A power device

Abstract

This utility model discloses a power device, including a main support frame, an RC absorption module located in the middle, and a rectifier module at the rear, which effectively reduces the complexity of installation and maintenance between components. It is also equipped with a liquid cooling system to further improve heat dissipation efficiency. By arranging the liquid cooling main pipe and branch pipes connected to the RC absorption module and rectifier module, efficient flow of coolant is ensured, improving the overall heat dissipation performance of the module and thus enhancing its reliability under high-power operating environments.

Description

Technical Field

[0001] This utility model relates to the field of electrical equipment technology, and in particular to a power device. Background Technology

[0002] With the continuous development of power electronics technology, the demand for high-power converters is increasing. Traditional power modules have revealed some key problems during application, such as low heat dissipation efficiency of RC snubber circuits, complex installation, difficult maintenance, and poor protection capabilities. These problems not only affect the reliability of power modules but also increase maintenance costs and complexity, limiting their widespread application. Utility Model Content

[0003] The present invention provides a power device that aims to solve the problems of insufficient reliability and inconvenient installation and maintenance of traditional power modules in the prior art.

[0004] This utility model provides a power device, characterized in that it includes: a main support; a rectifier module disposed at the rear end of the main support; an RC absorption module electrically connected to the rectifier module, the RC absorption module being disposed in the middle of the main support; and a liquid cooling system including a liquid cooling main pipe and liquid cooling branch pipes, the liquid cooling main pipe being disposed at the front end of the main support, and the liquid cooling branch pipes connecting the RC absorption module, the rectifier module, and the liquid cooling main pipe.

[0005] In the power device provided by this utility model, the RC absorption module includes multiple sets of RC absorption circuits connected in a triangular topology. The RC absorption circuit includes at least one absorption capacitor, multiple absorption resistors connected in series, and multiple liquid-cooled heat dissipation resistors connected in parallel. The absorption capacitor and the multiple absorption resistors connected in series are connected in parallel, and the multiple liquid-cooled heat dissipation resistors connected in parallel are connected in series with the parallel absorption capacitor and the multiple absorption resistors.

[0006] In the power device provided by this utility model, the RC absorption module further includes a first conductive bus, and the absorption capacitor, absorption resistor and liquid cooling heat dissipation resistor are respectively connected through the first conductive bus.

[0007] In the power device provided by this utility model, the rectifier module includes at least two rectifier power strings, the two ends of which are respectively connected to the left and right ends of the main body support along the length direction, and at least two rectifier power strings are distributed at intervals along the front and rear direction of the main body support.

[0008] In the power device provided by this utility model, the rectified power string includes a plurality of rectified diodes and heat sinks. The plurality of rectified diodes are arranged continuously along the left-right direction of the main body support, and the plurality of heat sinks are arranged at intervals along the left-right direction of the main body support. Each rectified diode abuts against at least two heat sinks.

[0009] In the power device provided by this utility model, the rectifier module further includes a second conductive bus, with the second conductive bus sandwiched between adjacent rectifier diodes, and multiple second conductive buses connected to the rectifier diodes to form a complete rectifier circuit.

[0010] In the power device provided by this utility model, the first conductive bus and the second conductive bus are connected by a detachable cable.

[0011] In the power device provided by this utility model, the liquid-cooled heat dissipation resistor and the heat sink are both located near the upper end of the main support, and the liquid-cooled branch pipe connects the liquid-cooled heat dissipation resistor and the heat sink from the upper end of the main support.

[0012] In the power device provided by this utility model, the liquid cooling branch pipe includes an inlet branch pipe, a connecting branch pipe, and a return branch pipe, and the liquid cooling main pipe includes an inlet main pipe and a return main pipe. The inlet main pipe and the return main pipe are arranged side by side along the front-back direction of the main body support. The inlet main pipe and the return main pipe are located near the lower end of the main body support. The inlet main pipe, the inlet branch pipe, the liquid cooling heat dissipation resistor, the connecting branch pipe, the radiator, the return branch pipe, and the return main pipe are connected in sequence to form a cooling circuit.

