Impedance measurement analysis circuit board and impedance measurement analysis system

Abstract

The application discloses an impedance measurement analysis circuit board and an impedance measurement analysis system. The impedance measurement analysis circuit board is used for measurement and analysis of radio frequency front-end impedance. The impedance measurement analysis circuit board comprises a radio frequency front-end circuit. The radio frequency front-end circuit comprises a plurality of radio frequency front-end devices in different packaging and matching forms. In the impedance measurement analysis circuit board and the impedance measurement analysis system, the radio frequency front-end circuit is compatible with different packaging and matching forms of the radio frequency front-end devices, so as to meet the measurement and analysis requirements of the radio frequency front-end impedance in different project schemes.

Description

Technical Field

[0001] This application relates to the field of radio frequency front-end impedance measurement and analysis technology, and in particular to an impedance measurement and analysis circuit board and an impedance measurement and analysis system. Background Technology

[0002] In wireless communication systems, the radio frequency (RF) front-end circuit is responsible for processing signal transmission and reception, and its performance plays a decisive role in the overall communication quality. Impedance measurement and analysis circuit boards can be used to measure and analyze the impedance of the RF front-end. Currently, optimizing the design of RF front-end impedance measurement and analysis circuit boards has become an urgent problem to be solved. Utility Model Content

[0003] This application provides an impedance measurement and analysis circuit board and an impedance measurement and analysis system to solve at least one of the above-mentioned technical problems.

[0004] The impedance measurement and analysis circuit board of this application is characterized in that it is used for the measurement and analysis of radio frequency front-end impedance, and the impedance measurement and analysis circuit board includes a radio frequency front-end circuit.

[0005] The radio frequency front-end circuit includes multiple radio frequency front-end devices with different packages and matching forms.

[0006] In some embodiments, the plurality of said radio frequency front-end devices include any combination of SWITCH, DPX, SAW, Filter, and FEM.

[0007] In some embodiments, the radio frequency front-end circuit includes a signal path TX-ANT from the transmitter to the antenna, a signal path ANT-PRX from the antenna to the pseudo-random sequence receiver, and a signal path ANT-DRX from the antenna to the dual receiver, wherein multiple test points are reserved in the signal path TX-ANT, the signal path ANT-PRX, and the signal path ANT-DRX for segmented impedance measurement.

[0008] In some embodiments, the top layer of the radio frequency front-end circuit, except for the mounting area for the radio frequency front-end device, is set as a grounding area.

[0009] In some embodiments, the impedance measurement and analysis circuit board further includes a power supply circuit connected to the radio frequency front-end circuit. The power supply circuit is used to receive external power input and output a voltage that is stepped down / stepped up and then regulated to drive active devices.

[0010] In some implementations, the active device includes a MIPI device and / or a GPIO device.

[0011] In some embodiments, the impedance measurement and analysis circuit board further includes a MIPI circuit connected to the RF front-end circuit. The MIPI circuit is used to generate the clock signal required by the MIPI device and drive the MIPI device to work based on the external power input and serial communication.

[0012] In some embodiments, the impedance measurement and analysis circuit board further includes an external interface for connecting the external power supply and / or the MIPI device.

[0013] The impedance measurement and analysis system of this application includes the impedance measurement and analysis circuit board of any of the above embodiments.

[0014] In some embodiments, the impedance measurement and analysis system further includes peripheral devices disposed outside the impedance measurement and analysis circuit board;

[0015] The peripheral device includes any one or more of PA, PMIC, BB, Memory, and Transceiver.

[0016] In the impedance measurement and analysis circuit board and impedance measurement and analysis system of this application, the RF front-end circuit is compatible with different packages and matching forms of RF front-end devices to meet the measurement and analysis requirements of RF front-end impedance in different project solutions.

