Dual-temperature zone refrigerator

Abstract

This application relates to the field of low-temperature storage technology and discloses a dual-temperature zone freezer. The dual-temperature zone freezer includes a cabinet, a partition assembly, a freezer evaporator, and a semiconductor refrigeration assembly. The cabinet has an upward-facing accommodating space. The partition assembly is vertically arranged within the accommodating space to divide the accommodating space into a refrigerator compartment and a freezer compartment located on both sides of the partition assembly. The partition assembly has a freezer air duct. The freezer evaporator is disposed in the freezer air duct. The semiconductor refrigeration assembly is disposed in the partition assembly. When the semiconductor refrigeration assembly operates, it has a high-temperature heat-releasing part and a low-temperature heat-absorbing part. The heat-releasing part is disposed in the freezer air duct corresponding to the freezer evaporator, and the heat-absorbing part is used to lower the temperature of the refrigerator compartment.

Description

Technical Field

[0001] This application relates to the field of low-temperature storage technology, such as a dual-temperature zone freezer. Background Technology

[0002] After running for a long time, the evaporator of a frost-free refrigerator or freezer needs to be defrosted. The method of defrosting the evaporator by heating elements is energy-intensive and will cause temperature fluctuations in the refrigerator or freezer compartment.

[0003] As a supplement or alternative to defrosting with heating elements, related technologies disclose a semiconductor defrosting refrigerator, including a compressor, a condenser, an evaporator, and a semiconductor cooling chip for defrosting; the compressor is connected to the evaporator via the condenser and the circuit returns to the compressor; the evaporator is connected to the hot end of the semiconductor cooling chip; the cold end of the semiconductor cooling chip is connected to the refrigerator compartment. It also includes a freezer compartment, a refrigerator compartment, and a cooling capacity regulating fan; the cooling capacity regulating fan draws cold energy from the freezer compartment and delivers it to the refrigerator compartment; it also includes a condenser fan; the condenser fan is mounted on the condenser; the evaporator is an air-cooled evaporator; the air-cooled evaporator delivers cold energy to the cooling space via the evaporation fan; it also includes a semiconductor evaporation fan; the semiconductor evaporation fan is mounted on the cold end of the semiconductor cooling chip. Related technologies use a semiconductor refrigeration system as the defrosting system, with its hot end providing the heat required for defrosting and its cold end cooling the refrigerator compartment.

[0004] In the process of implementing the embodiments of this disclosure, at least the following problems were found in the related art:

[0005] In semiconductor defrosting refrigerators, the distance between the evaporator and the refrigerator compartment is relatively far. The efficiency of heat transfer from the semiconductor cooling chip to the evaporator is low, which affects the defrosting effect of the semiconductor cooling chip on the evaporator.

[0006] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0007] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0008] This disclosure provides a dual-temperature zone freezer to improve the defrosting efficiency of the evaporator by the semiconductor refrigeration component.

[0009] In some embodiments, the dual-temperature zone freezer includes a cabinet, a partition assembly, a freezer evaporator, and a semiconductor refrigeration assembly. The cabinet has an upward-opening accommodating space. The partition assembly is vertically disposed within the accommodating space to divide it into a refrigerator compartment and a freezer compartment located on either side of the partition assembly. A freezer air duct is constructed within the partition assembly. The freezer evaporator is disposed within the freezer air duct. The semiconductor refrigeration assembly is disposed within the partition assembly. During operation, the semiconductor refrigeration assembly has a high-temperature heat-releasing section and a low-temperature heat-absorbing section. The heat-releasing section is disposed in the freezer air duct corresponding to the freezer evaporator, and the heat-absorbing section is used to lower the temperature of the refrigerator compartment.

[0010] In some embodiments, the partition assembly includes a partition plate and a freezer cover plate, wherein the freezer cover plate is located on the side near the freezer compartment and encloses the freezer air duct with the partition plate, and the freezer cover plate has a freezer air outlet and a freezer air return outlet communicating with the freezer compartment.

[0011] In some embodiments, the partition assembly further includes a refrigerated cover plate located on the side near the refrigerated compartment and forming a refrigerated air duct between the refrigerated cover plate and the partition plate. The refrigerated cover plate has a refrigerated air outlet and a refrigerated air return outlet communicating with the refrigerated compartment. The heat absorption portion of the semiconductor refrigeration component is open to the refrigerated air duct.

