Heat dissipation structure and electric appliance

Abstract

The utility model relates to a kind of heat dissipation structure and electrical appliance, belong to electrical appliance field.A kind of heat dissipation structure, comprising: base subassembly, base subassembly is equipped with installation space;Shell subassembly, shell subassembly is set on base subassembly, shell subassembly is cooperated with base subassembly and is formed with containing cavity, installation space is communicated with containing cavity;Air inlet shell, air inlet shell is set on shell subassembly, air inlet shell is equipped with air inlet space, air inlet space is communicated with containing cavity, the cross-sectional area of air inlet space is greater than the cross-sectional area of containing cavity;Circuit board subassembly, circuit board subassembly is set on base subassembly, circuit board subassembly is located in installation space and containing cavity.This application discloses a kind of heat dissipation structure, air inlet shell uses its specially designed air inlet space, to expand cross-sectional area mode, under the premise that not changing air duct main body size, significantly improve air suction amount.

Description

Technical Field

[0001] This utility model relates to the field of electrical appliances, and in particular to a heat dissipation structure and an electrical appliance. Background Technology

[0002] In existing technologies, inverter modules in appliances such as microwave ovens are high-voltage live components, requiring installation and enclosure with insulated plastic brackets to prevent electric shock risks. However, during operation, their circuit boards generate a large amount of heat, and if not dissipated in time, critical components are prone to failure and damage due to high temperatures. Currently, inverter modules generally rely on cooling fans for cooling, and their outer casings are mostly cylindrical, with cool air carrying away heat through the casing's air ducts. However, this design has limitations: when the module requires high-volume cooling, the cylindrical outer casing must be enlarged, encroaching on the design space of other components in the entire machine; if the casing is not enlarged, increasing the fan power does not meet energy-saving and noise reduction requirements. Utility Model Content

[0003] Therefore, it is necessary to address the problem of the lack of reasonable heat dissipation structure design in electrical appliances by providing a heat dissipation structure and an electrical appliance.

[0004] A heat dissipation structure includes: a base assembly having an installation space; a housing assembly disposed on the base assembly, the housing assembly and the base assembly forming a receiving cavity, the installation space communicating with the receiving cavity; an air inlet housing disposed on the housing assembly, the air inlet housing having an air inlet space communicating with the receiving cavity, the cross-sectional area of ​​the air inlet space being larger than the cross-sectional area of ​​the receiving cavity; and a circuit board assembly disposed on the base assembly, the circuit board assembly being located within the installation space and the receiving cavity.

[0005] The above-disclosed heat dissipation structure achieves a dual breakthrough in space utilization and heat dissipation performance through innovative design concepts. Traditional cylindrical casings, to meet airflow requirements, often reserve a large amount of redundant space around the circuit board, resulting in a bulky overall size and limited internal layout. This heat dissipation structure, however, employs a breakthrough design: the mounting space of the base component precisely fits the outer contour of the circuit board component, eliminating unnecessary gaps with a seamless design; the casing component also uses a flexible, curved shape, cleverly bending and wrapping around the protruding components on the circuit board component, achieving maximum space utilization. This close-fitting design completely changes the traditional, coarse casing layout, freeing up more valuable space inside the appliance, greatly improving the product's structural compactness, and powerfully promoting the development of appliances towards miniaturization and thinness. Regarding improved heat dissipation efficiency, the air intake casing utilizes its uniquely designed air intake space to significantly increase the air intake volume without changing the main dimensions of the airflow duct, by expanding the cross-sectional area. Compared to traditional airflow ducts, this heat dissipation structure allows more cool air to quickly enter the receiving cavity, efficiently flowing through key heat-generating components such as power chips and transistors on the circuit board component, promptly removing heat. The air intake housing also functions as an airflow guide, which can guide the airflow to evenly cover the surface of the circuit board, avoid local heat accumulation, and ensure that the circuit board components are always in a safe and stable operating temperature range, fundamentally solving the problems of device performance degradation and shortened lifespan caused by excessive temperature.