[0017] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort. Among them:

[0019] Figure 1 This is a PCB layout diagram for a discrete RF front-end solution in related technologies;

[0020] Figure 2 This is a schematic diagram of RF front-end impedance measurement using a vector network analyzer;

[0021] Figure 3 This is a schematic diagram of an impedance measurement and analysis circuit board according to certain embodiments of this application;

[0022] Figure 4This is a schematic diagram of a resistor-capacitor-inductor jumper compatible design in some embodiments of this application;

[0023] Figure 5 This is a schematic diagram of a radio frequency front-end circuit according to certain embodiments of this application;

[0024] Figure 6 This is a circuit block diagram of the radio frequency front-end circuit of some embodiments of this application;

[0025] Figure 7 This is a circuit block diagram of a power supply circuit according to certain embodiments of this application;

[0026] Figure 8 This is a circuit block diagram of a MIPI circuit according to certain embodiments of this application;

[0027] Figure 9 This is a schematic diagram of the impedance measurement and analysis system according to certain embodiments of this application;

[0028] Figure 10 This is a schematic diagram illustrating an application scenario of the impedance measurement and analysis circuit board according to certain embodiments of this application;

[0029] Figure 11 This is a schematic diagram of the overall layout of the impedance measurement and analysis circuit board according to certain embodiments of this application;

[0030] Figure 12 This is a circuit block diagram of a power supply circuit according to certain embodiments of this application;

[0031] Figure 13 This is a circuit block diagram of SP8T according to certain embodiments of this application;

[0032] Figure 14 This is a circuit block diagram of an SPDT according to certain embodiments of this application;

[0033] Figure 15 This is a circuit block diagram of an SPDT according to certain embodiments of this application;

[0034] Figure 16 This is a circuit block diagram of an SPDT according to certain embodiments of this application;

[0035] Figure 17 This is a circuit block diagram of an SPDT according to certain embodiments of this application;

[0036] Figure 18 This is a circuit block diagram of a DPX according to certain embodiments of this application;

[0037] Figure 19 This is a circuit block diagram of a DPX according to certain embodiments of this application;

[0038] Figure 20This is a circuit block diagram of SAW according to certain embodiments of this application;

[0039] Figure 21 This is a circuit block diagram of SAW according to certain embodiments of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] Impedance measurement and analysis circuit board 100, RF front-end circuit 10, RF front-end device 11, power supply circuit 20, MIPI circuit 30, peripheral device 200, impedance measurement and analysis system 1000. Detailed Implementation

[0042] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0043] During the development and debugging of RF modules, situations often arise where RF performance does not meet expectations, such as low saturation power, sensitivity below link budget, and reduced sensitivity. Due to the small size and compact layout of the module design, which includes power supply circuits and other functional circuits in addition to the RF front-end circuitry, impedance measurement and analysis are quite difficult.

[0044] In discrete RF front-end solutions, the impedance of each RF line segment can be measured and analyzed to pinpoint the problem accurately. However, due to the small module design and highly compact device layout, the ground (GND) area on the top layer of the printed circuit board (PCB) is very small, excluding the components. Furthermore, the presence of active components necessitates the inclusion of power supply circuitry, and the available grounding area under multilayer boards is also very limited. These factors make segmented impedance analysis difficult and inaccurate.

[0045] like Figure 1 The diagram shown is the PCB layout of a discrete RF front-end solution. Figure 1 As can be seen, the PCB contains components such as power amplifiers (PA), wireless transceivers (WTR), power management integrated circuits (PMIC), baseband processors (BB), and memory, with a highly compact layout.

[0046] Please see Figure 2In passive impedance measurement, a vector network analyzer (VNA) is typically used. First, set the desired frequency range on the VNA, such as 500MHz to 3GHz, and perform self-calibration. Then, connect the two ports of the VNA (Port1 and Port2) to the beginning and end of the impedance line under test (see measurement diagram). Figure 2 (As shown). Based on the current discrete RF front-end solution design and debugging, the following problems were found during the RF impedance measurement and analysis process:

[0047] (1) Design stage: Since it is impossible to accurately predict the ILOSS (insertion loss) of the selected components and whether the combination of multiple components will lead to impedance mismatch, a Π-type matching circuit is usually reserved for later debugging as a precaution. However, this approach increases the number of matching circuits, which in turn affects the layout of the entire PCB, increases the difficulty of layout design, and results in a low first-time board acceptance rate.

