A reflow soldering mold for a meter circuit board

Abstract

The utility model relates to a kind of electric meter circuit board reflow soldering mould, including bottom plate, the front of bottom plate is equipped with the circuit board card slot for circuit board insertion, the periphery outside of circuit board card slot is equipped with the rotatable and the rotating block of compacting circuit board, multiple device slots for electronic component insertion are equipped in circuit board card slot, pin hole for the pin of electronic component insertion is opened in device slot, the back of bottom plate is respectively equipped with baffle corresponding device slot position.This utility model can insert pin type device in advance on circuit board, reflow soldering with other patch type device, that is, all devices can be welded by once reflow soldering of this utility model, greatly simplify the welding process, shorten production cycle.

Description

Technical Field

[0001] This utility model relates to a welding mold used in the production process of electricity meters. Background Technology

[0002] In existing technologies, electronic components on circuit boards can be soldered using either wave soldering or reflow soldering. The key difference between wave soldering and reflow soldering is that reflow soldering is suitable for surface mount components (SMT), where soldering is achieved by heating pre-applied solder paste, while wave soldering is suitable for through-hole components (THT), where molten solder forms a connection by contacting the leads with the wave. Since the circuit boards of electricity meters contain both surface mount components and through-hole devices such as connectors, current methods typically involve reflow soldering followed by wave soldering. This results in a complex process and a long production cycle. Summary of the Invention

[0003] In order to overcome the above-mentioned shortcomings in the prior art, this utility model provides a reflow soldering mold for meter circuit boards that can realize the reflow soldering of pin-type devices.

[0004] This utility model is achieved through the following technical solution:

[0005] A reflow soldering mold for an electric meter circuit board includes a base plate. The front of the base plate is provided with a circuit board slot for inserting the circuit board. Rotating blocks that can rotate and press the circuit board are provided around the outer perimeter of the circuit board slot. Multiple component slots for inserting electronic components are provided inside the circuit board slots. Pin holes for inserting the pins of electronic components are provided inside the component slots. Baffles are provided on the back of the base plate corresponding to the positions of the component slots.

[0006] Preferably, the spacing between the baffle and the base plate is matched to the length of the electronic component pins, and the baffles in the same row are integrated into a baffle strip.

[0007] Preferably, heat dissipation holes are provided on the circuit board slot.

[0008] Preferably, a screw is fixed to the outer perimeter of the circuit board slot, and the rotating block is sleeved on the screw.

[0009] Preferably, the outer side of the circuit board slot is connected to a pick-and-place slot.

[0010] Preferably, the base plate has inwardly opening operation holes on both sides.

[0011] In this application, the leaded electronic components to be soldered are first inserted into the component slot, and then the circuit board with pre-coated solder paste is placed into the base plate of the mold. The other end of the electronic components in the component slot is inserted into the circuit board, and then sent into the reflow soldering equipment. This can realize the soldering of all components in one reflow soldering, and there is no need to send them to the wave soldering machine again for soldering leaded components.

[0012] The beneficial effects of this utility model are as follows: This utility model can pre-insert leaded devices onto the circuit board and reflow solder them together with other surface mount devices. That is, this utility model can solder all devices in just one reflow soldering, which greatly simplifies the soldering process and shortens the production cycle. Attached Figure Description

[0013] Figure 1 This is a front structural diagram of the present invention.

[0014] Figure 2 This is a schematic diagram of the reverse side structure of this utility model. Detailed Implementation

[0015] The utility model will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0016] like Figure 1 , 2 As shown, a reflow soldering mold for an electric meter circuit board includes a base plate 1. The front of the base plate is provided with a circuit board slot 2 for inserting the circuit board. Rotating blocks 4 are provided around the circuit board slot 2 to rotate and press the circuit board. Multiple component slots 9 are provided inside the circuit board slot for inserting electronic components. Pin holes 10 are provided inside the component slots 9 for inserting the pins of the electronic components. Baffles 11 are provided on the back of the base plate corresponding to the positions of the component slots.

[0017] The spacing between the baffle 11 and the base plate 1 matches the length of the electronic component pins, and the baffles in the same row are integrated into a baffle strip 6. The distance between the baffle and the base plate needs to be consistent, and setting it as an integrated baffle strip is easier to achieve.

[0018] Screws 3 are fixed around the outer perimeter of the circuit board slot, and rotating blocks 4 are fitted onto the screws. When the rotating blocks rotate inward, they can be in a tightened state, and when they rotate outward, they can be in a loosened state, thus achieving the rotation function, and they are not easy to loosen after rotating inward.

[0019] Five ventilation holes are provided on the circuit board slot. During the soldering process, high temperatures are generated, and the ventilation holes can reduce the overall temperature of the base plate.

[0020] The outer side of the circuit board slot is connected to a pick-and-place slot 7 for easy pick-and-place of the circuit board. Operating holes 8 are provided on both sides of the base plate to facilitate the overall removal and placement of the base plate.

[0021] In this application, components with leads on both sides are also soldered using reflow soldering. First, the leaded electronic components to be soldered are inserted into the component slot 9. Due to the back retainer 6, the insertion depth is limited. Then, the circuit board, pre-coated with solder paste and with the surface-mount components in place, is placed into the circuit board slot 2 of the base plate. During placement, the components are handled gently to avoid displacement. Simultaneously, the other end of the electronic components in the component slot 9 is inserted into the corresponding position on the circuit board. The rotating block 4 is rotated to press the circuit board firmly, and then the board is fed into the input track of the reflow soldering equipment. This application allows all components to be soldered in a single reflow soldering operation, eliminating the need for wave soldering of leaded components.

[0022] This invention allows pin-type devices to be pre-inserted onto a circuit board and reflow soldered together with other surface-mount devices. In other words, this invention can solder all devices in a single reflow soldering operation, greatly simplifying the soldering process and shortening the production cycle.

Claims

1. A reflow soldering mold for an electric meter circuit board, characterized in that: The device includes a base plate. The front of the base plate is provided with a circuit board slot for inserting a circuit board. Rotating blocks that can rotate and press the circuit board are provided around the outer perimeter of the circuit board slot. The circuit board slot is provided with multiple device slots for inserting electronic components. The device slots are provided with pin holes for inserting the pins of the electronic components. The back of the base plate is provided with baffles corresponding to the positions of the device slots.

2. The reflow soldering mold for an electric meter circuit board according to claim 1, characterized in that: The spacing between the baffle and the base plate is matched to the length of the electronic component pin, and the baffles in the same row are integrally connected to form a baffle strip.

3. The reflow soldering mold for an electric meter circuit board according to claim 2, characterized in that: The circuit board slot has heat dissipation holes.

4. The reflow soldering mold for an electric meter circuit board according to claim 3, characterized in that: The circuit board slot is fixed with screws on its outer perimeter, and the rotating block is sleeved on the screws.

5. The reflow soldering mold for an electric meter circuit board according to claim 4, characterized in that: The outer side of the circuit board slot is connected to a pick-and-place slot.

6. The reflow soldering mold for an electric meter circuit board according to claim 5, characterized in that: Operating holes are provided on both sides of the base plate.

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