[0013] In the power device provided by this utility model, the main support includes a first frame, a second frame and a third frame, which are detachably connected in sequence along the front-to-back direction. The first frame includes a partial liquid cooling system, and the RC absorption module and the rectifier module are respectively disposed in the second frame and the third frame.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This utility model discloses a power device comprising a main support frame, an RC absorption module located in the middle, and a rectifier module at the rear, effectively reducing the complexity of installation and maintenance between components. It is also equipped with a liquid cooling system to further improve heat dissipation efficiency. By arranging the liquid cooling main pipe and branch pipes connected to the RC absorption module and rectifier module, efficient flow of coolant is ensured, improving the overall heat dissipation performance of the module and thus enhancing its reliability under high-power operating conditions. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 A three-dimensional view showing the functional area division of the power device in an embodiment of this utility model;

[0018] Figure 2 This is a three-dimensional view of the power device according to an embodiment of the present invention from two oblique perspectives;

[0019] Figure 3 This is a three-dimensional view of the power device according to another oblique two-sided perspective of this utility model embodiment;

[0020] Figure 4 This is a schematic diagram of the circuit connection relationship of the power device in an embodiment of this utility model;

[0021] Figure 5 This is a three-dimensional view showing the positional relationship of a component of the power device according to an embodiment of the present invention;

[0022] Figure 6 This is a bottom view showing the positional relationship of a component of the power device according to an embodiment of the present utility model;

[0023] Figure 7 This is a three-dimensional view of the pipeline connection relationship of the power device according to an embodiment of the present utility model;

[0024] Figure 8 This is a left view of the pipeline connection relationship of the power device according to an embodiment of the present utility model;

[0025] Figure 9 This is a schematic diagram of the spatial relationships of a traditional power device;

[0026] Figure 10 This is a schematic diagram of the spatial relationship of the power device in an embodiment of this utility model.

[0027] Figure label explanation:

[0028] 10. Rectifier module; 11. Rectifier power string; 12. Rectifier diode; 13. Heat sink; 14. Second busbar; 15. Detachable cable;

[0029] 20. RC absorption module; 21. RC absorption circuit; 22. Absorption capacitor; 23. Absorption resistor; 24. Liquid-cooled heat dissipation resistor; 25. First conductive busbar;

[0030] 30. Liquid cooling system; 31. Liquid cooling main pipe; 32. Inlet main pipe; 33. Return main pipe; 34. Liquid cooling branch pipe; 35. Inlet branch pipe; 36. Connecting branch pipe; 37. Return branch pipe;

[0031] 40. Main support frame; 41. First frame; 42. Second frame; 43. Third frame;

[0032] 50. Traditional power devices; 51. Circuit stabilization devices; 52. External cables; 53. New structure power devices; 54. Maintenance space; 55. Equipment cabinets. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0035] This utility model provides a power device aimed at solving the problems of insufficient reliability and inconvenient installation and maintenance of traditional power modules in the prior art. (Refer to...) Figures 1 to 8 The power device includes: a main support 40; a rectifier module 10 located at the rear end of the main support 40; an RC absorption module 20 electrically connected to the rectifier module 10, the RC absorption module 20 being located in the middle of the main support 40; and a liquid cooling system 30, including a liquid cooling main pipe 31 and liquid cooling branch pipes 34, the liquid cooling main pipe 31 being located at the front end of the main support 40, and the liquid cooling branch pipes 34 connecting the RC absorption module 20, the rectifier module 10, and the liquid cooling main pipe 31.

[0036] The power device of this invention adopts a modular integrated design, in which the main support frame 40 provides overall support, and the functional units are arranged in an optimized layout. The main support frame 40 adopts a metal frame structure to ensure that it can withstand the mechanical stress caused by high power and large load during operation and facilitates heat dissipation. The rectifier module 10 is installed in the rear end area of ​​the main support frame 40. This module contains a three-phase full-bridge rectifier circuit. Specifically, the common cathode diode of the upper arm is connected to the DC positive bus, and the common anode diode of the lower arm is connected to the DC negative bus. Each AC input terminal is connected to an external three-phase power supply through the bus, realizing the AC to DC power conversion. The RC absorption module 20 is arranged in the middle of the main support frame 40, maintaining a specified electrical safety distance from the rectifier module 10. This module contains multiple sets of RC absorption circuits 21. Each set of RC absorption circuits 21 consists of an absorption capacitor 22, an absorption resistor 23, and a liquid-cooled resistor 24. The three sets of units are connected in a delta configuration (AB, BC, CA) via a first busbar 25. Their input terminals are connected in parallel to the AC input terminal of the rectifier module 10 via an insulated busbar to absorb transient overvoltages generated during the switching of power devices. In each RC circuit, the absorption capacitor 22 and the absorption resistor 23 are first connected in parallel and then in series with the liquid-cooled resistor to form a complete RC absorption loop.

