Immersion liquid-cooled supercomputing battery cell array device based on microchannel enhanced heat transfer

Abstract

This invention relates to the field of heat dissipation technology for electronic devices, specifically to an immersion liquid-cooled supercomputing cell array device based on microchannel-enhanced heat transfer. The device includes a sealed enclosure and a computing chip array housed within it, as well as a heat-conducting flat tube disposed within the computing chip array. The heat-conducting flat tube has a microchannel structure inside. The sealed enclosure has an inlet circuit and an outlet circuit connected to the heat-conducting flat tube. By incorporating the heat-conducting flat tube with an internal microchannel structure, the effective heat exchange area between the coolant and the computing chips can be significantly increased, enhancing heat transfer efficiency. Combined with the inlet and outlet circuits, uniform coolant distribution can be achieved, avoiding localized flow imbalances. Simultaneously, the insulating coolant circulating within the sealed enclosure through a first and second connecting pipe forms dual liquid cooling, rapidly removing core heat from the chip array, eliminating localized hot spots, and balancing the overall temperature, ultimately significantly improving the heat dissipation performance and long-term operational stability of the supercomputing chip array.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, specifically to an immersion liquid-cooled supercomputing cell array device based on microchannel enhanced heat transfer. Background Technology

[0002] As supercomputers rapidly develop towards higher density and higher computing power, the power consumption and heat generation of their core computing chip arrays are increasing exponentially. Heat dissipation efficiency has become a key bottleneck restricting the performance improvement, operational stability, and lifespan of supercomputing systems.

[0003] Current heat dissipation solutions for computing chip arrays have significant limitations. Traditional air cooling technology is limited by the inherent characteristic of low thermal conductivity of air, making it difficult to meet the concentrated heat dissipation requirements of high-density chips. This can easily lead to chip frequency reduction or even failure due to localized overheating. Even when using a single immersion liquid cooling technology, the effective heat exchange area between the coolant and the chip is often insufficient, making it impossible to quickly remove a large amount of heat from the core area of ​​the array. This results in localized hot spots and uneven temperature distribution in the chip array. To address these issues, this invention proposes an immersion liquid-cooled supercomputing battery cell array device based on microchannel-enhanced heat transfer to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide an immersion liquid-cooled supercomputing battery cell array device based on microchannel enhanced heat transfer. By combining microchannel heat-conducting flat tubes with dual liquid cooling, the heat exchange area is increased, local hot spots are eliminated, and heat dissipation efficiency is improved, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an immersion liquid-cooled supercomputing cell array device based on microchannel enhanced heat transfer, comprising a sealed housing and a computing chip array disposed therein, and further comprising a heat-conducting flat tube disposed in the computing chip array, wherein the heat-conducting flat tube has a microchannel structure inside;

[0006] The sealed housing is equipped with an inlet circuit and an outlet circuit connected to the heat-conducting flat tube. The coolant flows into the microchannel structure inside the heat-conducting flat tube through the inlet circuit, exchanges heat with the computing chip array, and then flows out through the outlet circuit.

[0007] Preferably, the liquid inlet circuit includes a liquid inlet pipe, a first branch pipe and a plurality of first convex pipes connected in sequence, wherein the first convex pipes are connected to the heat-conducting flat pipe.

[0008] Preferably, the liquid outlet circuit includes a plurality of second convex tubes, second branch tubes and liquid outlet tubes connected in sequence, wherein the second convex tubes are connected to the heat-conducting flat tube.

[0009] Preferably, the computing chip array consists of multiple rows of computing chips, and the heat-conducting flat tube is disposed between every two rows of computing chips and is in close contact with the sides of these two rows of computing chips.

[0010] Preferably, the sealed enclosure is filled with insulating coolant, and the enclosure is provided with a first connecting pipe and a second connecting pipe for guiding the insulating coolant into and out of the sealed enclosure.

[0011] Preferably, the heat-conducting flat tube is tightly bonded to the side of the computing chip via a heat-conducting medium.

[0012] Preferably, the microchannel structure is composed of multiple microchannels with rectangular cross-sections.