[0048] (2) Debugging phase: It was found that RF indicators such as saturation power, sensitivity, and Desense could not reach the expected performance level through debugging link matching, resulting in a low performance achievement rate.

[0049] (3) Analysis stage: Due to the high density of device layout, it is difficult to conveniently and accurately measure the impedance of a certain section of RF line, so it is impossible to accurately locate the specific reason for the deviation between ILOSS and the calculated value.

[0050] In view of this, the present application provides an impedance measurement and analysis circuit board and an impedance measurement and analysis system to solve at least one of the above-mentioned technical problems.

[0051] Please see Figures 3 to 5 The impedance measurement and analysis circuit board 100 of this application embodiment is used for the measurement and analysis of radio frequency (RF) front-end impedance. The impedance measurement and analysis circuit board 100 includes an RF front-end circuit 10. The RF front-end circuit 10 includes multiple RF front-end devices 11 with different packages and matching forms.

[0052] In the impedance measurement and analysis circuit board 100 of this application embodiment, the radio frequency front-end circuit 10 is compatible with different packages and matching forms of the radio frequency front-end device 11 to meet the measurement and analysis requirements of radio frequency front-end impedance in different project schemes.

[0053] Specifically, the impedance measurement and analysis circuit board 100 is also known as the impedance measurement and analysis demo board. In this embodiment, during the initial design phase of the demo board, packaging and surface-mount compatibility designs can be implemented. Figure 4Taking the design of RC inductor jumper compatibility as an example, the RF front-end device 11 is allowed to be mounted in different positions (such as position 1 or position 2), thus following different paths (such as path one or path two). In this way, the package and jumper compatibility of different devices are considered in the early stages of the demo board design, enabling the demo board to adapt to the needs of different project solutions. For example, the demo board can flexibly support multiple RF front-end devices 11 with different packages and matching forms, ensuring that multiple RF front-end devices 11 with different packages and matching forms can be tested and analyzed on the same demo board.

[0054] In some embodiments, the package type refers to the device package type of the RF front-end device 11. Different package types may include, for example, the following:

[0055] Surface Mount Device (SMD): The device is directly mounted on the PCB.

[0056] Through-Hole Device (THD) is a device that connects to circuitry through holes on a PCB.

[0057] Ball Grid Array (BGA) packages are suitable for high-performance and high-pin-count devices;

[0058] Quad Flat No-lead Package (QFN) is suitable for surface mounting.

[0059] Leadless Grid Array (LGA) package is suitable for high-density applications.

[0060] In some embodiments, the matching type refers to the impedance matching type of the RF front-end device 11. Different matching types may include, for example, the following:

[0061] Pi-type matching: A matching network consisting of two parallel capacitors and one series inductor, which can achieve impedance transformation and has a certain filtering function over a wide frequency range.

[0062] T-matching (T-matching): A matching network consisting of two series inductors and one parallel capacitor. In high-frequency applications, it can effectively adjust the circuit impedance and affect the signal phase and amplitude.

[0063] L-type matching (L-matching): A matching network consisting of two series inductors and one parallel capacitor. It has a simple structure and is suitable for applications with relatively fixed frequency and uncomplicated impedance matching requirements.

[0064] Stub-tuned matching: This technique uses stubs to adjust impedance and is commonly used in microstrip line designs.

[0065] P-type matching: mainly composed of inductors, capacitors and other components to form a specific resonant circuit. By reasonably designing the component parameters, the circuit can generate series or parallel resonance at the target frequency, forming a high impedance or low impedance point, thereby suppressing the signal of that specific frequency from passing through. It is often used to eliminate interference signals in communication systems, such as adjacent channel interference or specific noise frequencies.