[0037] The liquid cooling system 30 adopts a series pipe cooling scheme, with the main liquid cooling pipe 31 arranged laterally along the front end of the main support 40. The liquid cooling branch pipe 34 connects the liquid-cooled resistor inlet of the RC absorption module 20 and the circuit connection outlet of the radiator 13 of the rectifier module 10. The coolant flow path is as follows: after entering from the inlet of the main liquid cooling pipe 31, it first flows through the liquid-cooled resistor of the RC absorption module 20, then through the aluminum radiator 13 substrate of the rectifier module 10, and finally returns to the outlet of the main liquid cooling pipe 31. This cooling path design ensures that high heat flux density components are preferentially cooled. The radiator 13 of the rectifier module 10 is press-fitted to the diode device, and the contact surface is coated with high thermal conductivity silicone grease to reduce contact thermal resistance. Through this partitioned layout and optimized cooling design, the entire system achieves a dual improvement in power density and operational reliability.

[0038] In one embodiment, reference is made to Figures 4 to 8The RC absorption module 20 includes multiple sets of RC absorption circuits 21 connected in a triangular topology. Each RC absorption circuit includes at least one absorption capacitor 22, multiple absorption resistors 23 connected in series, and multiple liquid-cooled heat dissipation resistors 24 connected in parallel. The absorption capacitor 22 and the multiple series-connected absorption resistors 23 are connected in parallel, and the multiple parallel-connected liquid-cooled heat dissipation resistors 24 are connected in series with the parallel-connected absorption capacitor 22 and the multiple absorption resistors 23. In this embodiment, each set of RC absorption circuits 21 consists of an absorption capacitor 22, an absorption resistor 23, and a liquid-cooled heat dissipation resistor 24. The absorption capacitor 22 and the absorption resistor 23 are connected in parallel to form a basic RC circuit, mainly used to absorb transient voltage and current fluctuations caused by switching operations or load changes. The absorption capacitor 22 stores electrical energy and releases it when the voltage changes abruptly, while the absorption resistor 23 is used to dissipate excess energy and prevent circuit overload. This parallel configuration can effectively reduce the impedance of the circuit, improve the response speed to transient signals, and thus enhance the stability of the circuit. Based on this, the liquid-cooled heat dissipation resistor 24 is connected in series with the parallel absorption capacitor 22 and absorption resistor 23, enabling the liquid-cooled heat dissipation resistor 24 to effectively dissipate the heat generated during the operation of the absorption circuit, ensuring that the circuit will not experience performance degradation or damage due to overheating during high-power operation. The surface of the liquid-cooled heat dissipation resistor 24 is in direct contact with the coolant, enabling it to quickly conduct heat into the coolant, thereby achieving efficient heat dissipation. Through this triangular topology design, the RC absorption module 20 not only improves its ability to absorb voltage spikes but also optimizes its heat dissipation performance, ensuring that the module can maintain a stable operating state under high-power conditions and extending the service life of the equipment. In addition, the design of multiple sets of RC absorption circuits 21 spaced apart along the left and right directions of the main support 40 further enhances the overall heat dissipation capacity of the module, allowing each set of circuits to work independently and avoiding the impact of local overheating on the reliability of the entire system.

