A bracket, a light-emitting assembly and a lighting system
By setting recesses in the polarity connector and using white bracket material, the problem of insufficient brightness in existing LED lights has been solved, achieving higher light reflectivity and improved brightness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN DEREN OPTICAL CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-07-07
AI Technical Summary
The polarity connector of existing LED lights is plated with a silver layer, which results in low light reflectivity and affects brightness.
A recess is provided in the polar connector, and part of the bracket body is housed in the recess to form the bottom wall of the receiving groove. The bracket body is made of white material and combined with a white adhesive layer reflective area to improve light reflectivity.
By improving the support structure and materials, the reflectivity of light was increased, thereby increasing the brightness of the light-emitting components.
Smart Images
Figure CN224473675U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of LED light source technology, and in particular to a bracket, a light-emitting component, and a lighting system. Background Technology
[0002] LED (Light Emitting Diode) lights can emit various colors of light and are commonly used in electronic products to indicate device status. See also: Figure 1 An LED light typically includes a chip 1', a bracket 2', a light-emitting layer 3', and two polarity connectors 4'. The bracket 2' and the two polarity connectors 4' together form a groove 21', wherein the two polarity connectors 4' constitute at least part of the bottom wall 211' of the groove 21'. The chip 1' is housed in the groove 21', and the positive and negative electrodes of the chip 1' are respectively soldered to the two polarity connectors 4'. The light-emitting layer 3' is typically a mixture of colloid and phosphor, which fills the groove 21' to cover and fix the chip 1'.
[0003] During the implementation of this application embodiment, the inventors discovered that the surfaces of the two polar connectors 4' are usually plated with a silver layer. Silver has a low reflectivity to light, which can easily lead to low brightness of the LED light. Utility Model Content
[0004] The main technical problem addressed by the embodiments of this application is to provide a bracket, a light-emitting component, and an illumination system that can improve the brightness of the light-emitting component.
[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application embodiment is as follows: a bracket is provided, including a bracket body and two polar connectors. The bracket body is provided with a receiving groove and two mutually spaced through grooves, the two through grooves being disposed on the bottom wall of the receiving groove; at least a portion of one polar connector is received in one through groove, and both polar connectors are at least partially exposed in the receiving groove, the portions of the two polar connectors exposed in the receiving groove are configured to be soldered to an LED chip; the polar connector is provided with a recess, at least a portion of the bracket body is received in the recess, the portion of the bracket body received in the recess constitutes part of the bottom wall of the receiving groove, and the bracket body is white in color; one of the bracket body and the polar connector is provided with a positioning post, and the other is provided with a positioning groove, the positioning post being inserted into the positioning groove.
[0006] In some embodiments, the polar connector exposed on the surface of the receiving groove is provided with a silver plating layer, which is configured to be soldered to the LED chip.
[0007] In some embodiments, the through groove includes a first groove and a second groove. The first groove is disposed on the bottom wall of the receiving groove, and the second groove is connected to the end of the first groove away from the receiving groove. At least a portion of the polar connector passes through the second groove and is at least partially received in the first groove. Along a first direction, the projection of the second groove is located within the projection of the portion of the polar connector received in the first groove. The first direction is perpendicular to the bottom wall of the receiving groove.
[0008] In some embodiments, a polar connector exposed on a portion of the surface of the receiving groove forms a welding area, and a bracket body exposed on a portion of the surface of the receiving groove forms a reflective area. The welding area is configured for welding LED chips, and the reflective area is configured to reflect light.
[0009] In some embodiments, the reflective area is provided with a white adhesive layer.
[0010] In some embodiments, the diameter of the receiving groove gradually increases from the bottom wall of the receiving groove to the opening of the receiving groove, and the opening of the receiving groove is opposite to the bottom wall of the receiving groove.
[0011] To solve the above-mentioned technical problems, another technical solution adopted in the embodiments of this application is: to provide a light-emitting component, including an LED chip, a light-emitting layer and the above-mentioned bracket, wherein the LED chip is housed in a receiving groove, the LED chip is welded to two polarity connectors, the light-emitting layer is housed in the receiving groove, and the light-emitting layer covers the LED chip.
[0012] In some embodiments, a polar connector exposed on a portion of the surface of the receiving groove forms a welding area, a bracket body exposed on a portion of the surface of the receiving groove forms a reflective area, the welding area is configured for welding LED chips, and the reflective area is configured to reflect light; along a first direction, the LED chip covers the welding area.
[0013] In some embodiments, the light-emitting layer comprises a colloid and a phosphor, wherein the phosphor and the colloid are mixed and filled in a receiving groove.
[0014] To solve the above-mentioned technical problems, another technical solution adopted in this application embodiment is to provide a lighting system including the above-mentioned light-emitting components.