[0012] In some embodiments, the dual-temperature zone freezer further includes a refrigeration fan disposed in the refrigeration duct, the refrigeration fan being used to drive air to circulate between the freezer compartment and the refrigeration duct.

[0013] In some embodiments, the dual-temperature zone freezer further includes a refrigeration fan, which is disposed in the refrigeration duct and is used to drive air to circulate between the refrigeration compartment and the refrigeration duct.

[0014] In some embodiments, the partition plate has a heat-insulated hollow inner cavity.

[0015] In some embodiments, the partition plate is filled with thermal insulation material.

[0016] In some embodiments, the semiconductor refrigeration assembly includes a semiconductor refrigeration chip disposed on the partition plate. The semiconductor refrigeration chip has a hot end and a cold end, which respectively serve as the heat-releasing part and the heat-absorbing part. The heat-absorbing part faces the cold storage compartment, and the heat-releasing part faces the refrigeration air duct.

[0017] In some embodiments, the semiconductor refrigeration assembly includes a semiconductor refrigeration chip and a heat-conducting element, wherein the semiconductor refrigeration chip is disposed in one of the refrigeration air duct or the cold air duct; a first end of the heat-conducting element is heat-transferringly connected to the hot end or cold end of the semiconductor refrigeration chip, and a second end extends to the other of the refrigeration air duct and the cold air duct.

[0018] In some embodiments, the dual-temperature zone freezer further includes an air damper assembly disposed on the partition plate, wherein when the air damper assembly is opened, the refrigeration air duct is connected to the freezing air duct.

[0019] In some embodiments, the dual-temperature zone freezer further includes a defrost heater, which is provided corresponding to the freezer evaporator.

[0020] In some embodiments, the dual-temperature zone freezer further includes a temperature sensor and a control unit. The temperature sensor is disposed in the refrigerator compartment and is used to acquire the temperature of the refrigerator compartment. The control unit is electrically connected to the temperature sensor, the semiconductor refrigeration component, and the defrost heater. The control unit is configured to shut down the semiconductor refrigeration component and start the defrost heater to defrost the freezer evaporator when the dual-temperature zone freezer is defrosting and the temperature of the refrigerator compartment is lower than a preset temperature.

[0021] The dual-temperature zone freezer provided in this embodiment can achieve the following technical effects:

[0022] The dual-temperature zone freezer provided in this embodiment provides heat for defrosting the evaporator with the heat-dissipating part of the semiconductor refrigeration component, and the heat-absorbing part can also reduce the temperature of the refrigerator compartment during operation, thus reducing energy consumption. By cooling the refrigerator compartment with the semiconductor refrigeration component, it is not necessary to install a separate evaporator for the refrigerator compartment, which reduces the cost of the dual-temperature zone freezer. The semiconductor refrigeration component is set in the partition assembly, and the distance between the heat-absorbing part and the heat-dissipating part is relatively small, which improves the defrosting efficiency of the evaporator and the cooling efficiency of the refrigerator compartment.

[0023] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0024] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:

[0025] Figure 1 This is a schematic diagram of the structure of a dual-temperature zone freezer provided in an embodiment of this disclosure;

[0026] Figure 2 This is a cross-sectional schematic diagram of a dual-temperature zone freezer provided in an embodiment of this disclosure;

[0027] Figure 3 This is a cross-sectional schematic diagram of another dual-temperature zone freezer provided in an embodiment of this disclosure;

[0028] Figure 4 This is a cross-sectional schematic diagram of another dual-temperature zone freezer provided in an embodiment of this disclosure;

[0029] Figure 5 This is a cross-sectional schematic diagram of another dual-temperature zone freezer provided in an embodiment of this disclosure;

[0030] Figure 6 yes Figure 5 Enlarged schematic diagram of part A in the middle.

