An optical module

Abstract

This disclosure provides an optical module with a circuit board having an insertion slot. A light emitting component is inserted into the insertion slot, and a light receiving component is disposed on the circuit board. A protective housing covers the light emitting component and the light receiving component. The light emitting component includes a semiconductor cooler and a laser chip array. The light receiving component includes a first light receiving assembly and a second light receiving assembly. The first light receiving assembly is located behind the insertion slot, and the second light receiving assembly is located in front of the insertion slot. A pad array and a pad group are disposed on the circuit board. The pad array is electrically connected to the laser chip array. The pad group is electrically connected to the semiconductor cooler. The distance between the first and second light receiving assemblies and the edge of the insertion slot is smaller than the width of the pad group. Both the pad array and the pad group are located on the right side of the insertion slot to provide accommodating space for the first and second light receiving assemblies, such that the light emitting component and the light receiving component are arranged side by side along the width direction of the circuit board.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing. Utility Model Content

[0003] This disclosure provides an optical module that protects both an optical emitting component and an optical receiving component.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] The circuit board has an insertion slot.

[0006] The light emitting component is embedded in the embedding port;

[0007] A light receiving component is disposed on the circuit board and arranged side by side with the light emitting component along the width direction of the circuit board;

[0008] A protective housing is provided over the light emitting component and the light receiving component;

[0009] The light emitting component includes:

[0010] Semiconductor coolers;

[0011] A laser chip array, disposed on the semiconductor cooler, is used to emit optical signals;

[0012] The optical receiving component includes:

[0013] First optical receiving component;

[0014] Second optical receiving component;

[0015] The circuit board is provided with:

[0016] The pad array is electrically connected to the laser chip array;

[0017] The pad group is electrically connected to the semiconductor cooler; the first light receiving component is located on the rear side of the embedding port, the second light receiving component is located on the front side of the embedding port, the distance between the first light receiving component and the second light receiving component and the edge of the embedding port is smaller than the width of the pad group, and the pad group and the pad array are both located on the right side of the embedding port.

[0018] The above technical solution has the following beneficial effects: This disclosure provides an optical module, including a circuit board, an optical emitting component, an optical receiving component, and a protective housing. The circuit board has an insertion slot, in which the optical emitting component is inserted. The optical receiving component is disposed on the circuit board, and the optical receiving component and the optical emitting component are arranged side-by-side along the width direction of the circuit board. Since the width of the circuit board is limited, the optical emitting component and the optical receiving component are arranged side-by-side along the width direction of the circuit board. A protective housing covers the optical emitting component and the optical receiving component, protecting them. The optical emitting component includes a semiconductor cooler and a laser chip array. The laser chip array is disposed on the semiconductor cooler and is used to emit optical signals. The optical receiving component includes a first optical receiving component and a second optical receiving component. The first optical receiving component is located behind the insertion slot, such that the first optical receiving component and the optical emitting component are arranged side-by-side along the width direction of the circuit board. The second optical receiving component is located in front of the insertion slot, such that the first optical receiving component and the second optical receiving component are arranged side-by-side along the width direction of the circuit board. The circuit board features a pad array and a pad group. The pad array is electrically connected to the laser chip array, providing electrical signals to the laser chip array, which in turn causes the laser chip array to emit light signals. The pad group is electrically connected to a thermoelectric cooler, providing electrical signals to the thermoelectric cooler, which in turn controls the operating temperature. The distance between the first and second light receiving components and the edge of the insertion port is smaller than the width of the pad group. Both the pad group and the pad array are located on the right side of the insertion port, allowing the first and second light receiving components to be positioned on the front and rear sides of the insertion port, thus enabling the light emitting and receiving components to be arranged side-by-side along the width of the circuit board.

[0019] In some embodiments, an optical module is provided, wherein one end of the protective housing is formed with:

[0020] Card access hole;

[0021] The optical module also includes:

[0022] The support plate, embedded in the embedding port, supports the light emitting component and has the following characteristics:

[0023] The support protrusion has its top surface connected to the bottom surface of one end of the protective housing.

[0024] A snap-fit ​​protrusion is provided on the support protrusion and is located inside the snap-fit ​​through hole.

[0025] The above technical solution has the following beneficial effects: The optical module also includes a support plate, which is embedded in an insertion slot and supports the light emitting component so that the light emitting component is embedded in the insertion slot. The support plate has a support protrusion, the top surface of which is connected to the bottom surface of one end of the protective housing to support that end of the protective housing. A snap-fit ​​protrusion is provided on the support protrusion, which is disposed within a snap-fit ​​through hole to define the position of the protective housing in the length and width directions of the circuit board, preventing the protective housing from detaching from the support plate under stress.

[0026] In some embodiments, an optical module is provided, wherein the upper surface of the circuit board is provided with:

[0027] First limiting post;

[0028] The other end of the protective shell has:

[0029] The first support column has its bottom surface connected to the upper surface of the circuit board and stops at the first limiting column.

[0030] The above technical solution has the following beneficial effects: a first limiting post is provided on the upper surface of the circuit board, and a first support post is formed at the other end of the protective shell. The bottom surface of the first support post is connected to the upper surface of the circuit board. The first support post is stopped at the first limiting post, which can limit the position of the protective shell in the length direction of the circuit board and prevent the protective shell from contacting the photoelectric device on one side of the first limiting post.

[0031] In some embodiments, an optical module is provided, wherein the circuit board is provided with:

[0032] First limiting gap;

[0033] Second limiting gap;

[0034] The protective housing includes:

[0035] The bottom surface of the support plate is connected to the top surface of the support protrusion;

[0036] A protective plate, one end of which is connected to the support plate, covers the light emitting component and the light receiving component; a first snap-fit ​​plate, one side of which is connected to one side of the protective plate and the other side of which is connected to the circuit board, includes:

[0037] The first snap-fit ​​portion is disposed at the first limiting notch;

[0038] The bottom surface of the second snap-fit ​​part is in contact with the upper surface of the circuit board;

[0039] The second snap-on board, with one side connected to the other side of the protection board and the other side connected to the circuit board, includes:

[0040] The third locking part is provided at the second limiting notch;

[0041] The fourth snap-fit ​​part has its bottom surface in contact with the upper surface of the circuit board.

