Detachable high-voltage direct-current power conversion module heat dissipation base

Abstract

This utility model discloses a detachable high-voltage DC power conversion module heat dissipation base, belonging to the field of power equipment heat dissipation. The detachable high-voltage DC power conversion module heat dissipation base includes a mounting shell and multiple high-voltage DC power conversion modules disposed inside the mounting shell. Each high-voltage DC power conversion module has an integrated cooling positioning assembly on its top. The integrated cooling positioning assembly includes an inlet pipe located on the top of the high-voltage DC power conversion module, a return pipe symmetrically arranged with the inlet pipe, and multiple heat exchange plates uniformly fixed between the inlet pipe and the return pipe. Cooling medium flows inside the heat exchange plates, and the heat exchange plates are in close contact with the outer shell of the high-voltage DC power conversion module. This utility model achieves cooling and temperature reduction at the installation gaps of the conversion modules by tightly fitting the heat exchange plates with the module shell and allowing the coolant to absorb heat from the module through a serpentine flow channel. This effectively solves the problem of poor heat dissipation at the gaps between stacked modules, thus meeting the heat dissipation requirements of high-power modules.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation in power equipment, and in particular to a detachable heat dissipation base for a high-voltage DC power conversion module. Background Technology

[0002] High-voltage direct current (HVDC) power conversion modules, as core components of modern power electronics technology, play a crucial role in new energy power generation, intelligent buildings, and industrial power distribution. This paper explores innovative applications of HVDC power conversion modules in system integration and efficient heat dissipation, tailored to the needs of various engineering projects, thereby promoting the integrated development of power electronics technology and intelligent construction.

[0003] In the integrated installation of high-voltage DC power conversion modules, the structural layout and heat dissipation design directly affect the system's power density, reliability, and ease of maintenance. Traditional installation methods typically employ bolt fixing or DIN rail mounting, with multiple modules stacked within a cabinet.

[0004] However, in the stacked integrated installation of high-voltage DC power conversion modules, there is a trade-off between space utilization and heat dissipation efficiency. When modules are stacked, heat from lower-layer modules is transferred upwards through thermal radiation and convection, and the narrow gaps between adjacent modules can easily obstruct airflow. Traditional heat dissipation for modules relies on airflow, but this airflow cooling method is affected by the stacked structure and may not be able to establish an effective heat exchange path within the gap space. This results in a single heat dissipation path, which can easily lead to uneven heat dissipation between modules and affect the reliability of the system. Utility Model Content

[0005] This utility model provides a detachable high-voltage DC power conversion module heat dissipation base, which can solve the problem that existing detachable high-voltage DC power conversion module heat dissipation bases may not be able to establish an effective heat exchange path in the gap space, resulting in a single heat dissipation path, which can easily lead to uneven heat dissipation between modules and affect system reliability.

[0006] A detachable high-voltage DC power conversion module heat dissipation base includes a mounting shell and multiple high-voltage DC power conversion modules disposed inside the mounting shell. Each high-voltage DC power conversion module is provided with an integrated cooling positioning component on its top.

[0007] The integrated cooling positioning assembly includes an inlet pipe located on top of the high voltage DC power conversion module, a return pipe symmetrically arranged with the inlet pipe, and multiple heat exchange plates uniformly fixed between the inlet pipe and the return pipe. Cooling medium flows inside the heat exchange plates, and the heat exchange plates are in contact with the outer shell of the high voltage DC power conversion module.

[0008] The integrated cooling positioning assembly also includes a fixing rod, multiple push plates, guide grooves opened inside the corresponding push plates, and an adjustment assembly. The two ends of the fixing rod are fixedly connected to the top of the liquid inlet pipe and the return pipe, respectively. The guide groove is inclined downwards, and the fixing rod slides through the guide groove. The adjustment assembly is used to adjust the horizontal position of the push plate.