[0006] In one embodiment, the cross-sectional area of ​​the air intake space gradually increases from the boundary between the air intake space and the receiving cavity in a direction away from the receiving cavity. This design, utilizing the gradual expansion of the cross-sectional area of ​​the air intake space away from the receiving cavity, plays a crucial role in the heat dissipation structure. From an aerodynamic perspective, the gradually expanding cross-section effectively reduces air resistance during entry. As outside air enters the air intake space, the airflow velocity transitions smoothly as the channel cross-section gradually expands, avoiding turbulence and eddies caused by abrupt changes in cross-section. This allows the airflow to flow more smoothly towards the receiving cavity, improving the overall ventilation efficiency of the air duct. Simultaneously, this design significantly increases the contact area between the air intake space and the outside air. A larger contact area means more cool air can be drawn in, providing a sufficient cooling source for the heat dissipation of the circuit board assembly. This large influx of cool air can quickly flow through the heat-generating components, promptly carrying away heat and reducing the circuit board temperature. Furthermore, the gradually expanding space helps the air to diffuse before entering the containment cavity, allowing the cool air to be distributed more evenly on the circuit board surface, effectively reducing heat dissipation dead zones, avoiding local heat accumulation, ensuring that all parts of the circuit board assembly can be fully cooled, and improving the comprehensiveness and effectiveness of heat dissipation.

[0007] In one embodiment, the air intake housing includes an extended outer shell and a side shell. The extended outer shell is disposed on the outer shell assembly, and the side shell is disposed on the extended outer shell and / or the outer shell assembly. The extended outer shell and the side shell enclose the air intake space. By adopting a combined design of the extended outer shell and the side shell, the two enclose the air intake space. The extended outer shell, disposed on the outer shell assembly, directly expands the air intake port area of ​​the original heat dissipation structure, allowing outside cold air to flow in more smoothly. The enclosing design of the extended outer shell and the side shell can precisely guide the air entering the air intake space. By rationally designing the shape and angle of the two, cold air can be guided into the receiving cavity in a specific direction and path, allowing it to flow more directly through the key heat-generating areas on the circuit board assembly, maximizing heat exchange efficiency, quickly removing heat, and reducing the temperature of the heat-generating components on the circuit board.

[0008] In one embodiment, the extended housing includes a first extended housing and a second extended housing. The first extended housing is disposed on the housing assembly and connected to the side shell, while the second extended housing is disposed on the side wall of the housing assembly and connected to the first extended housing. By providing the first and second extended housings, the functionality and adaptability of the air intake housing are further optimized. The first extended housing is directly disposed on the housing assembly and connected to the side shell, forming the main framework of the air intake space, its main function being to significantly widen the lateral width of the air intake path. The second extended housing is disposed on the side wall of the housing assembly, cooperating with the first extended housing to further improve the three-dimensional structure of the air intake space, expanding the volume of the air intake space vertically. The synergistic effect of both allows the air intake space to be fully expanded in both horizontal and vertical directions, forming a three-dimensional and spacious air intake area, effectively improving the smoothness and capacity of air intake, and making the heat dissipation of the cooling system smoother and more efficient.

[0009] In one embodiment, the first extended housing and the top wall of the outer casing assembly form an obtuse angle, and the second extended housing and the side wall of the outer casing assembly form an obtuse angle. The second extended housing extends from its connection with the first extended housing to the base assembly. This structural design provides multiple practical benefits to the heat dissipation structure. The obtuse angle design effectively reduces airflow resistance. When cold air flows into the intake space, the smoothly transitioning obtuse angle structure avoids eddies and turbulence caused by right-angle turns, allowing air to flow more smoothly along the housing wall and improving the efficiency of airflow into the cavity. With the same fan power, the amount of air entering per unit time can be significantly increased, thereby enhancing the heat dissipation effect on the circuit board assembly. Furthermore, the second extended housing extending to the base assembly significantly expands the volume of the intake space, providing more ample space for cold air circulation without significantly increasing the external dimensions of the product. The first and second extended housings are integrally molded, eliminating weak points at the connection between the two housings and improving the structural strength of the intake housing.

