Fin array circuit control board heat dissipation structure

Abstract

The utility model relates to controller structure technical field discloses a fin array formula circuit control panel heat radiation structure, including protection shell, protection shell top side swing joint has the rotary shaft no.

Description

Technical Field

[0001] This utility model relates to the field of controller structure technology, and in particular to a heat dissipation structure for a finned array circuit control board. Background Technology

[0002] In today's information age, electronic devices have been deeply integrated into all aspects of production and life, from sophisticated and complex aerospace control systems to everyday smartphones and smart wearable devices. As the core component of electronic devices, circuit control boards undertake key functions such as signal processing and power control. With the development of electronic technology towards high integration and high performance, a large number of electronic components are densely integrated on circuit control boards.

[0003] In modern finned array circuit control board heat dissipation structure design, in order to prevent dust and other foreign objects from entering the interior, a dustproof mesh is usually designed on its periphery. The main function of this dustproof mesh is to filter out impurities in the air, thereby protecting the circuit board from contamination. However, this design also brings some problems, especially when it is necessary to maintain or repair the internal structure. The presence of the mesh may cause some inconvenience, as it may obstruct the maintenance personnel's view and operating space, making the maintenance work more complicated and time-consuming. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a finned array circuit control board heat dissipation structure, which aims to improve the problem that the dustproof mesh on the periphery of the existing finned array circuit control board heat dissipation structure may hinder its internal maintenance.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a finned array circuit control board heat dissipation structure, comprising a protective shell, a rotating shaft rotatably connected to one side of the top of the protective shell, a storage roll fixedly connected to the outer wall of the rotating shaft, a dustproof net fixedly connected to the outer wall of the storage roll, a pull rod fixedly connected to one side of the dustproof net, a fixing column fixedly connected inside the protective shell, a rotating spring provided inside the protective shell, one end of the rotating spring fixedly connected to one end of the rotating shaft, the other end of the rotating spring fixedly connected to the outer wall of the rotating spring, rotating rods rotatably connected to both sides inside the protective shell, one side of the rotating rod rotatably connected to one side of the pull rod, and a rotating shaft rotatably connected to the other side of the rotating rod, the outer wall of the rotating shaft rotatably connected inside the protective shell, a worm gear fixedly connected to the outer wall of the rotating shaft rotatably connected inside the protective shell, the worm gear meshing with the outer wall of the worm, and a handle fixedly connected to one end of the worm.

[0006] Furthermore, the protective shell has side heat dissipation holes inside.

[0007] Furthermore, the protective shell has a threaded post inside, and a handle is fixedly connected to one end of the threaded post.

[0008] Furthermore, one end of the threaded column is rotatably connected to a wedge-shaped sliding column, and the outer wall of the wedge-shaped sliding column is slidably connected inside the protective shell.

[0009] Furthermore, a wedge-shaped sliding post is slidably connected inside the protective shell, and the outer wall of the wedge-shaped sliding post is in contact with the outer wall of the wedge-shaped sliding post.

[0010] Furthermore, a transmission rod is rotatably connected inside the protective shell, and a sliding groove is provided inside the wedge-shaped sliding column.

[0011] Furthermore, a connecting column is fixedly connected to one side of the transmission rod, and the outer wall of the connecting column is slidably connected inside the slide groove.

[0012] Furthermore, a pressure plate is rotatably connected to one side of the transmission rod.

[0013] This utility model has the following beneficial effects:

[0014] 1. In this utility model, the worm gear is first rotated by the handle, and the worm gear drives the rotating shaft to rotate through the worm wheel. This controls the rotation of the rotating rod and drives the pull rod to open and retract. At the same time, the rotating spring and the storage roll cooperate to open and close the pull rod. This solves the problem of inconvenience in maintaining the internal structure of the fin array circuit control board after the pull rod is installed, and improves the convenience of maintenance.

[0015] 2. In this utility model, the screw column is first pushed by the handle two to push the wedge-shaped sliding column two, thereby pushing the wedge-shaped sliding column one in one step. The inner wall of the groove on the wedge-shaped sliding column one will push the connecting column, and the connecting column can drive the transmission rod to rotate. Thus, the heat dissipation structure of the fin array circuit control board is pressed by the pressure plate, which improves the convenience of fixing the heat dissipation structure of the fin array circuit control board. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the main structure of a fin array circuit control board heat dissipation structure proposed in this utility model.

[0017] Figure 2 This is a schematic diagram of the rotating shaft structure of a finned array circuit control board heat dissipation structure proposed in this utility model.

[0018] Figure 3 This is a cross-sectional schematic diagram of the protective shell of a finned array circuit control board heat dissipation structure proposed in this utility model.

