] To ensure stable rotation of the placement nozzle 671 during chip quality assessment, optionally in this embodiment, a first linear module 13 extending along the Y direction is provided on the second Y-axis crossbeam 12, and the placement head 67 is mounted on the slide of the first linear module 13 via a Z-axis moving member 69. The placement head 67 also includes a placement fixing seat 672, and the placement nozzle 671 is rotatably mounted in the placement fixing seat 672 via a bearing 673. The rotary drive assembly 68 includes: a first drive motor 681, a driving pulley 682, a driven pulley 683, and a synchronous belt 684.

[0098] The first drive motor 681 is mounted on the mounting bracket 672. The drive pulley 682 is connected to the first drive motor 681. Specifically, in this embodiment, the drive pulley 682 is sleeved on the output shaft of the first drive motor 681. The driven pulley 683 is sleeved on the outer circumference of the mounting nozzle 671. A synchronous belt 684 is wound around the outer circumference of the drive pulley 682 and the driven pulley 683, thereby driving the rotation of the mounting nozzle 671. Specifically, in this embodiment, the drive pulley 682 and the driven pulley 683 are toothed synchronous pulleys, and the driven pulley 683 is a toothed synchronous belt that meshes with the toothed synchronous pulleys to further improve rotational stability.

[0099] Alternatively, please refer to Figure 5 and Figure 9 In this embodiment, a waste bin 65 is also provided on one side of the good product recognition camera 64, and a vertically arranged cleaning brush 66 is also provided in the waste bin 65. In this way, if the good product recognition camera 64 fails the quality inspection, it can be transferred to the waste bin 65 to avoid interfering with subsequent steps, and the cleaning brush 66 in the waste bin 65 can clean the mounting nozzle 671 to ensure its adsorption capacity.

[0100] Alternatively, please refer to Figure 6 In this embodiment, the material carrier assembly 61 further includes a turntable fixing bracket 612 and a turntable XY moving module 614. A second drive motor 613 for driving the rotation of the material carrier turntable 611 is mounted on the turntable fixing bracket 612. The turntable XY moving module 614 is configured on the frame 1 and is used to drive the turntable fixing bracket 612 to move along the X and Y directions. Specifically, in this embodiment, three wafer disks 300 are arranged circumferentially along the material carrier turntable 611. The second drive motor 613 can drive the material carrier turntable 611 to rotate, thereby selecting different wafer disks 300 on the material carrier turntable 611. The turntable XY moving module 614 drives the turntable fixing bracket 612 to move along the X and Y directions, thereby causing chips at different positions on the wafer disks 300 to be identified by the chip positioning camera 621 and subsequently moved above the ejector pin assembly 63.

[0101] Alternatively, please refer to Figure 7In this embodiment, the ejector assembly 63 includes: an adsorption head 631, an ejector pin 632, and an adsorption lifting assembly 633. The adsorption head 631 is used to adsorb the crystal disk 300. Specifically, the adsorption head 631 is used to adsorb the bottom surface of the crystal disk 300 by applying negative pressure. The ejector pin 632 is disposed within the adsorption head 631. The adsorption lifting assembly 633 is connected to the ejector pin 632 and is used to drive the ejector pin 632 to lift the target chip on the crystal disk 300 upwards. Specifically, the adsorption head 631 adsorbs and fixes the film layer of the crystal disk 300, and the ejector pin 632 lifts the chip off the film layer of the crystal disk. Optionally, the adsorption lifting assembly 633 can be driven by a drive motor to drive the ejector pin 632 to move up and down via a lead screw, or driven by a piston rod of a cylinder; the specific method is not limited.

[0102] To standardize the return of Mini LED products with different package types, please refer to the following options: Figures 10 to 13 In this embodiment, the rework platform 8 includes a rework lifting frame 81 and a rework moving module 85.

[0103] The rework lifter 81 has rework product moving synchronous belts 811 on both sides of its flanges, which allows rework products to be received from the feed end a and moved to a fixed position. A lifting assembly 82 is installed in the middle of the rework lifter 81. The lifting assembly 82 is equipped with a positioning fixture 83 for carrying the furnace-backed product 200 or a lighting positioning fixture 84 for carrying the packaged product; thus, it can accommodate rework products of different types of Mini LED packages.

[0104] Specifically, the lighting positioning fixture 84 engages with the insertion slot of the packaged product (not shown in the figure) through its lighting interface 841, thereby fixing and positioning the packaged product and energizing the LED chip of the product.

[0105] The positioning fixture 83 fixes the furnace-bearing product 200 by clamping the lower pressure frame 831 and the upper top seat 832.

[0106] The rework moving module 85 is configured on the frame 1 and is used to drive the rework lifting frame 81 to move along the X and Y directions. This allows the reworked products to be transported to the working positions of each functional module.

[0107] Alternatively, please refer to Figure 12 and Figure 13 In this embodiment, the lifting assembly 82 includes: a lifting cylinder 821, a limiting cover plate 822, four guide pillars 823, a slide bar 824, a lifting block 825, and a lifting assembly plate 827.