[0039] Furthermore, referring to Figure 5 , Figure 7 and Figure 8The RC absorption module 20 further includes a first conductive bus 25, through which the absorption capacitor 22, absorption resistor 23, and liquid-cooled heat dissipation resistor 24 are connected. In this embodiment, the first conductive bus 25 is made of copper or aluminum with high conductivity and its surface is silver-plated to reduce contact resistance. Structurally, the first conductive bus 25 adopts a three-dimensional wiring method, including a horizontally arranged main connection section and a vertically extending branch connection section. Specifically, the absorption capacitor 22 and the liquid-cooled heat dissipation resistor 24 of each phase RC absorption circuit 21 are connected in series through the horizontal main connection section. This main connection section has multiple mounting holes and is fastened to the component terminals with stainless steel screws. At the parallel connection of the absorption capacitor 22 and the absorption resistor 23, an L-shaped branch connection section extends vertically from the main connection section. The end of the branch connection section has an elongated hole to accommodate the positional tolerance of the absorption resistor 23 during installation. The thickness and width of the first conductive bus 25 need to be designed according to the current capacity requirements to maintain good mechanical strength while meeting the high current carrying requirements. The layout of the first conductive bus 25 makes the electrical connection between the absorption capacitor 22, the absorption resistor 23 and the liquid cooling heat dissipation resistor 24 simpler, reduces the number of connection points, and thus reduces the risk of potential contact resistance and electrical failure.

[0040] Furthermore, a tin-plated copper gasket is installed between the first conductive bus 25 and the component terminals, and conductive paste is applied to ensure the conductivity of the contact surface. For the special installation requirements of the liquid-cooled heat dissipation resistor 24, the first conductive bus 25 is designed with a Z-shaped bend at its connection end to avoid the inlet and outlet water pipes of the heat dissipation resistor. All connection surfaces of the conductive bus are precision machined, with a surface roughness controlled within Ra1.6 to ensure the flatness of the contact surface. In addition, for ease of maintenance, the first conductive bus 25 adopts a segmented design, with each segment electrically connected by a detachable copper connecting block. This eliminates the need to disassemble the entire conductive bus system when replacing a single component. This conductive bus connection method not only ensures the electrical performance of the RC absorption circuit 21 but also achieves a compact module layout and convenient maintenance through optimized mechanical structure.

[0041] In one embodiment, reference is made to Figure 5The rectifier module 10 includes at least two rectifier power strings 11. The two ends of each rectifier power string 11 along its length are connected to the left and right ends of the main support 40, respectively. At least two rectifier power strings 11 are spaced apart along the front-back direction of the main support 40. The rectifier module 10 adopts a distributed power string layout design, comprising at least two rectifier power strings 11. These rectifier power strings 11 are connected to the left and right ends of the main support 40 along their length, respectively, and are spaced apart along the front-back direction of the main support 40. This structural design not only optimizes space utilization but also ensures the stable performance of the rectifier module 10 in high-power applications. Each group of rectifier power strings 11 consists of a three-phase rectifier unit, extending along the left-right direction of the main support 40, with its two ends fixed to the left and right sides of the main support 40 by insulating supports. In practice, the two sets of rectifier power strings 11 maintain a certain distance, which will be customized according to the design parameters of the power device, so as to ensure sufficient heat dissipation space while maintaining a compact overall structure. In addition, the connection between the rectifier power string 11 and the main support 40 adopts a shockproof design, and elastic components such as rubber damping pads or damping springs are added at the fixing points to absorb the mechanical vibration of the equipment during operation.

[0042] In one embodiment, reference is made to Figures 5 to 8 The rectifier power string 11 includes multiple rectifier diodes 12 and heat sinks 13. The multiple rectifier diodes 12 are continuously arranged along the left-right direction of the main support 40, and the heat sinks 13 are spaced apart along the left-right direction of the main support 40. Each rectifier diode 12 abuts against at least three heat sinks 13. The rectifier power string 11 adopts a high-density modular layout, consisting of multiple high-power rectifier diodes 12 and their corresponding heat sinks 13 continuously arranged along the left-right direction of the main support 40. Each rectifier power string 11 contains several rectifier diodes 12, which are electrically connected according to the three-phase full-bridge circuit topology and continuously arranged at a certain spacing along the length direction. The heat sinks 13 adopt an extruded aluminum heat dissipation fin structure, evenly distributed along the length direction of the rectifier power string 11 at a certain interval. Each rectifier diode 12 has a metal base (not shown in the figure) at both ends, and the metal base is in close contact with two adjacent heat sinks 13. The specific implementation method is as follows: At the diode mounting position, grooves conforming to the shape of the diode are machined at the ends of the two heat sinks 13. The diode is pressed onto the contact surface of the two heat sinks 13 by a spring pressing mechanism, and the contact surface is coated with thermally conductive grease with a high thermal conductivity. This three-point contact heat dissipation design allows the heat from each diode to be transferred to both heat sinks 13 simultaneously, significantly improving heat dissipation efficiency.