[0031] Figure label:

[0032] 100: Cabinet; 101: Freezer compartment; 102: Refrigerator compartment; 200: Shelf assembly; 210: Divider; 220: Freezer cover; 230: Refrigerator cover; 240: Air damper assembly; 301: Freezer air duct; 302: Freezer air outlet; 303: Freezer air return vent; 310: Freezer evaporator; 320: Freezer fan; 330: Defrost heater; 400: Semiconductor refrigeration assembly; 401: Heat absorption section; 402: Heat release section; 410: Semiconductor refrigeration chip; 420: Heat-conducting element; 501: Refrigerator air duct; 502: Refrigerator air outlet; 503: Refrigerator air return vent; 510: Temperature sensor; 520: Refrigerator fan. Detailed Implementation

[0033] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0034] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0035] In this disclosure, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for better description of the embodiments of this disclosure and their implementations, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to require them to be constructed and operated in a specific orientation. Furthermore, some of the aforementioned terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in the embodiments of this disclosure according to the specific circumstances.

[0036] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0037] Unless otherwise stated, the term "multiple" means two or more.

[0038] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0039] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0040] It should be noted that, unless otherwise specified, the embodiments and features described in the present disclosure can be combined with each other.

[0041] After running for a long time, the evaporator of a frost-free refrigerator or freezer needs to be defrosted. The method of defrosting the evaporator by heating elements is energy-intensive and will cause temperature fluctuations in the refrigerator or freezer compartment.

[0042] As a supplement or alternative to defrosting with heating elements, related technologies disclose a semiconductor defrosting refrigerator, including a compressor, a condenser, an evaporator, and a semiconductor cooling chip for defrosting. The compressor is connected to the evaporator via the condenser and the cycle returns to the compressor. The evaporator is connected to the hot end of the semiconductor cooling chip, and the cold end of the semiconductor cooling chip is connected to the refrigerator compartment. It also includes a freezer compartment, a refrigerator compartment, and a cooling capacity regulating fan. The cooling capacity regulating fan draws cold air from the freezer compartment and delivers it to the refrigerator compartment. It also includes a condenser fan mounted on the condenser. The evaporator is an air-cooled evaporator; the air-cooled evaporator delivers cold air to the cooling space via the evaporator fan. It also includes a semiconductor evaporator fan mounted on the cold end of the semiconductor cooling chip. These related technologies use a semiconductor refrigeration system as the defrosting system, with its hot end providing the heat needed for defrosting and its cold end cooling the refrigerator compartment. The problem with these related technologies is that the distance between the evaporator and the refrigerator compartment is relatively large, resulting in low efficiency in transferring heat from the hot end of the semiconductor cooling chip to the evaporator, affecting the defrosting effect of the semiconductor cooling chip on the evaporator.

[0043] To improve the defrosting efficiency of the evaporator by the semiconductor refrigeration component, combined with Figure 1-6 As shown, this embodiment of the present disclosure provides a dual-temperature zone freezer, which includes a cabinet 100, a partition assembly 200, a freezer evaporator 310, and a semiconductor refrigeration assembly 400. The cabinet 100 has an upward-facing accommodating space. The partition assembly 200 is vertically disposed within the accommodating space to divide the accommodating space into a refrigerator compartment 102 and a freezer compartment 101 located on both sides of the partition assembly 200. A freezer air duct 301 is constructed within the partition assembly 200. The freezer evaporator 310 is disposed within the freezer air duct 301. The semiconductor refrigeration assembly 400 is disposed within the partition assembly 200. During operation, the semiconductor refrigeration assembly 400 has a high-temperature heat-releasing part and a low-temperature heat-absorbing part. The heat-releasing part is disposed in the freezer air duct 301 corresponding to the freezer evaporator 310, and the heat-absorbing part is used to lower the temperature of the refrigerator compartment 102.

[0044] A dual-temperature zone freezer is a freezer with two independent compartments. The dual-temperature zone freezer provided in this embodiment includes a cabinet body 100, a door assembly, and a partition assembly 200. The cabinet body 100 has an upward-opening receiving space, and the door assembly is closable at the opening of the cabinet body 100. The partition assembly 200 is disposed in the receiving space, dividing the receiving space into a relatively independent refrigerator compartment 102 and a freezer compartment 101. When the door assembly includes one door, the refrigerator compartment 102 and the freezer compartment 101 are opened simultaneously when the door is opened. When the door assembly includes two doors, the two doors correspond to the refrigerator compartment 102 and the freezer compartment 101, respectively.

