Solar cell horizontal plating equipment

Abstract

The utility model discloses a solar cell piece horizontal electroplating equipment, include: the upper transmission roller, lower transmission roller, upper cathode roller, lower cathode roller, upper anode lance, lower anode lance, drive mechanism and electroplating rectifier, upper cathode roller, lower cathode roller, upper anode lance and lower anode lance are made of conductive material, and lower cathode roller and lower anode lance are staggered and set, and lower transmission roller is arranged between lower cathode roller and lower anode lance, and upper anode lance is arranged above lower anode lance with interval, and upper transmission roller is arranged above lower transmission roller with interval, and upper transmission roller and upper cathode roller can contact the top surface of silicon wafer, and upper transmission roller, lower transmission roller, upper cathode roller and lower cathode roller can rotate under the drive of drive mechanism and drive silicon wafer to move from the first end of base to the second end of base. The utility model discloses silicon wafer is not easy to break.

Description

Technical Field

[0001] This utility model relates to automated equipment, and more particularly to a horizontal electroplating equipment for solar cells. Background Technology

[0002] During the manufacturing process of solar cells, a metal layer needs to be coated on the surface of the silicon wafer. Currently, low-temperature silver paste screen printing is widely used to prepare metal electrodes for solar cells. However, low-temperature paste is basically dependent on imports and is relatively expensive. In addition, heterojunction cells have silver electrodes on both sides, which increases the amount of silver paste used, making it difficult to reduce the production cost of heterojunction cells. Copper interconnect technology is a non-contact electrode preparation technology that uses the principle of electrolysis to deposit metal on the surface of the conductive layer of the silicon wafer. Base metals such as copper and nickel can be used to prepare electrodes, reducing the manufacturing cost of the cell. Currently, existing electroplating equipment requires the cathode to be connected to the silicon wafer during electroplating, such as by connecting the silicon wafer with conductive clips. However, because the silicon wafers used to manufacture solar cells are thin and fragile, the silicon wafer is easily damaged when the cathode is connected, resulting in a decrease in yield and hindering industrial production and large-scale promotion. Utility Model Content

[0003] To overcome the above-mentioned defects, this utility model provides a horizontal electroplating equipment for solar cells, which has the advantage that the silicon wafers are not easily damaged.

[0004] The technical solution adopted by this utility model to solve its technical problem is: a horizontal electroplating device for solar cells, comprising: an upper drive roller, a lower drive roller, an upper cathode roller, a lower cathode roller, an upper anode nozzle, a lower anode nozzle, a drive mechanism, and an electroplating rectifier. The upper cathode roller, lower cathode roller, upper anode nozzle, and lower anode nozzle are all made of conductive material. The lower cathode roller and lower anode nozzle are staggered, and a lower drive roller is positioned between the lower cathode roller and lower anode nozzle. The upper cathode roller is spaced above the lower cathode roller, and the upper anode nozzle is spaced above the lower anode nozzle. The rollers are positioned above the lower drive roller. The lower drive roller and the lower cathode roller can contact the bottom surface of the silicon wafer, while the upper drive roller and the upper cathode roller can contact the top surface of the silicon wafer. The upper drive roller, the lower drive roller, the upper cathode roller, and the lower cathode roller can rotate under the drive of the drive mechanism and drive the silicon wafer to move from the first end of the base to the second end of the base. The upper cathode roller and the lower cathode roller are electrically connected to the negative terminal of the electroplating rectifier, and the upper anode nozzle and the lower anode nozzle are electrically connected to the positive terminal of the electroplating rectifier. The upper anode nozzle can spray electroplating liquid onto the top surface of the silicon wafer, and the lower anode nozzle can spray electroplating liquid onto the bottom surface of the silicon wafer.

[0005] Optionally, the system also includes a base, which comprises a bottom plate, a column, and a top plate. The top plate is fixed above the bottom plate by the column. Two side frames are fixed at intervals on the top surface of the top plate. The upper drive roller, the lower drive roller, the upper cathode roller, and the lower cathode roller are rotatably connected to the two side frames by bearings. Fixing grooves are provided on the side frames, and the upper anode nozzle and the lower anode nozzle can be locked in the fixing grooves.