[0043] In one embodiment, reference is made to Figures 5 to 8The rectifier module 10 further includes a second conductive bus 14, which is sandwiched between adjacent rectifier diodes 12. Multiple second conductive buses 14 are connected to the rectifier diodes 12 to form a complete rectifier circuit. The second conductive bus 14 of the rectifier module 10 is a non-circular copper busbar, used to realize the electrical connection between the rectifier diodes 12 and construct a complete three-phase rectifier circuit. The rectifier circuit is constructed as follows: the diode group of the upper bridge arm is connected to the DC positive output terminal through the second conductive bus 14 in series and then to the DC negative output terminal through the common cathode; the diode group of the lower bridge arm is also connected to the DC negative output terminal through the second conductive bus 14 in series and then to the DC negative output terminal through the common anode. The upper and lower bridge arm diodes with the same phase are connected to each other through the L-shaped second conductive bus 14 to realize AC node connection. All the second conductive buses 14 are arranged in an alternating manner, with the upper bridge arm conductive buses arranged in the upper layer and the lower bridge arm conductive buses arranged in the lower layer, separated by an insulating sheet in between, forming a compact three-dimensional electrical connection structure.

[0044] Furthermore, referring to Figure 6 The first conductive busbar 25 and the second conductive busbar 14 are connected by a detachable cable 15. The first conductive busbar 25 and the second conductive busbar 14 are electrically connected via a specially designed flexible connecting cable, which can be detached at any time. Copper terminals are crimped to both ends of the cable, and the terminal surfaces are silver-plated. These terminals are then fixed to the terminals on the conductive busbars using stainless steel bolts. This detachable connection method allows for individual maintenance or replacement of each module or system. Furthermore, the cable's flexibility absorbs vibration stress during equipment operation, preventing fatigue fracture caused by the rigid connection between the first conductive busbar 25 and the second conductive busbar 14. This ensures both the reliability of the electrical connection and significantly improves the ease of maintenance of the power device.

[0045] In one embodiment, reference is made to Figures 1 to 3 and Figures 5 to 8The liquid-cooled heat dissipation resistor 24 and the heat sink 13 are both located near the upper end of the main support 40. The liquid-cooled branch pipe 34 connects the liquid-cooled heat dissipation resistor 24 and the heat sink 13 from the upper end of the main support 40. The liquid-cooled heat dissipation resistor 24 of the RC absorption module 20 and the heat sink 13 of the rectifier module 10 are both installed within a certain height range from the top of the main support 40, forming an upper-mounted heat dissipation unit group. The liquid-cooled heat dissipation resistor 24 adopts a cuboid aluminum alloy shell with an embedded resistance wire and an S-shaped cooling channel, and is vertically fixed by the mounting structure at the top of the support. The heat sink 13 of the rectifier module 10 has an inlet and an outlet at the top. The liquid-cooled branch pipe 34 is arranged in a "top-supply, top-return" circulation mode. The pipe of the liquid-cooled branch pipe 34 is laid along the perforations set on the frame of the main support 40 and is connected to the liquid-cooled main pipe 31, the liquid-cooled heat dissipation resistor 24 and the heat sink 13 through quick-release connectors. Specifically, the quick-release connectors are stainless steel quick-release connectors, which facilitates the individual disassembly and maintenance of the modules. By placing both the liquid-cooled heat dissipation resistor 24 and the radiator 13 close to the upper end of the main support 40, a centralized piping arrangement is achieved, shortening the coolant flow path and reducing system flow resistance. Simultaneously, from the attached... Figure 1 and 2 As can be seen, the cooling pipes are concentrated on the front and top of the main support 40, which facilitates maintenance operations.

