Heat dissipation device with heat energy recovery and electronic equipment

Abstract

This invention provides a heat dissipation device and electronic device with heat recovery, comprising: an assembly and an energy storage module. The assembly includes: a semiconductor cooling chip that forms a first low-temperature surface and a first high-temperature surface when current flows through it; a heat sink attached to the first low-temperature surface to reduce the local temperature near the heat sink; a fan mounted on the heat sink; a semiconductor thermoelectric module having a second low-temperature surface and a second high-temperature surface, used to convert the heat energy generated by the temperature difference between the second low-temperature surface and the second high-temperature surface into electrical energy based on the thermoelectric effect; a cooling block that maintains a low temperature and is attached to the second low-temperature surface; a first heat-conducting block attached to the first high-temperature surface and the second high-temperature surface, used to absorb heat from the first high-temperature surface and transfer it to the second high-temperature surface; and a charging port of the energy storage module connected to the output terminal of the semiconductor thermoelectric module for storing the electrical energy generated by the semiconductor thermoelectric module. This invention can improve energy efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation design technology, and in particular to a heat dissipation device and electronic device with heat recovery. Background Technology

[0002] Currently, the power consumption of large data center or computer chassis on the market is increasing. High-power chassis generate more heat during operation, which leads to higher internal temperatures. This affects the lifespan of internal components and also hinders further performance improvements of the chassis.

[0003] Conventional heat dissipation designs typically employ a fan and ventilation holes, primarily utilizing natural convection for heat dissipation. The fan directly transfers the heat generated by the heat dissipation device to the external environment. Existing designs lack heat recovery devices, resulting in low energy efficiency. Utility Model Content

[0004] To address the aforementioned problems, this invention provides a heat dissipation device and electronic equipment with heat recovery, thereby improving energy efficiency.

[0005] In a first aspect, this utility model provides a heat dissipation device with heat recovery, comprising: a combination component for achieving heat dissipation and heat recovery, and an energy storage module, wherein the combination component includes:

[0006] A semiconductor refrigeration chip, when an electric current passes through it, forms a first low-temperature surface and a first high-temperature surface;

[0007] The radiator is placed close to the first low-temperature surface to reduce the local temperature near the radiator.

[0008] The fan is mounted on the heat sink;

[0009] A semiconductor thermoelectric module has a second low-temperature surface and a second high-temperature surface, which is used to convert the heat energy formed by the temperature difference between the second low-temperature surface and the second high-temperature surface into electrical energy according to the thermoelectric effect.

[0010] The cooling block maintains a consistently low temperature and remains in close contact with the second low-temperature surface.

[0011] The first heat-conducting block is in close contact with the first high-temperature surface and the second high-temperature surface, and is used to absorb the heat from the first high-temperature surface and transfer it to the second high-temperature surface;

[0012] The charging port of the energy storage module is connected to the output end of the semiconductor thermoelectric module to store the electrical energy generated by the semiconductor thermoelectric module.

[0013] Optionally, the temperature of the first low-temperature surface can reach below 0°C.

[0014] Optionally, the assembly also includes:

[0015] The first limiting bracket and the second limiting bracket are located on the side of the semiconductor cooling chip near the heat sink and are used to limit the perimeter of the first low-temperature surface. The second limiting bracket is located on the side of the semiconductor thermoelectric module near the first heat-conducting block and is used to limit the perimeter of the second high-temperature surface and to fix the semiconductor thermoelectric module. The first limiting bracket and the second limiting bracket are fixedly connected.

[0016] Optionally, the heat dissipation device further includes: at least one second heat-conducting block, the second heat-conducting block being in close contact with the heat-generating device, and the second heat-conducting block being connected to the first heat-conducting block through a heat-conducting pipe, so as to transfer the waste heat generated by the heat-generating device to the first heat-conducting block.

[0017] Optionally, the heat pipe is made of copper.

[0018] Optionally, silicone grease may be applied to the surface of the second heat-conducting block that is in close contact with the heat-generating device to enhance its thermal conductivity.