[0015] The beneficial effects of this application embodiment are as follows: Unlike the prior art, in this application embodiment, by setting a recess in the polar connector, at least a portion of the bracket body is accommodated in the recess, and the portion of the bracket body accommodated in the recess forms part of the bottom wall of the receiving groove. The bracket body is white in color, which is beneficial to improving the reflectivity of the bottom wall of the receiving groove to light, and beneficial to increasing the amount of light emitted from the groove opening to the outside, thereby improving the brightness of the light-emitting component equipped with the bracket in this application embodiment. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0017] Figure 1 This is a structural diagram of an existing LED lamp;
[0018] Figure 2 This is a schematic diagram of the support structure provided in the embodiments of this application from a first-view perspective;
[0019] Figure 3 This is an exploded structural diagram of the stent provided in the embodiments of this application;
[0020] Figure 4 This is a schematic diagram of the support structure provided in the embodiments of this application from a second perspective;
[0021] Figure 5 This is a schematic diagram of the structure of the light-emitting component provided in the embodiments of this application;
[0022] Figure 6 yes Figure 5 An enlarged view of the area shown in section A;
[0023] Figure 7 This is a schematic diagram of the structure of the light-emitting component provided in the embodiment of this utility model when a white adhesive layer is provided. Detailed Implementation
[0024] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0025] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0026] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0027] Please see Figure 2 and Figure 3 The bracket 100 includes a bracket body 1 and two polarity connectors 2. Both polarity connectors 2 are fixed to the bracket body 1 and are spaced apart from each other. Both polarity connectors 2 are used to solder to the LED chip 200 so that external power and electrical signals can be transmitted to the LED chip 200 through the two polarity connectors 2. One polarity connector 2 is used to solder to the positive electrode of the LED chip 200, and the other polarity connector 2 is used to solder to the negative electrode of the LED chip 200.
[0028] For the aforementioned support body 1, please refer to... Figure 2 , Figure 3 and Figure 5 The bracket body 1 is provided with a receiving groove 11 and two through grooves 12. The two through grooves 12 are spaced apart on the bottom wall 111 of the receiving groove 11. Two polar connectors 2 are provided on the side of the bracket body 1 away from the receiving groove 11. At least a portion of one polar connector 2 is received in one through groove 12. Both polar connectors 2 are at least partially exposed in the receiving groove 11. The portions of the two polar connectors 2 exposed in the receiving groove 11 are configured to be soldered to the LED chip 200.
[0029] In some embodiments, please refer to Figure 3 and Figure 5 The polar connector 2 is provided with a recess 22, and at least a portion of the bracket body 1 is accommodated in the recess 22. Please refer to... Figure 2The portion of the support body 1 housed within the recess 22 forms part of the bottom wall 111 of the receiving groove 11, and the support body 1 is white. Compared to the prior art method of reflection using a silver layer, since the silver layer is usually silvery-white, the reflectivity of a silvery-white object to light is less than that of a white object. Therefore, in this application, by providing a recess 22 in the polar connector 2, at least a portion of the support body 1 is housed in the recess 22, and the portion of the support body 1 housed within the recess 22 forms part of the bottom wall 111 of the receiving groove 11. This is beneficial to increase the reflectivity of the bottom wall 111 of the receiving groove 11 to light, thereby increasing the amount of light emitted from the opening of the receiving groove 11 to the outside, and improving the brightness of the light-emitting component 1000 (the relevant structure of the light-emitting component 1000 will be described later).
[0030] In some embodiments, the bracket body 1 is made of a white colloidal material. It is worth noting that silver can oxidize, and oxidation further reduces its reflectivity to light. White adhesive, on the other hand, does not oxidize significantly. Therefore, in this application, the bracket body 1 is made of a white colloidal material, which helps to further improve the reflectivity to light of the bracket body 1, thereby increasing the amount of light emitted from the opening of the receiving groove 11 to the outside, and improving the brightness of the light-emitting component 1000.
[0031] In some embodiments, please refer to Figure 3 and Figure 4 One of the bracket body 1 and the polar connector 2 is provided with a positioning post 13, and the other is provided with a positioning groove 21. At least a part of the positioning post 13 is inserted into the positioning groove 21. On the one hand, it realizes the positioning between the bracket body 1 and the polar connector 2, and on the other hand, it can increase the contact area between the bracket body 1 and the polar connector 2, which is beneficial to improving the stability of the connection between the bracket body 1 and the polar connector 2.
[0032] Furthermore, the aforementioned positioning post 13 is disposed on the bracket body 1, and the aforementioned positioning groove 21 is disposed on the polarity connector 2.
[0033] It is worth noting that there are two polar connectors 2. Correspondingly, at least two positioning posts 13 are provided on the bracket body 1. Each polar connector 2 is provided with at least one positioning groove 21. One positioning post 13 is inserted into one positioning groove 21, thereby realizing the positioning between the two polar connectors 2 and the bracket body 1.