[0046] In one embodiment, reference is made to Figure 7 and Figure 8The liquid cooling branch pipe 34 includes an inlet branch pipe 35, a connecting branch pipe 36, and a return branch pipe 37. The liquid cooling main pipe 31 includes an inlet main pipe 32 and a return main pipe 33. The inlet main pipe 32 and the return main pipe 33 are arranged side by side along the front-rear direction of the main support 40, and are located near the lower end of the main support 40. The inlet main pipe 32, the inlet branch pipe 35, the liquid cooling heat dissipation resistor 24, the connecting branch pipe 36, the radiator 13, the return branch pipe 37, and the return main pipe 33 are connected in sequence to form a cooling circuit. Specifically, the liquid cooling main pipe 31 consists of two parallel inlet main pipes 32 and return main pipes 33, which extend laterally along the front side of the bottom of the main support 40, maintaining a certain center distance, and are fixed to the lower crossbeam of the support by pipe clamps. The inlet main pipe 32 is responsible for pumping coolant from the external circulation system, while the return main pipe 33 discharges the heated coolant. The flow path of the cooling circuit is designed as follows: the coolant is first delivered from the main inlet pipe 32 through the vertically rising inlet branch pipe 35 to the inlet of the liquid-cooled heat dissipation resistor 24 located on the upper part of the support, completing the cooling of the RC absorption module 20; then it flows horizontally through the connecting branch pipe 36 to the inlet of the radiator 13 of the rectifier module 10, performing secondary cooling on the rectifier diode 12; finally, the heated coolant returns vertically downward to the main inlet pipe 33 through the return branch pipe 37. In particular, since the power device of this utility model has rectifier power strings 11 arranged side by side, the adjacent radiators 13 on the two rectifier power strings 11 are also connected by the connecting branch pipe 36, realizing the most efficient pipeline layout. Specifically, the outlet of the radiator 13 on the rectifier power string 11 near the RC absorption module 20 and the inlet of the radiator 13 on the rectifier power string 11 away from the RC absorption module 20 are connected by a connecting branch pipe 36. Furthermore, the inlet branch pipe 35 and the return branch pipe 37 can adopt a corrugated design to compensate for thermal expansion and contraction. In this embodiment, the bottom-mounted main pipe design lowers the overall center of gravity of the device and improves structural stability. Secondly, the series cooling path ensures that high-heat components receive low-temperature coolant preferentially. Thirdly, the pipe routing conforms to the thermodynamic principle of "low inlet, high outlet," which is beneficial for bubble discharge. All branch pipe connections use compression fittings, and exhaust valves are installed at high points. To monitor the cooling effect, temperature sensors and flow meters are installed on the inlet main pipe 32 and the return main pipe 33, respectively. This cooling system achieves efficient heat dissipation and reliable operation of the power unit through reasonable pipe layout and flow direction design.

[0047] In one embodiment, reference is made to Figure 2The main support 40 includes a first frame 41, a second frame 42, and a third frame 43, which are detachably connected sequentially along the front-to-back direction. The first frame includes a portion of the liquid cooling system, while the RC absorption module and rectifier module are respectively housed in the second and third frames. The main support 40 of the liquid-cooled power device adopts a modular three-section design, achieving functional zoning through the flexible combination of the first frame 41, second frame 42, and third frame 43. The first frame 41 is a dedicated frame for the liquid cooling system 30. The second frame 42 is the supporting frame for the RC absorption module 20. The third frame 43 serves as the mounting base for the rectifier module 10, and internally has multiple layers of supporting beams for mounting the rectifier power series 11 assembly. The three frames are quickly connected via standardized interfaces. Specifically, connection holes are provided on the mating surfaces of adjacent frames, and high-strength bolts designed to prevent loosening are used for fastening. Furthermore, a certain amount of pipeline transition space is reserved between the first frame 41 and the second frame 42, and a certain electrical insulation distance is maintained between the second frame 42 and the third frame 43.