[0019] Optionally, a heat conduction circuit is provided inside the first heat conduction block to ensure uniform heat distribution within the first heat conduction block.

[0020] Optionally, the output of the energy storage module is connected to the fan to supply power to the fan.

[0021] Optionally, the refrigeration block is provided with a coolant inlet and a coolant circulation loop. The coolant inlet is used to input external coolant, and the circulation of the external coolant in the coolant circulation loop keeps the refrigeration block at a low temperature.

[0022] Secondly, this utility model provides an electronic device, including a heat dissipation device with heat recovery as provided in the first aspect.

[0023] This invention provides a heat dissipation device with heat recovery. The thermoelectric cooler operates with an external power supply. The first low-temperature surface achieves a lower temperature. A fan-equipped heat sink is attached to the first low-temperature surface of the thermoelectric cooler, accelerating air convection and speeding up the cooling effect on the environment, resulting in good heat dissipation. Simultaneously, the thermoelectric module utilizes the temperature difference between the second low-temperature surface and the second high-temperature surface to convert the heat energy absorbed from the first high-temperature surface of the thermoelectric cooler into electrical energy, which is stored in the energy storage module, achieving heat recovery and improving energy efficiency. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of a heat dissipation device with heat recovery in one embodiment of the present invention;

[0025] Figure 2 Explosion of the assembly in one embodiment of this utility model Figure 1 ;

[0026] Figure 3Explosion of the assembly in one embodiment of this utility model Figure 2 ;

[0027] Figure 4 This is a schematic diagram of the second heat-conducting block in one embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the internal structure of the box in an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the external casing of an embodiment of the present invention.

[0030] Explanation of reference numerals in the attached figures

[0031] 11: Semiconductor cooling chip

[0032] 12: Radiator

[0033] 13: Fan

[0034] 14: Semiconductor thermoelectric module

[0035] 15: Cooling block

[0036] 16: First heat-conducting block

[0037] 17: First limiting bracket

[0038] 18: Second limit bracket

[0039] 19: Second heat-conducting block

[0040] 20: Energy storage module

[0041] 111: First Low Temperature Surface

[0042] 112: First High Temperature Surface

[0043] 113: Power input terminal

[0044] 141: Second Low Temperature Surface

[0045] 142: Second High Temperature Surface

[0046] 143: Output terminal of semiconductor thermoelectric module

[0047] 151: Coolant inlet

[0048] 161: First heat-conducting block connection end

[0049] 191: Second heat-conducting block connection end

[0050] 192: Contact Surface

[0051] 201: Charging port

[0052] 202: Energy storage module output terminal Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0054] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0055] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0056] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0057] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linking," and "socketing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0058] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0059] One embodiment of this utility model provides a heat dissipation device with heat recovery, see reference. Figures 1 to 3 The heat dissipation device includes: an assembly for achieving heat dissipation and heat energy recovery, and an energy storage module 20, wherein the assembly further includes:

[0060] The semiconductor refrigeration chip 11 has a power input terminal 113 connected to a power source. When current flows through the semiconductor refrigeration chip 11, a first low-temperature surface 111 and a first high-temperature surface 112 are formed.

[0061] Heat sink 12, which is in close contact with the first low-temperature surface 111 of the semiconductor cooling chip 11, is used to reduce the local temperature near the heat sink;

[0062] Fan 13 is mounted on heatsink 12;

[0063] The semiconductor thermoelectric module 14 has a second low-temperature surface 141 and a second high-temperature surface 142, which is used to convert the heat energy formed by the temperature difference between the second low-temperature surface 141 and the second high-temperature surface 142 into electrical energy according to the thermoelectric effect.

[0064] The cooling block 15 is always kept at a low temperature and is in close contact with the second low-temperature surface 141 of the semiconductor thermoelectric module 14.

[0065] The first heat-conducting block 16 is in close contact with the first high-temperature surface 112 and the second high-temperature surface 142, and is used to absorb the heat of the first high-temperature surface 112 and transfer it to the second high-temperature surface 142.