[0108] The lifting cylinder 821 is mounted on the rework lifting frame 81, and its piston rod is arranged in the horizontal direction.

[0109] The limiting cover plate 822 is installed on the repair lifting frame 81, covering at least part of the piston rod, and has an inclined upward limiting slide hole o1 on one side.

[0110] Four guide posts 823 are vertically arranged on the rework frame 81 and are provided with vertical guide holes o3. Specifically, in this embodiment, the four guide posts 823 are arranged in a quadrilateral pattern on both sides of the piston rod. Of course, in other embodiments, the number and arrangement of the guide posts 823 may be different, and no specific limitation is made here.

[0111] The slide bar 824 is movable up and down in the guide hole o3.

[0112] The lifting block 825 is connected to the piston rod through the connecting post 826 that passes through the limiting sliding hole o1.

[0113] The lifting assembly plate 827 is installed on the upper surface of the guide column 823 and the lifting block 825, and is used to install the positioning fixture 83 and the lighting positioning fixture 84, and to move up and down under the drive of the lifting cylinder 821.

[0114] Thus, the lifting cylinder 821 pushes the piston rod to move, the connecting column 826 moves upward along the limiting sliding hole o1, thereby driving the lifting block 825 to move, and the lifting assembly plate 827 moves up and down under the limiting action of the guide column 823 and the sliding rod 824, thereby driving the positioning fixture 83 and the lighting positioning fixture 84 on it to move up and down.

[0115] Alternatively, please refer to Figure 2 , Figure 4 , Figures 14 to 16 In this embodiment, the repair equipment 100 further includes a second X-direction beam 15 installed on the first Y-direction beam 11 and the second Y-direction beam 12.

[0116] The defect identification module 2 includes: a defect identification bracket 21, a first lifting component 22, an identification and positioning module 23, and a contact height measuring probe 24.

[0117] The first lifting component 22 is mounted on the first X-direction crossbeam 14 and is used to drive the defect identification bracket 21 to move up and down. Specifically, the first lifting component 22 is a drive motor, which drives the defect identification bracket 21 to move up and down through a lead screw and nut pair. Of course, the first lifting component 22 can also be a cylinder, and no specific limitation is made here.

[0118] The identification and positioning module 23 is mounted on the defect identification bracket 21 and moves with the defect identification bracket 21, thereby achieving height adjustment. Specifically, the identification and positioning module 23 includes a camera and a lens.

[0119] The contact height probe 24 is mounted on the defect identification bracket 21 via the second lifting assembly 25 and is located on one side of the identification and positioning module 23. Understandably, the second lifting assembly 25 is used for high-precision height adjustment, thereby enabling height measurement of defective points.

[0120] The encapsulation layer removal module 3 includes: an encapsulation layer removal laser body 31, an encapsulation layer removal laser head 32, and an encapsulation layer removal air blowing component 33.

[0121] The encapsulation layer removal laser body 31 is mounted on the second X-direction crossbeam 15. The encapsulation layer removal laser head 32 is disposed on the encapsulation layer removal laser body 31 and extends toward the first X-direction crossbeam 14. The encapsulation layer removal blowing element 33 is disposed on one side of the encapsulation layer removal laser head 32 and is used to blow away the encapsulation layer residue.

[0122] The die removal module 4 includes: a die removal head 41, a third lifting assembly 42, and a pad blowing component 43.

[0123] The third lifting assembly 42 is used to drive the die remover 41 to move along the Z-axis. In this embodiment, the third lifting assembly 42 is a drive motor and a lead screw and nut assembly. The pad air blowing component 43 is disposed on both sides of the die remover 41 and is used to clean the pad residue.

[0124] The soldering module 5 includes: a soldering tip 51 and a solder paste tray (not shown in the figure).

[0125] The solder tip 51 is mounted on the third lifting assembly 42 via the fourth lifting assembly 52. ​​Specifically, in this embodiment, the fourth lifting assembly 52 is a guide cylinder. The solder paste tray is positioned on one side of the solder tip 51 to facilitate solder application.

[0126] The welding module 7 includes a welding head 71 mounted on the defect identification bracket 21.

[0127] Alternatively, please refer to Figure 17 In this embodiment, the rework equipment 100 further includes a solder scraping mechanism 9 disposed on the first X-direction crossbeam 14 and on the same side as the soldering module 7. Specifically, the solder scraping mechanism 9 includes a solder pool 91, a rotating assembly 92 for driving the solder pool 91 to rotate, and a push rod motor 93 for driving the solder pool 91 to move along the Y direction.