[0042] The above technical solution has the following beneficial effects: The circuit board is provided with a first limiting notch and a second limiting notch, which are arranged opposite to each other. The protective housing includes a support plate, a protective plate, a first latching plate, and a second latching plate. The bottom surface of the support plate is connected to the top surface of a supporting protrusion so that the supporting protrusion supports the support plate. One end of the protective plate is connected to the support plate, and the protective plate covers the light emitting component and the light receiving component to protect them. One side of the first latching plate is connected to one side of the protective plate, and the other side of the first latching plate is connected to the circuit board. One side of the second latching plate is connected to the other side of the protective plate, and the other side of the second latching plate is connected to the circuit board. The first latching plate includes a first latching part, which is disposed at the first limiting notch to limit the position of the protective housing in the length direction of the circuit board. The first latching plate includes a second latching part, which is connected to the upper surface of the circuit board to support the protective housing. The second latching plate includes a third latching part, which is disposed at the second limiting notch to limit the position of the protective housing in the length direction of the circuit board. The second latching plate includes a fourth latching part, which is connected to the upper surface of the circuit board to support the protective housing.

[0043] In some embodiments, an optical module is provided, wherein the first latching portion includes:

[0044] The first sub-clamping part is connected to one side of the protective plate at the top, and its inner surface is connected to the inner wall of the first limiting notch.

[0045] The second sub-connector is connected at the top to the bottom of the first sub-connector, located below the circuit board, and bent inward relative to the first sub-connector.

[0046] The third latching portion includes:

[0047] The third sub-clamping part is connected at the top to the other side of the protective plate, and its inner surface is connected to the inner wall of the second limiting notch;

[0048] The fourth sub-connector is connected at the top to the bottom of the third sub-connector, located below the circuit board, and bent inward relative to the third sub-connector.

[0049] The above technical solution has the following beneficial effects: The first latching part includes a first sub-latching part and a second sub-latching part. The top of the first sub-latching part is connected to one side of the protective plate, and the top of the second sub-latching part is connected to the bottom of the first sub-latching part. The inner surface of the first sub-latching part is connected to the inner wall of the first limiting notch. The second sub-latching part is located below the circuit board and is bent inward relative to the first sub-latching part, reducing the probability of the protective shell detaching from the circuit board in the height direction. The second latching part includes a third sub-latching part and a fourth sub-latching part. The top of the third sub-latching part is connected to the other side of the protective plate, and the top of the fourth sub-latching part is connected to the bottom of the third sub-latching part. The inner surface of the third sub-latching part is connected to the inner wall of the second limiting notch. The fourth sub-latching part is located below the circuit board and is bent inward relative to the third sub-latching part, further reducing the probability of the protective shell detaching from the circuit board in the height direction, thus preventing the protective shell from detaching from the circuit board.

[0050] In some embodiments, an optical module is provided, the protection board comprising:

[0051] The first sub-protection board is connected to the first snap-on board on one side and covers the first optical receiving component;

[0052] The second sub-protection plate is connected to the other side of the first sub-protection plate on one side and covers the light emitting component;

[0053] The third sub-protection board is connected to the other side of the second sub-protection board on one side and to the second snap-fit ​​plate on the other side, and is covered on the second optical receiving component;

[0054] The bottom surface of the first sub-protection plate is recessed into the bottom surface of the second sub-protection plate.

[0055] The above technical solution has the following beneficial effects: The protective plate includes a first sub-protective plate, a second sub-protective plate, and a third sub-protective plate. One side of the first sub-protective plate is connected to a first snap-fit ​​plate, and the other side of the first sub-protective plate is connected to one side of the second sub-protective plate. The first sub-protective plate covers the first optical receiving component to protect it. The other side of the second sub-protective plate is connected to one side of the third sub-protective plate, and the second sub-protective plate covers the optical emitting component to protect it. The other side of the third sub-protective plate is connected to a second snap-fit ​​plate, and the third sub-protective plate covers the second optical receiving component to protect it. The height of the optical emitting component is lower than the height of the first and second optical receiving components. The bottom surfaces of both the first and third sub-protective plates are recessed into the bottom surface of the second sub-protective plate. This increases the strength of the protective shell while maintaining a safe distance between the optical emitting component, the first optical receiving component, the second optical receiving component, and the protective shell.

[0056] In some embodiments, an optical module is provided, wherein the circuit board is provided with:

[0057] The first support slot is located on the rear side of the embedding port and supports the first optical receiving component;

[0058] The second support slot is located on the front side of the embedding port and supports the second optical receiving component.

[0059] The above technical solution has the following beneficial effects: The circuit board is provided with a first carrier groove and a second carrier groove. The first carrier groove is located behind the insertion port and carries a first light receiving component, so that the first light receiving component is located behind the light emitting component, thereby making the first light receiving component and the light emitting component arranged side by side along the width direction of the circuit board. The second carrier groove is located in front of the insertion port and carries a second light receiving component, so that the second light receiving component is located in front of the light emitting component, thereby making the second light receiving component and the light emitting component arranged side by side along the width direction of the circuit board.

[0060] In some embodiments, an optical module is provided, wherein the optical emitting component includes:

[0061] An optical fiber array, located in the light-emitting direction of the laser chip array, includes:

[0062] First fiber optic array;

[0063] Second fiber optic array;

[0064] The support plate includes:

[0065] The first supporting surface is connected to the semiconductor cooler;

[0066] The adhesive dispensing surface has a second supporting surface and a supporting protrusion at one end, and the supporting protrusion at the other end; the second supporting surface is connected to the bottom surface of the first fiber array and the bottom surface of the second fiber array, one side of the supporting protrusion is connected to the side of the first fiber array, and the other side of the supporting protrusion is connected to the side of the second fiber array.

[0067] The above technical solution has the following beneficial effects: The light emitting component includes an optical fiber array, which is located in the light emission direction of the laser chip array to receive the light signal emitted by the laser chip array. The optical fiber array includes a first optical fiber array and a second optical fiber array, which are arranged side by side along the width direction of the circuit board. The support plate includes a first support surface and a dispensing surface. The first support surface is connected to the thermoelectric cooler to support the thermoelectric cooler. One end of the dispensing surface has a second support surface and a support protrusion, and the other end of the dispensing surface has a supporting protrusion. The second support surface is connected to the bottom surface of the first optical fiber array and the bottom surface of the second optical fiber array to support the first optical fiber array and the second optical fiber array. One side of the support protrusion is connected to the side of the first optical fiber array, and the other side of the support protrusion is connected to the side of the second optical fiber array to support the first optical fiber array and the second optical fiber array, which facilitates defining the position of the first optical fiber array and the second optical fiber array in the width direction of the support plate.