[0009] Preferably, the fixed rods are provided with connecting rods in pairs, and the two ends of the connecting rods are respectively fixedly connected to the corresponding push plates. The adjusting assembly includes a first fixed plate fixed to the inner wall of the mounting shell and a screw threadedly connected to the inside of the first fixed plate. One end of the screw is rotatably connected to the connecting plate.

[0010] Preferably, the top of the mounting housing is provided with a cooling circulation assembly, which includes a circulation pipe fixed inside the mounting housing and an infusion pipe fixed inside the mounting housing. The bottom ends of the circulation pipe and the infusion pipe extend into the mounting housing. The inlet pipe is connected to the infusion pipe, and the return pipe is connected to the circulation pipe.

[0011] Preferably, each of the heat exchange plates has a serpentine structure and a thermally conductive pad is fixed at the bottom.

[0012] Preferably, multiple support plates are uniformly fixed on the inner wall of the mounting housing, the high-voltage DC power conversion module is located on the top of every two support plates, and positioning plates are fixed at the front ends of the liquid inlet pipe and the return pipe.

[0013] Preferably, the cooling circulation assembly further includes a liquid storage tank fixed to the top of the mounting housing, a semiconductor cooling chip embedded inside the liquid storage tank, and a delivery pump fixed to the top of the mounting housing. The delivery pipe is connected to the liquid storage tank, and the circulation pipe is connected to the delivery pump.

[0014] Preferably, the heat exchange plate, the thermally conductive pad, the high-voltage DC power conversion module housing and the circulation pipe are all made of thermally conductive material, and multiple heat sinks are fixed on the outer side of the circulation pipe and on the side located at the top of the mounting housing.

[0015] Preferably, a plurality of limiting plates are fixedly provided on the top of each support plate, and the limiting plates are used in conjunction with the housing of the high voltage DC power conversion module.

[0016] Preferably, a second fixing plate is fixedly connected to one side of both the inlet pipe and the return pipe, and a second guide rod is slidably connected to the second fixing plate, the second guide rod being fixed to the top of the support plate.

[0017] Preferably, the thermally conductive pad is made of graphene, and first guide rods are symmetrically slidably connected to the first fixing plate, with each of the first guide rods being fixedly connected to the connecting plate.

[0018] This utility model provides a detachable heat dissipation base for a high-voltage DC power conversion module, which has the following advantages:

[0019] The operating screw moves the connecting plate and its upper push plate, which, in conjunction with the inclined guide groove on the push plate, adjusts the longitudinal position of the heat exchange plate. The heat exchange plate then presses down to compress the high-voltage DC power conversion module. In the compressed state, the heat exchange plate is tightly fitted to the module housing, and the coolant absorbs heat from the module through the serpentine flow channel, achieving cooling at the gaps in the conversion module installation. This effectively solves the problem of poor heat dissipation at the gaps between stacked modules and helps meet the heat dissipation requirements of high-power modules.

[0020] The screw drives the push plate to move horizontally, and the inclined guide groove converts the horizontal displacement into the vertical downward movement of the fixed rod. This allows for precise clamping and release of the heat exchange plate on the high-voltage DC power conversion module, ensuring accurate positioning of the module during installation and preventing misalignment. Simultaneously, the screw also allows the fixed rod to move upwards in the opposite direction, facilitating the disassembly and assembly of individual modules and improving maintenance efficiency. Attached Figure Description

[0021] Figure 1 Schematic diagram of the structure of the detachable high-voltage DC power conversion module heat dissipation base provided by this utility model Figure 1 ;

[0022] Figure 2 Schematic diagram of the structure of the detachable high-voltage DC power conversion module heat dissipation base provided by this utility model Figure 2 ;

[0023] Figure 3 A schematic diagram of the top mounting component structure of the high voltage DC power conversion module of the detachable high voltage DC power conversion module heat dissipation base provided by this utility model.