[0013] Preferably, the inlet pipe and the outlet pipe are connected to an external circulation pump and a heat exchanger.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] By incorporating heat-conducting flat tubes with internal microchannel structures, the effective heat exchange area between the coolant and the computing chip can be significantly increased, enhancing heat transfer efficiency. Combined with inlet and outlet circuits, the coolant can be evenly distributed, avoiding local flow imbalances. Simultaneously, the insulating coolant circulating through the first and second connecting pipes within the sealed enclosure forms dual liquid cooling, which can quickly remove heat from the core of the chip array, eliminate local hot spots, and balance the overall temperature, ultimately significantly improving the heat dissipation performance and long-term operational stability of the supercomputing chip array. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0017] Figure 2 This is a schematic diagram of the computing chip structure of the present invention.

[0018] Figure 3 This is a schematic diagram of the heat-conducting flat tube structure of the present invention.

[0019] Figure 4 This is a schematic diagram of the internal structure of the first convex tube of the present invention.

[0020] Figure 5 This is a schematic diagram of the microchannel structure of the present invention.

[0021] In the diagram: 1. Sealed housing; 2. Inlet pipe; 3. First branch pipe; 4. First convex pipe; 5. First connecting pipe; 6. Second connecting pipe; 7. Computing chip; 8. Thermally conductive flat tube; 9. Second convex pipe; 10. Second branch pipe; 11. Outlet pipe; 12. Microchannel structure. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] Please see Figures 1 to 5 This invention provides a technical solution: an immersion liquid-cooled supercomputing cell array device based on microchannel enhanced heat transfer, comprising a sealed housing 1 and a computing chip array disposed therein. The sealed housing 1 is used to accommodate the computing chip array and heat dissipation structure, and the housing as a whole has good sealing performance to prevent internal coolant leakage. The computing chip array consists of multiple rows of parallel-arranged computing chips 7, with a heat-conducting flat tube 8 tightly disposed between every two rows of computing chips 7. The space between the heat-conducting flat tube 8 and the side of the computing chip 7 is filled with thermally conductive silicone grease or other highly thermally conductive medium to ensure a tight and gapless fit, thereby minimizing contact thermal resistance and achieving rapid heat conduction.

[0025] like Figure 5 As shown, the interior of the heat-conducting flat tube 8 has multiple parallel rectangular cross-section microchannel structures 12 along its length. These microchannel structures 12 can significantly increase the contact area between the coolant and the inner wall of the heat-conducting flat tube 8, thereby improving the heat transfer efficiency.

[0026] like Figure 2 as well as Figure 3 As shown, the outer side of the sealed housing 1 is connected to the heat-conducting flat tube 8 via an inlet circuit and an outlet circuit. The inlet circuit consists of an inlet pipe 2, a first distribution pipe 3, and multiple first convex pipes 4 connected in sequence. One end of the inlet pipe 2 is connected to an external circulation pump, and the other end is sealed to one end of the first distribution pipe 3. The first distribution pipe 3 is horizontally arranged, and an interface is provided on its body corresponding to each heat-conducting flat tube 8. Each interface is sealed to one end of the corresponding heat-conducting flat tube 8 through a first convex pipe 4, ensuring that the externally supplied coolant can be evenly distributed to each heat-conducting flat tube 8 through the first distribution pipe 3.

[0027] like Figure 2as well as Figure 3 As shown, the liquid outlet circuit corresponds to the liquid inlet circuit structure and is composed of multiple second convex tubes 9, second diversion tubes 10, and liquid outlet pipes 11 connected in sequence. The other end of each heat-conducting flat tube 8 is sealed and connected to the corresponding interface of the second diversion tube 10 through a second convex tube 9. One end of the second diversion tube 10 is sealed and connected to one end of the liquid outlet pipe 11, and the other end of the liquid outlet pipe 11 is connected to the return end of the external heat exchanger to form a circulation path for the coolant. The way in which the liquid inlet pipe 2 and the liquid outlet pipe 11 are connected to the external circulation pump and the external heat exchanger to form a coolant circulation path is a conventional technology in the field. This connection and circulation principle does not involve any innovative improvement of the present invention and is a conventional technical means to realize coolant circulation in existing liquid cooling systems.

