An intelligent constant temperature heating circuit for a battery management system

By designing an intelligent constant temperature heating circuit, and utilizing the main control chip MCU and multi-point temperature measurement technology, the heating power of the lithium battery is dynamically adjusted, solving the problems of large temperature fluctuations and uneven heating in existing technologies, and improving the safety and lifespan of the lithium battery.

CN224472530UActive Publication Date: 2026-07-07HANGZHOU LIDONG TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HANGZHOU LIDONG TECH CO LTD
Filing Date
2025-10-22
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Existing lithium battery heating control systems lack real-time adjustment capabilities, resulting in large temperature fluctuations, uneven heating, high energy consumption, and reverse electrical interference to the BMS system, failing to effectively solve the safety issues of lithium batteries in low-temperature environments.

Method used

The system employs an intelligent constant-temperature heating circuit, which includes a main control chip (MCU), a temperature acquisition module, and a heating module. The MCU performs data processing and control to achieve intelligent constant-temperature heating of the lithium battery. Combined with multi-point temperature measurement and high-speed communication, the heating power is dynamically adjusted, and optocoupler isolation and transient suppression diode protection circuits are introduced.

Benefits of technology

Intelligent constant temperature heating control of lithium batteries has been achieved, avoiding drastic temperature fluctuations, extending battery life, and improving the electrical safety and anti-interference capability of the system.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of intelligent constant-temperature heating circuit for battery management system, including main control chip MCU, temperature acquisition module, heating module composition, main control chip MCU is as the whole system's central control, carries out resource allocation and data detection to system module, temperature acquisition module samples temperature, all sampling and after processing data are transmitted to main control chip MCU by SPI communication, main control chip MCU controls heating module output to heat battery heating system by signal processing. The utility model main control chip MCU, temperature acquisition module, heating module composition, main control chip MCU is as the whole system's central control, carries out resource allocation and data detection to system module, temperature acquisition module samples temperature, all sampling and after processing data are transmitted to main control chip MCU by SPI communication, main control chip MCU controls heating module output to heat battery heating system by signal processing.
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Description

Technical Field

[0001] This utility model relates to the field of battery management system technology, specifically to an intelligent constant temperature heating circuit for a battery management system. Background Technology

[0002] Lithium-ion batteries boast high energy density and long cycle life, making them widely used in electric vehicles, energy storage systems, and portable electronic devices. However, their performance is significantly affected by ambient temperature, with their optimal operating temperature range typically between 15°C and 35°C. When the ambient temperature drops below 0°C, the insertion rate of lithium ions between the graphite layers of the negative electrode decreases significantly. During charging, lithium ions are easily reduced to metallic lithium on the negative electrode surface, forming lithium dendrites. These dendrites can puncture the separator, causing internal short circuits, triggering thermal runaway, and resulting in serious safety issues such as fires or explosions. Simultaneously, this process irreversibly consumes electrolyte and active lithium ions, leading to permanent capacity degradation of the battery.

[0003] To address the problems caused by low temperatures, existing technologies often employ PTC heaters and pulse self-heating to preheat batteries, especially to raise the battery temperature to a suitable range before charging. However, existing heating control systems mostly use simple "start-stop" control logic, meaning heating is activated when the temperature is below a certain threshold and deactivated when it is above another threshold. This lacks real-time adjustment capabilities and easily leads to problems such as large temperature fluctuations, uneven heating, high energy consumption, and reverse electrical interference to the BMS system. Therefore, we propose an intelligent constant-temperature heating circuit for battery management systems. Utility Model Content

[0004] The purpose of this invention is to provide an intelligent constant temperature heating circuit for a battery management system to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an intelligent constant temperature heating circuit for a battery management system, comprising a temperature acquisition module, a heating module, and a main control chip MCU;

[0006] The main control chip (MCU) is used for data processing and instruction output.

[0007] The temperature acquisition module includes an analog front-end acquisition chip U1, which is electrically connected to the main control chip MCU. The temperature acquisition module is used to control the communication between the analog front-end acquisition chip U1 and the main control chip MCU. The temperature acquisition module transmits the temperature acquisition information to the main control chip MCU, which processes the temperature acquisition information. The main control chip MCU is electrically connected to the battery heating system.

[0008] The heating module is electrically connected to the battery heating system. The heating module receives control signals from the main control chip MCU and drives the external battery heating system to work.