[0068] In some embodiments, an optical module is provided, comprising:

[0069] Circuit board;

[0070] Light emitting components;

[0071] A light receiving component is disposed on the circuit board;

[0072] A protective housing is provided over the light emitting component and the light receiving component;

[0073] The light emitting component includes:

[0074] Semiconductor coolers;

[0075] A laser chip array, disposed on the semiconductor cooler, is used to emit optical signals;

[0076] The optical receiving component includes:

[0077] First optical receiving component;

[0078] Second optical receiving component;

[0079] The circuit board is provided with:

[0080] The pad array is electrically connected to the laser chip array;

[0081] The pad group is electrically connected to the semiconductor cooler; the first light receiving component is located on the rear side of the light emitting component, the second light receiving component is located on the front side of the light emitting component, the distance between the first light receiving component and the second light receiving component and the edge of the light emitting component is smaller than the width dimension of the pad group, and the pad group and the pad array are both located on the right side of the light emitting component.

[0082] The above technical solution has the following beneficial effects: This disclosure provides an optical module, including a circuit board, an optical emitting component, an optical receiving component, and a protective housing. The optical receiving component is disposed on the circuit board, and the optical receiving component and the optical emitting component are arranged side by side along the width direction of the circuit board. Since the width of the circuit board is limited, the optical emitting component and the optical receiving component are arranged side by side along the width direction of the circuit board, and a protective housing is disposed on the optical emitting component and the optical receiving component to protect them. The optical emitting component includes a semiconductor cooler and a laser chip array. The laser chip array is disposed on the semiconductor cooler and is used to emit optical signals. The optical receiving component includes a first optical receiving component and a second optical receiving component. The first optical receiving component is located behind the optical emitting component, such that the first optical receiving component and the optical emitting component are arranged side by side along the width direction of the circuit board. The second optical receiving component is located in front of the optical emitting component, such that the first optical receiving component and the second optical receiving component are arranged side by side along the width direction of the circuit board. The circuit board has a pad array and a pad group. The pad array is electrically connected to the laser chip array, providing electrical signals to the laser chip array, which in turn causes the laser chip array to emit light signals. The pad group is electrically connected to a thermoelectric cooler, providing electrical signals to the thermoelectric cooler, which in turn controls the operating temperature. The distance between the first and second light receiving components and the edge of the light emitting component is smaller than the width of the pad group. Both the pad group and the pad array are located to the right of the light emitting component, allowing the first and second light receiving components to be positioned in front of and behind the light emitting component, thus enabling the light emitting and receiving components to be arranged side-by-side along the width of the circuit board.

[0083] In some embodiments, an optical module is provided, wherein the upper surface of the circuit board is provided with:

[0084] First limiting post;

[0085] Second limiting post;

[0086] The other end of the protective shell has:

[0087] The first support column has its bottom surface connected to the upper surface of the circuit board and stops at the first limiting column;

[0088] The second support column has its bottom surface connected to the upper surface of the circuit board and stops at the second limiting column.

[0089] The above technical solution has the following beneficial effects: A first limiting post and a second limiting post are provided on the upper surface of the circuit board. A first support post and a second support post are formed at the other end of the protective housing. The bottom surface of the first support post is connected to the upper surface of the circuit board, and the first support post stops at the first limiting post, thus limiting the position of the protective housing in the length direction of the circuit board and preventing the protective housing from contacting the photoelectric device on one side of the first limiting post. The bottom surface of the second support post is connected to the upper surface of the circuit board, and the second support post stops at the second limiting post, thus limiting the position of the protective housing in the length direction of the circuit board and preventing the protective housing from contacting the photoelectric device on one side of the second limiting post. Attached Figure Description

[0090] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0091] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments;

[0092] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0093] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0094] Figure 4 An exploded view of an optical module according to some embodiments;

[0095] Figure 5a This is an internal structural diagram of an optical module according to some embodiments;

[0096] Figure 5b This is an exploded view of the internal structure of an optical module according to some embodiments;

[0097] Figure 5c Partial breakdown of the internal structure of an optical module according to some embodiments Figure 1 ;

[0098] Figure 6 Partial breakdown of the internal structure of an optical module according to some embodiments Figure 2 ;

[0099] Figure 7 Partial breakdown of the internal structure of an optical module according to some embodiments Figure 3 ;

[0100] Figure 8a The structure of a protective housing provided according to some embodiments Figure 1 ;

[0101] Figure 8b The structure of a protective housing provided according to some embodiments Figure 2 ;

[0102] Figure 8c The structure of a protective housing provided according to some embodiments Figure 3 ;

[0103] Figure 8d This is a cross-sectional view of a protective housing provided according to some embodiments;

[0104] Figure 9a A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 1 ;

[0105] Figure 9b A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 2 ;

[0106] Figure 9c A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 3 ;

[0107] Figure 9d A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 4 . Detailed Implementation

[0108] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure are within the scope of protection of this disclosure.

[0109] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0110] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0111] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0112] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0113] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0114] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0115] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0116] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0117] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0118] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0119] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0120] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0121] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0122] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0123] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0124] Figure 2 This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0125] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0126] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0127] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0128] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0129] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0130] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0131] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0132] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component, the light receiving component, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0133] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0134] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0135] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0136] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0137] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0138] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0139] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0140] In some implementations, the gold fingers are located on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers are set on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is large.

[0141] In some implementations, the gold fingers of the circuit board extend from the electrical port and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0142] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0143] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0144] Figure 5a This is an internal structural diagram of an optical module according to some embodiments. Figure 5b This is an exploded view of the internal structure of an optical module according to some embodiments. Figure 5c Partial breakdown of the internal structure of an optical module according to some embodiments Figure 1 The length direction of the circuit board is left-right, and the width direction is front-back. For example... Figure 5a , Figure 5b and Figure 5c As shown, in some embodiments, the optical module includes an optical emitting component 400. The optical emitting component 400 is used to emit optical signals.

[0145] The optical emitting component 400 may include a laser chip array 420, which is used to emit at least one optical signal.

[0146] The light emitting component 400 may be a thermoelectric cooler (TEC) 410. A laser chip array 420 may be placed on the thermoelectric cooler 410 to control the operating temperature of the laser chip array 420 within a preset range of the target temperature.

[0147] In some embodiments, the thermoelectric cooler 410 may include a first electrode post 411 and a second electrode post 412, which are electrically connected to a driving circuit on the circuit board 300, respectively, so that the driving circuit provides a driving current to the thermoelectric cooler 410, enabling the thermoelectric cooler 410 to operate and thereby controlling the operating temperature of the laser chip array 420 within a preset range of a target temperature. In some embodiments, the optical module includes a light receiving component 500. The light receiving component 500 may be disposed on the surface of the circuit board 300. The light receiving component 500 is used to receive optical signals and convert the optical signals into electrical signals.

