An ultrasonic thickness measuring device based on zigbee wireless communication

Abstract

The utility model discloses an ultrasonic thickness measuring device based on zigBee wireless communication, include: single -chip microcomputer, ultrasonic thickness sensor, its pin connection with single -chip microcomputer, is used for gathering wall thickness data, zigBee wireless communication circuit, its pin connection with single -chip microcomputer, power monitoring circuit, its both ends are connected with the positive and negative pole of battery power respectively, voltage reducing circuit, its input end is connected with the output of power monitoring circuit, and the output is connected with the pin of single -chip microcomputer and zigBee wireless communication circuit, sensor power supply management circuit, its input end is connected with the output of power monitoring circuit and the pin of single -chip microcomputer, voltage increasing circuit, its input end is connected with the output of sensor power supply management circuit, and the output is connected with ultrasonic thickness sensor.

Description

Technical Field

[0001] This utility model belongs to the field of oil and gas exploration and development technology, and specifically relates to an ultrasonic thickness measurement device based on ZigBee wireless communication. Background Technology

[0002] Common wall thickness monitoring devices require wired connections to transmit data. Wired connections necessitate the installation of cables at the test site. These cables are used for data transmission and long-distance power supply. Cable installation is difficult and the cables are prone to breakage. Cable power supply and data transmission also lead to poor equipment reliability and issues such as water ingress into the interfaces. Utility Model Content

[0003] The purpose of this invention is to solve the problems of existing wall thickness monitoring devices being difficult to install, prone to breakage, and having poor equipment reliability, and to provide an ultrasonic thickness measurement device based on ZigBee wireless communication.

[0004] The technical solution provided by this utility model is as follows:

[0005] An ultrasonic thickness measurement device based on ZigBee wireless communication includes:

[0006] Microcontroller;

[0007] An ultrasonic thickness sensor is connected to the pins of the microcontroller and is used to collect wall thickness data.

[0008] The ZigBee wireless communication circuit is connected to the pins of the microcontroller.

[0009] The power monitoring circuit has its two ends connected to the positive and negative terminals of the battery power supply, respectively; the output terminal of the power monitoring circuit outputs a 7.2V power supply.

[0010] A step-down circuit has its input terminal connected to the output terminal of the power monitoring circuit, and its output terminal connected to the pins of the microcontroller and the ZigBee wireless communication circuit; the output terminal of the step-down circuit outputs a 3.3V power supply.

[0011] The sensor power supply management circuit has its input terminal connected to the output terminal of the power monitoring circuit and the pins of the microcontroller.

[0012] The boost circuit has its input terminal connected to the output terminal of the sensor power management circuit and its output terminal connected to the ultrasonic thickness sensor; the output terminal of the boost circuit outputs a 12V power supply.

[0013] Preferably, the power monitoring circuit includes:

[0014] The first resistor has one end connected to the positive terminal of the battery power supply;

[0015] The second resistor has one end connected to the negative terminal of the battery power supply, and the other end connected to the other end of the first resistor and to the pin of the microcontroller.

[0016] Preferably, the step-down circuit includes:

[0017] The step-down chip has its pin 3 connected to the output of the power monitoring circuit, its pin 2 outputting 3.3V power, and its pin 1 grounded.

[0018] The first filter capacitor has one end connected to pin 3 of the step-down chip and the other end grounded.

[0019] Second filter capacitor;

[0020] The third filter capacitor, which is connected in parallel with the second filter capacitor, forms the first filter circuit. One end of the first filter circuit is connected to pin 2 of the step-down chip, and the other end is grounded.

[0021] Preferably, the sensor power supply management circuit is as follows:

[0022] The first drive switch is composed of a first MOSFET and a first Zener diode;

[0023] The second drive switch is composed of a second MOSFET and a second Zener diode;

[0024] In this configuration, the drain of the second MOSFET is connected to the anode of the second Zener diode, the source of the second MOSFET is connected to the cathode of the first Zener diode and connected to the output terminal of the power monitoring circuit; the source of the first MOSFET is connected to the anode of the first Zener diode and grounded, and the drain of the first MOSFET is connected to the cathode of the first Zener diode and the gate of the second MOSFET.