[0024] Figure 4 A schematic diagram of the guide groove, thermal pad, heat exchange plate, and screw structure of the detachable high-voltage DC power conversion module heat dissipation base provided by this utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. Mounting shell; 2. Support plate; 3. High-voltage DC power conversion module; 4. First fixing plate; 5. Inlet pipe; 6. Return pipe; 7. Heat exchange plate; 8. Thermal pad; 9. Fixing rod; 10. Push plate; 11. Guide groove; 12. Connecting plate; 13. Screw; 14. First guide rod; 15. Circulation pipe; 16. Infusion pipe; 17. Connecting rod; 18. Positioning plate; 19. Second guide rod; 20. Second fixing plate; 21. Limiting plate; 22. Liquid storage tank; 23. Semiconductor cooling chip; 24. Transfer pump; 25. Radiator. Detailed Implementation

[0027] The specific embodiments of this utility model are described in detail below, but it should be understood that the protection scope of this utility model is not limited to the specific embodiments.

[0028] like Figures 1 to 4 As shown in the figure, the detachable high-voltage DC power conversion module heat dissipation base provided in this embodiment of the utility model includes a mounting shell 1 and multiple high-voltage DC power conversion modules 3 disposed inside the mounting shell 1. Each high-voltage DC power conversion module 3 has an integrated cooling positioning assembly on its top. The integrated cooling positioning assembly includes an inlet pipe 5 disposed on the top of the high-voltage DC power conversion module 3, a return pipe 6 disposed on the top of the high-voltage DC power conversion module 3 and symmetrically arranged with the inlet pipe 5, and multiple heat exchange plates 7 uniformly fixed between the inlet pipe 5 and the return pipe 6. The heat exchange plates 7 have a hollow internal structure and are connected to the inlet pipe 5 and the return pipe 6. Cooling medium, preferably commonly used water coolant, flows inside the heat exchange plates 7, and the heat exchange plates 7 are in contact with the outer shell of the high-voltage DC power conversion module 3.

[0029] Multiple sets of high-voltage DC power conversion modules 3 are stacked and installed inside the mounting housing 1. Integrated cooling and positioning components are set between the conversion modules to fix and cool them down. During cooling, the heat exchange plate 7 moves and fits tightly against the conversion module. The internal heat of the conversion module is dissipated by the outer shell, and the inlet pipe 5 delivers coolant to the inside of the heat exchange plate 7, absorbing heat and flowing to the return pipe 6, thus achieving cooling at the gaps between the conversion modules to meet the heat dissipation requirements of the high-power modules. At the same time, the heat exchange plate 7 contacts the conversion module, achieving positioning and fixing of the high-voltage DC power conversion module 3. The modular design facilitates the disassembly and assembly of each conversion module and facilitates subsequent maintenance.

[0030] In some specific implementation plans, such as Figure 1 and Figure 2 As shown, a cooling circulation assembly is provided on the top of the mounting housing 1. The cooling circulation assembly includes a circulation pipe 15 fixed inside the mounting housing 1, a liquid delivery pipe 16 fixed inside the mounting housing 1, a liquid storage tank 22 fixed on the top of the mounting housing 1, a semiconductor cooling chip 23 embedded inside the liquid storage tank 22, and a delivery pump 24 fixed on the top of the mounting housing 1. The bottom ends of the circulation pipe 15 and the liquid delivery pipe 16 extend into the mounting housing 1. The inlet pipe 5 is connected to the liquid delivery pipe 16, the return pipe 6 is connected to the circulation pipe 15, and the liquid delivery pipe 16 is connected to the liquid storage tank 22. Flexible hoses are used for the connecting pipes between the inlet pipe 5 and the liquid delivery pipe 16, and between the return pipe 6 and the circulation pipe 15. The circulation pipe 15 is connected to the delivery pump 24, and the delivery pump 24 is connected to the liquid storage tank 22. A buffer pad is provided at the bottom of the delivery pump 24 to reduce vibration during operation. The cooling end of the semiconductor refrigeration chip 23 faces the inside of the liquid storage tank 22, and the heat dissipation end faces the outside of the liquid storage tank 22.