[0128] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the substance of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A rework apparatus suitable for different package types of Mini LED products, characterized in that, include: The frame is equipped with a first Y-direction crossbeam, a second Y-direction crossbeam, and a first X-direction crossbeam, and has a feed end at the end near the first Y-direction crossbeam; A defect identification module, a packaging layer removal module, a die removal module, a soldering module, and a welding module are configured on one side of the first X-direction crossbeam; The chip mounting module includes a material carrier assembly disposed on the side of the first X-direction crossbeam away from the die-removing module, and a material pick-up and mounting assembly disposed on the side away from the feed end. The rework platform, which can be moved along the X and Y directions, is configured on the frame to carry rework products and transport them to the working positions of each functional module. The encapsulation layer removal module can be selectively activated according to the encapsulation status of the returned product, and is used to remove the encapsulation layer of the encapsulated product.

2. The rework apparatus of claim 1, wherein The material carrier assembly includes a material carrier turntable that carries the crystal disk; The material handling and mounting assembly includes: A chip positioning camera is configured above the material carrier turntable for locating and identifying target chips; The ejector assembly, located below the material carrier turntable, is used to lift the target chip from the die disk; A good product recognition camera is configured on one side of the material-carrying turntable; The placement head, movable along the Y direction on the second Y-direction crossbeam, includes a placement nozzle and a rotary drive assembly for driving the placement nozzle to rotate; it is used to pick up the required chip, send it to the good product recognition camera for quality inspection, and place the qualified chip onto the solder pad after soldering.

3. The rework apparatus of claim 2, wherein The second Y-axis crossbeam is provided with a first linear module extending along the Y-axis, and the mounting head is mounted on the slide of the first linear module via a Z-axis moving part; The placement head also includes a placement fixing base, and the placement nozzle is rotatably mounted in the placement fixing base via a bearing; The rotary drive assembly includes: a first drive motor mounted on the mounting base, a drive pulley connected to the first drive motor, a driven pulley sleeved around the periphery of the mounting nozzle, and a synchronous belt wound around the periphery of the drive pulley and the driven pulley.

4. The rework apparatus of claim 3, wherein The good product recognition camera is also equipped with a waste bin on one side, and the waste bin is also equipped with vertically arranged cleaning brushes.

5. The rework equipment as described in claim 4, characterized in that, The material loading assembly further includes: A turntable fixing bracket is provided, on which a second drive motor is mounted to drive the material-carrying turntable to rotate. A turntable XY moving module is configured on the frame and is used to drive the turntable fixed bracket to move along the X and Y directions; The ejector pin assembly includes: Adsorption head, used to adsorb crystal disks; A push pin is disposed inside the adsorption head; An adsorption lifting assembly, connected to the ejector pin, is used to drive the ejector pin upward to lift the target chip on the crystal disk.

6. The rework apparatus of claim 1, wherein The repair platform includes: The rework lifting frame has a synchronous belt for moving rework products on both sides of the flange, and a lifting component is installed in the middle. The positioning fixture for carrying the products after the furnace or the lighting positioning fixture for carrying the packaged products is installed on the lifting component. A rework moving module, configured on the frame, is used to drive the rework lifting frame to move along the X and Y directions.

7. The rework apparatus of claim 6, wherein The lifting assembly includes: The lifting cylinder is mounted on the rework lift, and its piston rod is arranged in a horizontal direction. A limiting cover plate is installed on the repair lifter, covering at least part of the piston rod, and has an inclined upward limiting slide hole on one side. Several guide columns are vertically arranged on the repair frame and are provided with vertical guide holes; A slide bar is movably disposed in the guide hole; The lifting block is connected to the piston rod via a connecting post passing through the limiting sliding hole; The lifting assembly plate is installed on the upper surface of the guide column and the lifting block, and is used to install the positioning fixture and the lighting positioning jig, and to move up and down under the drive of the lifting cylinder.

8. The rework apparatus of claim 1, wherein, It also includes a second X-direction crossbeam installed on the first Y-direction crossbeam and the second Y-direction crossbeam; The defect identification module includes: a defect identification bracket, a first lifting component installed on the first X-direction crossbeam for driving the defect identification bracket to move up and down, an identification and positioning module installed on the defect identification bracket, and a contact height measuring probe installed on the defect identification bracket via a second lifting component and located on one side of the identification and positioning module. The encapsulation layer removal module includes: an encapsulation layer removal laser body mounted on the second X-direction crossbeam, an encapsulation layer removal laser head disposed on the encapsulation layer removal laser body and extending toward the first X-direction crossbeam, and an encapsulation layer removal air blowing component disposed on one side of the encapsulation layer removal laser head for blowing away encapsulation layer residue. The die removal module includes: a die removal head, a third lifting component for driving the die removal head to move along the Z direction, and a pad air blowing component disposed on both sides of the die removal head for cleaning pad residues; The soldering module includes: a soldering head mounted on the third lifting assembly via a fourth lifting assembly, and a solder paste tray disposed on one side of the soldering head; The welding module includes a welding head mounted on the defect identification bracket.

9. The rework apparatus of claim 1, wherein, Also includes: A solder scraping mechanism is configured on the first X-direction crossbeam and on the same side as the welding module.

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