[0019] Legend:

[0020] 1. Protective shell; 2. Side ventilation holes; 3. Storage roll; 4. Dustproof net; 5. Pull rod; 6. Rotating rod; 7. Rotary spring; 8. Rotating shaft one; 9. Fixed column; 10. Worm gear; 11. Rotating shaft two; 12. Worm; 13. Handle one; 14. Pressure plate; 15. Transmission rod; 16. Slide groove; 17. Connecting column; 18. Wedge-shaped slide column one; 19. Handle two; 20. Threaded column; 21. Wedge-shaped slide column two. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Reference Figure 1 and Figure 2 This utility model provides an embodiment of a finned array circuit control board heat dissipation structure, including a protective shell 1. A rotating shaft 8 is rotatably connected to one side of the top of the protective shell 1. A storage roll 3 is fixedly connected to the outer wall of the rotating shaft 8. A dustproof net 4 is fixedly connected to the outer wall of the storage roll 3. A pull rod 5 is fixedly connected to one side of the dustproof net 4. A fixing post 9 is fixedly connected inside the protective shell 1. A rotating spring 7 is provided inside the protective shell 1. One end of the rotating spring 7 is fixedly connected to one end of the rotating shaft 8, and the other end of the rotating spring 7 is fixed... A rotating rod 6 is rotatably connected to both sides of the inner side of the protective shell 1, connected to the outer wall of the rotating spring 7. One side of the rotating rod 6 is rotatably connected to the side of the pull rod 5, and the other side of the rotating rod 6 is fixedly connected to the rotating shaft 11. The outer wall of the rotating shaft 11 is rotatably connected to the inner side of the protective shell 1. A worm gear 10 is fixedly connected to the outer wall of the rotating shaft 11. A worm 12 is rotatably connected to the inner side of the protective shell 1. The worm gear 10 meshes with the outer wall of the worm 12. A handle 13 is fixedly connected to one end of the worm 12. A side heat dissipation hole 2 is opened inside the protective shell 1.

[0023] Specifically, in this heat dissipation structure, the dustproof mesh 4 and the protective shell 1 work together to achieve effective dust prevention. When necessary maintenance and inspection of the internal circuit control board are required, the user can operate the handle 13 to control the rotation of the worm gear 12. The rotation of the worm gear 12 will drive the meshing worm wheel 10 to rotate together. The worm wheel 10 is connected to the rotating rod 6 through the rotating shaft 11, so the rotating rod 6 will also rotate. As the rotating rod 6 rotates, it will drive the pull rod 5 to perform a corresponding rotation action, thereby opening one side of the dustproof mesh 4. At the same time, the storage roll 3 is connected to the rotating spring 7 through the rotating shaft 8. When the pull rod 5 drives one side of the dustproof mesh 4 to open, the rotating spring 7 will automatically extend, promoting the rotation of the storage roll 3. In this way, the dustproof mesh 4 can be rolled up and neatly stored on the storage roll 3, thus facilitating the opening and closing of the dustproof mesh and ensuring the efficient operation of the heat dissipation structure and the long-term stability of the internal circuit.

[0024] Reference Figure 1 and Figure 3 The protective shell 1 has a threaded post 20 inside, a handle 19 fixedly connected to one end of the threaded post 20, a wedge-shaped slide post 21 rotatably connected to one end of the threaded post 20, the outer wall of the wedge-shaped slide post 21 slidably connected to the inside of the protective shell 1, a wedge-shaped slide post 18 slidably connected inside the protective shell 1, the outer wall of the wedge-shaped slide post 18 fits against the outer wall of the wedge-shaped slide post 21, a transmission rod 15 rotatably connected inside the protective shell 1, a slide groove 16 is opened inside the wedge-shaped slide post 18, a connecting post 17 is fixedly connected to one side of the transmission rod 15, the outer wall of the connecting post 17 slidably connected to the inside of the slide groove 16, and a pressure plate 14 rotatably connected to one side of the transmission rod 15.

[0025] Specifically, in the design of the fixing mechanism for controlling the heat dissipation structure of the fin array circuit control board, the structure is fixed in the internal space of the protective shell 1. The user can operate the handle 219 to control the rotation of the threaded column 20. When the threaded column 20 rotates, it applies force to the wedge-shaped slide column 21, causing the latter to move along its inclined surface. This inclined surface design allows the wedge-shaped slide column 21 to slide upward effectively. During the sliding process, it pushes the wedge-shaped slide column 18 located above it. The inner wall of the groove 16 on the wedge-shaped slide column 18 can cooperate with the connecting column 17. When the wedge-shaped slide column 18 slides upward, the inner wall of the groove 16 applies force to the connecting column 17, thereby driving the connecting column 17 to rotate along its axis. The rotation of the connecting column 17 is transmitted to the transmission rod 15, causing the transmission rod 15 to rotate accordingly. The transmission rod 15 drives the pressure plate 14 to move along its designed trajectory. Finally, the pressure plate 14 presses against the outer wall of the fin array circuit control board heat dissipation structure, ensuring the stability and safe fixing of the heat dissipation structure.