[0010] In one embodiment, the housing assembly includes a main housing, a first connecting housing, and a second connecting housing. The first and second connecting housings are disposed on the main housing and located on both sides of the main housing. The first and second connecting housings are snapped into the base assembly, and the connection point of the first connecting housing mates with the connection point of the main housing to form an obtuse angle. By forming an obtuse angle between the connection point of the first connecting housing and the connection point of the main housing, the complex layout of various components on the circuit board assembly, with its numerous irregular protrusions, allows for precise fitting of the contours of the edge components of the circuit board assembly. This ensures a tight fit between the housing assembly and the circuit board assembly, achieving complete enclosure and protection of the circuit board within a limited space. Traditional right-angle housings require a large amount of redundant space to accommodate circuit board components, resulting in significant material waste. The obtuse angle structure optimizes space according to the actual shape of the components, minimizing unnecessary housing extension, reducing injection molding costs and processing energy consumption during production, and achieving efficient resource utilization. Simultaneously, the obtuse angle connection significantly enhances the structural strength of the housing assembly. Under the vibration of electrical operation or external impact, the obtuse angle can evenly distribute stress throughout the entire housing, preventing cracking or deformation at the connection points due to stress concentration, ensuring the stability of the housing, and thus protecting the circuit board assembly from damage. In addition, the design of the first and second connecting housings being snapped into the base assembly, combined with the obtuse angle structure, forms a stable triangular support system between the housing assembly and the base assembly, further enhancing the overall structure's resistance to deformation and seismic performance.

[0011] In one embodiment, the base assembly includes a base body and multiple support feet. These support feet are disposed on the base body, and the outer casing assembly is disposed on the base body and cooperates to form the receiving cavity. The circuit board assembly is adapted to be disposed on the base body, and the base body has the installation space. This structural design, employing a base body with multiple support feet, plays a crucial role in load-bearing, support, and space planning. The multiple support feet are evenly distributed on the base body, forming a stable multi-point support system. This design effectively distributes the weight of the upper outer casing assembly, circuit board assembly, and air intake housing, preventing deformation of the base body due to excessive localized stress. Simultaneously, the support feet can firmly support the heat dissipation structure on a flat surface, maintaining the balance and stability of the overall structure even when the appliance vibrates or is subjected to external impacts. This prevents problems such as loosening of internal components and connection failures caused by shaking, ensuring the reliable operation of the circuit board assembly. The base body, as the core load-bearing component, cooperates with the outer casing assembly to form a receiving cavity, and combined with its own installation space, provides a precisely fitted installation space for the circuit board assembly. Its surface shape and size are precisely designed to fit closely to the contours of the circuit board assembly, ensuring that the circuit board is fixed in position within the mounting space and housing cavity.

[0012] In one embodiment, the base body includes a base body and connecting protrusions. Multiple connecting protrusions are disposed on the base body and located on both sides of the base body. The housing assembly is disposed on the multiple connecting protrusions. By symmetrically distributing multiple connecting protrusions on both sides of the base body, a robust mechanical connection system is constructed. The multiple connecting protrusions tightly engage with the housing assembly, and the housing assembly is firmly fixed to the base body via a snap-fit ​​connection. This multi-point connection design effectively disperses the pressure applied by the housing assembly, improving its tensile and torsional resistance compared to single-point or few-point connections. The connecting protrusions cleverly utilize the space on both sides of the base body, achieving a stable connection with the housing assembly without significantly increasing the overall size of the base body. This allows the central area of ​​the base body to be completely preserved for supporting the circuit board assembly, providing ample installation space for the circuit board.

[0013] In one embodiment, the circuit board assembly includes a circuit board body, a heat sink, and a heating element. The circuit board body is disposed on the base assembly, the heat sink is disposed on the circuit board body, and the heating element is disposed on the circuit board body and / or the heat sink. The heat sink is located in the receiving cavity and the air intake space. The circuit board body is adapted to the mounting space, and the heat sink and the heating element are adapted to the receiving cavity. By placing the heating element on the circuit board body and / or the heat sink, this precise layout ensures that the heat generated by the heating element can be quickly conducted to the heat sink. The heat sink, located in the receiving cavity and the air intake space, is directly exposed to the flowing cold air. When outside cold air enters the receiving cavity through the air intake space, it preferentially flows through the heat sink, quickly carrying away heat and forming an efficient heat exchange process. The precise fit between the circuit board body and the mounting space of the base assembly ensures that the circuit board body can be stably mounted on the base body. The tight fit structure prevents the circuit board body from shaking within the receiving cavity, reducing the risk of loose electrical connections due to vibration. Moreover, the fit between the circuit board body and the mounting space, and between the heat sink and the heating element and the housing cavity, makes full use of the internal space formed by the base assembly and the housing assembly, avoids wasting space, and makes the entire heat dissipation structure more compact and reasonable, meeting the design requirements of miniaturization and integration of modern electrical appliances.

