Test equipment

Abstract

This application relates to the field of chips, specifically disclosing a testing device. The testing device includes a housing and a support frame. The support frame is disposed within the housing, and multiple support structures are spaced apart along the height of the support frame. A receiving layer is formed between adjacent support structures, and a partition plate connects adjacent support structures, dividing each receiving layer into a first receiving area and a second receiving area. In each receiving layer, multiple test fixtures are mounted on the portion of the support structure located in the first receiving area, and multiple test motherboards are placed on the portion of the support structure located in the second receiving area. Each test fixture is provided with multiple test interfaces, which are used to connect to test hard drives of different specifications, and each test interface is connected to the test motherboard via a connecting cable. This application, through the above methods, improves the problem of limited test product types in testing equipment and increases testing capacity.

Description

Technical Field

[0001] This application relates to the field of chips, and more particularly to a testing device. Background Technology

[0002] To test hard drive performance, long-term stress tests are often conducted. This typically involves simulating the required test environment in a testing device and using that device to monitor changes in relevant hard drive parameters during extended operation to determine if the hard drive's performance meets standards.

[0003] Traditional testing equipment has a limited range of testing interfaces and a small number of hard drive test bits, which limits the types and quantities of hard drives it can test, resulting in low testing productivity.

[0004] Therefore, how to improve the situation where testing equipment can only test a limited range of products and increase testing capacity has become an urgent problem to be solved in this field. Utility Model Content

[0005] This application discloses a testing device, the purpose of which is to improve the problem of testing devices testing only a limited range of product types and increase testing capacity.

[0006] This application discloses a testing device, which includes a housing and a support frame. The support frame is disposed within the housing, and multiple support structures are spaced apart along the height direction of the support frame. A receiving layer is formed between two adjacent support structures, and a partition plate connects two adjacent support structures. The partition plate divides each receiving layer into a first receiving area and a second receiving area. In each receiving layer, multiple test fixtures are installed on the portion of the support structure located in the first receiving area, and multiple test motherboards are placed on the portion of the support structure located in the second receiving area. Each test fixture is provided with multiple test interfaces, which are used to connect to test hard drives of different specifications, and each test interface is connected to the test motherboard via a connecting cable.

[0007] Optionally, each of the partition plates is provided with a through hole corresponding to the position of each of the test fixtures; one end of each of the connecting lines is connected to the test interface of the corresponding specification, and the other end is connected to the test motherboard through the through hole; and a sealing layer is provided in the through hole, and the sealing layer fills the through hole.

[0008] Optionally, the support structure includes a support plate and a plurality of support frames, the plurality of support frames being located in the first accommodating area and the support plate being located in the second accommodating area; the plurality of support frames are spaced apart along the length direction of the support plate and connected to the side of the support plate; the side of each support frame away from the support plate is connected to the corresponding test fixture.

[0009] Optionally, the test fixture includes a first test board and a second test board. One side of the first test board is connected to the support frame, and the first test board is perpendicular to the support frame. The side of the first test board away from the support frame is connected to the second test board, and the second test board is perpendicular to the first test board and parallel to the support frame. The test interface includes a USB interface, a 2.5-inch hard drive interface, and a PCIe interface. The first test board is provided with multiple USB interfaces and multiple 2.5-inch hard drive interfaces. The second test board is provided with a circuit board, and the circuit board is provided with multiple PCIe interfaces.

[0010] Optionally, a pressing device is provided on the side of the first test board near the second test board. The pressing device includes a connector, a rotating member, and a pressing rod. The connector is connected to the first test board. One end of the rotating member is rotatably connected to the connector. The pressing rod is connected to the end of the rotating member away from the connector. The rotating member rotates relative to the connector to control the pressing rod to descend or rise. The extension direction of the pressing rod is the same as the arrangement direction of the multiple PCIe interfaces. The pressing rod is used to simultaneously press down on the hard drives connected to the multiple PCIe interfaces.

[0011] Optionally, a PCIE 4.0 adapter board is provided on the side of the partition away from the first test board, and the PCIE 4.0 adapter board is connected to the PCIE interface and the test motherboard respectively via connecting cables.