[0048] by Figure 9 and Figure 10 For example, in traditional systems, the power device 50 and the circuit stabilization device 51 containing the RC absorption circuit 21 are separate structures, requiring an external cable 52 for electrical connection. Furthermore, the power device 50 and the circuit stabilization device 51 containing the RC absorption circuit 21 are installed in different equipment cabinets 55, occupying significant space. During maintenance, both the power module and the RC absorption circuit 21 need to be disassembled simultaneously in two equipment cabinets 55, making the operation complex and unsuitable for integrated cooling piping. However, the new power device 53 in this invention, with its three-frame integrated design, reduces the overall size of the device, allowing for compact installation within a single equipment cabinet 55. All electrical connections between the RC absorption circuit 21 and the rectifier module 10 are internal, with no exposed cables. Maintenance personnel have ample maintenance space 54 within the equipment cabinet 55, facilitating maintenance and enhancing safety. Simultaneously, the liquid cooling piping is neatly arranged along the frame edges, eliminating interference points and making integrated liquid cooling piping more feasible.

[0049] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A power device, characterized by, include: Main support frame; The rectifier module is located at the rear end of the main support frame; An RC absorption module is electrically connected to the rectifier module, and the RC absorption module is located in the middle of the main support. The liquid cooling system includes a main liquid cooling pipe and a branch liquid cooling pipe. The main liquid cooling pipe is located at the front end of the main support, and the branch liquid cooling pipe connects the RC absorption module, the rectifier module, and the main liquid cooling pipe.

2. The power device of claim 1, wherein, The RC absorption module includes multiple sets of RC absorption circuits connected in a triangular topology. Each RC absorption circuit includes at least one absorption capacitor, multiple absorption resistors connected in series, and multiple liquid-cooled heat dissipation resistors connected in parallel. The absorption capacitor and the multiple absorption resistors connected in series are connected in parallel, and the multiple liquid-cooled heat dissipation resistors connected in parallel are connected in series with the parallel absorption capacitor and the multiple absorption resistors.

3. The power device of claim 2, wherein, The RC absorption module also includes a first conductive bus, through which the absorption capacitor, absorption resistor and liquid-cooled heat dissipation resistor are respectively connected.

4. The power device of claim 3, wherein, The rectifier module includes at least two rectifier power strings, the two ends of which are connected to the left and right ends of the main body support respectively along the length direction, and the at least two rectifier power strings are distributed at intervals along the front and back direction of the main body support.

5. The power device of claim 4, wherein, The rectified power string includes a plurality of rectified diodes and heat sinks. The plurality of rectified diodes are arranged continuously along the left-right direction of the main body support, and the plurality of heat sinks are arranged at intervals along the left-right direction of the main body support. Each rectified diode abuts against at least two heat sinks.

6. The power device of claim 5, wherein, The rectifier module further includes a second conductive bus, with the second conductive bus sandwiched between adjacent rectifier diodes, and multiple second conductive buses connected to the rectifier diodes to form a complete rectifier circuit.

7. The power device of claim 6, wherein, The first conductive bus and the second conductive bus are connected by a detachable cable.

8. The power device of claim 5, wherein, Both the liquid-cooled heat dissipation resistor and the heat sink are located near the upper end of the main support, and the liquid-cooled branch pipe connects the liquid-cooled heat dissipation resistor and the heat sink from the upper end of the main support.

9. The power device of claim 8, wherein, The liquid cooling branch pipe includes an inlet branch pipe, a connecting branch pipe, and a return branch pipe. The liquid cooling main pipe includes an inlet main pipe and a return main pipe. The inlet main pipe and the return main pipe are arranged side by side along the front-back direction of the main body support. The inlet main pipe and the return main pipe are located near the lower end of the main body support. The inlet main pipe, the inlet branch pipe, the liquid cooling heat dissipation resistor, the connecting branch pipe, the radiator, the return branch pipe, and the return main pipe are connected in sequence to form a cooling circuit.

10. The power device of claim 1, wherein, The main support includes a first frame, a second frame, and a third frame, which are detachably connected in sequence along the front-to-back direction. The first frame includes a portion of the liquid cooling system, and the RC absorption module and the rectifier module are respectively located in the second frame and the third frame.

Images