[0014] The second aspect of this application discloses an electrical appliance, which includes the aforementioned heat dissipation structure.

[0015] The second aspect disclosed above discloses an electrical appliance in which a heat dissipation structure is installed. The mounting space of the base component precisely matches the outer contour of the circuit board component, and the two fit together tightly like a jigsaw puzzle, completely eliminating any unnecessary gaps. The outer shell component breaks with convention, adopting a flexible, curved shape that cleverly bends and wraps around the protruding components on the circuit board component, making full use of every available space. This design maximizes the use of the internal space of the appliance. Compared with traditional structures, the overall size can be significantly reduced, freeing up more installation space for other key components, helping electrical products to develop towards miniaturization and thinness, and enhancing the product's competitiveness in the market. The air intake shell utilizes its uniquely designed air intake space, significantly increasing the air intake volume through an innovative method of expanding the cross-sectional area without changing the main size of the air duct. At the same time, the air intake shell also has excellent airflow guiding function, which can evenly guide cool air to every corner of the circuit board surface, ensuring that the circuit board component is always within a safe and stable operating temperature range. This fundamentally solves the problems of device performance degradation, shortened lifespan, or even failure caused by excessive temperature, ensuring the long-term stable operation of the appliance. Attached Figure Description

[0016] Figure 1 This is a first three-dimensional view of the heat dissipation structure;

[0017] Figure 2 This is a second perspective view of the heat dissipation structure;

[0018] Figure 3 Cross-sectional views of the housing assembly and the air inlet housing;

[0019] Figure 4 This is a first perspective view of the base assembly;

[0020] Figure 5 This is a second perspective view of the base assembly;

[0021] Figure 6 A first perspective view of the housing assembly and the air inlet housing;

[0022] Figure 7 A second perspective view of the housing assembly and the air inlet housing;

[0023] Figure 8 This is a third perspective view of the housing assembly and the air inlet housing;

[0024] Figure 9 This is a fourth perspective view of the housing assembly and the air inlet housing;

[0025] Figure 10 This is a third-dimensional view of the heat dissipation structure.

[0026] The correspondence between the reference numerals and the component names is as follows:

[0027] 1. Base assembly, 11. Base body, 111. Base main body, 112. Connecting protrusion, 12. Supporting feet, 101. Installation space;

[0028] 2. Outer shell assembly; 21. Main shell; 22. First connecting shell; 23. Second connecting shell; 201. Receiving cavity;

[0029] 3. Air inlet housing, 31. Extended outer shell, 311. First extended shell, 312. Second extended shell, 32. Side shell, 301. Air inlet space;

[0030] 4. Circuit board assembly, 41. Circuit board body, 42. Heat sink, 43. Heat-generating component. Detailed Implementation

[0031] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0032] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0033] The heat dissipation structure and electrical components of some embodiments of this utility model are described below with reference to the accompanying drawings.

[0034] Example 1

[0035] like Figures 1 to 10 As shown, this embodiment discloses a heat dissipation structure, including: a base assembly 1, which has an installation space 101; a shell assembly 2, which is disposed on the base assembly 1 and forms a receiving cavity 201 with the base assembly 1, and the installation space 101 communicates with the receiving cavity 201; an air inlet housing 3, which is disposed on the shell assembly 2 and has an air inlet space 301, which communicates with the receiving cavity 201, and the cross-sectional area of ​​the air inlet space 301 is larger than the cross-sectional area of ​​the receiving cavity 201; and a circuit board assembly 4, which is disposed on the base assembly 1 and is located within the installation space 101 and the receiving cavity 201.

[0036] This application discloses a heat dissipation structure that achieves a dual breakthrough in space utilization and heat dissipation performance through innovative design concepts. Traditional cylindrical casings, to meet airflow requirements, often reserve a large amount of redundant space around the circuit board, resulting in a bulky overall size and limited internal layout. This heat dissipation structure, however, employs a breakthrough design: the mounting space 101 of the base component 1 precisely fits the outer contour of the circuit board component 4, eliminating unnecessary gaps with a seamless design; the outer casing component 2 further utilizes a flexible, curved shape, cleverly bending and wrapping around the protruding components on the circuit board component 4, achieving maximum space utilization. This tightly fitting design completely changes the traditional, coarse casing layout, freeing up more valuable space inside the appliance, greatly improving the product's structural compactness, and powerfully promoting the development of appliances towards miniaturization and thinness. Regarding improved heat dissipation efficiency, the air intake casing 3 utilizes its uniquely designed air intake space 301 to significantly increase the air intake volume without changing the main dimensions of the airflow duct by expanding the cross-sectional area. Compared to traditional air ducts, this heat dissipation structure allows more cool air to quickly enter the receiving cavity 201, efficiently flowing over key heat-generating components such as power chips and transistors on the circuit board assembly 4, and promptly removing heat. The air intake housing 3 also functions as an airflow guide, directing airflow to evenly cover the circuit board surface, preventing localized heat accumulation, and ensuring that the circuit board assembly is always within a safe and stable operating temperature range. This fundamentally solves problems such as performance degradation and shortened lifespan caused by excessively high temperatures.