[0066] The energy storage module 20 has a charging port 201 and an output terminal 202. The charging port 201 is connected to the output terminal 143 of the semiconductor thermoelectric module 14. The energy storage module 20 is used to store the electrical energy generated by the semiconductor thermoelectric module 14.

[0067] The heat dissipation device with heat recovery provided in this embodiment of the invention operates with an external power supply for the semiconductor cooling chip. The first low-temperature surface can achieve a low temperature. The fan-equipped heat sink is close to the first low-temperature surface of the semiconductor cooling chip, which can accelerate air convection and speed up the cooling effect on the environment, resulting in good heat dissipation. At the same time, the semiconductor thermoelectric module utilizes the temperature difference between the second low-temperature surface and the second high-temperature surface to convert the heat energy absorbed from the first high-temperature surface of the semiconductor cooling chip into electrical energy, which is stored in the energy storage module, realizing heat energy recovery and improving energy efficiency.

[0068] In one embodiment, the output terminal 202 of the energy storage module 20 is connected to the fan 13 to supply power to the fan 13. Of course, the energy storage module 20 can also supply power to other components, not just fans. If there is a large amount of waste heat, it can also be used for other power needs. The energy storage module is connected to a fan with a fan-cooled heatsink, and the recovered energy is used to power the fan, thus realizing energy recovery and utilization.

[0069] The principle of the semiconductor cooling chip 11 is briefly explained below:

[0070] The working principle of the semiconductor thermoelectric element 11 is the "Peltier effect". The commonly used semiconductor thermoelectric material is bismuth telluride. The element is connected in series, with P-type and N-type as pairs, connected together by electrodes and sandwiched between two ceramic electrodes. When a direct current passes through the thermocouple composed of the two semiconductor materials, one end absorbs heat and the other end releases heat, and the heat-absorbing end generates a cooling effect.

[0071] In this embodiment, the power input terminal 113 of the thermoelectric cooler 11 is connected to a power source. After the power is turned on, due to the Peltier effect, the thermoelectric cooler 11 has a first low-temperature surface 111 on one side and a first high-temperature surface 112 on the other. The temperature of the first low-temperature surface 111 can reach below 0°C. The fan-equipped heat sink is attached to the first low-temperature surface 111. Due to the convection effect of the fan-equipped heat sink, the local temperature in the vicinity can be reduced to below the ambient temperature at a relatively fast speed, thereby reducing the ambient temperature and greatly improving the heat dissipation effect, thus improving the overall performance of the device.

[0072] like Figure 2 and Figure 3 As shown, the assembly also includes:

[0073] The first limiting bracket 17 is disposed on the side of the semiconductor cooling chip 11 near the heat sink 12, and is used to limit the periphery of the first low-temperature surface 111; the second limiting bracket 18 is disposed on the side of the semiconductor thermoelectric module 14 near the first heat-conducting block 16, and is used to limit the periphery of the second high-temperature surface 142, and to realize the fixed installation of the semiconductor thermoelectric module 14; the first limiting bracket 17 and the second limiting bracket 18 are fixedly connected.

[0074] refer to Figure 2 and Figure 3In one implementation, the second limiting bracket 18 is a square bracket, and the semiconductor thermoelectric module 14 can be installed in the required position, such as the side wall of the housing, through the openings on both sides. The first limiting bracket 17 is a square bracket, which is fixedly connected to the second limiting bracket 18 by studs, and the semiconductor cooling chip 11, the first heat conducting block 16, and the semiconductor thermoelectric module 14 are clamped and fixed in sequence. Of course, the installation structure between the first limiting bracket 17 and the second limiting bracket 18 is not limited to stud installation. There is an opening between the second limiting bracket 18 and the first limiting bracket 17. The opening in the middle of the second limiting bracket 18 facilitates the first heat conducting block 16 to fit tightly against the second high-temperature surface 142, and the opening in the middle of the first limiting bracket 17 facilitates the heat sink 12 to fit tightly against the first low-temperature surface 111.

