A power module package structure

Abstract

This application discloses a power module packaging structure, which includes a first substrate; a power device located on a first surface of the first substrate; a housing including opposing first and second sides, and opposing third and fourth sides, the first, second, third, and fourth sides of the housing surrounding the first substrate, the first and third sides being perpendicular, and each of the first, second, third, and fourth sides having a support structure, the support structures of the first, second, third, and fourth sides being connected; silicone gel covering the first substrate and the power device; a second substrate located on the support structure and situated on a second surface of the first substrate; and grooves on the second surface of the support structure. By improving the grooves on the second surface of the support structure that contact the substrate, the generation of bubbles is reduced, and the stability and insulation performance of the adhesive layer are improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor device manufacturing, and more specifically, to a power module packaging structure. Background Technology

[0002] In the field of electronic packaging, the design of the packaging structure directly affects the reliability and lifespan of devices. Especially during long-term use, the packaging material may experience insulation layer failure due to changes in the external environment, temperature fluctuations, mechanical stress, etc., leading to electrical faults or short circuits. Therefore, how to enhance the insulation capability of the packaging structure and ensure the stability of electronic components under extreme conditions has become one of the key issues in the development of electronic packaging technology.

[0003] Traditional packaging designs often have shortcomings in the scribe groove design at the contact point between the casing and the substrate. Particularly in the design of the groove width, depth, and angle, stress concentration and adhesive layer breakage are frequently unavoidable, potentially leading to insulation failure during use. While existing technologies have made some improvements, they have not completely resolved these issues.

[0004] Therefore, an encapsulation structure was invented to enhance the protection against insulation failure. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a packaging structure for a power module, which improves the stability and insulation performance of the adhesive layer by modifying the adhesive groove at the bottom of the shell that contacts the substrate.

[0006] This utility model provides a packaging structure for a power module, comprising: a first substrate; a power device located on a first surface of the first substrate; a housing including opposing first and second sides and opposing third and fourth sides, the first, second, third, and fourth sides of the housing surrounding the first substrate, the first and third sides being perpendicular to each other, each of the first, second, third, and fourth sides having a support structure, the support structures of the first, second, third, and fourth sides being connected; silicone gel covering the first substrate and the power device; a second substrate located on the support structure and on a second surface of the first substrate; and a groove on the second surface of the support structure.

[0007] Preferably, the grooves on the support structures of the first side, the second side, the third side, and the fourth side are connected.

[0008] Preferably, the grooves on the support structures of the first side, the second side, the third side, and the fourth side are connected by a transition structure.

[0009] Preferably, the transition structure is a circular arc structure.

[0010] Preferably, the cross-section along the length of the groove is an arc shape.

[0011] Preferably, the cross-section of the groove along its length is an arc, and the diameter of the arc is 0.5mm-3mm.

[0012] Preferably, the cross-section of the groove along its length is an arc, and the radius of the arc is R0.1~R3.

[0013] Preferably, the top of the groove is smoothly connected to the first surface of the side by a rounded corner.

[0014] Preferably, the power module further includes a plurality of terminals, one end of which is connected to the power device, and the other end of which extends out from the housing.

[0015] Preferably, the second substrate is a heat dissipation substrate.

[0016] According to the packaging structure provided by this utility model, by widening and improving the adhesive groove at the bottom of the outer shell that contacts the substrate, the thickness and uniformity of the adhesive layer can be ensured, enhancing the packaging structure's resistance to electrical failure and reducing the risk of insulation failure. Simultaneously, the optimized packaging structure improves the overall stability of the package, thereby enhancing the reliability of electronic components. Attached Figure Description

[0017] To more clearly illustrate the technical solution of this application, the accompanying drawings of the embodiments will be briefly described below. Obviously, the drawings in the following description only relate to some embodiments of this disclosure and are not intended to limit this disclosure.

[0018] Figure 1 A schematic diagram of a typical structure after optimization of the glue groove;

[0019] Figure 2 This is a schematic diagram of the assembly of the outer casing and the substrate;

[0020] Figure 3 This is a schematic cross-sectional view of the assembly of the outer casing and the substrate.