[0031] Coolant flows from the storage tank 22 into the inlet pipe 5 via the delivery pipe 16, absorbs heat through the heat exchange plate 7, returns to the circulation pipe 15 via the return pipe 6, and is finally pumped back to the storage tank 22 by the delivery pump 24. The semiconductor cooling chip 23 cools the coolant, thus realizing the coolant circulation system.

[0032] In some specific implementation plans, such as Figure 3 and Figure 4 As shown, the integrated cooling positioning assembly also includes fixed rods 9, multiple push plates 10, guide grooves 11 formed inside corresponding push plates 10, and an adjustment assembly located near the front of the mounting housing 1 for adjusting the horizontal position of the push plates 10. Two fixed rods 9 are symmetrically arranged, with their ends fixedly connected to the tops of the inlet pipe 5 and return pipe 6, respectively. The guide grooves 11 are inclined downwards to allow the longitudinal movement of the fixed rods 9 to be achieved through the horizontal movement of the push plates 10. The fixed rods 9 slide within the guide grooves 11, and connecting rods 17 are paired between the fixed rods 9. The ends of the connecting rods 17 are fixedly connected to corresponding push plates 10, enabling synchronous movement of the push plates 10. A connecting plate 12 is fixedly connected to the push plates 10 located on the front side. The adjustment assembly includes a first fixed plate 4 fixed to the inner wall of the mounting housing 1 and a screw 13 threadedly connected to the inside of the first fixed plate 4. One end of the screw 13 is rotatably connected to the connecting plate 12, and the other end has a knob for easy operation of the screw 13.

[0033] After the conversion module 3 slides above the support plate 2, rotating the screw 13 moves the connecting plate 12, causing the push plate 10 to move horizontally in sync. As the push plate 10 moves, the inclined guide groove 11 pushes the fixing rod 9 downwards, thereby adjusting the longitudinal position of the heat exchange plate 7 and pressing it against the high-voltage DC power conversion module 3, facilitating the fixation of the conversion module. Simultaneously, the heat exchange plate 7 maintains close contact with the conversion module, facilitating subsequent convection heat exchange and achieving cooling and temperature reduction of the conversion module.

[0034] When the conversion module needs to be disassembled, the reverse rotating screw 13 drives the connecting plate 12 to move, causing the push plate 10 to move horizontally in sync. When the push plate 10 moves, it uses the inclined guide groove 11 to push the fixing rod 9 upward, separating the heat exchange plate 7 from the high conversion module, which facilitates the disassembly and maintenance of the conversion module.

[0035] In some specific implementation plans, such as Figure 2 , Figure 3 and Figure 4As shown, each heat exchange plate 7 has a serpentine structure, increasing the contact area between the heat exchange plate 7 and the high-voltage DC power conversion module 3, thus improving heat exchange efficiency. Each heat exchange plate 7 has a thermally conductive pad 8 fixed to its bottom. The heat exchange plate 7, thermally conductive pad 8, the outer shell of the high-voltage DC power conversion module 3, and the circulation pipe 15 are all made of thermally conductive material, preferably aluminum alloy. The thermally conductive pad 8 is made of graphene. Placing a graphene thermally conductive pad on the contact surface between the heat exchange plate 7 and the conversion module shell helps ensure a flat contact surface, thereby reducing gaps and enhancing heat conduction efficiency. Multiple heat sinks 25 are fixed to the outside of the circulation pipe 15 on one side of the mounting shell 1. The heat sinks 25 have a circular structure to enhance the cooling of the coolant.