[0148] In some embodiments, the optical module includes a protective housing 900. The protective housing 900 may be disposed on the light emitting component 400 to protect the optoelectronic devices of the light emitting component 400. The protective housing 900 may be disposed on the light receiving component 500 to protect the optoelectronic devices of the light receiving component 500.

[0149] In some embodiments, a DSP chip 320 may be disposed on the surface of the circuit board 300. The DSP chip 320 may be connected to the optical emitting component 400 so that the DSP chip 320 can process the electrical signals transmitted by the optical network terminal through the gold fingers and transmit the electrical signals to the optical emitting component 400, so that the optical emitting component 400 can emit optical signals under the action of the electrical signals. The DSP chip 320 may be connected to the optical receiving component 500 so that the DSP chip 320 can process the electrical signals transmitted by the optical receiving component 500.

[0150] In some embodiments, a first limiting post 330 may be provided on the surface of the circuit board 300. The first limiting post 330 may be located between the protective housing 900 and the DSP chip 320. The first limiting post 330 may limit the position of the protective housing 900 in the length direction of the circuit board 300, preventing the protective housing 900 from contacting the DSP chip 320, thereby avoiding unnecessary pressure or interference to the DSP chip 320.

[0151] In some embodiments, a second limiting post 340 may be provided on the surface of the circuit board 300. The second limiting post 340 can limit the position of the protective housing 900 in the length direction of the circuit board 300, so as to prevent the protective housing 900 from contacting the DSP chip 320, thereby avoiding unnecessary pressure or interference to the DSP chip 320.

[0152] In some embodiments, the light emitting component 400 may be disposed on the surface of the circuit board 300.

[0153] In some embodiments, the circuit board 300 may have an insertion port 310. The light emitting component 400 may be disposed at the insertion port 310 of the circuit board 300 so that the light emitting path of the light emitting component 400 can be flush with the upper surface of the circuit board 300.

[0154] In some embodiments, the optical module further includes a support plate 900a. The support plate 900a can be embedded in the insertion port 310 to connect the support plate 900a to the circuit board 300. The central region of the support plate 900a can support the light emitting component 400. The edge regions of the support plate 900a can support the circuit board 300. The support plate 900a can be connected to the protective housing 900.

[0155] In some embodiments, the light receiving component 500 may include a first light receiving assembly 510. The first light receiving assembly 510 may be disposed on the rear side of the light emitting component 400, so that the first light receiving assembly 510 and the light emitting component 400 can be arranged side by side along the width direction of the circuit board 300. For example, the first light receiving assembly 510 may be located on the first side 313 of the insertion port 310.

[0156] In some embodiments, the light receiving component 500 may include a second light receiving assembly 520. The second light receiving assembly 520 may be disposed on the front side of the light emitting component 400, so that the second light receiving assembly 520 and the light emitting component 400 can be arranged side by side along the width direction of the circuit board 300. For example, the second light receiving assembly 520 may be located on the second side 312 of the insertion port 310.

[0157] The first optical receiving component 510 and the optical emitting component 400 can be arranged side by side along the width direction of the circuit board 300, and the second optical receiving component 520 and the optical emitting component 400 can be arranged side by side along the width direction of the circuit board 300. Therefore, the first optical receiving component 510, the optical emitting component 400 and the second optical receiving component 520 can be arranged side by side along the width direction of the circuit board 300.

[0158] Since the width of the circuit board 300 is limited, the first light receiving component 510, the light emitting component 400 and the second light receiving component 520 can be arranged side by side along the width direction of the circuit board 300. In some embodiments, the protective housing 900 can be covered on the light emitting component 400 and the light receiving component 500 to protect the optoelectronic devices of the light emitting component 400 and the light receiving component 500.

[0159] Figure 6 Partial breakdown of the internal structure of an optical module according to some embodiments Figure 2 .like Figure 6 As shown, in some embodiments, the circuit board 300 may include a first carrier groove 370 for carrying a first light receiving component 510. The first carrier groove 370 may be located on the rear side of the insertion port 310 so that the first light receiving component 510 can be arranged side by side with the first light emitting component and the second light emitting component in the width direction. For example, the first carrier groove 370 may be located on the first side 313 of the insertion port 310.

[0160] In some embodiments, the first support groove 370 is recessed into the surface of the circuit board 300 so that the first light receiving component 510 can be securely embedded therein, avoiding shaking or misalignment during the operation of the optical module, thereby ensuring stable transmission of the optical signal. Furthermore, a conductive connection point may be provided at the bottom of the first support groove 370 for electrical connection with the electrical connection portion of the first light receiving component 510, thereby ensuring the normal operation of the light receiving component.

[0161] In some embodiments, the circuit board 300 may include a second carrier groove 380 for carrying a second light receiving component 520. The second carrier groove 380 may be located on the front side of the insertion port 310 so that the second light receiving component 520 can be arranged side by side with the first light emitting component and the second light emitting component in the width direction. For example, the second carrier groove 380 may be located on the second side 312 of the insertion port 310, and the first side 313 and the second side 312 may be arranged opposite to each other.

[0162] In some embodiments, the second support groove 380 is recessed into the surface of the circuit board 300 so that the second light receiving component 520 can be securely embedded therein, preventing shaking or misalignment during the operation of the optical module, thereby ensuring stable transmission of the optical signal. Furthermore, a conductive connection point may be provided at the bottom of the second support groove 380 for electrical connection with the electrical connection portion of the second light receiving component 520, thereby ensuring the normal operation of the light receiving component.

[0163] In some embodiments, a pad array 350 may be provided on the surface of the circuit board 300. The pad array 350 may be disposed on one side of the insertion port 310. The pad array 350 may be electrically connected to a laser chip array, so that the laser chip array emits an optical signal under the action of an electrical signal. For example, the pad array 350 includes at least one pad electrically connected to a laser chip, so that the laser chip emits one optical signal under the action of an electrical signal, thereby causing the laser chip array to emit multiple optical signals.

[0164] In some embodiments, a pad group 360 may be provided on the surface of the circuit board 300. The pad group 360 may be provided on one side of the insertion port 310. One end of the pad group 360 may be electrically connected to the drive circuit, and the other end of the pad group 360 may be electrically connected to the thermoelectric cooler 410, so that the drive circuit is electrically connected to the thermoelectric cooler 410.

[0165] In some embodiments, the pad group 360 may include a first pad 361 and a second pad 362. The first pad 361 may be connected to the first electrode post 411 via a first wire bonding, and the second pad 362 may be connected to the second electrode post 412 via a second wire bonding, so that the pad group 360 is electrically connected to the thermoelectric cooler 410.