[0012] Optionally, the support plate is provided with a plurality of first heat dissipation holes; at least two of the first heat dissipation holes form a group of heat dissipation holes; and the plurality of groups of heat dissipation holes are arranged at intervals along the length direction of the support plate.

[0013] Optionally, on the first test board, a second heat dissipation hole is provided between each of the two adjacent 2.5-inch hard drive interfaces; on the second test board, a plurality of third heat dissipation holes are provided at the positions corresponding to the circuit board; the second test board is provided with a plurality of support members, which are connected to the circuit board and are used to support the circuit board at a preset height relative to the second test board.

[0014] Optionally, the enclosure includes a shell and a door panel. The shell has an accommodating space for mounting the bracket. The door panel is rotatably connected to the shell on the side near the support plate. The door panel is provided with multiple heat dissipation devices, each of which is positioned corresponding to the location of each accommodating layer.

[0015] Optionally, the testing equipment further includes a computer, and the chamber is equipped with a refrigeration device and a heating device, and the computer is signal-connected to the refrigeration device and the heating device respectively; the computer is used to control the refrigeration device to cool down the chamber to a preset temperature, or to control the heating device to heat up the chamber to a preset temperature.

[0016] This application improves upon traditional testing equipment by incorporating a bracket within the equipment's housing, with multiple support structures spaced at intervals along the bracket's height. Test motherboards and test fixtures are mounted on the bracket using these support structures. A receiving layer is formed between adjacent support structures, providing installation space for multiple test motherboards and test fixtures, allowing each motherboard and corresponding test fixture to be installed within the same receiving layer via the support structures. Each receiving layer is divided into a first receiving area and a second receiving area by a partition plate. Multiple test fixtures are installed in the first receiving area via the support structures, and multiple test motherboards are installed in the second receiving area via the support structures. This partitioned installation of multiple test fixtures and test motherboards within the limited space of the bracket fully utilizes the internal space, increasing the number of test fixtures and test motherboards that can be installed in each receiving layer. This allows the testing equipment to test a larger number of hard drives simultaneously. Furthermore, since each test fixture has multiple test interfaces of different specifications, it can simultaneously test multiple hard drives of different specifications, effectively increasing the number of hard drives that can be tested while addressing the issue of traditional testing equipment testing only a single product type. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the embodiments of this application and form part of the specification. They serve to demonstrate implementation methods of this application and, together with the textual description, explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort. In the drawings:

[0018] Figure 1 This is a schematic diagram of the first embodiment of the test equipment of this application;

[0019] Figure 2 This is a schematic diagram of the test fixture in the first embodiment of the test equipment of this application;

[0020] Figure 3 This is a schematic diagram of the test fixture in the second embodiment of the test equipment of this application;

[0021] Figure 4 This is a schematic diagram of the third embodiment of the test equipment of this application;

[0022] Figure 5 This is a schematic diagram of the support plate in the fourth embodiment of the test equipment of this application;

[0023] Figure 6 This is a schematic diagram of the test fixture in the fifth embodiment of the test equipment of this application;

[0024] Figure 7 This is a schematic diagram of the sixth embodiment of the test equipment of this application;

[0025] Figure 8 This is a schematic diagram of the seventh embodiment of the test equipment of this application.

[0026] Among them, 10 is the testing equipment; 100 is the enclosure; 110 is the shell; 120 is the door panel; 130 is the heat dissipation device; 200 is the supporting structure; 210 is the support frame; 220 is the support plate; 221 is the first heat dissipation hole; 222 is the heat dissipation hole group; 300 is the housing layer; 310 is the first housing area; 320 is the second housing area; 400 is the partition plate; 410 is the through hole; 420 is the sealing layer; 500 is the testing fixture; 510 is the first test plate; 511 is the second heat dissipation hole; and 520 is the second test plate. 521. Third heat dissipation hole; 522. Support component; 523. Circuit board; 530. Test interface; 531. USB interface; 532. 2.5-inch hard drive interface; 533. PCIe interface; 540. Connecting cable; 550. Test motherboard; 560. Pressing device; 561. Connecting component; 562. Rotating component; 563. Pressing lever; 570. PCIe 4.0 adapter board; 600. Bracket; 700. Computer; 710. Cooling device; 720. Heating device; 800. Test hard drive. Detailed Implementation