[0036] In some specific implementation plans, such as Figure 3 and Figure 4 As shown, multiple support plates 2 are evenly fixed on the inner wall of the mounting shell 1. The high-voltage DC power conversion module 3 is located on top of the opposite support plate 2. The high-voltage DC power conversion module 3 is placed above every two horizontally opposite support plates 2. The support plates 2 are used to support the conversion module. Positioning plates 18 are fixed at the front ends of the inlet pipe 5 and the return pipe 6. Multiple limiting plates 21 are fixed on the top of the support plates 2. The limiting plates 21 are used in conjunction with the shell of the high-voltage DC power conversion module 3. The limiting plate 21 located on the rearmost side is designed with an L-shaped structure. The positioning plate 18 contacts the front side of the conversion module and is positioned in conjunction with the L-shaped limiting plate 21.

[0037] In some specific implementation plans, such as Figure 3 and Figure 4 As shown, a second fixing plate 20 is fixedly connected to one side of both the inlet pipe 5 and the return pipe 6. A second guide rod 19 is slidably connected to the second fixing plate 20. The second guide rod 19 is fixed to the top of the support plate 2. When the inlet pipe 5 and the return pipe 6 move, they move smoothly through the cooperation of the second fixing plate 20 and the second guide rod 19. A first guide rod 14 is symmetrically slidably connected to the first fixing plate 4. The first guide rod 14 is fixedly connected to the connecting plate 12. The first guide rod 14 can better support the connecting plate 12, the push plate 10, and the connecting rod 17.

[0038] To facilitate understanding of the embodiments of this solution by those skilled in the art, the working principle of this solution will now be briefly explained in conjunction with specific application scenarios:

[0039] The high-voltage DC power conversion module 3 is slid above the support plate 2 and positioned in contact with the L-shaped limiting plate 21. Then, the screw 13 is rotated to move the connecting plate 12, causing the push plate 10 to move horizontally in sync. When the push plate 10 moves, the inclined guide groove 11 pushes the fixing rod 9 downward, thereby adjusting the longitudinal position of the heat exchange plate 7 and pressing the high-voltage DC power conversion module 3, facilitating the fixation of the conversion module. When the heat exchange plate 7 is pressed against the conversion module, the positioning plates 18 on the inlet pipe 5 and the return pipe 6 contact the front side of the conversion module, cooperating with the limiting plate 21 to achieve stable positioning.

[0040] Meanwhile, the heat exchange plate 7 maintains close contact with the conversion module. Coolant flows from the storage tank 22 into the inlet pipe 5 via the delivery pipe 16. The conversion module generates heat internally, and the outer casing conducts heat. The inlet pipe 5 delivers coolant to the heat exchange plate 7, where it absorbs heat and flows to the return pipe 6, achieving cooling at the installation gaps of the conversion module to meet the heat dissipation requirements of the high-power module. The coolant returns to the circulation pipe 15 via the return pipe 6 and is finally pumped back to the storage tank 22 by the delivery pump 24. The semiconductor cooling chip 23 cools the coolant, thus realizing the coolant circulation system.

[0041] When the conversion module needs to be disassembled, the reverse rotating screw 13 drives the connecting plate 12 to move, causing the push plate 10 to move horizontally in sync. When the push plate 10 moves, it uses the inclined guide groove 11 to push the fixing rod 9 upward, separating the heat exchange plate 7 from the high conversion module. The positioning plate 18 moves to a position above the conversion module, facilitating the disassembly and maintenance of the conversion module.

[0042] The above-disclosed embodiments are only a few specific examples of the present utility model. However, the embodiments of the present utility model are not limited thereto. Any variations that can be conceived by those skilled in the art should fall within the protection scope of the present utility model.

