A flying material preventing semiconductor device bucket type material distribution mechanism

Abstract

This utility model discloses a semiconductor device feeder mechanism with a feed barrel design to prevent chip spillage. It relates to the field of semiconductor device feeding and includes a feeding device body and multiple feeding barrels embedded within the feeding device body. The feeding device body has a feed inlet at its top and a lower channel body fixed above the feeding barrels within it. An upper channel body, located above the lower channel body, is mounted to the feeding device body via a power mechanism. Both ends of the upper channel body have upper flow channels corresponding to the feed inlet. This utility model employs a split flow channel design, consisting of an upper channel body and a lower channel body. The increased bottom area of ​​the lower flow channel allows it to completely cover the feed barrel. Simultaneously, the height of the feeding barrels can be adjusted via a lifting base, allowing manual adjustment of the gap between the feeding barrel and the lower flow channel. This ensures that even if chips are jolted by airflow disturbances, they will not jump out of the barrel.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device material distribution, specifically a semiconductor device material barrel-type material distribution mechanism to prevent flying materials. Background Technology

[0002] In the chip FT sorting test, NG products after visual inspection or electrical testing need to be classified according to the defect type; the nozzle blows the chips adsorbed by the nozzle into the material bin by switching between positive and negative pressure.

[0003] Patent application number CN202321280980.6 discloses a semiconductor device material barrel type dispensing mechanism, including a base with an inlet, a receiving unit detachably provided on the base, the receiving unit including a holding tank, the holding tank having a compartment for holding at least two dispensing barrels, and a flow channel switching unit on the base for guiding semiconductor devices at the inlet to the corresponding dispensing barrels. The flow channel switching unit includes a slide bracket, a drive motor, a bidirectional transmission plate, a unidirectional connecting plate, and flow channel components. The slide bracket is mounted on the base, the drive motor is mounted on the slide bracket, the output shaft of the drive motor is rotatably connected to one end of the bidirectional transmission plate through a connecting shaft, and the axis of the connecting shaft is eccentrically set with the axis of the output shaft of the drive motor. The other end of the bidirectional transmission plate is connected to the flow channel components, the flow channel components have at least two guiding channels, the unidirectional connecting plate is slidably connected to the slide bracket, and the unidirectional connecting plate is also slidably connected to the bidirectional transmission plate.

[0004] The aforementioned technical solution features an open top for the feed hopper, with a significant gap between the hopper and the flow channel. When testing small-sized chips (less than 2×2mm) on the machine, due to the product's light weight and low inertia, the large flow rate of compressed air from the nozzle causes the chip to be affected by gas turbulence after entering the feed hopper along the flow channel, resulting in it flying out of the hopper opening. Existing technologies mainly mitigate this problem by reducing the blowing airflow or adding exhaust vents. However, the former may result in the chip not being blown off the nozzle during actual production, while the latter requires consideration of product size; the diameter of the exhaust vent must be smaller than the chip size. Therefore, when the chip size is very small, the exhaust effect of the vent is limited, and turbulence can still cause the chip to fly out. Utility Model Content

[0005] Based on this, the purpose of this utility model is to provide a semiconductor device material barrel-type dispensing mechanism to prevent flying materials, so as to solve the problem that the chip on the suction nozzle may not be blown off. However, the latter needs to take into account the product size, and the diameter of the exhaust vent must be smaller than the chip size. Therefore, when the chip size is very small, the exhaust effect of the vent is limited, and the turbulence will still cause the chip to fly off.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor device material barrel-type dispensing mechanism for preventing flying materials, comprising a dispensing equipment body and multiple dispensing cylinders embedded in the dispensing equipment body. The top of the dispensing equipment body is provided with a feeding hole, and a lower channel body located above the dispensing cylinders is fixed in the dispensing equipment body. The dispensing equipment body is equipped with an upper channel body located above the lower channel body through a power mechanism. Both ends of the upper channel body are provided with upper flow channels corresponding to the feeding holes.

[0007] The present invention is further configured such that the two ends of the lower channel body are provided with lower flow channels corresponding to multiple material distribution cylinders, and the top of the lower flow channels is provided with flared inlet input ends corresponding to multiple upper flow channels.

[0008] The present invention is further configured such that both ends of the upper channel body are fixed with upper channel side plates for sealing the upper flow channel, and both ends of the lower channel body are fixed with lower channel side plates for sealing the upper flow channel.

[0009] The present invention is further configured such that the power mechanism includes a motor installed in the main body of the material distribution equipment and a slider slidably disposed on the top of the main body of the material distribution equipment and connected to the upper channel body.

[0010] The present invention is further configured such that the motor drives the slider to move through a coupling, and a slide table support is installed on the main body of the material distribution equipment.

[0011] The present invention is further configured such that sensors for controlling the motor are symmetrically installed on the top of the main body of the material distribution equipment, and the two sensors are respectively arranged on both sides of the feed hole.

[0012] The present invention is further configured such that the top of the slider is provided with a plurality of guide rails mounted perpendicularly to each other, and a bidirectional transmission plate is installed on one side of the slide bracket.

