A wafer flatness adjustment device

Abstract

This invention provides a wafer flatness adjustment device, relating to the field of wafer processing, comprising: a lifting mechanism, the lifting mechanism including a micro-cylinder, a lifting base, a turntable, a self-leveling hemispherical female base, a locking screw, and a self-leveling hemispherical male base; a stabilizing mechanism is provided at the top of the lifting mechanism, the stabilizing mechanism including a chuck, positioning bumps, a vacuum channel, and a wafer body. This invention, through the overlapping design of the spherical groove inside the self-leveling hemispherical female base and the spherical block at the bottom of the self-leveling hemispherical male base, utilizes gravity or mechanical preload to automatically engage the self-leveling hemispherical female base and the self-leveling hemispherical male base, thereby compensating for the initial tilt of the chuck. The locking screw is then inserted into the self-leveling hemispherical female base and the self-leveling hemispherical male base, thereby locking the self-leveling hemispherical female base and the self-leveling hemispherical male base after leveling, facilitating the leveling operation between the wafer body and the photomask.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer flatness adjustment device. Background Technology

[0002] Wafers are the core basic material in semiconductor manufacturing. They are usually made of high-purity single-crystal silicon and are in the shape of a circular thin sheet. They are the "substrate" for manufacturing chips. Through processes such as photolithography, etching, and ion implantation, a large number of identical integrated circuits are processed on the wafer, which are then cut into individual chips.

[0003] In existing technologies, during wafer processing, flatness errors can easily occur between the wafer and the photomask, making adjustments inconvenient. Utility Model Content

[0004] The purpose of this invention is to provide a wafer flatness adjustment device to solve the problem mentioned in the background art that when processing wafers, errors in flatness between the wafer and the photomask are easy to occur, and the adjustment is inconvenient.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: including a lifting mechanism, wherein the lifting mechanism includes a miniature electric cylinder, a lifting seat, a turntable, a self-leveling hemispherical female seat, a locking screw and a self-leveling hemispherical male seat, and a stabilizing mechanism is provided on the top of the lifting mechanism, wherein the stabilizing mechanism includes a chuck, a positioning bump, a vacuum channel and a wafer body.

[0006] In a preferred embodiment, the extended end of the top of the miniature electric cylinder is fixedly connected to the bottom of the lifting seat, and the outer wall of the housing of the miniature electric cylinder is fixedly connected to the inner wall of the turntable.

[0007] In a preferred embodiment, the turntable has a hollow movable groove inside, and the inner wall of the hollow movable groove is movably connected to the outer wall of the lifting seat.

[0008] In a preferred embodiment, the top of the lifting seat is fixedly connected to the bottom of the self-leveling hemispherical female seat, and threaded stabilizing grooves are provided on both sides of the self-leveling hemispherical female seat.

[0009] In a preferred embodiment, the spherical inner wall of the self-leveling hemispherical female seat is movably connected to the outer wall of the self-leveling hemispherical male seat, and threaded locking grooves are provided on both sides of the self-leveling hemispherical male seat.

[0010] In a preferred embodiment, the inner walls of both the thread stabilizing groove and the thread locking groove are threadedly connected to the outer wall of the locking screw.

[0011] In a preferred embodiment, the top of the self-leveling hemispherical male seat is fixedly connected to the bottom of the chuck, and the top of the chuck is fixedly connected to the bottom of the positioning protrusion.

[0012] In a preferred embodiment, the chuck has a vacuum channel inside, and the top of the chuck is movably connected to the bottom of the wafer body.

[0013] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0014] 1. This utility model utilizes the overlapping design of the spherical groove inside the self-leveling hemispherical female socket and the spherical block at the bottom of the self-leveling hemispherical male socket. Gravity or mechanical pre-tightening force is used to automatically engage the self-leveling hemispherical female socket and the locking self-leveling hemispherical male socket, thereby compensating for the initial tilt of the chuck. The locking screw is then inserted into the self-leveling hemispherical female socket and the self-leveling hemispherical male socket, leveling and locking them. A micro-electric cylinder is activated to move the lifting seat, thereby moving the wafer body up and down. This facilitates the leveling operation between the wafer body and the photomask. Simultaneously, the up-and-down adjustment of the wafer body facilitates the adjustment between the wafer body and the photomask.

[0015] 2. In this utility model, the wafer body is first positioned on top of the chuck by positioning bumps. An external vacuum pumping device performs a vacuum pumping operation through a vacuum channel, thereby vacuum locking the bottom of the wafer body. This facilitates the positioning and stability of the wafer body and increases the stability of the wafer body during processing. Attached Figure Description

[0016] Figure 1 A three-dimensional schematic diagram of a wafer flatness adjustment device provided by this utility model;

[0017] Figure 2 An internal schematic diagram of a wafer flatness adjustment device provided by this utility model;

[0018] Figure 3 A three-dimensional schematic diagram of the stabilization mechanism of a wafer flatness adjustment device provided by this utility model;

[0019] Figure 4 Internal view of the lifting mechanism of a wafer flatness adjustment device provided by this utility model.

[0020] Legend:

[0021] 1. Lifting mechanism; 101. Miniature electric cylinder; 102. Lifting seat; 103. Turntable; 104. Self-leveling hemispherical female seat; 105. Locking screw; 106. Self-leveling hemispherical male seat; 2. Stabilizing mechanism; 201. Chuck; 202. Positioning bump; 203. Vacuum channel; 204. Wafer body. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1-4 This utility model provides a technical solution including: a lifting mechanism 1, which includes a micro electric cylinder 101, a lifting seat 102, a turntable 103, a self-leveling hemispherical female seat 104, a locking screw 105, and a self-leveling hemispherical male seat 106. A stabilizing mechanism 2 is provided on the top of the lifting mechanism 1, which includes a chuck 201, a positioning bump 202, a vacuum channel 203, and a wafer body 204.