[0066] The demo board allows users to select different packages and matching forms for the compatible RF front-end devices 11, improving its versatility and flexibility. Theoretically, if the demo board is large enough, compatibility with multiple packages and matching forms can be achieved in the early stages of design, allowing users to choose flexibly based on their specific needs.

[0067] Please see Figure 5 and Figure 6 In some embodiments, the plurality of radio frequency front-end devices 11 include any of the following: switch, DPX, SAW, filter, and FEM.

[0068] Specifically, the multiple RF front-end devices 11 may include any of the devices that may be used in the transmitter (TX) / pseudo-random sequence receiver (PRX) / dual receiver (DRX) path, such as SWITCH, DPX, SAW, filter, and FEM.

[0069] For example, multiple RF front-end devices 11 may include a switch and a DPX; or, multiple RF front-end devices 11 may include a DPX and a SAW; or, multiple RF front-end devices 11 may include a SAW and a filter; or, multiple RF front-end devices 11 may include a filter and a FEM; or, multiple RF front-end devices 11 may include a switch, a DPX, a SAW, a filter, and a FEM, etc., which will not be listed here. The specific devices included in the multiple RF front-end devices 11 can be set according to the project solution requirements.

[0070] The SWITCH is used to switch between different radio frequency paths. For example, it can switch between transmit and receive modes, or between different frequency bands. In full-duplex operation, the SWITCH can quickly switch between transmit and receive paths to adapt to the requirements of the communication protocol. Figure 6In the examples, SWITCH is a single-pole double-throw (SPDT) switch, a single-pole eight-throw (SP8T) switch, etc.

[0071] A DPX (duplexer) is a device that allows simultaneous transmission and reception over a single transmission line. A DPX typically consists of two filters, one for the transmission band and one for the reception band. In systems requiring simultaneous transmission and reception, such as mobile phones and wireless communication base stations, DPX effectively separates the transmitted and received signals, reducing mutual interference.

[0072] SAW (Surface Acoustic Wave) filters utilize surface acoustic wave technology to selectively allow signals of specific frequencies while suppressing unwanted frequency components. SAW filters exhibit good frequency selectivity and low insertion loss. They are widely used in mobile communication devices to filter out unwanted frequency components and improve signal purity.

[0073] A filter is used to selectively allow signals within a specific frequency range to pass through while attenuating signals at other frequencies. Filters can be low-pass, high-pass, band-pass, or band-stop filters, depending on the application requirements. In the RF front-end, filters protect the receive link from unwanted signal interference while ensuring that the transmitted signal meets spectral masking requirements.

[0074] A Front-End Module (FEM) integrates multiple RF front-end functions, such as power amplification, low-noise amplification, filtering, and switching. FEMs simplify RF front-end design and improve performance and reliability. They are widely used in various wireless communication devices, such as smartphones, wireless access points, and IoT devices, to provide complete RF front-end solutions.

[0075] In some implementations, the RF front-end circuit 10 has multiple test points reserved for segmented impedance measurement.

[0076] by Figure 6For example, the demo board can reserve multiple test points on key paths in the RF front-end circuit 10, such as the signal path from transmitter to antenna (TX-ANT), the signal path from antenna to pseudo-random sequence receiver (ANT-PRX), and the signal path from antenna to dual receiver (ANT-DRX). (The connection nodes of each RF front-end device 11 can be reserved as test points.) By reserving multiple test points, it is convenient to measure the impedance of the RF lines in segments, thereby solving the problem of impedance measurement difficulties under high-density device layout.

[0077] For example, these test points can be used for:

[0078] Signal measurement: Measuring parameters such as the amplitude, phase, and frequency of a signal to evaluate the performance of a circuit.

[0079] Fault diagnosis: Locate the fault point in the circuit to facilitate debugging and repair.

[0080] Impedance analysis: Measure the impedance characteristics along the path to ensure impedance matching and reduce signal reflection and loss.