[0034] In some embodiments, the two polar connectors 2 are made of copper.
[0035] In some embodiments, please refer to Figure 5A silver plating layer 23 is provided on the surface of the polarity connector 2 exposed in the receiving groove 11. The silver plating layer 23 is configured to be soldered to the LED chip 200, thereby realizing the soldering between the LED chip 200 and the polarity connector 2. Silver has a stronger conductivity than copper; therefore, providing a silver plating layer 23 is beneficial to improving the conductivity between the polarity connector 2 and the LED chip 200.
[0036] In some embodiments, please refer to Figure 3 and Figure 5 The through groove 12 includes a first groove 121 and a second groove 122. The first groove 121 is connected to the bottom wall 111 of the receiving groove 11. The second groove 122 is connected to the end of the first groove 121 away from the receiving groove 11, and the end of the second groove 122 away from the first groove 121 is connected to the surface of the support body 1 opposite to the receiving groove 11. After at least a portion of the polar connector 2 is inserted through the second groove 122, at least a portion of the polar connector 2 is received in the first groove 121. Along the first direction X, the projection of the second groove 122 is located within the projection of the portion of the polar connector 2 received in the first groove 121. This allows the portion of the polar connector 2 received in the through groove 12 to form a snap-fit with the through groove 12, which helps to further improve the stability of the fixation between the polar connector 2 and the support body 1 and reduces the risk of the polar connector 2 detaching from the support body 1.
[0037] In some embodiments, please refer to Figure 5 and Figure 6 Along the first direction X, the height of the bracket body 1 that forms the bottom wall 111 of the receiving groove 11 protruding from the silver plating layer 23 is D, and satisfies 0 < D ≤ 0.04 mm. If the value of D is too large, the bracket body 1 may block the side light emission of the LED chip 200, reducing the brightness of the light-emitting component 1000. Therefore, choosing 0 < D ≤ 0.04 mm helps to reduce the obstruction of the side of the LED chip 200 and improve the brightness of the light-emitting component 1000. Furthermore, if the value of D is too small (0.02 mm ≤ D ≤ 0.03 mm), the thickness of the bracket body 1 at the recess 22 will be thin, requiring higher processing precision and increasing processing difficulty, leading to increased costs. Therefore, choosing 0.02 mm ≤ D ≤ 0.03 mm can further reduce costs and further reduce the obstruction of the side of the LED chip 200, improving the brightness of the light-emitting component 1000.
[0038] In some embodiments, the support body 1 is injection molded.
[0039] In some embodiments, the diameter of the receiving groove 11 gradually increases from the bottom wall 111 to the opening of the receiving groove 11. When the LED chip 200 located on the bottom wall 111 of the receiving groove emits light, the side wall 113 of the receiving groove 11 can guide the light to be emitted from the opening in a divergent manner, which is beneficial to expanding the illumination range of the light-emitting component 1000. Furthermore, the side wall 113 of the receiving groove 11 can concentrate the light to reflect towards the opening, which is beneficial to improving the brightness.
[0040] In some embodiments, please refer to Figure 3 and Figure 5 The polar connector 2, with a portion of its surface exposed in the receiving groove 11, forms a welding area 1111. The bracket body 1, with a portion of its surface exposed in the receiving groove 111, forms a reflective area 1112. The welding area 1111 is configured for welding LED chips, and the reflective area 1112 is configured to reflect light. Therefore, when light emitted by the LED chip 200 shines on the reflective area 1112, the probability of light being reflected increases, which is beneficial for improving the brightness of the light-emitting component 1000.
[0041] In some embodiments, please refer to Figure 7 A white adhesive layer 112 is provided in the reflective area 1112, which is configured to reflect light. By providing the white adhesive layer 112, the reflectivity of the bracket body 1 to light is further improved, thereby increasing the brightness of the light-emitting component 200.
[0042] In some embodiments, the white adhesive layer 112 is formed on the reflective area 1112 by a two-color injection molding process.
[0043] In this embodiment, by providing a recess 22 in the polar connector 2, at least a portion of the bracket body 1 is accommodated in the recess 22, and the portion of the bracket body 1 accommodated in the recess 22 constitutes part of the bottom wall 111 of the receiving groove 11. The bracket body 1 is white, which is beneficial to improving the reflectivity of the bottom wall 111 of the receiving groove 11 to light, and is beneficial to increasing the amount of light emitted from the opening of the receiving groove 11 to the outside, thereby improving the brightness of the light-emitting component 1000 provided with the bracket 100 in this embodiment.