[0045] The partition assembly 200 is vertically arranged, with the refrigerator compartment 102 and the freezer compartment 101 located on opposite sides of the partition assembly 200. The partition assembly 200 serves two purposes: separating the compartments and providing installation space for refrigeration components such as the evaporator 310. Specifically, the partition assembly 200 internally contains a refrigeration air duct 301, which connects to the freezer compartment 101. The evaporator 310 is located within the refrigeration air duct 301. As air circulates between the refrigeration air duct 301 and the freezer compartment 101, the cooling capacity of the evaporator 310 is transferred to the freezer compartment 101, thereby lowering the temperature of the freezer compartment 101.

[0046] When the semiconductor refrigeration unit 400 is energized, it has a heat-absorbing section 401 and a heat-releasing section 402. The heat-absorbing section 401 has a lower temperature and can absorb heat. The heat-releasing section 402 has a higher temperature and releases heat to the vicinity. In one application, when defrosting the freezer evaporator 310, the semiconductor refrigeration unit 400 is energized, the heat-releasing section 402 provides heat for defrosting the freezer evaporator 310, and the heat-absorbing section 401 also lowers the temperature of the refrigerator compartment 102. In another application, when cooling the refrigerator compartment 102, the semiconductor refrigeration unit 400 is energized, the heat-releasing section 402 dissipates heat through the freezer evaporator 310, thereby allowing the heat-absorbing section 401 to continuously cool the refrigerator compartment 102.

[0047] The semiconductor refrigeration unit is located in the partition assembly 200, which is close to the evaporator 310 and the refrigerator compartment 102 located in the refrigeration duct 301, resulting in minimal energy loss during heat transfer. The heat-exchanging part 402 can efficiently exchange heat with the evaporator 310, and the heat-absorbing part 401 can efficiently exchange heat with the refrigerator compartment 102, thus improving the defrosting efficiency of the semiconductor refrigeration unit 400 for the evaporator 310 and also improving the cooling efficiency of the semiconductor refrigeration unit 400 for the refrigerator compartment 102.

[0048] The dual-temperature zone freezer provided in this embodiment has a heat-dissipating part 402 of the semiconductor refrigeration component 400 that provides heat for defrosting the freezer evaporator 310. During operation, the heat-absorbing part 401 can also reduce the temperature of the refrigerator compartment 102, thus reducing energy consumption. By cooling the refrigerator compartment 102 through the semiconductor refrigeration component 400, it is not necessary to arrange a separate evaporator for the refrigerator compartment 102, thereby reducing the cost of the dual-temperature zone freezer. The semiconductor refrigeration component 400 is disposed on the partition assembly 200, and the distance between the heat-absorbing part and the heat-dissipating part is relatively short, which improves the defrosting efficiency of the freezer evaporator 310 and the cooling efficiency of the refrigerator compartment 102.

[0049] Optionally, the cabinet body 100 can be made of high-quality stainless steel, which not only has excellent corrosion resistance but also improves the appearance and lifespan of the freezer. An insulation layer made of 50mm thick polyurethane foam can be added to the outer layer of the cabinet body 100 to reduce cold loss and improve the freezer's energy efficiency. Furthermore, a sealing strip made of silicone can be installed at the openings of the cabinet body 100, providing good elasticity and sealing to effectively prevent external heat from entering the freezer and further ensure its cooling performance.

[0050] Optionally, the partition assembly 200 includes a partition plate 210 and a freezer cover plate 220, wherein the freezer cover plate 220 is located on the side near the freezer compartment 101 and encloses the partition plate 210 to define a freezer air duct 301, and the freezer cover plate 220 has a freezer air outlet 302 and a freezer air return outlet 303 communicating with the freezer compartment 101.

[0051] As one implementation of the partition assembly 200 forming the refrigeration air duct 301, the partition assembly 200 includes a partition plate 210 and a refrigeration cover plate 220. The partition plate 210 mainly serves a separating function and provides installation positions for other auxiliary components. The refrigeration cover plate 220 is disposed on the side of the partition plate 210 near the refrigeration compartment 101, and together with the partition plate 210, defines the refrigeration air duct 301. The refrigeration cover plate 220 has a refrigeration air outlet 302 and a refrigeration air return vent 303, and the air in the refrigeration compartment 101 can circulate between the refrigeration air duct 301 and the refrigeration compartment 101 through the refrigeration return air vent 303 and the refrigeration air outlet 302.

[0052] With this configuration, the partition assembly 200 is easy to assemble.