[0166] In some embodiments, along the width direction of the circuit board 300, the distance between the first pad 361 and the first electrode post 411 is greater than the distance between the second pad 362 and the first electrode post 411, and the distance between the first pad 361 and the second electrode post 412 is greater than the distance between the second pad 362 and the second electrode post 412. This avoids the first and second bonding wires crossing each other, thus preventing signal crosstalk. For example, the first pad 361 may be located behind the second pad 362, and the first electrode post 411 and the second electrode post 412 may be located in front of the second pad 362. This also avoids the first and second bonding wires crossing each other, thus preventing signal crosstalk.

[0167] In some embodiments, the pad array 350 and the pad group 360 may be located on different sides of the insertion port 310. For example, the pad array 350 may be disposed on the first side 311 (i.e., the right side of the insertion port 310), and the pad group 360 may be disposed on the first side 313 (i.e., the rear side of the insertion port 310) or the second side 312 (i.e., the front side of the insertion port 310).

[0168] The distances between the first light receiving component 510 and the second light receiving component 520 and the edge of the embedding port 310 are both less than the width of the pad group 360. That is, the distances between the first light receiving component 510 and the second light receiving component 520 and the edge of the light emitting component 400 are both less than the width of the pad group 360. The pad array 350 and the pad group 360 are located on different sides of the embedding port 310, which results in limited space on the circuit boards 300 on both sides of the light emitting component 400, making it impossible to accommodate the first light receiving component 510 or the second light receiving component 520. This prevents the light emitting component 400 and the light receiving component 500 from being arranged side by side along the width direction of the circuit board 300.

[0169] To address this issue, in some embodiments, the pad array 350 and the pad group 360 can be located on the same side of the insertion port 310, providing accommodating space for the first light receiving component 510 and the second light receiving component 520 located on both sides of the light emitting component 400, such that the first light receiving component 510, the light emitting component 400, and the second light receiving component 520 are arranged side-by-side along the width direction of the circuit board 300. For example, both the pad array 350 and the pad group 360 can be located on the first side 311 of the insertion port 310 (i.e., the right side of the insertion port 310), meaning that the pad array 350 and the pad group 360 can be located on the right side of the light emitting component 400.

[0170] like Figure 6 As shown, in some embodiments, a first limiting notch 390 may be provided on the first side 313 of the insertion port 310. The first limiting notch 390 may be connected to the protective housing 900 and may limit the position of the protective housing 900 in the length direction of the circuit board.

[0171] In some implementations, a second limiting notch 391 may be provided on the second side 312 of the insert 310. The second limiting notch 391 may be connected to the protective housing 900 and may limit the position of the protective housing 900 in the length direction of the circuit board.

[0172] Figure 7 Partial breakdown of the internal structure of an optical module according to some embodiments Figure 3 .like Figure 7As shown, in some embodiments, the laser chip array 420 may include a first laser chip array 421, which can emit at least one optical signal. For example, the first laser chip array 421 may include four laser chips arranged side by side along the width of the circuit board to emit four optical signals.

[0173] The laser chip array 420 may include a second laser chip array 422, which can emit at least one optical signal. For example, the second laser chip array 422 may include four laser chips arranged side by side along the width of the circuit board to emit four optical signals.

[0174] In some embodiments, the light emitting component 400 may include a lens array 430. The lens array 430 may be located in the light emission direction of the laser chip array 420 to receive the light signal emitted by the laser chip array 420. The lens array 430 can converge the received light signal.

[0175] For example, lens array 430 may include a first lens array 431, which may be located in the light emission direction of the first laser chip array 421, and the number of lenses in the first lens array 431 is the same as the number of laser chips in the first laser chip array 421. Lens array 430 may also include a second lens array 432, which may be located in the light emission direction of the second laser chip array 422, and the number of lenses in the second lens array 432 is the same as the number of laser chips in the second laser chip array 422.

[0176] In some embodiments, the lenses of the lens array 430 may include converging lenses, so that the lens array 430 may include a converging lens array. The converging lens array can focus the optical signal emitted by the laser chip array 420.

[0177] In some embodiments, the lenses of the lens array 430 may include collimating lenses, so that the lens array 430 may include a collimating lens array. The collimating lens array may be located between the laser chip array 420 and the converging lens array. The collimating lens array can collimate the optical signal emitted by the laser chip array 420.

[0178] Because the optical signal between the converging lens array and the collimating lens array is collimated light, the distance between them can be short or long, facilitating the placement of more components. This flexibility not only increases the tolerance of the emitted optical path, making it more tolerant of changes in the position and angle of components, but also improves the stability of the emitted optical path.

[0179] In some embodiments, the light emitting component 400 may include an isolator array 440. The isolator array 440 can prevent optical signals from returning to the laser chip array 420 via their original path. The number of isolator arrays 440 is the same as the number of lens arrays 430, so that the isolators of the isolator array 440 correspond one-to-one with the lenses of the lens array 430. The isolator array 440 may include at least one isolator to prevent at least one optical signal from returning to the laser chip array 420 via its original path.

[0180] For example, isolator array 440 may include a first isolator array 441, which can prevent optical signals from returning to the first laser chip array 421 via their original path. Isolator array 440 may also include a second isolator array 442, which can prevent optical signals from returning to the second laser chip array 422 via their original path.

[0181] In some embodiments, the light emitting component 400 may include an optical fiber array 450. The optical fiber array 450 may be located in the converging direction of the lens array 430, so that the end face of the optical fiber of the optical fiber array 450 may be located at the focal point of the lens array 430, thereby enabling the optical fiber of the optical fiber array 450 to transmit optical signals.

[0182] For example, the fiber optic array 450 may include a first fiber optic array 451, which may be located in the convergence direction of the first lens array 431. The fiber optic array 450 may also include a second fiber optic array 452, which may be located in the convergence direction of the second laser chip array 422.

[0183] The first laser chip array 421, the first lens array 431, the first isolator array 441 and the first fiber array 451 constitute a first optical emitting component, and the second laser chip array 422, the second lens array 432, the second isolator array 442 and the second fiber array 452 constitute a second optical emitting component. The first optical emitting component and the second optical emitting component are arranged side by side along the width direction of the circuit board.

[0184] like Figure 7 As shown, in some embodiments, the top of the support plate 900a may include a first support surface 910a, which may support the thermoelectric cooler 410.

[0185] In some embodiments, the top of the support plate 900a may include a dispensing surface 940a for dispensing adhesive. One end of the dispensing surface 940a may protrude outward to form a second supporting surface 950a, which is connected to the bottom surfaces of the first fiber array 451 and the second fiber array 452, and can support the first fiber array 451 and the second fiber array 452. The dispensing surface 940a and the first supporting surface 910a may be arranged along the length direction of the support plate 900a, so that the optoelectronic devices, the first fiber array 451, and the second fiber array 452 on the semiconductor cooler 410 are arranged along the length direction of the support plate 900a.