[0013] The present invention is further configured such that a lifting base is installed at the bottom of the plurality of distributing cylinders, the bottom of the lifting base is fixed to the bottom wall of the main body of the distributing equipment, and a hydraulic lifting platform connected to the distributing cylinder is installed in the lifting base. The lifting platform consists of a cylinder embedded in the lifting base and a lifting plate connected to the bottom of the distributing cylinder.

[0014] In summary, the present invention has the following advantages: The present invention features a split-channel design, consisting of an upper channel body and a lower channel body. The upper and lower channels on either side are enclosed by upper and lower channel side plates, respectively. The lower channel body is fixed, while the upper channel body is movable and driven by a motor coupling and a slider. The increased bottom area of ​​the lower channel allows it to completely cover the material barrel. Simultaneously, the height of the dispensing cylinder is adjusted via a lifting base, allowing manual adjustment of the gap between the dispensing cylinder and the lower channel. This ensures that even if the chip is jolted up by airflow disturbance, it will not jump out of the barrel but will instead return to the corresponding material barrel along the channel.

[0015] The four lower channels on the main body of the lower channel correspond to four material distribution bins. The top of the lower channel is a flared inlet, which ensures that when the upper channel moves and the upper channel switches positions, the output port of the upper channel always moves within the range of its corresponding lower channel input port (i.e., the rotation trajectory is always within the range of the lower channel input port). This prevents classification errors during the switching process. In addition, the flared design can reduce the size of the output channel, thereby increasing the strength of the parts, i.e., the cross-sectional area is smaller at the top and larger at the bottom. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0018] Figure 3 This is a schematic diagram of the main structure of the upper channel of this utility model;

[0019] Figure 4 This is a schematic diagram of the disassembled structure of the lower channel body of this utility model.

[0020] In the diagram: 1. Main body of the material distribution equipment; 2. Sensor; 3. Slide table support; 4. Coupling; 5. Drive motor; 6. Material distribution cylinder; 7. Lifting base; 8. Lower channel side plate; 9. Upper channel side plate; 10. Slider; 11. Lower channel main body; 12. Upper channel main body; 13. Feed hole; 14. Upper flow channel; 15. Lower flow channel; 16. Horn mouth input end. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0022] A semiconductor device feeder-type dispensing mechanism to prevent flying materials, such as Figure 1-4As shown, the device includes a main body 1 for distributing materials and multiple distributing cylinders 6 embedded in the main body 1. The top of the main body 1 is provided with a feed hole 13, and a lower channel body 11 located above the distributing cylinders 6 is fixed in the main body 1. The main body 1 is equipped with an upper channel body 12 located above the lower channel body 11 via a power mechanism. Both ends of the upper channel body 12 are provided with upper flow channels 14 corresponding to the feed holes 13. The lower channel body 11 has lower flow channels 15 at both ends, corresponding to multiple distribution cylinders 6. The top of each lower flow channel 15 has a flared inlet 16 corresponding to multiple upper flow channels 14. Both ends of the upper channel body 12 are fixed with upper channel side plates 9 for sealing the upper flow channels 14. Both ends of the lower channel body 11 are fixed with lower channel side plates 8 for sealing the upper flow channels 14. The power mechanism includes a motor installed in the distribution equipment body 1 and a slider 10 slidably disposed on the top of the distribution equipment body 1 and connected to the upper channel body 12. Through the split-channel design, the flow channels are divided into... The upper channel body 12 and the lower channel body 11 are enclosed by upper channel side plates 9 and lower channel side plates 8 on both sides of the upper flow channel 14 and lower flow channel 15, respectively. The lower channel body 11 is fixed, while the upper channel body 12 is movable and driven by the motor coupling 4 and the slider 10. The bottom area of ​​the lower flow channel 15 is increased so that it can completely cover the material barrel. At the same time, the height of the dispensing cylinder 6 can be adjusted by the lifting base 7, so that the gap between the dispensing cylinder and the lower flow channel can be manually adjusted. This ensures that even if the chip jumps up due to airflow disturbance, it will not jump out of the barrel and can still return to the corresponding material barrel along the flow channel. Furthermore, the motor drives the slider 10 to move via a coupling. A slide support 3 is installed on the main body 1 of the material distribution equipment. Sensors 2 for controlling the motor are symmetrically installed on the top of the main body 1 of the material distribution equipment. Two sensors 2 are respectively set on both sides of the feed hole 13. Multiple guide rails are installed perpendicularly to each other on the top of the slider 10. A two-way transmission plate is installed on one side of the slide support 3. Lifting bases 7 are installed at the bottom of multiple material distribution cylinders 6. The bottom of the lifting base is fixed to the bottom wall of the main body 1 of the material distribution equipment, and a hydraulic lifting platform connected to the material distribution cylinders 6 is installed in the lifting base. The lifting platform is embedded. The cylinders installed in the lifting base and the lifting plate connected to the bottom of the distributing cylinder 6, the four lower channels 15 on the main body of the layer channel correspond to the four distributing cylinders. The top of the lower channel 15 is the horn-mouth input end 16, so that when the upper channel main body 12 moves and the upper channel 14 switches positions, the output port of the upper channel 14 always moves within the range of its corresponding lower channel input port (that is, the rotation trajectory is always within the range of the lower channel input port), and there will be no classification error during the switching process. In addition, the horn-mouth design can reduce the size of the output channel, thereby increasing the strength of the parts, that is, the cross-sectional area is smaller at the top and larger at the bottom.The working principle of this utility model is as follows: A split-channel design is used, consisting of an upper channel body 12 and a lower channel body 11. The upper channel 14 and lower channel 15 on both sides are enclosed by upper channel side plates 9 and lower channel side plates 8, respectively. The lower channel body 11 is fixed, while the upper channel body 12 is movable and driven by a motor coupling 4 and a slider 10. The bottom area of ​​the lower channel 15 is increased, allowing it to completely cover the material barrel. Simultaneously, the height of the dispensing cylinder 6 is adjusted by the lifting base 7, allowing manual adjustment of the gap between the dispensing cylinder and the lower channel. This ensures that even if the chip jumps due to airflow disturbance, it will not jump out of the barrel but will still return to the corresponding material barrel along the channel. The four lower channels 15 on the lower channel body 11 correspond to four dispensing cylinders. The top of the lower channel 15 is a flared inlet input 16, allowing the upper channel body 12 to move and cause the upper channel 14 to cut... When changing positions, the output port of the upper flow channel 14 always moves within the range of its corresponding lower flow channel input port (i.e., the rotation trajectory is always within the range of the lower flow channel input port), so there will be no classification error during the switching process. In addition, the flared mouth design can reduce the size of the output flow channel, thereby increasing the strength of the parts, i.e., the cross-sectional area is smaller at the top and larger at the bottom. A bidirectional transmission plate is installed on the coupling 4 at the top of the motor, and the bidirectional transmission plate is used to drive the upper channel body 12 to move. When the defective product moves to the feed hole 13, the sensor 2 receives the signal, and the drive motor 5 drives the bidirectional transmission plate to move through the eccentric shaft on the coupling 4. The bidirectional transmission plate drives the upper channel body 12 to move, thereby switching the flow channel. The bidirectional transmission plate can achieve movement in both the X and Y directions through two sets of four mutually perpendicular guide rail rods. This movement method has been disclosed in the prior art and is not described in detail here.

