A circuit board with a moisture-proof structure
By attaching an insulating pad to the back of the circuit board and connecting it to the fins, combined with a thermal pad and a sealed box structure, the problems of moisture absorption and poor heat dissipation of the circuit board are solved, achieving both moisture protection and heat dissipation, and ensuring the safe and stable operation of the circuit board.
CN224460278UActive Publication Date: 2026-07-03MEIZHOU XINDEGUAN ELECTRONIC TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MEIZHOU XINDEGUAN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-07-15
- Publication Date
- 2026-07-03
AI Technical Summary
Technical Problem
When circuit boards are installed in chassis or power distribution cabinets, they are easily damaged by moisture and have poor heat dissipation, which affects their service life.
Method used
An insulating pad is attached to the back of the circuit board and connected to the fins via a mounting frame. Combined with a thermal pad and a sealed box structure, electrical isolation and moisture protection are achieved, while also enhancing heat dissipation.
Benefits of technology
It effectively prevents moisture condensation, ensures the safe and stable operation of the circuit board, improves heat dissipation efficiency, and extends service life.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224460278U_ABST
Abstract
This utility model relates to the field of circuit board technology, specifically a circuit board with a moisture-proof structure, including a circuit board body, a mounting frame that fits into the inner wall of a sealed box, a fixed connection between the circuit board body and the mounting frame, fins fixedly connected to the side of the mounting frame facing away from the circuit board body, a thermally conductive pad fixedly connected to the fins, and an insulating pad fixedly connected to the side of the circuit board body near the fins. First, a layer of thermally conductive pad is pasted on the upper surface of the fins, and then the fins are fixed to the outer wall of the mounting frame with screws. An insulating pad is pasted on the back of the circuit board body. The insulating pad can electrically isolate the fins from the circuit board body, ensuring safe and stable circuit operation, and at the same time, the insulating pad can block moisture, thus achieving a moisture-proof effect.
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