[0037] like Figure 2 and Figure 3 As shown, in addition to the features of the above embodiments, this embodiment further defines that the cross-sectional area of ​​the air intake space 301 gradually increases from the boundary between the air intake space 301 and the receiving cavity 201 in a direction away from the receiving cavity 201. This design, utilizing the gradual expansion of the cross-sectional area of ​​the air intake space 301 from the receiving cavity 201 in a direction away from the receiving cavity 201, plays a crucial role in the heat dissipation structure. From an aerodynamic perspective, the gradually expanding cross-section effectively reduces air resistance during entry. When outside air enters the air intake space 301, the airflow velocity transitions smoothly as the channel cross-section gradually expands, avoiding turbulence and eddies caused by abrupt changes in cross-section, allowing the airflow to flow more smoothly towards the receiving cavity 201 and improving the overall ventilation efficiency of the air duct. Simultaneously, this design significantly increases the contact area between the air intake space 301 and the outside air. A larger contact area means that more cold air can be drawn in, providing a sufficient cold source for the heat dissipation of the circuit board assembly 4. This large influx of cold air can quickly flow through the heat-generating elements, promptly carrying away heat and reducing the circuit board temperature. Furthermore, the gradually expanding space helps the air to diffuse initially before entering the containment cavity 201, allowing the cool air to be distributed more evenly on the surface of the circuit board, effectively reducing heat dissipation dead zones, avoiding local heat accumulation, ensuring that all parts of the circuit board assembly 4 can be fully cooled, and improving the comprehensiveness and effectiveness of heat dissipation.

[0038] like Figure 6 and Figure 8 As shown, in addition to the features of the above embodiments, this embodiment further defines: the air inlet housing 3 includes an extended outer shell 31 and a side shell 32. The extended outer shell 31 is disposed on the outer shell assembly 2, and the side shell 32 is disposed on the extended outer shell 31 and / or the outer shell assembly 2. The extended outer shell 31 and the side shell 32 enclose and form an air inlet space 301. By adopting the combined design of the extended outer shell 31 and the side shell 32, the two enclose and form the air inlet space 301. The extended outer shell 31 is disposed on the outer shell assembly 2, which directly expands the air inlet port area of ​​the original heat dissipation structure, allowing outside cold air to flow in more smoothly. The enclosing design of the extended outer shell 31 and the side shell 32 can play a precise guiding role for the air entering the air inlet space 301. By reasonably designing the shape and angle of the two, cold air can be guided into the receiving cavity 201 in a specific direction and path, so that it flows more directly through the key heat-generating area on the circuit board assembly 4, maximizing the heat exchange efficiency, quickly removing heat, and reducing the temperature of the heat-generating components on the circuit board.

[0039] like Figure 8 and Figure 9As shown, in addition to the features of the above embodiments, this embodiment further defines: the extended housing 31 includes a first extended housing 311 and a second extended housing 312. The first extended housing 311 is disposed on the housing assembly 2 and connected to the side housing 32, and the second extended housing 312 is disposed on the side wall of the housing assembly 2 and connected to the first extended housing 311. By providing the first extended housing 311 and the second extended housing 312, the functionality and adaptability of the air intake housing 3 are further optimized. The first extended housing 311 is directly disposed on the housing assembly 2 and connected to the side housing 32, forming the main frame of the air intake space 301, and its main function is to significantly widen the lateral width of the air intake path. The second extended housing 312 is disposed on the side wall of the housing assembly 2 and cooperates with the first extended housing 311 to further improve the three-dimensional structure of the air intake space 301. The second extended housing 312 expands the volume of the air intake space 301 in the vertical dimension. The combined effect of these two elements allows the air intake space 301 to be fully expanded in both the horizontal and vertical directions, forming a three-dimensional and spacious air intake area. This effectively improves the smoothness and capacity of air intake, making the heat dissipation of the cooling system smoother and more efficient.