[0081] The following is about Figure 6 The circuit connections and working principle will be introduced. Figure 6 There are three hardware paths: TX, PRX, and DRX. ① TX path: TX (test point) - Π-type match - SPDT - Π-type match - DPX - Π-type match - SPDT - Π-type match - SP8T - Π-type match - ANT (test point); ② PRX path: ANT (test point) - Π-type match - SP8T - Π-type match - SPDT - Π-type match - DPX - Π-type match - SPDT - Π-type match - PRX (test point); ③ DRX path: ANT (test point) - Π-type match - SP8T - SAW - Π-type match - SPDT - Π-type match - DRX (test point). It is normal for different designs to use different devices or matching methods. The devices mentioned in the solution can be flexibly replaced according to actual needs. For example, in the figure, SPDT may be SP4T or DPDT or none; DPX may be DIPX or SAW; SP8T may be SP10T or SP12T or other FEMs; and Π-type match may be L-type match or notch match, etc.

[0082] In some embodiments, the top layer of the RF front-end circuit 10, except for the mounting area for the RF front-end device 11, is set as a ground area.

[0083] Specifically, the top layer of the RF front-end circuit 10 refers to the topmost layer of the PCB, which is typically used to mount the RF front-end device 11. The mounting area specifically refers to the surface mount technology (SMT) area. In this embodiment, the Top layer, except for the SMT area used for the RF front-end device 11, is entirely a GND area, effectively expanding the grounding area and significantly improving the accuracy of impedance measurements.

[0084] Please see Figure 3 and Figure 7 In some embodiments, the impedance measurement and analysis circuit board 100 further includes a power supply circuit 20. The power supply circuit 20 is connected to the radio frequency front-end circuit 10. The power supply circuit 20 is used to receive an external power input and output a voltage that is bucked / boosted and then regulated to drive active devices.

[0085] Specifically, such as Figure 7 As shown, the power supply circuit 20 may include a power management unit (PMU). The PMU is used to convert the external power input into multiple different output voltage rails (VC1, VC2, VC3, etc.) to provide drive voltages for active devices. The PMU has various power management functions, including linear regulation (LDO), buck, and boost. The PMU can buck / boost the external power input and then regulate the output voltage according to different voltage requirements to drive the active devices.

[0086] In some implementations, the active devices include MIPI devices and / or GPIO devices.

[0087] Specifically, active devices may include MIPI devices; or, active devices may include GPIO devices; or, active devices may include both MIPI devices and GPIO devices. The specific devices included in the active device list can be set according to the project requirements.

[0088] MIPI devices, or Mobile Industry Processor Interface (MIPI) devices, are standard hardware and software interfaces used in mobile devices, supporting high-speed and low-power data transmission modes.

[0089] GPIO devices, or General Purpose Input / Output devices, can be used as general-purpose input / output pins to read external signals or send signals to external devices, implementing basic input / output functions as well as being multiplexed for other specific functions.

[0090] Please see Figure 3 and Figure 8 In some embodiments, the impedance measurement and analysis circuit board 100 further includes a MIPI circuit 30. The MIPI circuit 30 is connected to the RF front-end circuit 10. Furthermore, the MIPI circuit 30 is also connected to the aforementioned power supply circuit 20. The MIPI circuit 30 is used to generate the clock signal required by the MIPI device and drive the MIPI device to operate based on the external power input and serial communication.

[0091] Specifically, such as Figure 8 As shown, in the MIPI circuit 30, "Power Input" is the pin used to receive external power input. "SCLK" is the clock signal pin, used to output the clock signal required by the MIPI device. "SDATA" is the serial communication pin, used for serial communication with the PC. "GND" is the ground pin.

[0092] In one example, the MIPI circuit 30 is used to receive external power input, generate the clock signal required by the MIPI device, and communicate with the PC via serial port. The PC then issues commands to drive the MIPI device to work normally.

[0093] In some implementations, the impedance measurement and analysis circuit board 100 also includes an external interface. The external interface is used to connect an external power supply and / or MIPI devices.