[0006] Optionally, a bearing seat is provided on the side wall of any of the side frames, and a drive shaft is rotatably connected to the bearing seat. A first bevel gear and a first spur gear are coaxially provided at the ends of the lower drive roller and the lower cathode roller. A second bevel gear capable of meshing with the first bevel gear is provided on the drive shaft. A second spur gear capable of meshing with the first spur gear is provided at the ends of the upper drive roller and the upper cathode roller. A first drive wheel is provided at the rotating end of the drive mechanism, and a second drive wheel is provided on the drive shaft. The first drive wheel and the second drive wheel are connected by a chain drive.

[0007] Alternatively, the drive mechanism may be a motor.

[0008] Optionally, the upper cathode roller and the lower cathode roller are provided with a mercury slip ring at the end away from the drive shaft. The upper cathode roller and the lower cathode roller are electrically connected to the negative terminal of the electroplating rectifier through the mercury slip ring. The outer peripheral walls of the upper drive roller and the upper cathode roller are flush, and the outer peripheral walls of the lower drive roller and the lower cathode roller are flush.

[0009] Alternatively, both the upper and lower drive rollers may be made of insulating material.

[0010] Optionally, the upper anode nozzle has at least one row of first nozzles on the side facing the top surface of the silicon wafer, and the lower anode nozzle has at least one row of second nozzles on the side facing the bottom surface of the silicon wafer. Both the upper and lower anode nozzles have liquid inlet holes at their ends. A water tank and a water pump are provided on the base plate. Electroplating solution is provided in the water tank. The electroplating solution in the water tank can enter the upper and lower anode nozzles through the liquid inlet holes under the drive of the water pump. The electroplating solution can be sprayed out from the first and second nozzles.

[0011] Optionally, both the upper and lower anode nozzles are made of titanium, and their outer surfaces are covered with an iridium oxide coating.

[0012] The beneficial technical effects of this utility model are as follows: The horizontal electroplating equipment for solar cells includes: an upper drive roller, a lower drive roller, an upper cathode roller, a lower cathode roller, an upper anode nozzle, a lower anode nozzle, a drive mechanism, and an electroplating rectifier. In use, the lower drive roller and the lower cathode roller support the silicon wafer, while the upper drive roller and the upper cathode roller contact the top surface of the silicon wafer. The upper cathode roller and the lower cathode roller contact the top and bottom surfaces of the silicon wafer respectively, achieving electrical connection between the silicon wafer and the negative terminal of the electroplating rectifier. Simultaneously, the upper anode nozzle and the lower anode nozzle are electrically connected for electroplating. The positive terminal of the rectifier carries a positive charge in the electroplating solution sprayed through the upper and lower anode nozzles. When this positively charged solution comes into contact with the silicon wafer electrically connected to the negative terminal of the electroplating rectifier, the metal ions in the solution are reduced to metal atoms and deposited onto the surface of the silicon wafer, achieving electroplating. During this process, the upper cathode roller distributes pressure when contacting the top surface of the silicon wafer, and the lower cathode roller distributes pressure when contacting the bottom surface. Compared to using conductive clamps to hold the silicon wafer, the silicon wafer experiences more uniform force, making it less prone to breakage. This method offers the advantage of less breakage of the silicon wafer. Attached Figure Description

[0013] Figure 1 This is a three-dimensional view of the entire machine of this utility model;

[0014] Figure 2 This is a side view of the entire machine of this utility model;

[0015] Figure 3 This is a side sectional view of the entire machine of this utility model;

[0016] Figure 4 This is a schematic diagram of the transmission structure of the upper transmission roller, lower transmission roller, upper cathode roller, first bevel gear, first spur gear, second bevel gear and second spur gear of this utility model;

[0017] Figure 5 This is a perspective view of the lower cathode roller, mercury slip ring, first bevel gear, and first spur gear of this utility model;

[0018] Figure 6 This is a schematic diagram of the upper anode nozzle of this utility model;

[0019] in:

