A hollow wafer detection platform

By designing a hollow wafer inspection platform integrating a spectrometer, the simultaneous detection of wafer epitaxial film thickness and elemental concentration was achieved, solving the problems of high equipment cost and cumbersome operation in existing technologies, and improving production efficiency and detection accuracy.

CN224460549UActive Publication Date: 2026-07-03盖泽精密科技(苏州)有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
盖泽精密科技(苏州)有限公司
Filing Date
2025-06-23
Publication Date
2026-07-03

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Abstract

This invention provides a hollow wafer inspection platform, comprising an inspection box, an inspection stage, and an inspection instrument. The inspection box is a hollow box containing an inspection stage for loading wafers. The inspection stage is equipped with a rotation mechanism to drive the wafer's rotation. The inspection box also contains a transfer mechanism to move the inspection stage. The inspection box has an upper inspection port at the top and a lower inspection port at the bottom. The inspection instrument is a spectrometer with two optical paths. One optical path enters through the upper inspection port, is reflected back from the wafer surface, and is used to detect the epitaxial film thickness of the wafer. The other optical path enters through the upper inspection port, transmits through the wafer, and exits the inspection box through the lower inspection port, and is used to detect the elemental concentration of the wafer. This invention can simultaneously complete epitaxial film thickness and elemental concentration detection in a single inspection, simplifying equipment and wafer inspection processes, reducing equipment costs, and improving production efficiency.
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