[0094] Specifically, the demo board provides external interfaces for connecting external power supplies and / or MIPI devices. The number of external interfaces can be one or more, depending on the required number of external power supplies and MIPI devices.

[0095] Please see Figure 9 The impedance measurement and analysis system 1000 of this application includes the impedance measurement and analysis circuit board 100 of any of the above embodiments.

[0096] In the impedance measurement and analysis system 1000 of this application embodiment, the radio frequency front-end circuit 10 is compatible with different packages and matching forms of the radio frequency front-end device 11 to meet the measurement and analysis requirements of radio frequency front-end impedance in different project schemes.

[0097] Please see Figure 9 In some embodiments, the impedance measurement and analysis system 1000 further includes peripheral devices 200. Peripheral devices 200 are disposed outside the impedance measurement and analysis circuit board 100. Peripheral devices 200 include any one or more of PA, PMIC, BB, memory, and transceiver.

[0098] For example, peripheral device 200 may include a PA; or peripheral device 200 may include a PMIC; or peripheral device 200 may include a BB; or peripheral device 200 may include memory; or peripheral device 200 may include a transceiver; or peripheral device 200 may include a PA, PMIC, BB, memory, and transceiver, etc., which will not be listed here. The specific devices included in peripheral device 200 can be set according to the requirements of the project solution.

[0099] Among them, the power amplifier (PA) is used to amplify the power of the radio frequency signal so that the signal can be transmitted over long distances.

[0100] Power management integrated circuits (PMICs) are used to manage the power supply of devices, including power conversion, battery charging, and power distribution. They provide stable voltage and current to ensure the normal operation of the devices.

[0101] A baseband processor (BB) is used to process digital signals, including signal encoding, decoding, modulation, and demodulation.

[0102] Memory is used to store data and programs.

[0103] A transceiver is responsible for sending and receiving signals and typically includes an RF front-end and an analog signal processing section.

[0104] In summary, the embodiments of this application provide the following solutions to the pain points of impedance measurement and analysis encountered in the design and debugging of discrete RF front-end solutions:

[0105] (1) Design a demo board that is compatible with different packages and matching forms of conventional RF front-end devices 11 (such as SWITCH, DPX, SAW, Filter, FEM, etc.) (theoretically, if the size of the demo board is large enough, it can achieve compatibility of multiple packages and matching forms in the early stage of design, and users can choose flexibly according to actual needs) for impedance analysis.

[0106] (2) For active devices (such as MIPI devices, GPIO devices, etc.), the Demo board is designed with a power supply circuit 20 and a MIPI circuit 30 to provide the corresponding voltage and clock signals, and also provides an external interface for use by external power supply and MIPI box.

[0107] The impedance measurement and analysis circuit board 100 and impedance measurement and analysis system 1000 of the embodiments of this application have the following effects:

[0108] The traditional compact PCB layout has been improved by relocating components such as the PA, PMIC, BB, Memory, and Transceiver, which were originally located on the impedance measurement and analysis circuit board 100, to an external peripheral device 200. This removes unnecessary components, retaining only the RF front-end circuitry 10 (excluding the PA and Transceiver), power supply circuitry 20, and MIPI circuitry 30. Furthermore, external power supplies, USB ports, and other peripheral interface circuits can also be located outside the impedance measurement and analysis circuit board 100. This design simplifies the layout, solves the problem of difficult RF impedance measurement and analysis with single and multiple components, and improves the convenience of impedance measurement and analysis. The improved demo board can, to a certain extent, demonstrate the impedance characteristics of discrete RF solutions, effectively mitigating design risks and thus improving first-time board approval rate and performance achievement rate.