[0044] This application also provides 1000 embodiments of light-emitting components; please refer to [link / reference]. Figure 5The light-emitting component 1000 includes an LED chip 200, a light-emitting layer 300, and the aforementioned support 100. The LED chip 200 is housed in the bottom of a receiving groove 11. The positive electrode of the LED chip 200 is soldered to one polarity connector 2, and the negative electrode is soldered to the other polarity connector 2, so that the LED chip 200 can be electrically connected to other components (e.g., a circuit board) through the two polarity connectors 2, so that the circuit board can control the operation of the LED chip 200. The LED chip 200 is used to emit light. The light-emitting layer 300 is housed in the receiving groove 11 and covers the LED chip 200, thereby protecting the LED chip 200. The light-emitting layer 300 can also adjust the color temperature of the light to meet the user's requirements for the color temperature of the light.
[0045] In some embodiments, please refer to Figure 5 Along the first direction X, the LED chip 200 covers the welding area 1111, and along the first direction X, at least part of the reflective area 1112 is not covered by the LED chip. The welding area 1111 is a silver-plated layer 23, and the reflective area 1112 is white adhesive. Thus, when the LED chip 200 emits light, because the welding area 1111 is covered, light cannot reach the welding area 1111. When light reaches the reflective area 1112, the reflective area 1112 reflects the light, which helps to increase the amount of light emitted from the receiving groove 11 and improve the brightness of the light-emitting component 1000.
[0046] In some embodiments, the light-emitting layer 300 comprises a colloid and a phosphor, which are mixed and then filled into the receiving groove 11 to form the light-emitting layer 300. The phosphor, obtained from different formulations and proportions, can adjust the color temperature of the light to meet user needs, while the colloid can fix the phosphor and also fix the LED chip 200 to the bottom wall 111 of the receiving groove 11, reducing the risk of the LED chip 200 falling off.
[0047] This application also provides an embodiment of a lighting system, which includes the light-emitting component 1000 described above. For the specific structure and function of the light-emitting component 1000, please refer to the above embodiments, which will not be repeated here.
[0048] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A support, characterized in that, include: The support body is provided with a receiving groove and two mutually spaced through grooves, the two through grooves being disposed on the bottom wall of the receiving groove; Two polarity connectors are disposed on the bracket body. At least a portion of one polarity connector is received in one through groove, and at least a portion of both polarity connectors are exposed in the receiving groove. The portions of the two polarity connectors exposed in the receiving groove are configured to be soldered to an LED chip. The polar connector is provided with a recess, at least a portion of the bracket body is received in the recess, the portion of the bracket body received in the recess constitutes part of the bottom wall of the receiving groove, and the color of the bracket body is white. One of the bracket body and the polar connector is provided with a positioning post, and the other is provided with a positioning groove, wherein the positioning post is inserted into the positioning groove.
2. The bracket according to claim 1, characterized in that, The polar connector exposed on the surface of the receiving groove is provided with a silver plating layer, which is configured to be soldered to the LED chip.
3. The bracket according to claim 1, characterized in that, The through groove includes a first groove and a second groove. The first groove is disposed on the bottom wall of the receiving groove, and the second groove is connected to the end of the first groove away from the receiving groove. The polar connector is at least partially inserted through the second groove and at least partially housed in the first groove. Along a first direction, the projection of the second groove lies within the projection of the portion of the polar connector housed in the first groove. The first direction is perpendicular to the bottom wall of the receiving groove.
4. The bracket according to claim 1, characterized in that, The polar connector exposed on a portion of the surface of the receiving groove forms a welding area, the bracket body exposed on a portion of the surface of the receiving groove forms a reflective area, the welding area is configured for welding the LED chip, and the reflective area is configured to reflect light.
5. The bracket according to claim 4, characterized in that... The reflective area is provided with a white adhesive layer.
6. The bracket according to claim 1, characterized in that, The diameter of the receiving groove gradually increases from the bottom wall to the opening of the receiving groove, and the opening of the receiving groove is opposite to the bottom wall of the receiving groove.
7. A light-emitting component, characterized in that, The device includes an LED chip, a light-emitting layer, and a bracket according to any one of claims 1-6, wherein the LED chip is housed in the receiving groove, the LED chip is soldered to two of the polarity connectors, the light-emitting layer is housed in the receiving groove, and the light-emitting layer covers the LED chip.
8. The light-emitting component according to claim 7, characterized in that, The polar connector exposed on a portion of the surface of the receiving groove forms a welding area, the bracket body exposed on a portion of the surface of the receiving groove forms a reflective area, the welding area is configured for welding the LED chip, and the reflective area is configured to reflect light. Along the first direction, the LED chip covers the welding area.
9. The light-emitting component according to claim 7, characterized in that, The light-emitting layer comprises a colloid and a phosphor, wherein the phosphor and the colloid are mixed and filled in the receiving groove.
10. A lighting system, characterized in that, Includes the light-emitting component as described in any one of claims 7-9.