[0021] Figure descriptions: 201 - Transition structure; 202 - Ultrasonic welding terminal; 203 - Groove; 204 - Smooth connection between the top of the groove and the rounded corner of the first surface on the side; 205 - Housing snap-fit; 206 - Second substrate; 207 - Substrate support structure. Detailed Implementation

[0022] The present application will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are indicated by similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Furthermore, some well-known parts may not be shown. For simplicity, a semiconductor device obtained after several steps can be depicted in a single figure.

[0023] Many specific details of this application, such as the structure, materials, dimensions, processing techniques, and methods of the devices, are described below to provide a clearer understanding of the application. However, as those skilled in the art will understand, this application may be implemented without adhering to these specific details.

[0024] Figure 1 This is a schematic diagram of a power module packaging structure provided by the present invention, as shown below. Figure 1 As shown, the power module packaging structure includes a first substrate, a second substrate 206, at least one power device, a housing, and silicone gel. Specifically, the power device is located on the first surface of the first substrate; the housing includes opposing first and second sides, as well as opposing third and fourth sides, which surround the first substrate. The first and third sides are perpendicular to each other. Each of the first, second, third, and fourth sides has a support structure, and these support structures are connected. Silicone gel covers the first substrate and the power device. The grooves on the support structures of the first, second, third, and fourth sides are connected by a transition structure 201, which is an arc structure. The grooves 203 on the support structures of the first, second, third, and fourth sides have an arc shape in cross-section along their length, with a diameter of 0.5mm-3mm and a fillet radius of R0.1~R3. The top and side surfaces of the recess 203 are smoothly connected by a rounded corner 204. The power module has multiple terminals, one end of which is connected to the power device, and the other end of which extends out from the housing.

[0025] Figure 2 This is a schematic diagram of the assembly of the outer casing and the substrate, and its cross-sectional view is shown below. Figure 3 As shown, the outer casing and substrate 206 are connected by sealant within the improved groove 203, ensuring the thickness and uniformity of the sealant layer, reducing bubble formation, enhancing the package structure's resistance to electrical failures, and lowering the risk of insulation failure. Simultaneously, the optimized package structure improves the overall stability of the package, thereby enhancing the reliability of the electronic components.

[0026] The above description does not provide detailed explanations of the technical aspects of each layer's patterning, etching, etc. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0027] The embodiments of this application have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of this application. The scope of this application is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this application, and all such substitutions and modifications should fall within the scope of this application.

Claims

1. A power module package structure, characterized by, include: First substrate; A power device located on a first surface of the first substrate; The housing includes opposing first and second sides, as well as opposing third and fourth sides. The first, second, third, and fourth sides of the housing surround a first substrate. The first and third sides are perpendicular to each other. The first, second, third, and fourth sides each have a supporting structure, and the supporting structures of the first, second, third, and fourth sides are connected to each other. Silicone gel, which covers the first substrate and the power device; The second substrate is located on the support structure and is located on the second surface of the first substrate; The second surface of the support structure has grooves.

2. The power module package structure of claim 1, wherein, The grooves on the support structures of the first side, the second side, the third side, and the fourth side are connected.

3. The package structure of claim 1, wherein, The grooves on the support structures of the first side, second side, third side, and fourth side are connected by a transition structure.

4. The power module package structure of claim 3, wherein, The transition structure is a circular arc structure.

5. The power module package structure of claim 1, wherein, The cross-section along the length of the groove is circular.

6. The power module package structure of claim 4, wherein, The cross-section along the length of the groove is an arc, and the diameter of the arc is 0.5mm-3mm.

7. The power module package structure of claim 5, wherein, The cross-section along the length of the groove is an arc, and the radius of the arc is R0.1~R3.

8. The power module package structure of claim 1, wherein, The top of the groove is smoothly connected to the first surface of the side by rounded corners.

9. The package structure of claim 1, wherein, The power module also includes multiple terminals, one end of which is connected to the power device, and the other end of which extends out from the housing.

10. The package structure of claim 1, wherein, The second substrate is a heat dissipation substrate.

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