[0009] Furthermore, the temperature acquisition module includes capacitor C3, thermistor sensor NTC3, resistor R11, capacitor C2, thermistor sensor NTC2, resistor R10, capacitor C1, thermistor sensor NTC1, and resistor R9. The 25th pin of the analog front-end acquisition chip U1 is connected to capacitor C3, thermistor sensor NTC3, and resistor R11, and the other end of capacitor C3, thermistor sensor NTC3, and resistor R11 is grounded.

[0010] The 26th pin of the analog front-end acquisition chip U1 is connected to capacitor C2, thermistor sensor NTC2 and resistor R10, and the other end of capacitor C2, thermistor sensor NTC2 and resistor R10 is grounded.

[0011] The 27th pin of the analog front-end acquisition chip U1 is connected to a capacitor C1, a thermistor sensor NTC1, and a resistor R9, and the other end of the capacitor C1, the thermistor sensor NTC1, and the resistor R9 is grounded.

[0012] Furthermore, a resistor R5 is connected to pin 30 of the analog front-end acquisition chip U1, and the other end of the resistor R5 is connected to pin 20 of the main control chip MCU. A resistor R4 is connected to pin 31 of the analog front-end acquisition chip U1, and the other end of the resistor R4 is connected to pin 21 of the main control chip MCU. A resistor R2 is connected to pin 32 of the analog front-end acquisition chip U1, and the other end of the resistor R2 is connected to pin 22 of the main control chip MCU. A resistor R1 is connected to pin 33 of the analog front-end acquisition chip U1, and the other end of the resistor R1 is connected to pin 23 of the main control chip MCU.

[0013] Furthermore, the heating module includes resistor R3, resistor R6, optocoupler PC1, and diode D1. Pin 17 of the main control chip MCU is connected to resistor R6 through resistor R3. The other end of resistor R6 is connected to pin 1 of optocoupler PC1. The other end of resistor R6 is grounded through pin 2 of optocoupler PC1. Pin 4 of optocoupler PC1 is connected to resistor R7. The other end of resistor R7 is connected to the cathode of diode D1. The anode of diode D1 is connected to an external power supply.

[0014] Furthermore, the heating module also includes a transient voltage suppressor diode (TVS1), a Zener diode (DZ1), and a MOSFET (QM1). Pin 3 of the optocoupler PC1 is connected to resistor R8, the cathode of Zener diode DZ1, and the gate of MOSFET (QM1). The other end of resistor R8 is connected to the anode of Zener diode DZ1 and the gate of MOSFET (QM1). The source of MOSFET (QM1) is connected to one end of transient voltage suppressor diode TVS1. The drain of MOSFET (QM1) is connected to pin 2 of connector J1 through the other end of transient voltage suppressor diode TVS1. Connector J1 is used to connect to an external battery heating system. Pin 1 of connector J1 is connected to the positive terminal of the external power supply, and pin 2 of connector J1 is connected to the positive terminal of the external battery heating system.

[0015] Compared with the prior art, the present invention has the following advantages: The present invention consists of a main control chip MCU, a temperature acquisition module, and a heating module. The main control chip MCU acts as the central control of the entire system, allocating resources and detecting data for the system modules. The temperature acquisition module samples the temperature and transmits all sampled and processed data to the main control chip MCU via SPI communication. The main control chip MCU processes the signal and controls the output of the heating module to heat the battery heating system.

[0016] Furthermore, it achieves intelligent constant temperature heating control for lithium batteries, which can dynamically adjust the heating power according to the real-time temperature to avoid drastic temperature fluctuations and extend battery life. Moreover, multi-point temperature measurement and high-speed communication ensure the accuracy and reliability of temperature acquisition.

[0017] Furthermore, the introduction of optocoupler isolation and transient suppression diode TVS1 protection circuit enhances the electrical safety and anti-interference capability of the system, preventing the heating system from causing reverse current surges to the BMS. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the system principle of this utility model;

[0019] Figure 2 This is the circuit diagram of the analog front-end acquisition chip U1 of this utility model;

[0020] Figure 3 This is the circuit diagram of the MCU main control chip of this utility model;

[0021] Figure 4 This is the circuit diagram of the heating module of this utility model. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1-4 This utility model provides a technical solution: an intelligent constant temperature heating circuit for a battery management system, including a temperature acquisition module, a heating module and a main control chip MCU;

[0024] The main control chip (MCU) is used for data processing and instruction output.