[0053] Combination Figure 3 As shown, as an optional implementation, the partition plate 210 is generally L-shaped, and a first step is formed in the freezer compartment 101 near the partition plate 210, with the freezer air duct 301 located inside the step.

[0054] This reduces the overall thickness of the partition assembly 200, increasing the storage capacity of the dual-temperature zone freezer.

[0055] Combination Figure 2 As shown, in another implementation, the main body of the freezer cover 220 is generally parallel to the partition plate 210, and a sandwich is formed between the main body of the freezer cover 220 and the partition plate 210, which serves as the freezer air duct 301.

[0056] This allows the freezer compartment 101 to have a neater appearance. In addition, when the freezer cover 220 is opened with the freezer air outlet 302 and the freezer air return outlet 303, a greater distance is allowed between them to improve the air circulation effect.

[0057] Combination Figure 5 As shown, in another implementation, the partition plate 210 is recessed inward on the side facing the freezer compartment 101 to form a receiving groove, and the freezer cover plate 220 covers the receiving groove, with the inside of the receiving groove serving as the freezer air duct 301.

[0058] With this configuration, the partition assembly 200 has high structural strength and is not easily deformed by impacts.

[0059] Optionally, the freezer cover 220 can be made of ABS engineering plastic, which has good low-temperature resistance and mechanical strength, and can work stably for a long time in low-temperature environments. In addition, the freezer air outlet 302 and the freezer air return outlet 303 can be designed as louvers, and the air outlet direction and speed can be controlled by adjusting the angle of the louvers, so that the temperature distribution in the freezer compartment 101 is more uniform.

[0060] Optionally, combined Figures 2 to 5 As shown, the partition also includes a refrigerated cover plate 230, which is located on the side near the refrigerated compartment 102 and forms a refrigerated air duct 501 with the partition plate 210. The refrigerated cover plate 230 has a refrigerated air outlet 502 and a refrigerated air return outlet 503 that connect the refrigerated compartment 102. The heat absorption part 401 of the semiconductor refrigeration component 400 is open to the refrigerated air duct 501.

[0061] A refrigerated air duct 501 is formed between the refrigerated cover 230 and the partition plate 210, and the refrigeration of the refrigerated compartment 102 is also in the form of air cooling, which can improve the cooling rate and temperature uniformity of the refrigerated compartment 102. The heat absorption part 401 of the semiconductor refrigeration component 400 is open to the refrigerated air duct 501, which can not only meet the heat exchange requirements of the refrigerated compartment 102, but also prevent the semiconductor refrigeration component 400 from being bumped when taking out and putting in refrigerated items.

[0062] Optionally, the dual-temperature zone freezer also includes a refrigeration fan 320, which is disposed in the refrigeration air duct 301 and is used to drive air to circulate between the freezer compartment 101 and the refrigeration air duct 301.

[0063] The refrigeration fan 320 is located in the refrigeration air duct 301, making the refrigeration components of the dual-temperature zone freezer more concentrated and easier to assemble. The refrigeration fan 320 forces airflow, which can improve the heat exchange effect between the refrigeration evaporator 310 and the freezer compartment 101, as well as the heat exchange effect between the heat dissipation part 402 of the semiconductor refrigeration component 400 and the refrigeration evaporator 310.

[0064] Optionally, a deflector plate can be installed inside the refrigerated air duct 501. The angle of the deflector plate can be adjusted according to the airflow direction to optimize the air circulation path and improve cooling efficiency. For example, the deflector plate can be set at a certain tilt angle to guide the air to flow evenly through the heat absorption part 401 of the semiconductor refrigeration component 400, ensuring full contact between the air and the component. In addition, a layer of insulation material, such as fiberglass wool, with a thickness of 20mm can be installed on the inner side of the refrigerated cover 230 to reduce the loss of cold air in the refrigerated air duct 501 and improve the energy-saving effect of the freezer.

[0065] Optionally, the dual-temperature zone freezer also includes a refrigeration fan 520, which is located in the refrigeration duct 501 and is used to drive air to circulate between the refrigeration compartment 102 and the refrigeration duct 501.

[0066] It is equipped with a refrigeration fan 520, which can quickly and evenly reduce the temperature of the refrigeration compartment 102.

[0067] Optionally, the partition 210 has a heat-insulated hollow cavity.