[0027] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0028] Figure 1 This is a schematic diagram of the first embodiment of the test equipment of this application. Figure 2 This is a schematic diagram of the test fixture in the first embodiment of the test equipment of this application, as shown below. Figure 1 and Figure 2As shown in the embodiment of this application, a testing device 10 is disclosed. The testing device 10 includes a housing 100 and a support 600. The support 600 is disposed inside the housing 100. Multiple support structures 200 are spaced apart along the height direction of the support 600, and a receiving layer 300 is formed between two adjacent support structures 200. A partition plate 400 connects two adjacent support structures 200, and the partition plate 400 divides each receiving layer 300 into a first receiving area 310 and a second receiving area 320. In each receiving layer 300, multiple test fixtures 500 are installed on the part of the support structure 200 located in the first receiving area 310, and multiple test motherboards 550 are placed on the part of the support structure 200 located in the second receiving area 320. Multiple test interfaces 530 are provided on each test fixture 500, and the multiple test interfaces 530 are used to connect to test hard disks 800 of different specifications respectively. Each test interface 530 is connected to the test motherboard 550 through a connecting cable 540.

[0029] This application improves upon the conventional testing equipment 10 by providing a bracket 600 within the housing 100 of the testing equipment 10, and by providing multiple support structures 200 spaced apart along the height direction of the bracket 600. The test motherboard 550 and test fixture 500 are mounted on the bracket 600 using the support structures 200. A receiving layer 300 is formed between adjacent support structures 200, providing installation space for multiple test motherboards 550 and multiple test fixtures 500, while allowing both the test motherboards 550 and their corresponding test fixtures 500 to be mounted within the same receiving layer 300 via the support structures 200. Furthermore, a partition plate 400 divides each receiving layer 300 into a first receiving area 310 and a second receiving area 320. Multiple test fixtures 500 are then mounted via the support structures. Structure 200 is installed in the first accommodating area 310, and multiple test motherboards 550 are installed in the second accommodating area 320 through the support structure 200. This allows multiple test fixtures 500 and multiple test motherboards 550 to be installed in a partitioned manner within the limited space of the bracket 600, thereby making full use of the internal space of the bracket 600. This is beneficial to increasing the number of test fixtures 500 and test motherboards 550 that can be installed in each accommodating layer 300. This allows the testing equipment 10 to test a larger number of test hard drives 800 at the same time. Furthermore, since each test fixture 500 has multiple test interfaces 530 of different specifications, it can test multiple test hard drives 800 of different specifications at the same time. This effectively increases the number of test hard drives 800 while improving the problem of the traditional testing equipment 10 testing only one type of product.

[0030] It should be noted that the test fixture 500 in this application is mainly to provide hard drive interfaces of different specifications for testing, so as to facilitate connection with hard drives of different specifications and types; while the test motherboard 550 can be a computer motherboard. Each computer motherboard usually comes with a battery device to power the computer motherboard to ensure the normal operation of the computer motherboard.

[0031] Furthermore, unlike traditional test equipment 10 where the test motherboard 550 is exposed to the external environment, the test motherboard 550 and test fixture 500 of this application are both mounted on the bracket 600 inside the test equipment 10 housing 100 via the support structure 200. This prevents the test motherboard 550 and test fixture 500 from being exposed to the external environment, avoiding the messy external space caused by the ribbon cables on the motherboard when the test motherboard 550 is exposed to the external environment. It also effectively protects the test motherboard 550 from the influence of external forces and corrosion caused by dust, moisture, etc. in the environment, which helps to extend the service life of the test motherboard 550 and improve the testing stability of the test equipment 10.

[0032] Furthermore, each partition plate 400 is provided with a through hole 410 corresponding to the position of each test fixture 500; one end of each connecting line 540 is connected to the test interface 530 of the corresponding specification, and the other end is connected to the test main board 550 through the through hole 410; and a sealing layer 420 is provided in the through hole 410, and the sealing layer 420 fills the through hole 410.

