Integrated ultra-high speed centrifugal force resistant rotary rectifier

CN224459673UActive Publication Date: 2026-07-03BEIJING XINCHUANG CHUNSHU RECTIFIER

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
BEIJING XINCHUANG CHUNSHU RECTIFIER
Filing Date
2025-07-18
Publication Date
2026-07-03

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Abstract

This invention provides an integrated ultra-high-speed centrifugal force-resistant rotary rectifier assembly, including rectifier elements and a base heat sink. Furthermore, a mounting portion is provided on the base heat sink, on the side in contact with the rectifier elements. The rectifier elements are sequentially encapsulated within this mounting portion, which is integrally formed with the base heat sink. This integrated assembly structure eliminates the technical problem of connection points between the rectifier elements and the base heat sink, improving the operational reliability of the rectifier assembly. Simultaneously, the rectifier elements are essentially directly mounted within the base heat sink, eliminating the need for thermal grease or thermal pads, maximizing thermal resistance, improving heat dissipation efficiency, extending the lifespan of core components such as diodes within the die, simplifying the assembly process, extending maintenance cycles, and providing convenience.
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Description

Technical Field

[0001] This utility model relates to a rotating rectifier assembly in an excitation generator, and more particularly to a rotating rectifier assembly suitable for ultra-high speed rotation with high resistance to centrifugal force. Background Technology

[0002] Currently, the rotating rectifier components used in high-speed rotating excitation generators are of a split structure, meaning that the rotating rectifier element and the base heat sink are two independent assemblies. Typically, the rotating rectifier element is fixed to the base heat sink as a whole using fixing processes such as bolts, clamps, and welding.

[0003] The existing method of fixing rotating rectifier components to base heat sinks faces the following risks:

[0004] 1. Rotating rectifiers and base heat sinks are often in a high-speed rotating environment, subjected to huge centrifugal forces and vibrations of various frequencies. The connection points of the above-mentioned fixed configuration are prone to loosening, deformation, or even breakage due to fatigue, leading to rectification failure. This is currently the most frequent cause of failure.

[0005] 2. Vibration and / or fretting wear can increase the contact resistance between rectifier components and the heat sink, as well as within the internal connections of each rectifier component. This not only increases power loss (heat generation) but also creates localized overheating points under high current, accelerating aging and even causing burnout. Severe vibration or loosening may completely disconnect the electrical connection, causing an open circuit in the excitation circuit and generator de-excitation shutdown.

[0006] 3. Loose connecting parts or metal debris may be flung out during high-speed rotation, causing short circuits between different potential points and leading to serious accidents.

[0007] 4. A split structure means that the heat generated by the rectifier needs to be transferred to the base heatsink through physical interfaces (applying thermal grease or adding a thermal pad). Vibration and fretting wear can damage the integrity of these interfaces, significantly increasing contact thermal resistance and leading to decreased heat dissipation efficiency. Uneven heat dissipation or poor contact can cause localized high-temperature areas (hot spots) inside the rectifier, severely reducing the reliability and lifespan of the rectifier (such as accelerating diode junction aging and thermal breakdown).

[0008] 5. Split structures typically require more complex assembly processes and more rigorous maintenance checks (such as regularly tightening connectors), resulting in higher maintenance costs. Utility Model Content

[0009] To address the aforementioned technical problems, this invention provides a reliable integrated rotary rectifier assembly suitable for ultra-high-speed rotation and with high resistance to centrifugal force.

[0010] The technical solution provided by this utility model is:

[0011] An integrated ultra-high-speed centrifugal force resistant rotary rectifier assembly includes rectifier elements and a base heat sink. Furthermore, a mounting portion is provided on the base heat sink, on the side in contact with the rectifier elements. The rectifier elements are sequentially encapsulated within the mounting portion, which is integrally formed with the base heat sink.

[0012] This integrated assembly structure eliminates the technical challenges of connection points between the rectifier components and the base heat sink, improving the reliability of the rectifier assembly. Simultaneously, the rectifier components are essentially directly mounted within the base heat sink, eliminating the need for thermal grease or additional thermal pads. This minimizes thermal resistance, improves heat dissipation efficiency, extends the lifespan of core components such as diodes within the die, simplifies the assembly process, extends maintenance cycles, and provides convenience.

[0013] As a refined embodiment of the rectifier assembly structure, the rectifier, from bottom to top, consists of a positioning ring contacting the bottom surface of the mounting section; a die located within the positioning ring and also contacting the bottom surface of the mounting section; a silver sheet above the die; an electrode post above the silver sheet; and, from bottom to top, a lower gasket, a mica sheet, an upper gasket, a disc spring, and a pressure cap fitted onto the electrode post. The pressure cap is screwed into the port of the mounting section, and the deformation of the disc spring is used to encapsulate each rectifier element within the mounting section. Furthermore, the rectifier is assembled as integrally as possible. A boss can be provided on the bottom surface of the mounting section, with one end of the positioning ring fitted onto the boss and the other end fitted onto the electrode post. The die and silver sheet are encapsulated between the electrode post and the boss via the positioning ring. This design integrates the core components of the rectifier, reducing the possibility of loosening and improving reliability in adapting to vibration intensity.