[0026] Working principle: In this heat dissipation structure, the dustproof mesh 4 and the protective shell 1 provide dust protection. When maintenance of the internal circuit control board is required, the handle 13 can control the worm gear 12 to rotate, which in turn drives the worm wheel 10 to rotate. The worm wheel 10 then drives the rotating rod 6 to rotate via the rotating shaft 11. The rotating rod 6 then drives the pull rod 5 to rotate and open, controlling one side of the dustproof mesh 4. The storage roll 3 is connected to the rotating spring 7 via the rotating shaft 8. Therefore, when the pull rod 5 retracts one side of the dustproof mesh 4, the rotating spring 7 promotes the rotation of the storage roll 3, thereby retracting the dustproof mesh 4. The dustproof net 4 is stored on the storage roll 3. When the heat dissipation structure of the control fin array circuit control board is fixed inside the protective shell 1, the threaded column 20 can be rotated by the handle 2 19. The threaded column 20 will push the wedge-shaped slide column 21, and the wedge-shaped slide column 21 will push the wedge-shaped slide column 18 upward through its inclined surface. The inner wall of the slide groove 16 on the wedge-shaped slide column 18 will push the connecting column 17, thereby driving the transmission rod 15 to rotate. Under the rotation of the transmission rod 15, the pressure plate 14 will be pressed against the outer wall of the heat dissipation structure of the control fin array circuit control board, thereby fixing it.

[0027] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation structure for a finned array circuit control board, comprising a protective shell (1), characterized in that: The protective shell (1) is rotatably connected to a rotating shaft (8) on one side of its top. A storage roll (3) is fixedly connected to the outer wall of the rotating shaft (8). A dustproof net (4) is fixedly connected to the outer wall of the storage roll (3). A pull rod (5) is fixedly connected to one side of the dustproof net (4). A fixing column (9) is fixedly connected inside the protective shell (1). A rotating spring (7) is installed inside the protective shell (1). One end of the rotating spring (7) is fixedly connected to one end of the rotating shaft (8), and the other end of the rotating spring (7) is fixedly connected to the outer wall of the rotating spring (7). Rotating rods (6) are rotatably connected to both sides inside the protective shell (1). One side of the rotating rod (6) is rotatably connected to the side of the pull rod (5), and the other side of the rotating rod (6) is fixedly connected to a rotating shaft (11). The outer wall of the rotating shaft (11) is rotatably connected to the inside of the protective shell (1). A worm gear (10) is fixedly connected to the outer wall of the rotating shaft (11). A worm (12) is rotatably connected inside the protective shell (1). The worm gear (10) meshes with the outer wall of the worm (12). A handle (13) is fixedly connected to one end of the worm (12).

2. The heat dissipation structure of a finned array circuit control board according to claim 1, characterized in that: The protective shell (1) has side heat dissipation holes (2) inside.

3. The heat dissipation structure of a finned array circuit control board according to claim 1, characterized in that: The protective shell (1) has a threaded post (20) inside, and a handle (19) is fixedly connected to one end of the threaded post (20).

4. The heat dissipation structure of a finned array circuit control board according to claim 3, characterized in that: One end of the threaded column (20) is rotatably connected to a wedge-shaped sliding column (21), and the outer wall of the wedge-shaped sliding column (21) is slidably connected inside the protective shell (1).

5. The heat dissipation structure of a finned array circuit control board according to claim 4, characterized in that: The protective shell (1) has a wedge-shaped sliding column one (18) slidably connected inside, and the outer wall of the wedge-shaped sliding column one (18) is in contact with the outer wall of the wedge-shaped sliding column two (21).

6. The heat dissipation structure of a finned array circuit control board according to claim 5, characterized in that: The protective shell (1) is rotatably connected to a transmission rod (15), and the wedge-shaped sliding column (18) has a sliding groove (16) inside.

7. The heat dissipation structure of a finned array circuit control board according to claim 6, characterized in that: A connecting column (17) is fixedly connected to one side of the transmission rod (15), and the outer wall of the connecting column (17) is slidably connected inside the slide groove (16).

8. The heat dissipation structure of a finned array circuit control board according to claim 7, characterized in that: A pressure plate (14) is rotatably connected to one side of the transmission rod (15).

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