[0025] Fourth filter capacitor;

[0026] The fifth filter capacitor is connected in parallel with the fourth filter capacitor to form a second filter circuit; one end of the second filter circuit is connected to the source of the second MOS transistor, and the other end is grounded.

[0027] The third resistor has one end connected to the source of the second MOSFET and the other end connected to the gate of the second MOSFET.

[0028] The sixth filter capacitor has one end connected to the drain of the second MOSFET and the other end grounded.

[0029] The fourth resistor has one end connected to a pin of the microcontroller;

[0030] The fifth resistor has one end grounded and the other end connected to the other end of the fourth resistor and connected to the gate of the first MOS transistor.

[0031] Preferably, the boost circuit includes:

[0032] An inductor, with its pin 1 connected to the output terminal of the sensor power supply management circuit;

[0033] The rectifier diode has its positive terminal connected to pin 2 of the inductor, and its negative terminal outputs a 12V power supply.

[0034] The boost converter chip has pin 1 connected to pin 2 of the inductor, pin 2 grounded, and pins 4 and 5 both connected to the output of the sensor power supply management circuit.

[0035] The seventh filter capacitor has one end connected to the output terminal of the sensor power supply management circuit and the other end grounded.

[0036] The sixth resistor has one end connected to the negative terminal of the rectifier diode and the other end connected to pin 3 of the boost chip.

[0037] The eighth filter capacitor is connected in parallel with the sixth resistor;

[0038] The seventh resistor has one end grounded and the other end connected to the other end of the sixth resistor.

[0039] The ninth filter capacitor has one end connected to the negative terminal of the rectifier diode and the other end grounded.

[0040] Preferably, the ZigBee wireless communication circuit includes:

[0041] The XBee module has pin 1 connected to the output of the step-down circuit, pins 2, 3 and 9 connected to the pins of the microcontroller, and pin 10 grounded.

[0042] The tenth filter capacitor has one end connected to the output terminal of the step-down circuit and the other end grounded.

[0043] The eighth resistor has one end connected to the output terminal of the step-down circuit and the other end connected to pin 5 of the XBee module.

[0044] The ninth resistor has one end connected to the output terminal of the step-down circuit and the other end connected to pin 9 of the XBee module.

[0045] The beneficial effects of this utility model are: the ultrasonic thickness measuring device based on ZigBee wireless communication provided by this utility model adopts ZigBee wireless communication technology, combined with multi-level power management and real-time power monitoring, which makes the ultrasonic thickness measuring device easy to install, improves the stability of data transmission, and enhances the reliability of the ultrasonic thickness measuring device. Attached Figure Description

[0046] Figure 1This is a schematic diagram of the ultrasonic thickness measurement device based on ZigBee wireless communication described in this utility model.

[0047] Figure 2 This is a schematic diagram of the power monitoring circuit structure described in this utility model.

[0048] Figure 3 This is a schematic diagram of the step-down circuit structure described in this utility model.

[0049] Figure 4 This is a schematic diagram of the sensor power supply management circuit structure described in this utility model.

[0050] Figure 5 This is a schematic diagram of the boost circuit structure described in this utility model.

[0051] Figure 6 This is a schematic diagram of the ZigBee wireless communication circuit structure described in this utility model. Detailed Implementation

[0052] The present invention will now be described in further detail with reference to the accompanying drawings, so that those skilled in the art can implement it based on the description.