[0186] In some embodiments, the other end of the dispensing surface 940a may protrude outward to form a support protrusion 980a. The top surface of the support protrusion 980a may be connected to the bottom surface of the protective housing 900 to support the protective housing 900.

[0187] In some embodiments, a snap-fit ​​protrusion 990a may be provided on the support protrusion 980a. The snap-fit ​​protrusion 990a may be disposed within the snap-fit ​​through hole 911 of the protective housing 900, which can define the position of the protective housing 900 in the length and width directions of the circuit board, preventing the protective housing 900 from detaching from the support plate 900a when subjected to force. In addition, the provision of the snap-fit ​​protrusion 990a and the snap-fit ​​through hole 911 also facilitates the quick assembly and disassembly of the support protrusion 980a and the protective housing 900, improving the assembly efficiency and maintainability of the optical module.

[0188] In some embodiments, a fulcrum surface 970a is formed by an inwardly recessed center of the adhesive dispensing surface 940a. The fulcrum surface 970a may be located between the second support surface 950a and the support protrusion 980a. The fulcrum surface 970a may be located in the projection area of ​​the first fiber array 451 and the second fiber array 452, and there is a gap between the fulcrum surface 970a and the first fiber array 451 and the second fiber array 452 to facilitate the separation of the first fiber array 451 and the second fiber array 452 from the support plate 900a by using the fulcrum surface 970a as a fulcrum.

[0189] In some embodiments, the top of the support plate 900a may include a third support surface 920a. The third support surface 920a may be located in the edge region of the support plate 900a, and the third support surface 920a may be connected to the lower surface of the side of the insertion port 310 to support the circuit board 300. The third support surface 920a may be recessed into the dispensing surface 940a.

[0190] In some embodiments, the top of the support plate 900a may include a fourth support surface 930a. The fourth support surface 930a may be located between 910a and the second support surface 950a, and the fourth support surface 930a may support the first isolator array 441 and the second isolator array 442. There may be a height difference between 910a and the fourth support surface 930a, so that the light signal converged by the first lens array 431 placed above the thermoelectric cooler 410 can pass through the first isolator array 441, and the light signal converged by the second lens array 432 can pass through the second isolator array 442.

[0191] In some embodiments, the top of the support plate 900a may include a support protrusion 960a. The support protrusion 960a may be located on the adhesive dispensing surface 940a. The support protrusion 960a may be disposed along the length direction of the support plate 900a.

[0192] In some embodiments, one side of the first fiber array 451 may abut against one side of the supporting protrusion 960a, and one side of the second fiber array 452 may abut against the other side of the supporting protrusion 960a. The first fiber array 451 and the second fiber array 452 can be supported, which facilitates defining the position of the first fiber array 451 and the second fiber array 452 in the width direction of the support plate 900a.

[0193] In some embodiments, one side of the first isolator array 441 may abut against one side of the supporting protrusion 960a, and one side of the second isolator array 442 may abut against the other side of the supporting protrusion 960a, so as to define the position of the first isolator array 441 and the second isolator array 442 in the width direction of the support plate 900a.

[0194] Figure 8a The structure of a protective housing provided according to some embodiments Figure 1 . Figure 8b The structure of a protective housing provided according to some embodiments Figure 2 . Figure 8c The structure of a protective housing provided according to some embodiments Figure 3 .like Figure 8a , Figure 8b and Figure 8c As shown, in some embodiments, the protective housing 900 may include a support plate 910. The bottom surface of the support plate 910 may be in contact with the top surface of the support protrusion 980a of the support plate 900a, so that the support protrusion 980a can support the support plate 910.

[0195] In some embodiments, the support plate 910 may be provided with a snap-fit ​​through hole 911. The snap-fit ​​through hole 911 may be placed on the snap-fit ​​protrusion 990a of the support plate 900a to define the position of the protective housing 900 in the length and width directions of the circuit board, so as to prevent the protective housing 900 from detaching from the support plate 900a when subjected to force.

[0196] In some embodiments, the shape of the snap-fit ​​through hole 911 matches that of the snap-fit ​​protrusion 990a, the length of the snap-fit ​​through hole 911 is greater than or equal to the length of the snap-fit ​​protrusion 990a, and the width of the snap-fit ​​through hole 911 is greater than or equal to the width of the snap-fit ​​protrusion 990a, so that the snap-fit ​​protrusion 990a can be placed inside the snap-fit ​​through hole 911.

[0197] In some embodiments, the protective housing 900 may include a protective plate 920. A first end of the protective plate 920 may be connected to a support plate 910. A second end of the protective plate 920 may be connected to the surface of the circuit board 300 so that the circuit board 300 can support the protective plate 920. The protective plate 920 may cover the first light receiving component 510, the second light receiving component 520, and the light emitting component 400 to protect the first light receiving component 510, the second light receiving component 520, and the light emitting component 400.

[0198] In some embodiments, the protective housing 900 may include a first snap-fit ​​plate 930. The first snap-fit ​​plate 930 may be connected to one side of the protective plate 920. The first snap-fit ​​plate 930 may be connected to the circuit board 300.

[0199] The first latching plate 930 may include a first latching portion 931. The first latching portion 931 may be disposed at the first limiting notch 390 to limit the position of the protective housing 900 in the length direction of the circuit board 300.

[0200] The first latching plate 930 may include a second latching portion 932. The second latching portion 932 may contact the surface of the circuit board 300 so that the circuit board 300 supports the protective housing 900.

[0201] The first mounting plate 930 may include a first clearance portion 933. There is a gap between the first clearance portion 933 and the surface of the circuit board 300 to avoid optoelectronic devices on the circuit board 300.

[0202] In some embodiments, the first latching portion 931 protrudes from the second latching portion 932 so that when the second latching portion 932 is in contact with the surface of the circuit board 300, the first latching portion 931 can be latched at the first limiting notch 390 of the circuit board 300.

[0203] In some embodiments, the protective housing 900 may include a second snap-fit ​​plate 940. The second snap-fit ​​plate 940 may be connected to the other side of the protective plate 920. The second snap-fit ​​plate 940 may be connected to the circuit board 300.

[0204] The second latching plate 940 may include a third latching portion 941. The third latching portion 941 may be disposed at the second limiting notch 391 to limit the position of the protective housing 900 in the length direction of the circuit board 300.