[0040] like Figure 2 , Figure 8 and Figure 9 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the first extended housing 311 and the top wall of the outer casing assembly 2 form an obtuse angle, the second extended housing 312 and the side wall of the outer casing assembly 2 form an obtuse angle, and the second extended housing 312 extends from the connection with the first extended housing 311 to the base assembly 1. Through the above structural design, the heat dissipation structure is endowed with multiple practical values. The obtuse angle design effectively reduces airflow resistance. When outside cold air flows into the air intake space 301, the smoothly transitioning obtuse angle structure avoids eddies and turbulence caused by right-angle turns in the airflow, allowing the air to flow more smoothly along the housing wall, improving the efficiency of airflow entering the receiving cavity 201. Under the same fan power, the amount of air entering per unit time can be significantly increased, thereby enhancing the heat dissipation effect on the circuit board assembly 4. Moreover, the second extended housing 312 extends to the base assembly 1, significantly expanding the volume of the air intake space 301, providing more ample circulation space for cold air without significantly increasing the external dimensions of the product. The first extended housing 311 and the second extended housing 312 are manufactured using an integral molding process, which eliminates the weak points at the connection between the two housings and improves the structural strength of the air intake housing 3.

[0041] like Figure 2 , Figure 6 and Figure 7As shown, in addition to the features of the above embodiments, this embodiment further defines: the outer shell assembly 2 includes a main shell 21, a first connecting shell 22, and a second connecting shell 23. The first connecting shell 22 and the second connecting shell 23 are disposed on the main shell 21 and located on both sides of the main shell 21. The first connecting shell 22 and the second connecting shell 23 are snapped onto the base assembly 1. The connection point of the first connecting shell 22 and the connection point of the main shell 21 cooperate to form an obtuse angle. By forming an obtuse angle between the connection point of the first connecting shell 22 and the connection point of the main shell 21, the complex layout of various components on the circuit board assembly 4, with many irregular protrusions, allows for precise fitting of the contours of the edge components of the circuit board assembly 4, ensuring a tight fit between the outer shell assembly 2 and the circuit board assembly 4, achieving complete enclosure and protection of the circuit board within a limited space. Traditional right-angle shells require a large amount of redundant space to accommodate circuit board components, resulting in serious material waste. The obtuse angle structure optimizes space according to the actual shape of the components, minimizing unnecessary shell extension, reducing injection molding costs and processing energy consumption during production, and achieving efficient resource utilization. Meanwhile, the obtuse angle connection significantly enhances the structural strength of the housing assembly 2. Under the vibration of electrical operation or external impact, the obtuse angle can evenly distribute stress throughout the entire housing, preventing cracking or deformation at the connection due to stress concentration, ensuring the stability of the receiving cavity 201, and thus protecting the circuit board assembly 4 from damage. In addition, the design of the first connecting housing 22 and the second connecting housing being snapped into the base assembly 1, combined with the obtuse angle structure, makes the housing assembly 2 and the base assembly 1 form a stable triangular support system, further improving the overall structure's resistance to deformation and seismic performance.

[0042] like Figure 4 and Figure 5As shown, in addition to the features of the above embodiments, this embodiment further defines: the base assembly 1 includes a base body 11 and support feet 12, the number of support feet 12 is multiple, the multiple support feet 12 are disposed on the base body 11, the outer shell assembly 2 is disposed on the base body 11 and cooperates to form a receiving cavity 201, the circuit board assembly 4 is adapted to be disposed on the base body 11, and the base body 11 is provided with an installation space 101. By adopting a structural design of base body 11 with multiple support feet 12, it plays a key role in load bearing, support, and space planning. The multiple support feet 12 are evenly disposed on the base body 11 to form a stable multi-point support system. This design effectively distributes the weight of the upper outer shell assembly 2, circuit board assembly 4 and air inlet shell 3, and avoids deformation of the base body 11 due to excessive local stress. At the same time, the support feet 12 can stably support the heat dissipation structure on the plane, and even when the electrical appliance vibrates or is subjected to external force, it can maintain the balance and stability of the overall structure, prevent problems such as loosening of internal components and connection failure due to shaking, and ensure the reliable operation of circuit board assembly 4. The base body 11, as the core load-bearing component, cooperates with the outer shell assembly 2 to form a receiving cavity 201. Combined with its own mounting space 101, it provides a precisely fitted mounting space for the circuit board assembly 4. The shape and size of its surface are precisely designed to closely fit the contour of the circuit board assembly 4, ensuring that the circuit board is fixed in position within the mounting space 101 and the receiving cavity 201.