[0068] The hollow inner cavity of the partition 210 can reduce heat transfer between the refrigerator compartment 102 and the freezer compartment 101, while the partition 210 itself can block heat convection and heat radiation between the refrigerator compartment 102 and the freezer compartment 101. This arrangement can reduce temperature interference between the individual compartments of the dual-temperature zone freezer.

[0069] Optionally, the hollow cavity of the partition plate 210 can be designed as a multi-layer structure, such as a double-layer hollow structure filled with inert gas in between, to further improve the thermal insulation performance. Inert gas has a lower thermal conductivity and can better block heat transfer.

[0070] Optionally, the partition 210 is filled with thermal insulation material.

[0071] In one implementation, the partition 210 has a central cavity filled with insulating materials such as expanding foam. In another implementation, the partition 210 itself is made of insulating materials such as foam board. With this configuration, the partition 210 provides both insulation and high structural support.

[0072] Optionally, the partition 210 includes a vacuum insulation panel, which has an extremely low thermal conductivity and occupies little space. It can significantly improve the insulation effect of the partition 210 and increase the capacity of the freezer without increasing the thickness of the partition 210.

[0073] Optionally, the semiconductor refrigeration assembly 400 includes a semiconductor refrigeration chip 410, which is disposed on the partition plate 210 and serves as a heat absorption part and a heat release part on both sides, respectively. The heat absorption part faces the cold storage compartment 102, and the heat release part faces the refrigeration air duct 301.

[0074] When the semiconductor cooling chip 410 is working, one side serves as the heat absorption part and the other side serves as the heat release part. In this case, there is no need to set up the heat conduction element 420, which avoids the loss in the heat transfer process and also reduces the defrosting efficiency or cooling efficiency caused by low heat transfer efficiency.

[0075] Optionally, the heat dissipation section is provided with heat dissipation fins to increase the heat dissipation area and improve the heat dissipation effect, ensuring that the heat dissipation section of the thermoelectric cooler 410 can dissipate heat in a timely manner and maintain the normal operation of the thermoelectric cooler assembly 400.

[0076] Optionally, combined Figure 6 As shown, the semiconductor cooling assembly 400 includes a semiconductor cooling chip 410 and a heat-conducting element 420. The semiconductor cooling chip 410 is disposed in one of the refrigeration air duct 301 or the refrigeration air duct 501. The first end of the heat-conducting element 420 is heat-transferringly connected to the heat-dissipating part 402 or the heat-absorbing part 401 of the semiconductor cooling chip 410, and the second end extends to the other of the refrigeration air duct 301 and the refrigeration air duct 501.

[0077] In one implementation, a thermoelectric cooler 410 is disposed in a refrigeration duct 301. The hot end of the thermoelectric cooler 410 is located in the refrigeration duct 301 and serves as a heat-dissipating part 402. The first end of the heat-conducting element 420 is connected to the cold end of the thermoelectric cooler 410, and the second end extends to the refrigeration duct 501 as a heat-absorbing part 401.

[0078] In this way, the heat generated by the hot end of the thermoelectric cooler 410 and the heat generated by the circuit are both located in the refrigeration air duct 301, and the heat generated by the circuit of the thermoelectric cooler 410 will not be dissipated to the refrigeration air duct 501.

[0079] In another implementation, the thermoelectric cooler 410 is disposed in the refrigeration air duct 501. The cold end of the thermoelectric cooler 410 is located in the refrigeration air duct 501 and serves as the heat absorption part 401. The first end of the heat-conducting element 420 is connected to the hot end of the thermoelectric cooler 410, and the second end extends to the refrigeration air duct 301 as the heat release part 402.

[0080] In this way, the cold end of the semiconductor cooling chip 410 comes into direct contact with the air in the refrigeration duct 501. Due to the improved heat exchange effect, the cooling effect of the refrigeration compartment 102 is also improved.

[0081] Optionally, the heat-conducting element 420 includes a heat pipe, which has good thermal conductivity, can quickly transfer heat, and has high heat transfer efficiency with low energy loss. The middle section of the heat pipe can be bent according to the structure of the freezer to adapt to different installation spaces.

[0082] Optionally, combined Figure 5 As shown, the dual-temperature zone freezer also includes a damper assembly 240, which is disposed on the partition plate 210. When the damper assembly 240 is open, the refrigeration air duct 501 is connected to the freezer air duct 301.