[0023] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A flying material preventing semiconductor device cartridge type material distribution mechanism comprising a material distribution device main body (1) and a plurality of material distribution cartridges (6) which are embedded in the material distribution device main body (1), characterized in that: The top of the main body (1) of the material distribution equipment is provided with a feed hole (13), and a lower channel body (11) located above the material distribution cylinder (6) is fixed in the main body (1). The main body (1) of the material distribution equipment is equipped with an upper channel body (12) located above the lower channel body (11) through a power mechanism. Both ends of the upper channel body (12) are provided with upper flow channels (14) corresponding to the feed hole (13).

2. The anti-dusting semiconductor device tray-type distributing mechanism according to claim 1, characterized by: The lower channel body (11) has a lower flow channel (15) at both ends, which are respectively corresponding to a plurality of material distribution cylinders (6), and the top of the lower flow channel (15) is provided with a horn-shaped input end (16) corresponding to a plurality of upper flow channels (14).

3. A material flight preventing semiconductor device bucket-type material distributing mechanism according to claim 2, characterized in that: Both ends of the upper channel body (12) are fixed with upper channel side plates (9) for sealing the upper flow channel (14), and both ends of the lower channel body (11) are fixed with lower channel side plates (8) for sealing the upper flow channel (14).

4. The anti-dusting semiconductor device tray-type distributing mechanism according to claim 1, characterized by: The power mechanism includes a motor installed in the main body (1) of the material distribution equipment and a slider (10) that is slidably disposed on the top of the main body (1) of the material distribution equipment and connected to the upper channel body (12).

5. A material flight preventing semiconductor device bucket-type material distributing mechanism according to claim 4, characterized in that: The motor drives the slider (10) to move through the coupling, and the main body (1) of the material distribution equipment is equipped with a slide table bracket (3).

6. The anti-dusting semiconductor device tray-type dispensing mechanism according to claim 1, characterized by: The top of the main body (1) of the material distribution equipment is symmetrically equipped with sensors (2) for controlling the motor, and the two sensors (2) are respectively set on both sides of the feed hole (13).

7. A material flight preventing semiconductor device bucket-type material distributing mechanism according to claim 5, characterized in that: The top of the slider (10) is provided with a plurality of guide rails that are installed perpendicularly to each other, and a bidirectional transmission plate is installed on one side of the slide bracket (3).

8. The anti-dusting semiconductor device tray-type dispensing mechanism according to claim 1, characterized by: A lifting base (7) is installed at the bottom of each of the multiple material distribution cylinders (6). The bottom of the lifting base (7) is fixed to the bottom wall of the main body (1) of the material distribution equipment, and a hydraulic lifting platform connected to the material distribution cylinder (6) is installed in the lifting base (7).

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