[0053] like Figure 1 As shown, this utility model provides an ultrasonic thickness measurement device based on ZigBee wireless communication, comprising: a microcontroller, which is the main control chip; an ultrasonic thickness sensor, which is connected to the pins of the main control chip; the ultrasonic thickness sensor is used to collect wall thickness data; a ZigBee wireless communication circuit, which is connected to the pins of the main control chip; and a power management circuit, comprising: a power monitoring circuit, whose two ends are respectively connected to the positive and negative terminals of a battery power supply; the battery power supply is a 7.2V lithium battery; the output terminal VCC_BAT_OUT of the power monitoring circuit outputs 7.2V power; a step-down circuit, whose input terminal is connected to the output terminal VCC_BAT_OUT of the power monitoring circuit, and whose output terminal is connected to the pins of the main control chip and the ZigBee wireless communication circuit; the output terminal AVCC3V3 of the step-down circuit outputs 3.3V power, which is supplied to the main control chip and the ZigBee wireless communication circuit. The communication circuit is powered by a step-down circuit that converts 7.2V to 3.3V. A sensor power management circuit has its input connected to the output VCC_BAT_OUT of the power monitoring circuit and a pin of the main control chip. A boost circuit has its input connected to the output VCC_SEN_BAT of the sensor power management circuit and its output connected to the ultrasonic thickness sensor. The boost circuit's output SENSOR_PWR outputs 12V to power the ultrasonic thickness sensor. The boost circuit converts 3.3V to 12V.

[0054] like Figure 2 As shown, the power monitoring circuit includes: a first resistor R1 (100K 1%), one end of which is connected to the positive terminal of the battery power supply; a second resistor R2 (100K 1%), one end of which is connected to the negative terminal of the battery power supply, and the other end of which is connected to the other end of the first resistor R1 and connected to the pin of the main control chip; the first resistor R1 and the second resistor R2 are connected in series to form a first voltage divider circuit, which is connected to the pin of the main control chip to transmit the detected power monitoring signal BAT_ADC to the main control chip, thereby providing the user with battery power consumption information; when the power monitoring signal BAT_ADC shows that the battery power is low, the user can clearly observe the battery power and replace the battery in time.

[0055] like Figure 3 As shown, the step-down circuit includes: a step-down chip U1, whose pin 3 is connected to the output terminal VCC_BAT_OUT of the power monitoring circuit, pin 2 outputs 3.3V power, and pin 1 is grounded; a first filter capacitor C1 (10μF / 16V), one end of which is connected to pin 3 of the step-down chip U1, and the other end is grounded; a second filter capacitor C2 (1μF / 16V); and a third filter capacitor C3 (10μF / 16V), which is connected in parallel with the second filter capacitor C2 to form a first filter circuit, one end of which is connected to pin 2 of the step-down chip U1, and the other end is grounded.

[0056] like Figure 4As shown, the sensor power supply management circuit includes: a first drive switch Q1 (2N7002), which is composed of a first MOSFET and a first Zener diode; a second drive switch Q2 (AO3415A), which is composed of a second MOSFET and a second Zener diode; wherein the drain of the second MOSFET is connected to the anode of the second Zener diode, the source of the second MOSFET is connected to the cathode of the first Zener diode and connected to the output terminal VCC_BAT_OUT of the power monitoring circuit; the source of the first MOSFET is connected to the anode of the first Zener diode and grounded, and the drain of the first MOSFET is connected to the cathode of the first Zener diode and the gate of the second MOSFET; a fourth filter capacitor C4 (0.1μF); a fifth filter capacitor C5 (10μF), which is connected in parallel with the fourth filter capacitor C4 to form a second filter circuit; one end of the second filter circuit is connected to the source of the second MOSFET, and the other end is grounded; and a third resistor R3 (200KΩ). The first MOSFET has a 1% (1%) capacitor, one end of which is connected to the source of the second MOSFET and the other end to the gate of the second MOSFET; the sixth filter capacitor C6 (0.1μF) has one end connected to the drain of the second MOSFET and the other end grounded; the fourth resistor R4 (2K) has one end connected to the pin of the main control chip; the fifth resistor R5 (100K1%) has one end grounded and the other end connected to the other end of the fourth resistor R4 and connected to the gate of the first MOSFET; the fourth resistor R4 and the fifth resistor R5 form a second voltage divider circuit and are connected to the pin of the main control chip. The main control chip controls the opening or closing of the sensor power management circuit through the sensor power control signal SENSOR_PWR_CTR, controls the operation or stopping of the boost circuit, and thus controls the working state of the ultrasonic thickness sensor.