[0075] The principle of the semiconductor thermoelectric module 14 is briefly explained below:

[0076] The semiconductor thermoelectric module 14 has a second low-temperature surface 141 on one side and a second high-temperature surface 142 on the other side. It utilizes the temperature difference between the two sides of the semiconductor thermoelectric material and then converts it into electrical energy through the thermoelectric effect, thereby realizing waste heat recovery and improving energy utilization efficiency.

[0077] In this embodiment, the second low-temperature surface 141 of the semiconductor thermoelectric module 14 is in close contact with a cooling block 15. The cooling block 15 maintains a consistently low temperature, thus keeping the temperature of the second low-temperature surface 141 at a low level. As one implementation, the cooling block 15 is provided with a coolant inlet 151 and a coolant flow circuit. The coolant inlet 151 is used to input external coolant, and the circulation of the external coolant within the coolant flow circuit keeps the cooling block 15 at a consistently low temperature. For example, the coolant can be cold water; the circulation of the coolant keeps the cooling block 15 at a consistently low temperature. Under the action of the cooling block 15, the second low-temperature surface 141 of the semiconductor thermoelectric module 14 maintains a low temperature.

[0078] The second high-temperature surface 142 of the semiconductor thermoelectric module 14 is in close contact with one side of the first heat-conducting block 16. The other side of the first heat-conducting block 16 is the first high-temperature surface 112 of the semiconductor cooling chip 11, which can absorb the heat from the first high-temperature surface 112 of the semiconductor cooling chip. The output terminal 143 of the semiconductor thermoelectric module 14 is connected to the charging port 201 of the energy storage module.

[0079] Furthermore, in one embodiment, the heat dissipation device may further include: at least one second heat-conducting block 19. Figure 4 The diagram shows a structural view of the second heat-conducting block 19 in two directions. The second heat-conducting block 19 is attached to the heating device and is connected to the first heat-conducting block 16 through a heat pipe to transfer the waste heat generated by the heating device to the first heat-conducting block 16.

[0080] Specifically, the second heat-conducting block 19 is provided with a connecting end 191, and the first heat-conducting block 16 is provided with a connecting end 161. The connecting ends 191 and 161 of the second and first heat-conducting blocks are connected by a heat-conducting pipe (not shown) to achieve heat conduction. As one embodiment, the heat-conducting pipe can be a copper pipe. Additionally, silicone grease is applied to the contact surface 192 of the second heat-conducting block 19 where it is in close contact with the heating device to enhance its thermal conductivity.

[0081] Furthermore, the first heat-conducting block 16 is also provided with a heat-conducting circuit (not shown) to ensure uniform heat distribution within the first heat-conducting block 16. It is understood that the connection end 161 may be led out from the heat-conducting circuit.

[0082] In this embodiment, the second heat-conducting block 19 is a heat-conducting block with a customizable position. For example, it can be applied to an industrial control computer chassis and is directly attached to heat source devices with large heat dissipation, such as CPUs and graphics cards. The waste heat generated by these high-power devices is absorbed by the second heat-conducting block 19 and then transferred to the first heat-conducting block 16 through a heat pipe.

[0083] It is conceivable that the second heat-conducting block 19 is not limited to one piece; multiple blocks can be customized to connect multiple devices with large heat generation, depending on actual needs.

[0084] In this embodiment, the heat of the first heat-conducting block 16 comes from two sources: the second heat-conducting block 19 absorbs the waste heat from the heating device and conducts it to the first heat-conducting block 16 through a copper pipe; and the first heat-conducting block 16 itself absorbs the heat from the first high-temperature surface 112 of the semiconductor cooling chip 11. Because the first heat-conducting block 16 absorbs the waste heat from the heating device inside the chassis, its temperature rises significantly, resulting in a large temperature difference between the two sides of the semiconductor thermoelectric module 14. The semiconductor thermoelectric module 14 then generates electrical energy through the thermoelectric effect.