[0109] For example, during project debugging, if it is found that the "sensitivity" cannot reach the link budget, a detailed investigation and analysis can be performed on the demo board to determine if it is caused by "impedance mismatch" of a certain component. Figure 10 For example, suppose a recommended design for a SAW (Self-Device Anode) in the design is to add a parallel inductor. However, traditional solutions, due to compact layout and limited space, cannot accommodate an additional parallel inductor. The demo board in this application, however, has no size limitations, is compatible with different matching methods, and has sufficient reserved matching positions. Therefore, this inductor can be added to the demo board to confirm whether the lack of this inductor causes impedance mismatch, leading to increased insertion loss and sensitivity falling short of the link budget.

[0110] In a design example, the overall layout diagram of the impedance measurement and analysis circuit board 100 can be shown as follows: Figure 11 As shown. The impedance measurement and analysis circuit board 100 mainly includes the aforementioned RF front-end circuit 10, power supply circuit 20, and MIPI circuit 30. In addition, Power_in is the power input interface used to provide power to the RF front-end circuit 10. VDD is the power supply voltage for digital or analog circuits. VC is the control voltage or power supply voltage for analog circuits. TX_Test is the transmit link test point used to measure and debug the transmit link signal. RX_Test is the receive link test point used to measure and debug the receive link signal. DRX_Test is the dual receive link test point used to measure and debug the dual receive link signal. ANT is the antenna interface used to connect an external antenna.

[0111] In a design example, the circuit block diagrams of each part of the impedance measurement and analysis circuit board 100 are as follows: Figures 12 to 21 As shown.

[0112] Figure 12 This is the circuit block diagram of power supply circuit 20. VBAT_RF receives 2.8V through an external current source. C0117 is a filter capacitor. VDD serves as the VDD input power supply for the SP8T / SPDT. A voltage divider can be used to output 1.8V via a 100Ω resistor connected in series with R0101 and a 180Ω resistor connected in parallel with C0137. Thus, VC1 / VC2 / VC3 serve as the VC / VIO input power supply for the SP8T. Different designs and devices may require different input power supply voltages. This part can use a DC-DC chip for boost / buck conversion to output the required voltage for the device.

[0113] Figure 13 This is the circuit block diagram of the SP8T. The antenna common terminal consists of ESD protection, Π-type matching, Coulper, and SP8T. It is normal for different designs to use different components or matching methods. The components and matching methods mentioned in the solution can be flexibly replaced according to actual needs. For example, the coupler in the figure may be an integrated DFEM or none at all, the SP8T may be an SP10T or DPDT, and the Π-type matching may be an L-type or notch matching, etc.

[0114] Figures 14 to 17 The circuit block diagrams are for SPDT_TX, SPDT_TRX, SPDT_PRX, and SPDT_DRX, respectively.

[0115] in, Figure 14 This simulation depicts a scenario where two frequency bands share a single PA output port, such as B5 / B8 sharing PA LB1 port. It's normal for different designs to use different components or matching schemes. Components and matching schemes mentioned in the solution can be flexibly replaced according to actual needs. For example, in the figure, SPDT may be SP4T or not present, and Π-type matching may be L-type or notch matching, etc.

[0116] Figure 15 This simulation demonstrates scenarios using DPX in different packages, such as 1814 or 1612. The TRX signal path can be switched using an SPDT. It's normal for different designs to use different components or matching methods. Components and matching methods mentioned in the solution can be flexibly replaced according to actual needs. For example, the SPDT in the figure may be an SP4T or not present, and the Π-type matching may be an L-type or notch matching, etc.

[0117] Figure 16This simulation demonstrates scenarios using DPX packages of different sizes, such as 1814 or 1612. The PRX signal path can be switched using an SPDT. It's normal for different designs to use different components or matching schemes. Components and matching schemes mentioned in the solution can be flexibly replaced according to actual needs. For example, the SPDT in the figure may be an SP4T or not present, and the Π-type matching may be an L-type or notch matching, etc.

[0118] Figure 17 This simulation uses SAW packages of different types, such as 1109 or 0907, and the DRX signal path can be switched using SPDT. It's normal for different designs to use different components or matching methods. Components and matching methods mentioned in the solution can be flexibly replaced according to actual needs. For example, the SPDT in the figure may be SP4T or not present, and the Π-type matching may be L-type or notch matching, etc.