[0057] like Figure 5As shown, the boost circuit includes: an inductor L1 (6.8μH / 500mA), whose pin 1 is connected to the output terminal VCC_SEN_BAT of the sensor power supply management circuit; a rectifier diode D1 (DSK34), whose anode is connected to pin 2 of the inductor L1, and whose cathode outputs 12V power; a boost chip U2, whose pin 1 is connected to pin 2 of the inductor L1, pin 2 is grounded, and pins 4 and 5 are both connected to the output terminal VCC_SEN_BAT of the sensor power supply management circuit; a seventh filter capacitor C7 (10μF), one end of which is connected to the output terminal VCC_SEN_BAT of the sensor power supply management circuit, and the other end is grounded; a sixth resistor R6 (1.8M 1%), one end of which is connected to the cathode of the rectifier diode D1, and the other end of which is connected to pin 3 of the boost chip U2; an eighth filter capacitor C8 (4.9P), which is connected in parallel with the sixth resistor R6; and a seventh resistor R7 (205K). 1%), one end of which is grounded and the other end is connected to the other end of the sixth resistor R6; the sixth resistor R6 and the seventh resistor R7 are connected in series to form the third voltage divider circuit; the ninth filter capacitor C9 (10μF), one end of which is connected to the negative terminal of the rectifier diode D1 and the other end is grounded.

[0058] like Figure 6 As shown, the ZigBee wireless communication circuit includes: an XBee module JP1, whose pin 1 is connected to the output terminal ACC3V3 of the step-down circuit, pins 2, 3, and 9 are connected to the pins of the main control chip, and pin 10 is grounded; the main control chip controls the XBee module JP1 to enter or exit sleep mode through the XBee sleep control signal XBEE SLEEP CTR, thereby reducing device power consumption; simultaneously, the main control chip transmits the thickness measurement data collected by the ultrasonic thickness sensor to the XBee module JP1 via UART, using serial port commands to package the data, and performs digital signal transmission and reception, thereby performing data interaction and realizing wireless data transmission using ZigBee wireless transmission technology; a tenth filter capacitor C10 (0.1μF / 50V), one end of which is connected to the output terminal ACC3V3 of the step-down circuit, and the other end is grounded; an eighth resistor R8 (30K) 1%), one end of which is connected to the output terminal ACC3V3 of the step-down circuit, and the other end is connected to pin 5 of the XBee module JP1; the ninth resistor R9 (30K 1%), one end of which is connected to the output terminal ACC3V3 of the step-down circuit, and the other end is connected to pin 9 of the XBee module JP1.

[0059] This invention provides an ultrasonic thickness measurement device based on ZigBee wireless communication. By replacing traditional wired connections with ZigBee wireless communication technology, it completely solves the problems of difficult and easily broken cables during on-site installation, simplifying installation and significantly reducing construction complexity. The power management circuit integrates battery monitoring, buck and boost functions. Through real-time power detection and multi-stage voltage conversion, it ensures stable power supply to the ultrasonic thickness measurement sensor, optimizes overall system energy consumption, and extends battery life. The wireless communication module supports sleep mode control, further reducing power consumption and enhancing the device's continuous operation capability. The ZigBee module uses UART interface command control, combined with a data packet transmission mechanism, to ensure efficient, interference-resistant, and stable data transmission, avoiding the risk of failure caused by water ingress in traditional wired interfaces. The battery monitoring function can promptly provide power information, preventing measurement interruptions due to insufficient power. Combined with wireless data transmission, it enables remote real-time monitoring and rapid maintenance response, significantly improving the reliability and applicability of the ultrasonic thickness measurement device.

[0060] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.

Claims

1. An ultrasonic thickness measurement device based on ZigBee wireless communication, characterized in that, include: Microcontroller; An ultrasonic thickness sensor is connected to the pins of the microcontroller and is used to collect wall thickness data. The ZigBee wireless communication circuit is connected to the pins of the microcontroller. The power monitoring circuit has its two ends connected to the positive and negative terminals of the battery power supply, respectively; the output terminal of the power monitoring circuit outputs a 7.2V power supply. A step-down circuit has its input terminal connected to the output terminal of the power monitoring circuit, and its output terminal connected to the pins of the microcontroller and the ZigBee wireless communication circuit; the output terminal of the step-down circuit outputs a 3.3V power supply. The sensor power supply management circuit has its input terminal connected to the output terminal of the power monitoring circuit and the pins of the microcontroller. The boost circuit has its input terminal connected to the output terminal of the sensor power management circuit and its output terminal connected to the ultrasonic thickness sensor; the output terminal of the boost circuit outputs a 12V power supply.

