A mite trapping pad with a mite trapping composite chip

By designing a mite-attracting composite chip mite-catching pad, and using an adhesive layer to fix mites, the problems of low production efficiency and poor capture effect of existing devices are solved, achieving efficient capture and prevention of escape.

CN224460945UActive Publication Date: 2026-07-07SHANGHAI RUICHENG IND CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANGHAI RUICHENG IND CO LTD
Filing Date
2025-07-28
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Existing mite-catching devices require manual cutting of the pesticide pack during production, which affects efficiency, results in poor capture effect, and allows mites to easily escape, thus hindering subsequent research.

Method used

A mite-attracting composite chip mite-trapping pad is designed. The structure is formed by stitching together an upper and lower covering layer. The internal structure includes an inducing core, an adhesive layer, and an absorbent paper layer. The adhesive layer is used to fix the mites, preventing them from escaping and improving production efficiency.

Benefits of technology

It achieves efficient mite capture, prevents escape, and improves the production efficiency and capture effect of the mite-catching device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a mite removing technical field, a kind of lure mite composite chip to catch mite pad, including upper cladding, the bottom of upper cladding is sewn with lower cladding, trapping layer is arranged between lower cladding and upper cladding, trapping layer is provided with inductive core, the utility model, by gluing layer, medicated powder layer is fixedly adhered in the middle part of lower water-absorbing paper layer and upper water-absorbing paper layer, lure mite composite chip is fixed in the trapping structure of upper mesh layer and lower mesh layer by adhesive layer, finally, it can complete the assembly process of entire catch mite pad by the closure of mutually sewn upper cladding and lower cladding, without cutting to fill the medicine bag to base material, improve the production efficiency of catch mite pad;Water-absorbing paper layer can improve the humidity inside catch mite pad, more conform to the living habits of mite, cooperate lure mite composite chip and induce mite to enter into adhesive layer, adhere to mite, prevent mite from escaping, and the effect of catching mite is good.
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Description

Technical Field

[0001] This utility model belongs to the field of mite removal technology, specifically relating to a mite-attracting composite chip mite-catching pad. Background Technology

[0002] Mites are tiny arthropods belonging to the subclass Acari of the class Arachnida. They are extremely small and widely distributed in the natural environment and human living spaces. Dust mites are one of the main indoor allergens and can be transmitted through the air, while scabies mites and Demodex mites directly infest the skin. Although mites are tiny, their impact on health and quality of life cannot be ignored. In order to study the impact of mites on people's lives, it is necessary to capture mites for scientific research. However, conventional capture methods, such as physical adsorption or manual picking, will affect the activity of mites. Insufficient activity of captured mites is not conducive to subsequent research. Most existing mite-catching devices fill the center with a drug pack as the induction part of the entire device. During the production process, the shape of the drug pack needs to be cut manually on the capture layer, which affects the production efficiency of the device. At the same time, the capture effect of mite-catching devices is poor. Mites can crawl out after entering, and captured mites are easily shaken off during the collection and transfer process. Therefore, it is necessary to design a mite-attracting composite chip mite-catching pad to capture live mites. Utility Model Content

[0003] The purpose of this invention is to provide a simple and reasonably designed mite-attracting composite chip mite-catching pad in order to solve the above problems.

[0004] This utility model achieves the above objectives through the following technical solutions:

[0005] A mite-attracting composite chip mite-catching pad includes an upper covering layer, a lower covering layer sewn to the bottom of the upper covering layer, a catching layer disposed between the lower covering layer and the upper covering layer, and an induction core disposed in the catching layer.

[0006] As a further optimization of this utility model, the capture layer includes a lower mesh layer laid on the lower covering layer, and an adhesive layer is provided on the lower mesh layer.

[0007] As a further optimization of this utility model, a mesh hole layer is laid on the adhesive layer, and the mesh hole layer is attached to the bottom of the upper covering layer.

[0008] As a further optimization of this utility model, the inducing core includes a lower absorbent paper layer laid on the adhesive layer, and an adhesive coating layer is provided above the lower absorbent paper layer.

[0009] As a further optimization of this utility model, a powder layer is laid on the adhesive layer, and an upper absorbent paper layer is laid on the powder layer, the upper absorbent paper layer being attached to the bottom of the mesh layer.

[0010] The beneficial effects of this utility model are as follows:

[0011] This invention relates to a mite-attracting composite chip in a mite-trapping pad. The powder layer is fixed to the middle section of the lower and upper absorbent paper layers using an adhesive layer. This chip is then fixed to the trapping structure formed by the mesh layer and the lower mesh layer using an adhesive layer. Finally, the entire assembly process is completed by sealing the mat with an upper and lower covering layer that are sewn together. The adhesive layer traps the mites, preventing them from escaping, resulting in a good mite-trapping effect. Furthermore, it eliminates the need to cut the substrate to fill the powder packet, thus improving the production efficiency of the mite-trapping pad. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0013] Figure 2 This is a schematic diagram showing the placement of the induction core in this utility model;

[0014] Figure 3 This is an exploded structural diagram of the present invention.

