An image sensor package structure

By employing a sidewall structure and multi-level aperture design in the image sensor packaging, the flow of the filler adhesive is controlled, solving the problem of air bubbles caused by rapid filling, improving the stability and sealing of the image sensor, and extending its service life.

CN224460436UActive Publication Date: 2026-07-03HUZHOU HONGWEI ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HUZHOU HONGWEI ELECTRONIC TECHNOLOGY CO LTD
Filing Date
2025-06-30
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

In the current image sensor packaging process, the rapid filling of a large amount of filler glue can easily form micro-bubbles, affecting the packaging stability and sealing performance, thereby shortening the lifespan of the image sensor.

Method used

The structure adopts a sidewall design, with the inner wall fixed to the outer wall and a gap between the inner wall and the substrate. The inner wall is provided with an annular buffer cavity and multi-level aperture guide holes. The flow of filler is controlled by the glue inlet and outlet holes, gradually reducing the formation of air bubbles.

Benefits of technology

It effectively reduces the generation of air bubbles in the filler adhesive, improves the stability and sealing of image sensor packaging, and extends service life.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224460436U_ABST
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Abstract

The utility model provides a kind of image sensor packaging structure, it is related to the field of semiconductor packaging, including substrate, image sensor and side wall;Image sensor is located the upper plate surface of substrate;Image sensor is electrically connected by lead with substrate;Side wall is arranged around the rim of substrate;Side wall includes outer wall and inner wall;Inner wall is provided with buffer inner chamber, several glue holes and several glue holes;Glue hole and glue hole are communicated with buffer inner chamber;Glue hole includes first guide hole, second guide hole and third guide hole, diameter decreases gradually;Glue hole further includes first connecting hole and second connecting hole, respectively communicating first guide hole and second guide hole, second guide hole and third guide hole;The cross section of first connecting hole and the cross section of second connecting hole gradually reduce from top to bottom.The utility model can solve the problem that existing technology is glued, if filling large amount of filling glue quickly, filling glue can be entrapped air bubble, bubble can affect the stability and sealing property of image sensor after packaging.
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