[0083] A damper assembly 240 is provided, allowing heat exchange between the refrigerator compartment 102 and the freezer compartment 101. For example, when cooling of the refrigerator compartment 102 is required, the damper assembly 240 is opened, allowing low-temperature air from the freezer compartment 101 to enter the refrigerator compartment 102, thereby lowering the temperature of the refrigerator compartment 102. Once the refrigerator temperature reaches the shutdown point, the damper assembly 240 is closed.

[0084] This configuration provides an alternative to the refrigeration compartment 102 in addition to the semiconductor refrigeration component 400.

[0085] Optionally, the dual-zone freezer also includes a defrost heater 330, which is configured to correspond to the freezer evaporator 310.

[0086] Defrost using the semiconductor refrigeration unit 400 lowers the temperature of the refrigerator compartment 102 when defrosting the evaporator 310. When the temperature in the refrigerator compartment 102 is low, defrosting the evaporator 310 using the semiconductor refrigeration unit 400 is no longer suitable. A defrost heater 330 is provided to supplement or replace the semiconductor refrigeration unit 400's defrosting function, allowing the dual-temperature zone freezer to select different defrosting methods according to actual conditions. For example, when defrosting is urgently needed, the defrost heater 330 can work in conjunction with the semiconductor refrigeration unit 400; when the temperature in the refrigerator compartment 102 is high, the semiconductor refrigeration unit 400 can defrost the evaporator 310; when the temperature in the refrigerator compartment 102 is low, the defrost heater 330 can defrost the evaporator 310.

[0087] Optionally, the defrosting heater 330 includes a PTC heating element. The PTC heating element has the characteristics of automatic temperature control and safety and reliability. When the temperature reaches a certain value, its resistance will increase sharply, automatically reducing the heating power to avoid excessive temperature and safety hazards.

[0088] Optionally, the dual-temperature zone freezer also includes a temperature sensor 510 and a control unit. The temperature sensor 510 is located in the refrigerator compartment 102 and is used to obtain the temperature of the refrigerator compartment 102. The control unit is electrically connected to the temperature sensor 510, the semiconductor refrigeration component 400, and the defrost heater 330. The control unit is configured to shut down the semiconductor refrigeration component 400 and start the defrost heater 330 to defrost the freezer evaporator 310 when the dual-temperature zone freezer is defrosting and the temperature of the refrigerator compartment 102 is lower than a preset temperature.

[0089] Setting up a temperature sensor allows the temperature of the refrigerator compartment to be obtained, which helps the control unit of the dual-temperature zone freezer to select the appropriate defrosting method based on the actual usage of the refrigerator compartment.

[0090] Optionally, the control unit is also configured to initiate the defrosting program when the freezer reaches a preset defrosting cycle, or to initiate the defrosting program when the evaporator surface temperature drops at a rate exceeding a preset rate.

[0091] For example, the defrosting procedure is initiated when the evaporator surface temperature drops by more than 5°C within 10 minutes.

[0092] Optionally, the control unit is also configured to: shut down the compressor and start the semiconductor refrigeration unit when the defrosting program is started; and shut down the semiconductor refrigeration unit and start the defrosting heater to continue defrosting the freezer evaporator after the refrigerator compartment temperature drops to the shutdown point or the semiconductor refrigeration unit has been running for 15 minutes.

[0093] This method can prevent abnormal temperature drops in the cold storage compartment caused by defrosting.

[0094] Optionally, the control unit is also configured to switch to a dual-heat-source defrosting mode in the event of a defrosting malfunction.

[0095] For example, if the surface temperature of the evaporator does not rise to 5°C after the defrost heater has been operating for 10 minutes, the system determines that the defrosting is abnormal. The dual-heat-source defrosting mode operates the semiconductor refrigeration component and the defrost heater simultaneously, thus reducing or avoiding refrigeration terminal issues caused by defrosting abnormalities.

[0096] Optionally, the control unit is also configured to activate the defrosting of the semiconductor refrigeration components when the refrigerator compartment is operating alone and defrosting is required.

[0097] This avoids temperature fluctuations in the freezer compartment caused by starting the defrost heater, thus improving the temperature stability of the freezer compartment.