[0119] Figure 18 and Figure 19 All are circuit block diagrams of DPX.

[0120] in, Figure 18 The diagram shows the matching configurations for the three ports ANT / TX / RX of the 1814 DPX. It is normal for different designs to use different matching configurations. You can flexibly replace the matching in the scheme according to the actual needs. For example, the Π-type matching in the diagram may be an L-type or a notch matching, etc.

[0121] Figure 19 The matching format for the three ports ANT / TX / RX of the 1612 DPX is shown. It is normal for different designs to use different matching formats. The matching in the scheme can be flexibly replaced according to the actual needs. For example, the Π-type matching in the figure may be L-type or notch matching, etc.

[0122] Figure 20 and Figure 21 All are circuit block diagrams for SAW.

[0123] in, Figure 20 The matching format for the 1411 / 1109 SAW IN / OUT ports is shown. It is normal for different designs to use different matching formats. The matching in the scheme can be flexibly replaced according to actual needs. For example, the Π-type matching in the figure may be an L-type or a notch matching, etc.

[0124] Figure 21 This refers to the matching format for the 0907 SAW IN / OUT ports. It is normal for different designs to use different matching formats. You can flexibly replace the matching in the scheme according to the actual needs. For example, the Π-type matching in the figure may be an L-type or a notch matching, etc.

[0125] It should be noted that the circuit structures described above are for illustrative purposes only. Other circuit structures may be used in other examples, and no restrictions are imposed here.

[0126] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0127] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0128] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0129] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0130] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," and "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with an embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0131] Although embodiments of this application have been shown and described above, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An impedance measurement and analysis circuit board, characterized in that, For measuring and analyzing the impedance of an RF front-end, the impedance measurement and analysis circuit board includes an RF front-end circuit; The radio frequency front-end circuit includes multiple radio frequency front-end devices with different packaging and matching forms; The radio frequency front-end circuit includes a signal path TX-ANT from the transmitter to the antenna, a signal path ANT-PRX from the antenna to the pseudo-random sequence receiver, and a signal path ANT-DRX from the antenna to the dual receiver. Multiple test points are reserved in the signal paths TX-ANT, ANT-PRX, and ANT-DRX for segmented impedance measurement.

2. The impedance measurement and analysis circuit board according to claim 1, characterized in that, The plurality of said RF front-end devices include any and more of SWITCH, DPX, SAW, Filter, and FEM.

3. The impedance measurement and analysis circuit board according to claim 1, characterized in that, Except for the mounting area for the RF front-end device, the top layer of the RF front-end circuit is set as a grounding area.

4. The impedance measurement and analysis circuit board according to claim 1, characterized in that, The impedance measurement and analysis circuit board also includes a power supply circuit, which is connected to the radio frequency front-end circuit. The power supply circuit is used to receive external power input and output the power through step-down / step-up and then regulated voltage to drive active devices.

5. The impedance measurement and analysis circuit board according to claim 4, characterized in that, The active devices include MIPI devices and / or GPIO devices.

6. The impedance measurement and analysis circuit board according to claim 1, characterized in that, The impedance measurement and analysis circuit board also includes a MIPI circuit, which is connected to the RF front-end circuit. The MIPI circuit is used to generate the clock signal required by the MIPI device and drive the MIPI device to work based on the external power input and serial communication.

7. The impedance measurement and analysis circuit board according to claim 5 or 6, characterized in that, The impedance measurement and analysis circuit board also includes an external interface for connecting the external power supply and / or the MIPI device.

8. An impedance measurement and analysis system, characterized in that, Includes the impedance measurement and analysis circuit board as described in any one of claims 1-7.

9. The impedance measurement and analysis system according to claim 8, characterized in that, The impedance measurement and analysis system also includes peripheral devices, which are disposed outside the impedance measurement and analysis circuit board; The peripheral device includes any one or more of PA, PMIC, BB, Memory, and Transceiver.

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