[0025] The temperature acquisition module includes an analog front-end acquisition chip U1, which is electrically connected to the main control chip MCU. The temperature acquisition module is used to control the communication between the analog front-end acquisition chip U1 and the main control chip MCU. The temperature acquisition module transmits the temperature acquisition information to the main control chip MCU, which processes the temperature acquisition information. The main control chip MCU is electrically connected to the battery heating system.

[0026] The heating module is electrically connected to the battery heating system. The heating module receives control signals from the main control chip MCU and drives the external battery heating system to work.

[0027] The entire device consists of a main control chip MCU, a temperature acquisition module, and a heating module. The main control chip MCU acts as the central control of the entire system, allocating resources and detecting data for the system modules. The temperature acquisition module samples the temperature and transmits all sampled and processed data to the main control chip MCU via SPI communication. The main control chip MCU processes the signals and controls the output of the heating module to heat the battery heating system.

[0028] Please see Figures 1-4The temperature acquisition module includes capacitor C3, thermistor sensor NTC3, resistor R11, capacitor C2, thermistor sensor NTC2, resistor R10, capacitor C1, thermistor sensor NTC1, and resistor R9. Pin 25 of the analog front-end acquisition chip U1 is connected to capacitor C3, thermistor sensor NTC3, and resistor R11, with the other end of capacitor C3, thermistor sensor NTC3, and resistor R11 grounded. Pin 26 of the analog front-end acquisition chip U1 is connected to capacitor C2, thermistor sensor NTC2, and resistor R10, with the other end of capacitor C2, thermistor sensor NTC2, and resistor R10 grounded. Pin 27 of the analog front-end acquisition chip U1 is connected to capacitor C1, thermistor sensor NTC1, and resistor R9, with the other end of capacitor C1, thermistor sensor NTC1, and resistor R9 grounded.

[0029] The thermistor sensors NTC3, NTC2, and NTC1 enable multi-point temperature measurement. Resistors R9, R10, and R11 act as pull-up resistors, forming a voltage divider circuit with thermistors NTC3, NTC2, and NTC1. Capacitors C1, C2, and C3 are filter capacitors connected in parallel across resistors R9, R10, and R11, forming an RC low-pass filter.

[0030] Please see Figures 1-4 The analog front-end acquisition chip U1 has a resistor R5 connected to its 30th pin, and the other end of the resistor R5 is connected to the 20th pin of the main control chip MCU. The analog front-end acquisition chip U1 has a resistor R4 connected to its 31st pin, and the other end of the resistor R4 is connected to the 21st pin of the main control chip MCU. The analog front-end acquisition chip U1 has a resistor R2 connected to its 32nd pin, and the other end of the resistor R2 is connected to the 22nd pin of the main control chip MCU. The analog front-end acquisition chip U1 has a resistor R1 connected to its 33rd pin, and the other end of the resistor R1 is connected to the 23rd pin of the main control chip MCU.

[0031] The resistors R1, R2, R3, R4, and R5 are set to suppress signal interference and improve communication stability.

[0032] Please see Figures 1-4The heating module includes resistors R3 and R6, an optocoupler PC1, and a diode D1. Pin 17 of the main control chip MCU is connected to resistor R6 via resistor R3. The other end of resistor R6 is connected to pin 1 of optocoupler PC1, and the other end of resistor R6 is grounded via pin 2 of optocoupler PC1. Pin 4 of optocoupler PC1 is connected to resistor R7, and the other end of resistor R7 is connected to the cathode of diode D1. The anode of diode D1 is connected to an external power supply. The heating module also includes a transient suppression diode TVS1, a Zener diode DZ1, and a MOSFET QM1. The optocoupler PC1... Pin 3 is connected to resistor R8, the cathode of Zener diode DZ1, and the gate of MOSFET QM1. The other end of resistor R8 is connected to the anode of Zener diode DZ1 and the gate of MOSFET QM1. The source of MOSFET QM1 is connected to one end of transient voltage suppressor diode TVS1. The drain of MOSFET QM1 is connected to pin 2 of connector J1 through the other end of transient voltage suppressor diode TVS1. Connector J1 is used to connect to an external battery heating system. Pin 1 of connector J1 is connected to the positive terminal of the external power supply, and pin 2 of connector J1 is connected to the positive terminal of the external battery heating system.