[0043] like Figure 4 and Figure 5 As shown, in addition to the features of the above embodiments, this embodiment further defines: the base body 11 includes a base main body 111 and connecting protrusions 112. There are multiple connecting protrusions 112, which are disposed on the base main body 111 and located on both sides of the base main body 111. The outer shell assembly 2 is disposed on the multiple connecting protrusions 112. By symmetrically distributing the multiple connecting protrusions 112 on both sides of the base main body 111, a stable mechanical connection system is constructed. The multiple connecting protrusions 112 and the outer shell assembly 2 are tightly fitted together, and the outer shell assembly 2 is firmly fixed to the base body 11 through a snap-fit ​​connection. This multi-point connection design effectively disperses the pressure applied by the outer shell assembly 2, and its tensile and torsional resistance is improved compared to single-point or few-point connections. The connecting protrusions 112 cleverly utilize the space on both sides of the base main body 111, achieving a stable connection with the outer shell assembly 2 without significantly increasing the overall size of the base main body 11. This allows the middle area of ​​the base main body 111 to be completely preserved for supporting the circuit board assembly 4, providing ample installation space for the circuit board.

[0044] like Figure 1 , Figure 2 and Figure 10As shown, in addition to the features of the above embodiments, this embodiment further defines: the circuit board assembly 4 includes a circuit board body 41, a heat sink 42, and a heating element 43. The circuit board body 41 is disposed on the base assembly 1, the heat sink 42 is disposed on the circuit board body 41, and the heating element 43 is disposed on the circuit board body 41 and / or the heat sink 42. The heat sink 42 is located in the receiving cavity 201 and the air inlet space 301. The circuit board body 41 is adapted to the mounting space 101, and the heat sink 42 and the heating element 43 are adapted to the receiving cavity 201. By disposing the heating element 43 on the circuit board body 41 and / or the heat sink 42, this precise layout ensures that the heat generated by the heating element 43 can be quickly conducted to the heat sink 42. The heat sink 42 is located in the receiving cavity 201 and the air inlet space 301, and is directly exposed to the flowing cold air. When outside cold air enters the receiving cavity 201 through the air inlet space 301, it will preferentially flow through the heat sink 42, quickly carrying away heat and forming an efficient heat exchange process. The circuit board body 41 is precisely fitted to the mounting space 101 of the base assembly 1, ensuring that the circuit board body 41 can be securely mounted on the base body 11. This tight fit prevents the circuit board body 41 from wobbling within the receiving cavity 201, reducing the risk of loose electrical connections due to vibration. Furthermore, the fit between the circuit board body 41 and the mounting space 101, and between the heat sink 42 and the heat-generating component 43 and the receiving cavity 201, fully utilizes the internal space formed by the base assembly 1 and the outer casing assembly 2, avoiding wasted space and making the entire heat dissipation structure more compact and efficient, meeting the miniaturization and integration requirements of modern electrical appliances.

[0045] Example 2

[0046] like Figures 1 to 10 As shown, this embodiment discloses an electrical appliance, including the above-described heat dissipation structure.

[0047] The second aspect of this application discloses an electrical appliance in which a heat dissipation structure is mounted. The mounting space 101 of the base assembly 1 precisely fits the outer contour of the circuit board assembly 4, with the two fitting together like a jigsaw puzzle, completely eliminating any gaps. The outer shell assembly 2 breaks with convention, adopting a flexible, curved shape that cleverly bends and wraps around the protruding components on the circuit board assembly 4, making full use of every available space. This design maximizes the use of the internal space of the appliance. Compared with traditional structures, the overall size can be significantly reduced, freeing up more installation space for other key components and helping electrical products to develop towards miniaturization and thinness, thereby enhancing the product's competitiveness in the market. The air intake housing 3 utilizes its uniquely designed air intake space 301, significantly increasing the air intake volume without changing the main dimensions of the air duct by innovatively expanding the cross-sectional area. At the same time, the air intake housing 3 also has excellent airflow guiding function, which can evenly guide cool air to every corner of the circuit board surface, ensuring that the circuit board assembly is always within a safe and stable operating temperature range. This fundamentally solves the problems of device performance degradation, shortened lifespan, or even failure caused by excessive temperature, ensuring the long-term stable operation of the appliance.