[0014] Furthermore, the mounting portion above the cover is filled with an insulating adhesive layer. This insulating adhesive layer is formed by filling the reserved mounting portion space with insulating adhesive, and the internal threads of the mounting portion port enhance the fixing strength of the insulating adhesive layer, thereby improving the structural strength of the rectifier component package, further reducing the possibility of loosening, and improving the reliability in adapting to vibration intensity. Attached Figure Description

[0015] Figure 1 This is a cross-sectional view of the base heat sink;

[0016] Figure 2 It is a cross-sectional view of the rectifier component assembly inside the mounting section;

[0017] Figure 3 This is a sectional view of the practical structure.

[0018] In the picture:

[0019] 1. Base heat sink; 2. Mounting part; 3. Positioning ring; 4. Core tube; 5. Silver sheet; 6. Electrode post; 7. Lower gasket; 8. Mica sheet; 9. Upper gasket; 10. Disc spring; 11. Pressure cap; 12. Boss; 13. Insulating adhesive layer. Detailed Implementation

[0020] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings:

[0021] like Figures 1 to 3 The integrated ultra-high-speed centrifugal force resistant rotary rectifier assembly shown has the same rectifier elements and base heat sink 1 as the prior art. However, the present invention has a mounting part 2 on the side of the base heat sink 1 that is in contact with the rectifier elements. The mounting part 2 is integrally formed with the base heat sink 1 by machining process and is used to assemble the rectifier elements in sequence.

[0022] like Figure 2 As shown, the assembly sequence of the above-mentioned rectifier components is the same as that of the prior art, namely, from bottom to top, the following components are: a positioning ring 3 in contact with the bottom surface of the mounting portion 2; a die 4 located inside the positioning ring 3 and in contact with the bottom surface of the mounting portion 2; a silver sheet 5 on top of the die 4; an electrode post 6 on top of the silver sheet 5; and, from bottom to top, a lower gasket 7, a mica sheet 8, an upper gasket 9, a disc spring 10, and a pressure cap 11 fitted onto the electrode post 6. The pressure cap 11 is screwed into the port of the mounting portion 2, and the pressure cap 11 presses against the disc spring 10, which deforms to encapsulate each rectifier component within the mounting portion 2. To improve the integrated design of the rectifier components, such as... Figure 1 and Figure 2 As shown, this embodiment has optimized the structure of the positioning ring 3 and the bottom surface of the mounting part 2. Specifically, the bottom surface of the mounting part 2 is provided with a boss 12, one end of the positioning ring 3 is sleeved on the boss 12, and the other end of the positioning ring 3 is sleeved on the electrode post 6. In this way, the core 4 and the silver sheet 5 are integrally encapsulated inside the positioning ring 3 and between the electrode post 6 and the boss 12, which further reduces the possibility of loosening and improves the reliability of adapting to vibration intensity.

[0023] Finally, an insulating adhesive layer 13 can be filled into the mounting portion 2 above the cover 11. This insulating adhesive layer 13 is formed by filling the reserved mounting portion 2 with insulating adhesive. At the same time, the fixing strength of the insulating adhesive layer 13 is enhanced by the threads on the inner side of the port of the mounting portion 2, which improves the structural strength of the rectifier component package, further reduces the possibility of loosening, and improves the reliability of adapting to vibration intensity and the ability to adapt to ultra-high speed rotation conditions.

Claims

1. An integrated high-speed centrifugal-resistant rotary rectifier assembly comprising a rectifier element and a base heat sink, characterized in that: A mounting portion is provided on the base heat sink, on the side that contacts the rectifier element. The rectifier element is sequentially encapsulated in the mounting portion, and the mounting portion is integrally formed with the base heat sink.

2. The integrated ultra-high speed centrifugal force resistant rotating choke assembly of claim 1, wherein: The rectifier elements, from bottom to top, consist of positioning rings that contact the bottom surface of the mounting section; The die is located inside the positioning ring and in contact with the bottom surface of the mounting part; a silver sheet is placed on the die; an electrode post is placed on the silver sheet; and a lower gasket, a mica sheet, an upper gasket, a disc spring, and a pressure cap are sleeved on the electrode post from bottom to top. The pressure cap is screwed into the port of the mounting part and is used to encapsulate each rectifier element in the mounting part by means of the deformation of the disc spring.

3. The integrated ultra-high-speed centrifugal force resistant rotary rectifier assembly as described in claim 2, characterized in that: The bottom surface of the mounting part is provided with a boss, one end of the positioning ring is sleeved on the boss, and the other end of the positioning ring is sleeved on the electrode post. The electrode post and the boss are encapsulated with a core and a silver sheet through the positioning ring.

4. The integrated ultra-high speed centrifugal force resistant rotating choke assembly of claim 2, wherein: The mounting portion above the pressure cap is filled with an insulating adhesive layer.