[0033] In this embodiment, by providing through holes 410 on the partition plate 400, after one end of the connecting cable 540 is connected to the corresponding type of test interface 530 on the test fixture 500, the other end can pass through the through hole 410 and connect to the test motherboard 550. In this way, multiple connecting cables 540 connected to the same test fixture 500 can all pass through the through hole 410 and connect to the test motherboard 550. The through hole 410 serves as a cable bundle for multiple connecting cables 540, avoiding the complex external wiring problems when the test motherboard 550 is exposed to the external environment in the traditional way. Moreover, multiple connecting cables 540 between two adjacent test fixtures 500 will not interfere with each other, making the internal structure of the test equipment 10 more concise and compact.

[0034] In addition, since the test fixture 500 located in the first containment area 310 usually needs to be tested in extreme environments such as high temperature or low temperature, if the test motherboard 550 is also in a space with large temperature changes for a long time, it is easy to cause the test motherboard 550 to degrade or be damaged.

[0035] Therefore, this embodiment of the application also uses a sealing layer 420 to fill the through hole 410, thereby sealing the gap between the connecting line 540 and the through hole 410, so that the first receiving area 310 and the second receiving area 320 are separated into two independent receiving areas. This can effectively prevent the low temperature or high temperature of the first receiving area 310 from affecting the second receiving area 320. The second receiving area 320 will not experience significant temperature changes due to the high or low temperature of the first receiving area 310, thereby effectively protecting the test motherboard 550 located in the second receiving area 320 and improving test stability.

[0036] Furthermore, the support structure 200 includes a support plate 220 and a plurality of support frames 210, the plurality of support frames 210 being located in a first receiving area 310 and the support plate 220 being located in a second receiving area 320; the plurality of support frames 210 are spaced apart along the length direction of the support plate 220 and are connected to the side of the support plate 220; the side of each support frame 210 away from the support plate 220 is connected to the corresponding test fixture 500.

[0037] In this embodiment, multiple support plates 220 are connected to the bracket 600 along the height direction, forming a multi-layer support plate 220 structure on the bracket 600. Each layer of support plate 220 is used to place multiple test motherboards 550, and multiple support frames 210 connected to one side of the support plate 220 are used to install test fixtures 500 respectively. That is, in one accommodating layer 300, multiple test motherboards 550 can be placed along the length direction of the support plate 220, and multiple support frames 210 connected to the same support plate 220 can install multiple test fixtures 500. Each test fixture 500 is connected to its corresponding test motherboard 550 through a connecting cable 540. In this way, the entire bracket 600 can install multiple hard drives at the same time, effectively increasing the number of test hard drives 800 in the test equipment 10.

[0038] Multiple support frames 210 are spaced apart along the length of the support plate 220. On the one hand, this can reasonably allocate the space of the first accommodating area 310, ensuring that each test fixture 500 can be adequately installed, while leaving enough wiring space for the connecting cable 540, thus improving the utilization rate of the limited space of the bracket 600. On the other hand, after two adjacent test fixtures 500 are installed on the support frame 210, they do not contact each other. When two adjacent test fixtures 500 are testing the test hard disk 800, the heat generated is less likely to cause significant interference, which is beneficial to improving the testing stability of the test fixtures 500.

[0039] Furthermore, the test fixture 500 includes a first test board 510 and a second test board 520. One side of the first test board 510 is connected to the support frame 210, and the first test board 510 is perpendicular to the support plate 220. The side of the first test board 510 away from the support frame 210 is connected to the second test board 520, and the second test board 520 is perpendicular to the first test board 510 and parallel to the support plate 220. The test interface 530 includes a USB interface 531, a 2.5-inch hard disk interface 532, and a PCIE interface 533. The first test board 510 is provided with multiple USB interfaces 531 and multiple 2.5-inch hard disk interfaces 532. The second test board 520 is provided with a circuit board 523, and the circuit board 523 is provided with multiple PCIE interfaces 533.