[0085] The following is an example of a box body applying an embodiment of this utility model. For example... Figure 5 and Figure 6 As shown, the heat dissipation device is installed on the side of the enclosure. The low-temperature surface of the semiconductor cooling chip is on the inner side of the enclosure, and the heat sink is attached to the low-temperature surface. The cooling block is located on the outer side of the enclosure, and the low-temperature surface of the semiconductor thermoelectric module is attached to the cooling block on the outer side of the enclosure through the enclosure wall.

[0086] On the other hand, this embodiment of the invention also provides an electronic device, including the heat dissipation device with heat recovery provided in the above embodiments. This electronic device includes, but is not limited to, an industrial control computer.

[0087] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A heat dissipating device with heat energy recovery, characterized by, The heat dissipation device includes: a combination component for achieving heat dissipation and heat energy recovery, and an energy storage module, wherein the combination component includes: A semiconductor refrigeration chip, which forms a first low-temperature surface and a first high-temperature surface when an electric current passes through it; A radiator is attached to the first low-temperature surface to reduce the local temperature near the radiator. A fan is mounted on the heat sink; A semiconductor thermoelectric module has a second low-temperature surface and a second high-temperature surface, which is used to convert the heat energy formed by the temperature difference between the second low-temperature surface and the second high-temperature surface into electrical energy according to the thermoelectric effect; A cooling block, which is kept at a low temperature and is in close contact with the second low-temperature surface; The first heat-conducting block is attached to the first high-temperature surface and the second high-temperature surface to absorb heat from the first high-temperature surface and transfer it to the second high-temperature surface. The charging port of the energy storage module is connected to the output terminal of the semiconductor thermoelectric module and is used to store the electrical energy generated by the semiconductor thermoelectric module.

2. The heat-dissipating device with heat energy recovery according to claim 1, characterized in that, The temperature of the first low-temperature surface can reach below 0°C.

3. The heat-recovery-equipped heat dissipating apparatus according to claim 1, wherein The assembly also includes: A first limiting bracket and a second limiting bracket are provided. The first limiting bracket is disposed on the side of the semiconductor cooling chip near the heat sink and is used to limit the periphery of the first low-temperature surface. The second limiting bracket is disposed on the side of the semiconductor thermoelectric module near the first heat-conducting block and is used to limit the periphery of the second high-temperature surface and to achieve the fixed installation of the semiconductor thermoelectric module. The first limiting bracket and the second limiting bracket are fixedly connected.

4. The heat-recovery-equipped heat dissipating apparatus according to claim 1, wherein The heat dissipation device further includes at least one second heat-conducting block, which is in close contact with the heat-generating device, and the second heat-conducting block is connected to the first heat-conducting block through a heat-conducting pipe to transfer the waste heat generated by the heat-generating device to the first heat-conducting block.

5. The heat energy recovery-equipped heat dissipating apparatus according to claim 4, wherein The heat pipe is a copper pipe.

6. The heat-recovery-equipped heat dissipating apparatus according to claim 4, wherein Silicone grease is applied to the surface of the second heat-conducting block that is in close contact with the heating device to enhance its thermal conductivity.

7. The heat dissipation device with heat recovery according to claim 1, characterized in that, The first heat-conducting block has a heat-conducting circuit inside to ensure that the heat of the first heat-conducting block is evenly distributed.

8. The heat energy recovery-equipped heat dissipating apparatus according to claim 1, wherein The output terminal of the energy storage module is connected to the fan and is used to supply power to the fan.

9. The heat energy recovery-equipped heat dissipating apparatus according to claim 1, wherein The refrigeration block is equipped with a coolant inlet and a coolant circulation loop. The coolant inlet is used to input external coolant, and the circulation of the external coolant in the coolant circulation loop keeps the refrigeration block at a low temperature.

10. An electronic device, comprising: Includes a heat dissipation device with heat recovery as described in any one of claims 1 to 9.

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