[0020] 1. Upper drive roller; 2. Lower drive roller; 3. Upper cathode roller; 4. Lower cathode roller;

[0021] 5. Upper anode nozzle; 6. Lower anode nozzle; 7. Base; 8. Side frame; 9. Drive shaft;

[0022] 10. First bevel gear; 11. First spur gear; 12. Second bevel gear; 13. Second spur gear; 14. Motor; 15. Mercury slip ring; 16. First nozzle; 17. Water tank; 18. Water pump; 19. Liquid inlet. Detailed Implementation

[0023] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0024] This specific embodiment describes in detail the horizontal electroplating equipment for solar cells described in this application, such as... Figures 1-6As shown, the horizontal electroplating equipment for solar cells includes: an upper drive roller 1, a lower drive roller 2, an upper cathode roller 3, a lower cathode roller 4, an upper anode nozzle 5, a lower anode nozzle 6, a drive mechanism, and an electroplating rectifier. The upper cathode roller 3, lower cathode roller 4, upper anode nozzle 5, and lower anode nozzle 6 are all made of conductive material. The lower cathode roller 4 and lower anode nozzle 6 are staggered, and a lower drive roller 2 is positioned between the lower cathode roller 4 and lower anode nozzle 6 (i.e., the arrangement order of the lower drive roller 2, lower cathode roller 4, and lower anode nozzle 6 is: lower drive roller 2, lower cathode roller 4, lower drive roller 2, lower anode nozzle 6, lower drive roller 2, lower cathode roller 4, lower drive roller 2, lower anode nozzle 6, lower drive roller 2...). The upper cathode roller 3 is spaced apart... The upper anode nozzle 5 is positioned above the lower cathode roller 4, and the upper drive roller 1 is positioned above the lower drive roller 2. The lower drive roller 2 and the lower cathode roller 4 can contact the bottom surface of the silicon wafer, and the upper drive roller 1 and the upper cathode roller 3 can contact the top surface of the silicon wafer. The upper drive roller 1, the lower drive roller 2, the upper cathode roller 3, and the lower cathode roller 4 can rotate under the drive of the drive mechanism and drive the silicon wafer to move from the first end of the base 7 to the second end of the base 7. The upper cathode roller 3 and the lower cathode roller 4 are electrically connected to the negative terminal of the electroplating rectifier, and the upper anode nozzle 5 and the lower anode nozzle 6 are electrically connected to the positive terminal of the electroplating rectifier. The upper anode nozzle 5 can spray electroplating liquid onto the top surface of the silicon wafer, and the lower anode nozzle 6 can spray electroplating liquid onto the bottom surface of the silicon wafer. In use, the silicon wafer is supported by the lower drive roller 2 and the lower cathode roller 4, while the upper drive roller 1 and the upper cathode roller 3 contact the top surface of the silicon wafer. The upper cathode roller 3 and the lower cathode roller 4 contact the top and bottom surfaces of the silicon wafer respectively, thus achieving electrical connection between the silicon wafer and the negative terminal of the electroplating rectifier. At the same time, since the upper anode nozzle 5 and the lower anode nozzle 6 are electrically connected to the positive terminal of the electroplating rectifier, the electroplating solution sprayed through the upper anode nozzle 5 and the lower anode nozzle 6 carries a positive charge. When the positively charged electroplating solution comes into contact with the silicon wafer electrically connected to the negative terminal of the electroplating rectifier, the metal ions in the electroplating solution are reduced to metal atoms and deposited on the surface of the silicon wafer to achieve electroplating. During this process, the pressure is dispersed by the upper drive roller 2 when the upper cathode roller 3 contacts the top surface of the silicon wafer, and the pressure is dispersed by the lower drive roller 2 when the lower cathode roller 4 contacts the bottom surface of the silicon wafer. Compared with the method of using conductive clamps to hold the silicon wafer, the silicon wafer is subjected to more uniform force and is less prone to breakage. It has the advantage that silicon wafers are not easily damaged.