[0040] In this embodiment, the first test board 510 is provided with multiple USB interfaces 531 and 2.5-inch hard drive interfaces 532. For example, the USB interface 531 can be a USB 3.0 interface, and the 2.5-inch hard drive interface 532 is a 2.5-inch solid-state drive interface. It can be understood that the USB 3.0 interface is backward compatible with testing solid-state drives with lower-specification interfaces such as USB 1.0 and USB 2.0, thereby adapting to solid-state drives of various specifications. This is beneficial to improving the compatibility and testing diversity of the test equipment 10, enabling it to meet the testing needs of different users or products.

[0041] The second test board 520 is equipped with a circuit board 523, which has multiple PCIe interfaces 533. The PCIe interfaces 533 have high-speed data transmission capabilities. The use of multiple PCIe interfaces 533 can effectively support the testing requirements of high-performance solid-state drives, ensuring the stability and efficiency of data transmission during the test. That is, in this embodiment of the application, the first test board 510 and the second test board 520 use different specifications and different numbers of interfaces to perform combined testing on different types of hard drives, further improving the testing diversity of the test equipment 10.

[0042] In addition, the first test board 510 is perpendicular to the support plate 220, while the second test board 520 is parallel to the support plate 220. This not only makes full use of the space within the housing layer 300, but also ensures the stability of various types of test hard disks 800 after they are installed in the test fixture 500, and prevents the test hard disks 800 from becoming loose or damaged due to vibration or other external factors.

[0043] Since the second test board 520 is mainly used to test PCIe interface 533 solid-state drives, and PCIe solid-state drives are prone to warping after being inserted into the corresponding PCIe interface 533, this can lead to unstable connection with the interface and even detachment. Based on this problem, this application has improved the test fixture 500, with the specific improvements as follows:

[0044] Figure 3 This is a schematic diagram of the test fixture in the second embodiment of the test equipment of this application, as shown below. Figure 3 As shown, a pressing device 560 is provided on the side of the first test board 510 near the second test board 520. The pressing device 560 includes a connector 561, a rotating member 562, and a pressing rod 563. The connector 561 is connected to the first test board 510. One end of the rotating member 562 is rotatably connected to the connector 561. The pressing rod 563 is connected to the end of the rotating member 562 away from the connector 561. The rotating member 562 rotates relative to the connector 561 to control the pressing rod 563 to descend or rise. The extension direction of the pressing rod 563 is the same as the arrangement direction of the multiple PCIe interfaces 533. The pressing rod 563 is used to simultaneously press the hard drives connected to the multiple PCIe interfaces 533.

[0045] The difference between this embodiment and the previous embodiment is that in this embodiment, a pressing device 560 is provided on the first test board 510, and the pressing device 560 is used to press down on the multiple test hard disks 800 installed on the second test board 520 located below the first test board 510.

[0046] After test hard drives 800 are installed on the multiple PCIe interfaces 533 on the second test board 520, the pressing lever 563 is pressed down. The rotating part 562 rotates relative to the connector 561 as the pressing lever 563 is pressed down until the pressing lever 563 presses the multiple test hard drives 800 tightly. This can effectively improve the warping phenomenon that occurs when the test hard drives 800 are connected to the PCIe interface 533, which is conducive to improving the stability of the test.

[0047] When it is necessary to remove the test hard drives 800, simply lift the pressing lever 563. The support rod will rotate relative to the connecting cable 540 as the pressing lever 563 is lifted until the pressing lever 563 releases the multiple test hard drives 800. This way, the multiple test hard drives 800 can be removed from the PCIe interface 533. The operation is simple and convenient.

[0048] The extension direction of the pressing lever 563 is the same as the arrangement direction of the multiple PCIe interfaces 533. The pressing lever 563 can simultaneously press the hard drives connected to multiple PCIe interfaces 533. Therefore, multiple test hard drives 800 can be pressed at the same time in one operation, reducing the time and steps of testing each hard drive 800 individually, which helps to improve the operating efficiency of the test device 10.

[0049] Figure 4 This is a schematic diagram of the third embodiment of the test equipment of this application, as shown below. Figure 4As shown, a PCIE 4.0 adapter board 570 is provided on the side of the partition plate 400 away from the first test board 510. The PCIE 4.0 adapter board 570 is connected to the PCIE interface 533 and the test motherboard 550 through the connecting cable 540.