[0028] like Figure 1 and Figure 2 As shown, the sealed enclosure 1 is also filled with insulating coolant, and two interfaces are correspondingly opened on the side wall of the enclosure, which are connected to the first connecting pipe 5 and the second connecting pipe 6 respectively. The first connecting pipe 5 is used to replenish or circulate insulating coolant into the sealed enclosure 1, and the second connecting pipe 6 is used to export the insulating coolant after it has absorbed heat inside the enclosure. After being cooled by external cooling equipment, it is sent back to the enclosure through the first connecting pipe 5, forming an independent liquid cooling cycle inside the enclosure. The insulating coolant inside the sealed enclosure 1 continuously circulates through the first connecting pipe 5 and the second connecting pipe 6, absorbing the heat dissipated around the computing chip array and forming an auxiliary heat dissipation cycle. The two work together to achieve efficient heat dissipation of the computing chip array and avoid the generation of local hot spots.

[0029] In use, the coolant enters the first branch pipe 3 through the inlet pipe 2, and is then distributed to multiple parallel first convex pipes 4, and then flows into the heat-conducting flat pipe 8 which is closely arranged between every two rows of computing chips 7. The microchannel structure 12 inside it greatly increases the heat exchange area, and the coolant exchanges heat efficiently with the computing chip 7 here and absorbs a large amount of heat.

[0030] After absorbing heat, the coolant collects at the second convex tube 9 at the other end of the heat-conducting flat tube 8 and flows into the second branch tube 10 for collection, finally being discharged from the system through the outlet tube 11. At the same time, the sealed housing 1 is also filled with insulating coolant, which enters the housing through the first connecting pipe 5 and is discharged through the second connecting pipe 6, forming an immersion liquid cooling circuit, providing secondary cooling and temperature equalization for the entire cell array, thereby achieving a double-enhanced heat dissipation effect.

[0031] It should be noted that, in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0032] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An immersed liquid-cooled supercomputing cell array device based on microchannel heat transfer enhancement, comprising a sealed box (1) and a computing chip array arranged in the box, characterized in that: It also includes a heat-conducting flat tube (8) disposed in the computing chip array, wherein a microchannel structure (12) is provided inside the heat-conducting flat tube (8); The sealed housing (1) is provided with an inlet circuit and an outlet circuit connected to the heat-conducting flat tube (8). The coolant flows into the microchannel structure (12) inside the heat-conducting flat tube (8) through the inlet circuit, exchanges heat with the computing chip array, and then flows out through the outlet circuit.

2. The microchannel heat transfer enhanced immersion liquid-cooled supercomputing processor array device of claim 1, wherein: The liquid inlet circuit includes a liquid inlet pipe (2), a first branch pipe (3) and a plurality of first convex pipes (4) connected in sequence, and the first convex pipes (4) are connected to the heat-conducting flat pipe (8).

3. The microchannel heat transfer enhanced immersion liquid-cooled supercomputing processor array device of claim 2, wherein: The liquid outlet circuit includes a plurality of second convex tubes (9), second diversion tubes (10) and liquid outlet tubes (11) connected in sequence, and the second convex tubes (9) are connected to the heat-conducting flat tubes (8).

4. The immersion liquid-cooled supercomputing cell array device based on microchannel enhanced heat transfer according to claim 1, characterized in that: The computing chip array consists of multiple rows of computing chips (7), and the heat-conducting flat tube (8) is disposed between every two rows of computing chips (7) and is in close contact with the sides of these two rows of computing chips (7).

5. The microchannel heat transfer enhanced immersion liquid-cooled supercomputing processor core array device of claim 4, wherein: The sealed box (1) is filled with insulating coolant. The box is provided with a first connecting pipe (5) and a second connecting pipe (6) to guide the insulating coolant into and out of the sealed box (1).

6. The microchannel heat transfer enhanced immersion liquid-cooled supercomputing processor core array device of claim 4, wherein: The heat-conducting flat tube (8) is tightly attached to the side of the computing chip (7) through a heat-conducting medium.

7. The microchannel heat transfer based immersion liquid-cooled supercomputing processor array device of claim 1, wherein: The microchannel structure (12) is composed of multiple microchannels with rectangular cross sections.

8. The microchannel heat transfer based immersion liquid-cooled supercomputing processor array device of claim 3, wherein: The inlet pipe (2) and the outlet pipe (11) are connected to an external circulation pump and a heat exchanger.

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