[0033] The resistor R3 limits current, while the voltage divider between resistor R6 and R3 increases the turn-on threshold voltage of MOSFET QM1 and reduces interference at the gate. The optocoupler PC1 serves two purposes: isolation between high and low voltage conditions and level conversion. The transient voltage suppressor diode TVS1 eliminates voltage spikes. After optocoupler PC1 is turned on, its pins 3 and 4 are shorted. Then, the voltage divider between resistors R7 and R8 controls the conduction of MOSFET QM1. Diode D1 provides reverse polarity protection.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An intelligent constant-temperature heating circuit for a battery management system, characterized in that: This includes a temperature acquisition module, a heating module, and a main control chip (MCU). The main control chip (MCU) is used for data processing and instruction output. The temperature acquisition module includes an analog front-end acquisition chip U1, which is electrically connected to the main control chip MCU. The temperature acquisition module is used to control the communication between the analog front-end acquisition chip U1 and the main control chip MCU. The temperature acquisition module transmits the temperature acquisition information to the main control chip MCU, which processes the temperature acquisition information. The main control chip MCU is electrically connected to the battery heating system. The heating module is electrically connected to the battery heating system. The heating module receives control signals from the main control chip MCU and drives the external battery heating system to work.

2. The intelligent constant temperature heating circuit for a battery management system according to claim 1, characterized in that: The temperature acquisition module includes capacitor C3, thermistor sensor NTC3, resistor R11, capacitor C2, thermistor sensor NTC2, resistor R10, capacitor C1, thermistor sensor NTC1, and resistor R9. The 25th pin of the analog front-end acquisition chip U1 is connected to capacitor C3, thermistor sensor NTC3, and resistor R11, and the other end of capacitor C3, thermistor sensor NTC3, and resistor R11 is grounded. The 26th pin of the analog front-end acquisition chip U1 is connected to capacitor C2, thermistor sensor NTC2 and resistor R10, and the other end of capacitor C2, thermistor sensor NTC2 and resistor R10 is grounded. The 27th pin of the analog front-end acquisition chip U1 is connected to a capacitor C1, a thermistor sensor NTC1, and a resistor R9, and the other end of the capacitor C1, the thermistor sensor NTC1, and the resistor R9 is grounded.

3. The intelligent constant temperature heating circuit for a battery management system according to claim 2, characterized in that: Pin 30 of the analog front-end acquisition chip U1 is connected to resistor R5, and the other end of resistor R5 is connected to pin 20 of the main control chip MCU. Pin 31 of the analog front-end acquisition chip U1 is connected to resistor R4, and the other end of resistor R4 is connected to pin 21 of the main control chip MCU. Pin 32 of the analog front-end acquisition chip U1 is connected to resistor R2, and the other end of resistor R2 is connected to pin 22 of the main control chip MCU. Pin 33 of the analog front-end acquisition chip U1 is connected to resistor R1, and the other end of resistor R1 is connected to pin 23 of the main control chip MCU.

4. The intelligent constant temperature heating circuit for a battery management system according to claim 3, characterized in that: The heating module includes resistor R3, resistor R6, optocoupler PC1, and diode D1. Pin 17 of the main control chip MCU is connected to resistor R6 through resistor R3. The other end of resistor R6 is connected to pin 1 of optocoupler PC1. The other end of resistor R6 is grounded through pin 2 of optocoupler PC1. Pin 4 of optocoupler PC1 is connected to resistor R7. The other end of resistor R7 is connected to the cathode of diode D1. The anode of diode D1 is connected to an external power supply.

5. The intelligent constant temperature heating circuit for a battery management system according to claim 4, characterized in that: The heating module also includes a transient voltage suppressor diode (TVS1), a Zener diode (DZ1), and a MOSFET (QM1). Pin 3 of the optocoupler PC1 is connected to resistor R8, the cathode of Zener diode DZ1, and the gate of MOSFET (QM1). The other end of resistor R8 is connected to the anode of Zener diode DZ1 and the gate of MOSFET (QM1). The source of MOSFET (QM1) is connected to one end of transient voltage suppressor diode TVS1. The drain of MOSFET (QM1) is connected to pin 2 of connector J1 through the other end of transient voltage suppressor diode TVS1. Connector J1 is used to connect to an external battery heating system. Pin 1 of connector J1 is connected to the positive terminal of the external power supply, and pin 2 of connector J1 is connected to the positive terminal of the external battery heating system.