[0050] In this embodiment, a PCIe 4.0 adapter board 570 is provided on the side of the separator 400 away from the first test board 510. The PCIe 4.0 adapter board 570 facilitates signal transmission between the PCIe interface 533 on the test fixture 500 and the test motherboard 550. This allows the PCIe interface 533 on the test fixture 500 to be connected to the PCIe 4.0 adapter board 570, enabling testing of PCIe 4.0 solid-state drives and meeting the testing requirements of PCIe 4.0 solid-state drives. Typically, the theoretical transmission speed is around 8000 MB / s, and the actual tested transmission speed can reach 7500 MB / s. The speed range is between 7800 MB / s, which can significantly improve the testing efficiency of high-performance solid-state drives. On the other hand, since the test fixture 500 located in the first containment area 310 is usually tested in extreme environments such as high or low temperatures, the environment of the first containment area 310 is quite extreme. Therefore, the PCIe 4.0 adapter board 570 is placed on the side of the partition plate 400 away from the first test board 510, so that it is located in the second containment area 320 separated by the partition plate 400. This prevents the PCIe 4.0 adapter board 570 from being in an extreme temperature environment for a long time, which helps to extend the service life of the PCIe 4.0 adapter board 570.

[0051] Figure 5 This is a schematic diagram of the support plate in the fourth embodiment of the test equipment of this application, as shown below. Figure 5 As shown, the support plate 220 is provided with a plurality of first heat dissipation holes 221; at least two first heat dissipation holes 221 form a group of heat dissipation hole groups 222; the plurality of groups of heat dissipation hole groups 222 are arranged at intervals along the length direction of the support plate 220.

[0052] In this embodiment, by providing multiple first heat dissipation holes 221 on the support plate 220, when multiple test motherboards 550 are placed on the support plate 220, air can circulate below the test motherboards 550 through the first heat dissipation holes 221. This allows the large amount of heat generated by the test motherboards 550 during long-term testing to be quickly carried away from the test motherboards 550 through the airflow below the first heat dissipation holes 221, preventing heat from accumulating at the test motherboards 550. This improves the heat dissipation efficiency of the test motherboards 550 and enhances the testing stability of the test motherboards 550.

[0053] In addition, multiple heat dissipation hole groups 222 are arranged at intervals along the length of the support plate 220. This allows operators to determine the placement position of the test motherboard 550 based on the position of the heat dissipation hole groups 222, which has high installation identification and helps to improve testing efficiency.

[0054] Furthermore, since the test fixture 500 needs to test multiple hard drives of different specifications simultaneously, a large amount of heat is generated when multiple hard drives of different specifications are connected to the test fixture 500 for testing at the same time. This causes the temperature of the hard drives to rise, thereby affecting the actual testing performance of the test hard drives 800. Based on this problem, this application has made improvements to the test fixture 500, the specific improvements of which are as follows:

[0055] Figure 6 This is a schematic diagram of the test fixture in the fifth embodiment of the test equipment of this application, as shown below. Figure 6 As shown, on the first test board 510, a second heat dissipation hole 511 is provided between each of the two adjacent 2.5-inch hard disk interfaces 532; on the second test board 520, a plurality of third heat dissipation holes 521 are provided at the positions corresponding to the circuit board 523; the second test board 520 is provided with a plurality of support members 522, which are connected to the circuit board 523 and are used to support the circuit board 523 at a preset height relative to the second test board 520.

[0056] In this embodiment, second heat dissipation holes 511 are provided on the first test board 510 between two adjacent 2.5-inch hard drive interfaces 532. The second heat dissipation holes 511 allow air to circulate between the front and back of the first test board 510. In this way, when multiple 2.5-inch hard drive interfaces 532 on the first test board 510 are connected to hard drives for testing at the same time, the generated heat will be carried away from the vicinity of the heat source (2.5-inch solid-state drive and 2.5-inch interface) by the circulating air, thereby avoiding heat accumulation near the heat source, which helps to improve the heat dissipation effect of the first test board 510 and improve the stability of the test.