[0205] The second latching plate 940 may include a fourth latching portion 942. The fourth latching portion 942 may contact the surface of the circuit board 300 so that the circuit board 300 supports the protective housing 900.

[0206] The second mounting plate 940 may include a second clearance portion 943. The second clearance portion 943 has a gap with the surface of the circuit board 300 to avoid photoelectric devices on the circuit board 300.

[0207] In some embodiments, the third latching portion 941 protrudes from the fourth latching portion 942, so that when the fourth latching portion 942 is in contact with the surface of the circuit board 300, the third latching portion 941 can be latched at the second limiting notch 391 of the circuit board 300.

[0208] In some embodiments, a first support post 924 may be provided at the second end of the protective plate 920. The first support post 924 may be connected to the surface of the circuit board 300 to support the protective housing 900. The first support post 924 may stop at the first limiting post 330 to prevent the first support post 924 from connecting with the DSP chip 320, thereby avoiding unnecessary pressure or interference to the DSP chip 320.

[0209] The second end of the protection plate 920 may be provided with a second support post 925. The second support post 925 may be connected to the surface of the circuit board 300 to support the protective housing 900. The second support post 925 may be stopped at the second limiting post 340 to prevent the second support post 925 from being connected to the DSP chip 320, thereby avoiding unnecessary pressure or interference to the DSP chip 320.

[0210] In some embodiments, a first clearance notch 926 may be provided at the second end of the protection plate 920. The first clearance notch 926 can avoid photoelectric devices on the circuit board 300. A second clearance notch 927 may be provided at the second end of the protection plate 920. The second clearance notch 927 can avoid photoelectric devices on the circuit board 300.

[0211] In some embodiments, the protection plate 920 may include a first sub-protection plate 921. One side of the first sub-protection plate 921 may be connected to the first snap-fit ​​plate 930. The first sub-protection plate 921 may cover the first optical receiving assembly 510 to protect the first optical receiving assembly 510.

[0212] In some embodiments, the protective plate 920 may include a second sub-protective plate 922. One side of the second sub-protective plate 922 may be connected to the other side of the first sub-protective plate 921. One end of the second sub-protective plate 922 may be connected to the support plate 910. The second sub-protective plate 922 may cover the light emitting component 400 to protect the light emitting component 400.

[0213] In some embodiments, the protective plate 920 may include a third sub-protective plate 923. One side of the third sub-protective plate 923 may be connected to the other side of the second sub-protective plate 922. The other side of the third sub-protective plate 923 may be connected to the second snap-fit ​​plate 940. The third sub-protective plate 923 may cover the second optical receiving assembly 520 to protect the second optical receiving assembly 520.

[0214] In some embodiments, the bottom surface of the support plate 910 is flush with the bottom surface of the second sub-protective plate 922.

[0215] In some embodiments, the bottom surface of the support plate 910 is not at the same height as the bottom surface of the second sub-protective plate 922, which can increase the strength of the protective housing 900. For example, the bottom surface of the support plate 910 protrudes from the bottom surface of the second sub-protective plate 922, or the bottom surface of the support plate 910 is recessed into the bottom surface of the second sub-protective plate 922.

[0216] Since the top surface of the light emitting component 400 is higher than the top surface of the supporting protrusion 980a, the bottom surface of the support plate 910 protrudes beyond the bottom surface of the second sub-protective plate 922, so that when the supporting protrusion 980a supports the support plate 910, the second sub-protective plate 922 can cover the light emitting component 400.

[0217] The distance between the bottom surface of the protection plate 920 and the top surface of the light emitting component 400 and the light receiving component 500 is greater than or equal to the safe distance, which can prevent the protection plate 920 from interfering with the light emitting component 400 and the light receiving component 500.

[0218] The top surfaces of the first optical receiving component 510 and the second optical receiving component 520 are higher than the top surface of the optical emitting component 400. In order to avoid interference, in some embodiments, the bottom surfaces of the first sub-protective plate 921, the second sub-protective plate 922 and the third sub-protective plate 923 are flush. The distance between the bottom surface of the second sub-protective plate 922 and the top surface of the optical emitting component 400 is greater than or equal to the safety distance, and the distance between the bottom surface of the second sub-protective plate 922 and the top surface of the optical emitting component 400 is greater than the distance between the bottom surface of the second sub-protective plate 922 and the top surface of the first optical receiving component 510.

[0219] In some embodiments, the bottom surfaces of the first sub-protective plate 921 and the third sub-protective plate 923 are recessed into the bottom surface of the second sub-protective plate 922. The distance between the bottom surface of the second sub-protective plate 922 and the top surface of the light emitting component 400 is greater than or equal to the safe distance. The distance between the bottom surface of the second sub-protective plate 922 and the top surface of the light emitting component 400 is equal to the distance between the bottom surface of the second sub-protective plate 922 and the top surface of the first light receiving component 510. This can increase the strength of the protective plate 920 while maintaining the safe distance between the light emitting component 400, the first light receiving component 510, the second light receiving component 520 and the protective plate 920.

[0220] Figure 8d This is a cross-sectional view of a protective housing provided according to some embodiments. Figure 8d As shown, in some embodiments, the first latching portion 931 includes a first sub-latching portion 9311, the top of which can be connected to the first sub-protective plate 921. The first sub-latching portion 9311 can be vertically arranged along the height direction of the circuit board 300. The inner surface of the first sub-latching portion 9311 can be connected to the inner wall of the first limiting notch 390 of the circuit board 300.

[0221] The first latching portion 931 includes a second sub-latching portion 9312, the top of which can connect to the bottom of the first sub-latching portion 9311. The second sub-latching portion 9312 can be disposed below the circuit board 300. The second sub-latching portion 9312 can be bent inward relative to the first sub-latching portion 9311, reducing the probability of the protective housing 900 detaching from the circuit board 300 in the height direction of the circuit board.

[0222] In some embodiments, the third latching portion 941 includes a third sub-latching portion 9411, the top of which can be connected to the third sub-protective plate 923. The third sub-latching portion 9411 can be vertically arranged along the height direction of the circuit board 300. The inner surface of the third sub-latching portion 9411 can be connected to the inner wall of the second limiting notch 391 of the circuit board 300.

[0223] The third latching portion 941 includes a fourth sub-latching portion 9412, the top of which can connect to the bottom of the third sub-latching portion 9411. The fourth sub-latching portion 9412 can be disposed below the circuit board 300. The fourth sub-latching portion 9412 can be bent inward relative to the third sub-latching portion 9411, further reducing the probability of the protective housing 900 detaching from the circuit board 300 in the height direction of the circuit board, and preventing the protective housing 900 from detaching from the circuit board 300.