2. The ultrasonic thickness measurement device based on ZigBee wireless communication according to claim 1, characterized in that, The power monitoring circuit includes: The first resistor has one end connected to the positive terminal of the battery power supply; The second resistor has one end connected to the negative terminal of the battery power supply, and the other end connected to the other end of the first resistor and to the pin of the microcontroller.

3. The ultrasonic thickness measurement device based on ZigBee wireless communication according to claim 1, characterized in that, The step-down circuit includes: The step-down chip has its pin 3 connected to the output of the power monitoring circuit, its pin 2 outputting 3.3V power, and its pin 1 grounded. The first filter capacitor has one end connected to pin 3 of the step-down chip and the other end grounded. Second filter capacitor; The third filter capacitor, which is connected in parallel with the second filter capacitor, forms the first filter circuit. One end of the first filter circuit is connected to pin 2 of the step-down chip, and the other end is grounded.

4. The ultrasonic thickness measurement device based on ZigBee wireless communication according to claim 1, characterized in that, The sensor power supply management circuit: The first drive switch is composed of a first MOSFET and a first Zener diode; The second drive switch is composed of a second MOSFET and a second Zener diode; In this configuration, the drain of the second MOSFET is connected to the anode of the second Zener diode, the source of the second MOSFET is connected to the cathode of the first Zener diode and connected to the output terminal of the power monitoring circuit; the source of the first MOSFET is connected to the anode of the first Zener diode and grounded, and the drain of the first MOSFET is connected to the cathode of the first Zener diode and the gate of the second MOSFET. Fourth filter capacitor; The fifth filter capacitor is connected in parallel with the fourth filter capacitor to form a second filter circuit; one end of the second filter circuit is connected to the source of the second MOS transistor, and the other end is grounded. The third resistor has one end connected to the source of the second MOSFET and the other end connected to the gate of the second MOSFET. The sixth filter capacitor has one end connected to the drain of the second MOSFET and the other end grounded. The fourth resistor has one end connected to a pin of the microcontroller; The fifth resistor has one end grounded and the other end connected to the other end of the fourth resistor and connected to the gate of the first MOS transistor.

5. The ultrasonic thickness measurement device based on ZigBee wireless communication according to claim 1, characterized in that, The boost circuit includes: An inductor, with its pin 1 connected to the output terminal of the sensor power supply management circuit; The rectifier diode has its positive terminal connected to pin 2 of the inductor, and its negative terminal outputs a 12V power supply. The boost converter chip has pin 1 connected to pin 2 of the inductor, pin 2 grounded, and pins 4 and 5 both connected to the output of the sensor power supply management circuit. The seventh filter capacitor has one end connected to the output terminal of the sensor power supply management circuit and the other end grounded. The sixth resistor has one end connected to the negative terminal of the rectifier diode and the other end connected to pin 3 of the boost chip. The eighth filter capacitor is connected in parallel with the sixth resistor; The seventh resistor has one end grounded and the other end connected to the other end of the sixth resistor. The ninth filter capacitor has one end connected to the negative terminal of the rectifier diode and the other end grounded.

6. The ultrasonic thickness measurement device based on ZigBee wireless communication according to claim 1, characterized in that, The ZigBee wireless communication circuit includes: The XBee module has pin 1 connected to the output of the step-down circuit, pins 2, 3 and 9 connected to the pins of the microcontroller, and pin 10 grounded. The tenth filter capacitor has one end connected to the output terminal of the step-down circuit and the other end grounded. The eighth resistor has one end connected to the output terminal of the step-down circuit and the other end connected to pin 5 of the XBee module. The ninth resistor has one end connected to the output terminal of the step-down circuit and the other end connected to pin 9 of the XBee module.

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