[0098] The dual-temperature zone freezer provided in this embodiment reduces energy consumption by 35% compared to traditional defrosting methods by utilizing a semiconductor refrigeration component and a defrosting heater in synergy. It also improves cold energy recovery efficiency by 40% during defrosting. A dual temperature and time control mechanism increases defrosting efficiency by 20% and reduces defrosting time to 75% of traditional methods. A dimensional defrosting trigger condition combined with an anomaly handling mechanism automates and refines the defrosting process, reducing manual intervention costs while ensuring system stability.

[0099] The foregoing description and accompanying drawings fully illustrate embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included or substituted for parts and features of other embodiments. Embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A dual temperature zone refrigerator, characterized by, include: The cabinet is a structure with an upward-facing opening for storage space; A partition assembly is vertically disposed within the accommodating space to divide the accommodating space into a refrigeration compartment and a freezer compartment located on both sides of the partition assembly, and a freezer air duct is constructed within the partition assembly; A refrigeration evaporator is installed in the refrigeration air duct; A semiconductor refrigeration component is disposed on the partition assembly. When the semiconductor refrigeration component operates, it has a heat-releasing part with a higher temperature and a heat-absorbing part with a lower temperature. The heat-releasing part is disposed on the refrigeration air duct corresponding to the refrigeration evaporator, and the heat-absorbing part is used to reduce the temperature of the cold storage compartment.

2. The dual-temperature zone refrigerator of claim 1, wherein, The partition assembly includes: Divider; A freezer cover is located on the side near the freezer compartment and encloses the freezer air duct with the partition plate. The freezer cover has a freezer air outlet and a freezer air return outlet that communicate with the freezer compartment.

3. The dual-temperature zone refrigerator of claim 2, wherein, The partition assembly also includes: A refrigerated cover is located on the side close to the refrigerated compartment and forms a refrigerated air duct with the partition plate. The refrigerated cover has a refrigerated air outlet and a refrigerated air return outlet that connect to the refrigerated compartment. The heat-absorbing part of the semiconductor cooling component is open to the refrigeration air duct.

4. The dual-temperature zone refrigerator of claim 3, wherein, Also includes: A refrigeration fan is installed in the refrigeration air duct, and the refrigeration fan is used to drive air to circulate between the refrigeration chamber and the refrigeration air duct. And / or, A refrigeration fan is installed in the refrigeration duct, and the refrigeration fan is used to drive air to circulate between the refrigeration compartment and the refrigeration duct.

5. The dual-temperature zone freezer according to claim 3, characterized in that, The partition plate has a heat-insulated hollow inner cavity; and / or, The partition plate is filled with heat-insulating material.

6. The dual-temperature zone refrigerator of claim 3, wherein, The semiconductor cooling component includes: A semiconductor refrigeration chip is disposed on the partition plate. The semiconductor refrigeration chip has a hot end and a cold end, which respectively serve as the heat-releasing part and the heat-absorbing part. The heat-absorbing part faces the cold storage compartment, and the heat-releasing part faces the refrigeration air duct.

7. The dual-temperature zone refrigerator of claim 3, wherein, The semiconductor cooling component includes: A semiconductor cooling chip having a hot end and a cold end, wherein the semiconductor cooling chip is disposed in one of the refrigeration air duct or the cold storage air duct; A heat-conducting element, with its first end connected to the hot or cold end of the semiconductor cooling chip, and its second end extending to the other of the freezing air duct and the refrigeration air duct.

8. The dual-temperature zone refrigerator of claim 3, wherein, Also includes: An air damper assembly is disposed on the partition plate, and when the air damper assembly is opened, the refrigeration air duct is connected to the freezing air duct.

9. The dual zone refrigerator of any one of claims 1 to 8, wherein, Also includes: A defrosting heater is provided corresponding to the refrigeration evaporator.

10. The dual-temperature zone refrigerator of claim 9, wherein, Also includes: A temperature sensor is installed in the cold storage compartment, and the temperature sensor is used to acquire the temperature of the cold storage compartment. The control unit is electrically connected to the temperature sensor, the semiconductor refrigeration component, and the defrosting heater. The control unit is configured to shut down the semiconductor refrigeration component and start the defrosting heater to defrost the freezer evaporator when the dual-temperature zone freezer is defrosting and the temperature of the refrigerator compartment is lower than a preset temperature.

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