[0224] Figure 9a A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 1 .like Figure 9a As shown, the snap-fit ​​protrusion 990a is disposed in the snap-fit ​​through hole 911.

[0225] Figure 9b A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 2 .like Figure 9b As shown, the first locking part 931 is disposed at the first limiting notch 390, and the third locking part 941 is disposed at the second limiting notch 391.

[0226] like Figure 9b As shown, the first sub-connector 9311 of the first latching part 931 is in contact with the bottom surface of the first limiting notch 390, the second sub-connector 9312 of the first latching part 931 is disposed below the circuit board 300, the third sub-connector 9411 of the third latching part 941 is in contact with the bottom surface of the second limiting notch 391, and the fourth sub-connector 9412 of the third latching part 941 is disposed below the circuit board 300.

[0227] Figure 9c A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 3 .like Figure 9c As shown, the bottom surface of the second latching part 932 is in contact with the surface of the circuit board 300, and the bottom surface of the fourth latching part 942 is in contact with the surface of the circuit board 300.

[0228] Figure 9d A cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 4 .like Figure 9d As shown, there is a gap between the bottom surface of the first clearance part 933 and the surface of the circuit board 300, and there is a gap between the bottom surface of the second clearance part 943 and the surface of the circuit board 300.

[0229] like Figure 9d As shown, the bottom surface of the first support column 924 is in contact with the surface of the circuit board 300, and the bottom surface of the second support column 925 is in contact with the surface of the circuit board 300.

[0230] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module characterized by comprising: include: The circuit board has an insertion slot. The light emitting component is embedded in the embedding port; A light receiving component is disposed on the circuit board; A protective housing is provided over the light emitting component and the light receiving component; The light emitting component includes: Semiconductor coolers; A laser chip array, disposed on the semiconductor cooler, is used to emit optical signals; The optical receiving component includes: a first optical receiving assembly; Second optical receiving component; The circuit board is provided with: The pad array is electrically connected to the laser chip array; The pad group is electrically connected to the semiconductor cooler; the first light receiving component is located on the rear side of the embedding port, the second light receiving component is located on the front side of the embedding port, the distance between the first light receiving component and the second light receiving component and the edge of the embedding port is smaller than the width of the pad group, and the pad group and the pad array are both located on the right side of the embedding port.

2. The optical module according to claim 1, characterized by One end of the protective housing has a snap-fit ​​through hole; The optical module also includes: The support plate, embedded in the embedding port, supports the light emitting component and has the following characteristics: A support protrusion has its top surface connected to the bottom surface of one end of the protective housing; a snap-fit ​​protrusion is provided on the support protrusion and is located inside the snap-fit ​​through hole.

3. The optical module according to claim 1, characterized by The upper surface of the circuit board is provided with: First limiting post; The other end of the protective shell has: The first support column has its bottom surface connected to the upper surface of the circuit board and stops at the first limiting column.

4. The optical module according to claim 2, characterized by The circuit board is provided with: a first limiting notch; Second limiting gap; The protective housing includes: The bottom surface of the support plate is connected to the top surface of the support protrusion; A protective plate, one end of which is connected to the support plate, covers the light emitting component and the light receiving component; The first snap-fit ​​board, with one side connected to one side of the protection board and the other side connected to the circuit board, includes: The first snap-fit ​​portion is disposed at the first limiting notch; The bottom surface of the second snap-fit ​​part is in contact with the upper surface of the circuit board; The second snap-on board, with one side connected to the other side of the protection board and the other side connected to the circuit board, includes: The third locking part is provided at the second limiting notch; The fourth snap-fit ​​part has its bottom surface in contact with the upper surface of the circuit board.

5. The optical module according to claim 4, characterized by The first latching part includes: The first sub-clamping part is connected to one side of the protective plate at the top, and its inner surface is connected to the inner wall of the first limiting notch. The second sub-connector is connected at the top to the bottom of the first sub-connector, located below the circuit board, and bent inward relative to the first sub-connector. The third latching portion includes: The third sub-clamping part is connected at the top to the other side of the protective plate, and its inner surface is connected to the inner wall of the second limiting notch; The fourth sub-connector is connected at the top to the bottom of the third sub-connector, located below the circuit board, and bent inward relative to the third sub-connector.

6. The optical module according to claim 4, characterized in that, The protective plate includes: The first sub-protection board is connected to the first snap-on board on one side and covers the first optical receiving component; The second sub-protection plate is connected to the other side of the first sub-protection plate on one side and covers the light emitting component; The third sub-protection board is connected to the other side of the second sub-protection board on one side and to the second snap-fit ​​plate on the other side, and is covered on the second optical receiving component; The bottom surface of the first sub-protection plate is recessed into the bottom surface of the second sub-protection plate.

7. The optical module of claim 1, wherein, The circuit board is provided with: The first support slot is located on the rear side of the embedding port and supports the first optical receiving component; The second support slot is located on the front side of the embedding port and supports the second optical receiving component.

8. The optical module of claim 2, wherein, The light emitting component includes: An optical fiber array, located in the light-emitting direction of the laser chip array, includes: First fiber optic array; Second fiber optic array; The support plate includes: The first supporting surface is connected to the semiconductor cooler; The adhesive dispensing surface has a second supporting surface and a supporting protrusion at one end, and the supporting protrusion at the other end; the second supporting surface is connected to the bottom surface of the first fiber array and the bottom surface of the second fiber array, one side of the supporting protrusion is connected to the side of the first fiber array, and the other side of the supporting protrusion is connected to the side of the second fiber array.

9. An optical module characterized by comprising: include: Circuit board; Light emitting components; A light receiving component is disposed on the circuit board; A protective housing is provided over the light emitting component and the light receiving component; The light emitting component includes: Semiconductor coolers; A laser chip array, disposed on the semiconductor cooler, is used to emit optical signals; The optical receiving component includes: a first optical receiving assembly; Second optical receiving component; The circuit board is provided with: The pad array is electrically connected to the laser chip array; The pad group is electrically connected to the semiconductor cooler; the first light receiving component is located on the rear side of the light emitting component, the second light receiving component is located on the front side of the light emitting component, the distance between the first light receiving component and the second light receiving component and the edge of the light emitting component is smaller than the width dimension of the pad group, and the pad group and the pad array are both located on the right side of the light emitting component.

10. The optical module according to claim 9, characterized by The upper surface of the circuit board is provided with: First limiting post; Second limiting post; The other end of the protective shell has: The first support column has its bottom surface connected to the upper surface of the circuit board and stops at the first limiting column; The second support column has its bottom surface connected to the upper surface of the circuit board and stops at the second limiting column.

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