[0048] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A heat dissipation structure, characterized in that, The heat dissipation structure includes: A base assembly (1) having an installation space (101); A housing assembly (2) is disposed on the base assembly (1), and the housing assembly (2) and the base assembly (1) cooperate to form a receiving cavity (201), and the mounting space (101) communicates with the receiving cavity (201); An air inlet housing (3) is disposed on the outer shell assembly (2). The air inlet housing (3) is provided with an air inlet space (301). The air inlet space (301) is connected to the receiving cavity (201). The cross-sectional area of ​​the air inlet space (301) is larger than the cross-sectional area of ​​the receiving cavity (201). A circuit board assembly (4) is disposed on the base assembly (1) and is located within the mounting space (101) and the receiving cavity (201).

2. The heat dissipation structure according to claim 1, characterized in that, The cross-sectional area of ​​the air intake space (301) gradually increases from the junction of the air intake space (301) and the receiving cavity (201) toward the direction away from the receiving cavity (201).

3. The heat dissipation structure according to claim 1, characterized in that, The air inlet housing (3) includes an extended outer shell (31) and a side shell (32). The extended outer shell (31) is disposed on the housing assembly (2), and the side shell (32) is disposed on the extended outer shell (31) and the housing assembly (2). The extended outer shell (31) and the side shell (32) enclose the air inlet space (301).

4. The heat dissipation structure according to claim 3, characterized in that, The extended housing (31) includes a first extended housing (311) and a second extended housing (312). The first extended housing (311) is disposed on the housing assembly (2) and connected to the side shell (32). The second extended housing (312) is disposed on the side wall of the housing assembly (2) and connected to the first extended housing (311).

5. The heat dissipation structure according to claim 4, characterized in that, The first extended housing (311) and the top wall of the outer shell assembly (2) cooperate to form an obtuse angle, and the second extended housing (312) and the side wall of the outer shell assembly (2) cooperate to form an obtuse angle. The second extended housing (312) extends from the connection with the first extended housing (311) to the base assembly (1).

6. The heat dissipation structure according to claim 1, characterized in that, The outer shell assembly (2) includes a main shell (21), a first connecting shell (22) and a second connecting shell (23). The first connecting shell (22) and the second connecting shell (23) are disposed on the main shell (21) and located on both sides of the main shell (21). The first connecting shell (22) and the second connecting shell (23) are engaged with the base assembly (1). The connection point of the first connecting shell (22) and the connection point of the main shell (21) form an obtuse angle.

7. The heat dissipation structure according to claim 1, characterized in that, The base assembly (1) includes a base body (11) and support feet (12). There are multiple support feet (12), which are disposed on the base body (11). The outer shell assembly (2) is disposed on the base body (11) and cooperates to form the receiving cavity (201). The circuit board assembly (4) is adapted to be disposed on the base body (11). The base body (11) is provided with the mounting space (101).

8. The heat dissipation structure according to claim 7, characterized in that, The base body (11) includes a base body (111) and connecting protrusions (112). There are multiple connecting protrusions (112). The multiple connecting protrusions (112) are disposed on the base body (111) and located on both sides of the base body (111). The outer shell assembly (2) is disposed on the multiple connecting protrusions (112).

9. The heat dissipation structure according to claim 1, characterized in that, The circuit board assembly (4) includes a circuit board body (41), a heat sink (42), and a heat generator (43). The circuit board body (41) is disposed on the base assembly (1). The heat sink (42) is disposed on the circuit board body (41). The heat generator (43) is disposed on the circuit board body (41) and / or the heat sink (42). The heat sink (42) is located in the receiving cavity (201) and the air inlet space (301). The circuit board body (41) is adapted to the mounting space (101). The heat sink (42) and the heat generator (43) are adapted to the receiving cavity (201).

10. An electrical appliance, characterized in that, The electrical appliances mentioned include: The heat dissipation structure according to any one of claims 1 to 9.

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