Claims

1. A detachable high-voltage DC power conversion module heat dissipation base, comprising a mounting shell (1) and a plurality of high-voltage DC power conversion modules (3) disposed inside the mounting shell (1), characterized in that, Each of the high-voltage DC power conversion modules (3) is equipped with an integrated cooling and positioning component on its top. The integrated cooling positioning assembly includes an inlet pipe (5) located on the top of the high voltage DC power conversion module (3), a return pipe (6) symmetrically arranged with the inlet pipe (5), and a plurality of heat exchange plates (7) uniformly fixed between the inlet pipe (5) and the return pipe (6). Cooling medium flows inside the heat exchange plates (7), and the heat exchange plates (7) are attached to the outer shell of the high voltage DC power conversion module (3). The integrated cooling positioning assembly also includes a fixing rod (9), multiple push plates (10), guide grooves (11) opened inside the corresponding push plates (10), and an adjustment assembly. The two ends of the fixing rod (9) are fixedly connected to the top of the liquid inlet pipe (5) and the return pipe (6), respectively. The guide groove (11) is inclined downwards, and the fixing rod (9) slides through the guide groove (11). The adjustment assembly is used to adjust the horizontal position of the push plate (10).

2. The detachable high-voltage DC power conversion module heat dissipation base as described in claim 1, characterized in that, The fixed rods (9) are provided with a pair of connecting rods (17), and the two ends of the connecting rods (17) are respectively fixedly connected to the corresponding push plates (10). The adjustment assembly includes a first fixed plate (4) fixed on the inner wall of the mounting shell (1) and a screw (13) threadedly connected to the inside of the first fixed plate (4). One end of the screw (13) is rotatably connected to the connecting plate (12).

3. The detachable high-voltage DC power conversion module heat dissipation base as described in claim 2, characterized in that, The top of the mounting shell (1) is provided with a cooling circulation assembly, which includes a circulation pipe (15) fixed inside the mounting shell (1) and an infusion pipe (16) fixed inside the mounting shell (1). The bottom ends of the circulation pipe (15) and the infusion pipe (16) extend into the mounting shell (1). The inlet pipe (5) is connected to the infusion pipe (16), and the return pipe (6) is connected to the circulation pipe (15).

4. The detachable high-voltage DC power conversion module heat dissipation base as described in claim 2, characterized in that, Each of the heat exchange plates (7) has a serpentine structure and a thermally conductive pad (8) is fixed at the bottom.

5. The detachable high-voltage DC power conversion module heat dissipation base as described in claim 4, characterized in that, Multiple support plates (2) are uniformly fixed on the inner wall of the mounting shell (1). The high voltage DC power conversion module (3) is located on the top of every two support plates (2). Positioning plates (18) are fixed at the front ends of the liquid inlet pipe (5) and the return pipe (6).

6. The detachable high-voltage DC power conversion module heat dissipation base as described in claim 3, characterized in that, The cooling circulation assembly also includes a liquid storage tank (22) fixed on the top of the mounting shell (1), a semiconductor cooling chip (23) embedded inside the liquid storage tank (22), and a delivery pump (24) fixed on the top of the mounting shell (1). The delivery pipe (16) is connected to the liquid storage tank (22), and the circulation pipe (15) is connected to the delivery pump (24).

7. The detachable high-voltage DC power conversion module heat dissipation base as described in claim 6, characterized in that, The heat exchange plate (7), the heat-conducting pad (8), the outer shell of the high voltage DC power conversion module (3) and the circulation pipe (15) are all made of heat-conducting material. Multiple heat sinks (25) are fixed on the outer side of the circulation pipe (15) and on the side located at the top of the mounting shell (1).

8. The detachable high-voltage DC power conversion module heat dissipation base as described in claim 5, characterized in that, The top of each support plate (2) is fixed with multiple limiting plates (21), which are used in conjunction with the outer shell of the high voltage DC power conversion module (3).

9. The detachable high-voltage DC power conversion module heat dissipation base as described in claim 8, characterized in that, A second fixing plate (20) is fixedly connected to one side of the inlet pipe (5) and the return pipe (6). A second guide rod (19) is slidably connected to the second fixing plate (20). The second guide rod (19) is fixed to the top of the support plate (2).

10. The detachable high-voltage DC power conversion module heat dissipation base as described in claim 4, characterized in that, The thermally conductive pad (8) is made of graphene. The first guide rod (14) is symmetrically slidably connected to the first fixing plate (4). The first guide rod (14) is fixedly connected to the connecting plate (12).

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