[0057] The third heat dissipation hole 521 on the second test board 520, corresponding to the position of the circuit board 523, allows air to circulate vertically on the second test board 520. This accelerates airflow below the circuit board 523, effectively dissipating the heat generated by the circuit board 523 and cooling the circuit board 523 and the test hard drive 800 connected to the PCIE interface 533 on the circuit board 523. This improves the heat dissipation effect of the second test board 520 and enhances the stability of the test.

[0058] Furthermore, the support member 522 supports the circuit board 523 at a preset height relative to the second test board 520, which not only provides additional air circulation space for the circuit board 523, but also reduces heat conduction between the circuit board 523 and other structures, thus avoiding deformation or failure of other components caused by heat transfer.

[0059] Figure 7 This is a schematic diagram of the sixth embodiment of the test equipment of this application, as shown below. Figure 7 As shown, the enclosure 100 includes a shell 110 and a door panel 120. The shell 110 has a receiving space for mounting the bracket 600. The door panel 120 is rotatably connected to the shell 110 on the side near the support plate 220. Multiple heat dissipation devices 130 are provided on the door panel 120, and each heat dissipation device 130 is positioned corresponding to the position of each receiving layer 300.

[0060] The difference between this embodiment and the previous embodiment is that in this embodiment, multiple heat dissipation devices 130 are also installed on the door panel 120 connected to the shell 110 of the box 100, wherein the heat dissipation device 130 can be a cooling fan.

[0061] Since the test motherboard 550 is placed on the support plate 220, the test motherboard 550 will release a lot of heat during long-term testing. Therefore, in this embodiment, multiple heat dissipation devices 130 are installed on the door panel 120 near the support plate 220, and each heat dissipation device 130 is set to the position of each receiving layer 300. When multiple test motherboards 550 are placed on each receiving layer 300, the multiple heat dissipation devices 130 actively dissipate heat from the multiple test motherboards 550, and quickly carry the heat generated by the multiple test motherboards 550 away from the heat source (test motherboard 550), thereby avoiding the heat from concentrating near the test motherboard 550, which is beneficial to extending the life of the test motherboard 550 and enabling the test motherboard 550 to maintain a better testing state.

[0062] Figure 8 As shown in Figure 8, the seventh embodiment of the testing equipment of this application is illustrated. The testing equipment 10 also includes a computer 700. A cooling device 710 and a heating device 720 are provided inside the housing 100. The computer 700 is connected to the cooling device 710 and the heating device 720 by signal. The computer 700 is used to control the cooling device 710 to cool down the inside of the housing 100 to a preset temperature, or to control the heating device 720 to heat up the inside of the housing 100 to a preset temperature.

[0063] Unlike traditional testing equipment 10, which typically can only perform tests at room temperature.

[0064] In this embodiment of the application, the computer 700 is connected to the cooling device 710 and the heating device 720 inside the enclosure 100 via a signal connection. The computer 700 controls the cooling device 710 and the heating device 720 to adjust the temperature inside the enclosure 100 to a preset value, thereby enabling the performance testing of the test hard drive 800 under different temperature conditions and helping to test the stability and reliability of the hard drive 800 in extreme temperature environments.

[0065] The refrigeration device 710 can be a refrigeration air conditioning unit or other refrigeration equipment. Common refrigeration air conditioning units can not only refrigerate but also circulate cold air, thereby accelerating the cooling of the chamber 100 to the preset temperature. The heating device 720 can be a heater or other heating equipment, which can circulate hot air while heating, thereby accelerating the heating of the chamber 100 to the preset temperature, so that the chamber 100 can reach the test environment more quickly.

[0066] It should be noted that the above description of the embodiments of this application is not intended to limit the specific types of the refrigeration device 710 and the heating device 720. Any device that can achieve the functions of refrigeration or heating is acceptable. This application only uses the refrigeration device 710 as a refrigeration and air conditioning device and the heating device 720 as a heater that can circulate hot air as an example. Controlling the refrigeration device 710 to lower the temperature and controlling the heating device 720 to raise the temperature through the computer 700 is a technology that can be understood in the art, and this application will not elaborate further.

[0067] In addition, the computer 700 can precisely control the temperature of the cooling device 710 and the heating device 720, thereby regulating the temperature change process inside the chamber 100, ensuring that the temperature inside the chamber 100 reaches and is maintained within the set range, avoiding errors that may be caused by manual operation, and improving the accuracy and consistency of test results.