[0015] In the diagram: 1. Upper coating layer; 2. Lower coating layer; 3. Capture layer; 4. Inducing core; 31. Lower mesh layer; 32. Adhesive layer; 33. Upper mesh layer; 41. Lower absorbent paper layer; 42. Glue coating layer; 43. Powder layer; 44. Upper absorbent paper layer. Detailed Implementation

[0016] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0017] Example

[0018] Please see Figures 1-3 A mite-attracting composite chip mite-trapping pad includes an upper covering layer 1, with the edges of the upper covering layer 1 and the lower covering layer 2 sewn together and fixed. Both the upper covering layer 1 and the lower covering layer 2 are multi-layered cotton or non-woven fabric layers. After sewing, the trapping layer 3 is located between the lower covering layer 2 and the upper covering layer 1. The trapping layer 3 is provided with an induction core 4 that can attract mites into the mite-trapping pad. Driven by the induction core 4, the mites crawl from the upper covering layer 1 and the lower covering layer 2 into the mite-trapping pad and are then captured by the trapping layer 3 to prevent the mites from escaping.

[0019] The trapping layer 3 includes a lower mesh layer 31 laid at the top center of the lower covering layer 2. An adhesive layer 32 is provided on the lower mesh layer 31, and the adhesive layer 32 is double-sided adhesive. A net mesh layer 33 is laid on the adhesive layer 32. The net mesh layer 33 is attached to the bottom of the upper covering layer 1. The net mesh layer 33 and the lower mesh layer 31 are fixed to each other by the adhesive layer 32. After the mites pass through the mesh of the net mesh layer 33 and the lower mesh layer 31 and enter the adhesive layer 32, they will be stuck to the surface of the adhesive layer 32.

[0020] The inducing core 4 includes a lower absorbent paper layer 41 laid on the adhesive layer 32. A coating layer 42 is provided above the lower absorbent paper layer 41. A powder layer 43 is laid on the coating layer 42, and an upper absorbent paper layer 44 is laid on the powder layer 43. The upper absorbent paper layer 44 is attached to the bottom of the mesh layer 33. Both the lower absorbent paper layer 41 and the upper absorbent paper layer 44 are printed material layers cut from polymer absorbent paper. The upper absorbent paper layer 44 and the lower absorbent paper layer 41 can absorb moisture in the air, increase the humidity of the inducing core 4, and make the humidity environment of the entire inducing core 4 more in line with the living habits of mites. The powder layer 43 is fixedly adhered to the middle part of the lower absorbent paper layer 41 and the upper absorbent paper layer 44 by the coating layer 42.

[0021] It should be noted that, in the production process of this mite-attracting composite chip mite-trapping pad, firstly, a layer of absorbent paper 41 is laid down, then an adhesive layer 42 is coated on the absorbent paper 41, then an inducing powder layer 43 is filled on the adhesive layer 42, and then an absorbent paper layer 44 is laid on the powder layer 43 to form a three-layer mite-attracting composite chip; then, the mite-attracting composite chip is glued to the adhesive layer 32, and the lower mesh layer 31 and the upper mesh layer 33 are glued respectively. The trapping structure of the mite-trapping pad is formed at the bottom and top of the adhesive layer 32. Finally, the upper covering layer 1 and the lower covering layer 2 are sewn together to seal and complete the assembly process of the mite-trapping pad. There is no need to cut the substrate to fill the medicine bag, which improves the production efficiency of the mite-trapping pad. During use, mites are induced by the mite-attracting composite chip to crawl through the lower mesh layer 31 and the upper mesh layer 33 into the adhesive layer 32. The double-sided adhesive layer 32 can stick and capture the mites that have entered.

[0022] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A mite-attracting composite chip mite-trapping pad, comprising an upper covering layer (1), characterized in that: The bottom of the upper covering layer (1) is sewn with a lower covering layer (2), and a trapping layer (3) is provided between the lower covering layer (2) and the upper covering layer (1). An induction core (4) is provided in the trapping layer (3).

2. The mite-attracting composite chip mite-trapping pad according to claim 1, characterized in that: The capture layer (3) includes a lower mesh layer (31) laid on the lower covering layer (2), and an adhesive layer (32) is provided on the lower mesh layer (31).

3. The mite-attracting composite chip mite-trapping pad according to claim 2, characterized in that: A mesh perforated layer (33) is laid on the adhesive layer (32), and the mesh perforated layer (33) is attached to the bottom of the upper covering layer (1).

4. The mite-attracting composite chip mite-trapping pad according to claim 3, characterized in that: The induction core (4) includes a lower absorbent paper layer (41) laid on the adhesive layer (32), and an adhesive coating layer (42) is provided above the lower absorbent paper layer (41).

5. The mite-attracting composite chip mite-trapping pad according to claim 4, characterized in that: A powder layer (43) is laid on the adhesive layer (42), and an upper absorbent paper layer (44) is laid on the powder layer (43), which is attached to the bottom of the mesh layer (33).