[0024] In one embodiment, the extended end of the top of the miniature electric cylinder 101 is fixedly connected to the bottom of the lifting seat 102, the outer wall of the housing of the miniature electric cylinder 101 is fixedly connected to the inner wall of the turntable 103, the turntable 103 has a hollow movable groove inside, and the inner wall of the hollow movable groove is movably connected to the outer wall of the lifting seat 102. The top of the lifting seat 102 is fixedly connected to the bottom of the self-leveling hemispherical female seat 104, and threaded stabilizing grooves are opened on both sides of the self-leveling hemispherical female seat 104.

[0025] Specifically: The micro electric cylinder 101 is activated to move the lifting seat 102, thereby moving the wafer body 204 up and down. By adjusting the wafer body 204 up and down, the adjustment between the wafer body 204 and the photomask is facilitated.

[0026] In one embodiment, the spherical inner wall of the self-leveling hemispherical female seat 104 is movably connected to the outer wall of the self-leveling hemispherical male seat 106. Threaded locking grooves are provided on both sides of the self-leveling hemispherical male seat 106. The inner walls of the threaded stabilizing groove and the threaded locking groove are threadedly connected to the outer wall of the locking screw 105.

[0027] Specifically: the locking screw 105 is inserted into the self-leveling hemispherical female seat 104 and the self-leveling hemispherical male seat 106, thereby locking the self-leveling hemispherical female seat 104 and the self-leveling hemispherical male seat 106 after leveling.

[0028] In one embodiment, the top of the self-leveling hemispherical male seat 106 is fixedly connected to the bottom of the chuck 201, and the top of the chuck 201 is fixedly connected to the bottom of the positioning protrusion 202.

[0029] Specifically: the chuck 201 has a maximum clamping diameter of 1 inch, and the positioning bumps 202 facilitate the positioning of the wafer body 204.

[0030] In one embodiment, the chuck 201 has a vacuum channel 203 inside, and the top of the chuck 201 is movably connected to the bottom of the wafer body 204.

[0031] Specifically, the wafer body 204 is positioned above the chuck 201 by the positioning bump 202. An external vacuum pumping device performs a vacuuming operation through the vacuum channel 203, thereby vacuum locking the bottom of the wafer body 204. This facilitates the positioning and stability of the wafer body 204 and increases the stability of the wafer body 204 during processing.

[0032] Working principle: First, the wafer body 204 is positioned above the chuck 201 by the positioning bump 202. The external vacuum pumping device performs evacuation through the vacuum channel 203, thereby vacuum locking the bottom of the wafer body 204. Through the overlapping design of the spherical groove inside the self-leveling hemispherical female connector 104 and the spherical block at the bottom of the self-leveling hemispherical male connector 106, gravity or mechanical preload is used to automatically fit the self-leveling hemispherical female connector 104 and the self-leveling hemispherical male connector 106, thereby compensating for the initial tilt of the chuck 201. The locking screw 105 is then inserted into the self-leveling hemispherical female connector 104 and the self-leveling hemispherical male connector 106, thereby locking the self-leveling hemispherical female connector 104 and the self-leveling hemispherical male connector 106 after leveling. The micro electric cylinder 101 is activated to drive the lifting seat 102 to move, thereby moving the wafer body 204 up and down.

[0033] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A device for adjusting flatness of a wafer, characterized by, include: The lifting mechanism (1) includes a miniature electric cylinder (101), a lifting seat (102), a turntable (103), a self-leveling hemispherical female seat (104), a locking screw (105), and a self-leveling hemispherical male seat (106). A stabilizing mechanism (2) is provided at the top of the lifting mechanism (1). The stabilizing mechanism (2) includes a chuck (201), a positioning bump (202), a vacuum channel (203), and a wafer body (204). The lifting seat (105) is also provided with a stabilizing mechanism (2). The top of 102) is fixedly connected to the bottom of the self-leveling hemispherical female seat (104). The self-leveling hemispherical female seat (104) has threaded stabilizing grooves on both sides. The spherical inner wall of the self-leveling hemispherical female seat (104) is movably connected to the outer wall of the self-leveling hemispherical male seat (106). The self-leveling hemispherical male seat (106) has threaded locking grooves on both sides. The inner walls of the threaded stabilizing groove and the threaded locking groove are threadedly connected to the outer wall of the locking screw (105).

2. The apparatus for adjusting wafer flatness according to claim 1, wherein: The extended end of the top of the miniature electric cylinder (101) is fixedly connected to the bottom of the lifting seat (102), and the outer wall of the shell of the miniature electric cylinder (101) is fixedly connected to the inner wall of the turntable (103).

3. The apparatus for adjusting wafer flatness according to claim 2, wherein: The turntable (103) has a hollow movable groove inside, and the inner wall of the hollow movable groove is movably connected to the outer wall of the lifting seat (102).

4. The apparatus for adjusting wafer flatness according to claim 1, wherein: The top of the self-leveling hemispherical male seat (106) is fixedly connected to the bottom of the chuck (201), and the top of the chuck (201) is fixedly connected to the bottom of the positioning protrusion (202).

5. The apparatus for adjusting wafer flatness according to claim 4, wherein: The chuck (201) has a vacuum channel (203) inside, and the top of the chuck (201) is movably connected to the bottom of the wafer body (204).

Images