[0068] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0069] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A test apparatus, characterized by, The testing equipment includes a housing and a support. The support is disposed inside the housing. Multiple support structures are spaced apart along the height direction of the support, and a receiving layer is formed between two adjacent support structures. A partition plate is connected between two adjacent support structures, and the partition plate divides each receiving layer into a first receiving area and a second receiving area. In each of the accommodating layers, the portion of the support structure located in the first accommodating area is equipped with multiple test fixtures, and the portion of the support structure located in the second accommodating area is used to place multiple test motherboards; each test fixture is provided with multiple test interfaces, which are used to connect to test hard drives of different specifications respectively, and each test interface is connected to the test motherboard via a connecting cable.

2. The test apparatus of claim 1, wherein, Each of the partition plates is provided with a through hole corresponding to the position of each of the test fixtures; One end of each of the connecting cables is connected to the test interface of the corresponding specification, and the other end is connected to the test motherboard through the through hole; Furthermore, a sealing layer is provided inside the through hole, and the sealing layer fills the through hole.

3. The test apparatus of claim 2, wherein, The support structure includes a support plate and multiple support frames, with the multiple support frames located in the first accommodating area and the support plate located in the second accommodating area; the multiple support frames are spaced apart along the length direction of the support plate and connected to the side of the support plate; the side of each support frame away from the support plate is connected to the corresponding test fixture.

4. The test apparatus of claim 3, wherein, The test fixture includes a first test plate and a second test plate. One side of the first test plate is connected to the support frame, and the first test plate is perpendicular to the support plate. The side of the first test plate away from the support frame is connected to the second test plate, and the second test plate is perpendicular to the first test plate and parallel to the support plate; The test interfaces include a USB interface, a 2.5-inch hard drive interface, and a PCIe interface; The first test board is equipped with multiple USB ports and multiple 2.5-inch hard drive ports; The second test board is provided with a circuit board, and the circuit board is provided with multiple PCIe interfaces.

5. The test apparatus of claim 4, wherein, A pressing device is provided on the side of the first test plate near the second test plate. The pressing device includes a connector, a rotating member, and a pressing rod. The connector is connected to the first test plate. One end of the rotating member is rotatably connected to the connector. The pressing rod is connected to the end of the rotating member away from the connector. The rotating member rotates relative to the connector to control the pressing rod to descend or rise. The extension direction of the pressing lever is the same as the arrangement direction of the multiple PCIe interfaces; the pressing lever is used to simultaneously press the hard drives connected to the multiple PCIe interfaces.

6. The test apparatus of claim 5, wherein, A PCIE 4.0 adapter board is provided on the side of the partition away from the first test board. The PCIE 4.0 adapter board is connected to the PCIE interface and the test motherboard via connecting cables.

7. The test apparatus of claim 6, wherein, The support plate is provided with a plurality of first heat dissipation holes; at least two of the first heat dissipation holes form a group of heat dissipation holes; the multiple groups of heat dissipation holes are arranged at intervals along the length of the support plate.

8. The test apparatus of claim 7, wherein, On the first test board, a second heat dissipation hole is provided between each of the two adjacent 2.5-inch hard disk interfaces; on the second test board, a plurality of third heat dissipation holes are provided at the positions corresponding to the circuit board; the second test board is provided with a plurality of support members, which are connected to the circuit board and are used to support the circuit board at a preset height relative to the second test board.

9. The test apparatus of claim 8, wherein, The enclosure includes a shell and a door panel. The shell has an internal space for mounting the bracket. The door panel is rotatably connected to the shell on the side near the support plate. The door panel is provided with multiple heat dissipation devices, each of which is positioned corresponding to the location of each of the internal storage layers.

10. The test apparatus of claim 9, wherein, The testing equipment also includes a computer. The chamber is equipped with a refrigeration device and a heating device. The computer is connected to the refrigeration device and the heating device respectively. The computer is used to control the refrigeration device to cool the chamber to a preset temperature, or to control the heating device to heat the chamber to a preset temperature.

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