[0025] Optionally, this embodiment also includes a base 7, which includes a base plate, a column, and a top plate. The top plate is fixed above the base plate by the column. Two side frames 8 are fixed at intervals on the top surface of the top plate. The upper drive roller 1, the lower drive roller 2, the upper cathode roller 3, and the lower cathode roller 4 are rotatably connected to the two side frames 8 by bearings. The side frames 8 are provided with fixing grooves, and the upper anode nozzle 5 and the lower anode nozzle 6 can be locked in the fixing grooves.

[0026] Optionally in this embodiment, a bearing seat is provided on the side wall of any side frame 8, and a drive shaft 9 is rotatably connected to the bearing seat. A first bevel gear 10 and a first spur gear 11 are coaxially provided at the ends of the lower drive roller 2 and the lower cathode roller 4. A second bevel gear 12 that can mesh with the first bevel gear 10 is provided on the drive shaft 9. A second spur gear 13 that can mesh with the first spur gear 11 is provided at the ends of the upper drive roller 1 and the upper cathode roller 3. A first drive wheel is provided at the rotating end of the drive mechanism, and a second drive wheel is provided on the drive shaft 9. The first drive wheel and the second drive wheel are connected by a chain drive. When it is necessary to drive the upper transmission roller 1, lower transmission roller 2, upper cathode roller 3, and lower cathode roller 4 to rotate, the drive mechanism drives the first transmission wheel to rotate. The first transmission wheel drives the second transmission wheel to rotate via a chain, thereby driving the transmission shaft 9 and the second bevel gear 12 to rotate. The second bevel gear 12 drives the first bevel gear 10 and the first spur gear 11 to rotate. The first spur gear 11 drives the lower transmission roller 2 and the lower cathode roller 4 to rotate, while simultaneously driving the second spur gear 13, which meshes with itself, to rotate. The second spur gear 13 drives the upper transmission roller 1 and the upper cathode roller 3 to rotate, thereby realizing the rotation of the upper transmission roller 1, lower transmission roller 2, upper cathode roller 3, and lower cathode roller 4.

[0027] Optionally, in this embodiment, the driving mechanism is a motor 14.

[0028] Optionally in this embodiment, the upper cathode roller 3 and the lower cathode roller 4 are provided with a mercury slip ring 15 at the end away from the drive shaft 9. The upper cathode roller 3 and the lower cathode roller 4 are electrically connected to the negative terminal of the electroplating rectifier through the mercury slip ring 15. The outer peripheral walls of the upper drive roller 1 and the upper cathode roller 3 are flush, and the outer peripheral walls of the lower drive roller 2 and the lower cathode roller 4 are flush.

[0029] Optionally in this embodiment, both the upper drive roller 1 and the lower drive roller 2 are made of insulating material.

[0030] Optionally in this embodiment, the upper anode nozzle 5 has at least one row of first nozzles 16 on the side facing the top surface of the silicon wafer, and the lower anode nozzle 6 has at least one row of second nozzles on the side facing the bottom surface of the silicon wafer. Both the upper anode nozzle 5 and the lower anode nozzle 6 have liquid inlet holes 19 at their ends. A water tank 17 and a water pump 18 are provided on the bottom plate. Electroplating solution is provided in the water tank 17. The electroplating solution in the water tank 17 can enter the upper anode nozzle 5 and the lower anode nozzle 6 through the liquid inlet holes 19 under the drive of the water pump 18. The electroplating solution can be sprayed out from the first nozzles 16 and the second nozzles. The electroplating solution is drawn from the water tank 17 by the water pump 18 and sent into the upper anode nozzle 5 and the lower anode nozzle 6. It is then sprayed out through the first nozzle 16 and the second nozzle. In this embodiment, when the electroplating solution is sprayed from the first nozzle 16 and the second nozzle and comes into contact with the silicon wafer, it needs to maintain a columnar shape to ensure circuit continuity. Before production, the user needs to adjust the spray pressure of the electroplating solution to form a continuous column. The user can also record the spray pressure for future use. Therefore, the water pump 18 in this embodiment can be a commercially available model with adjustable spray pressure and real-time pressure display. In this embodiment, the width of the single row of first nozzles 16 is greater than or equal to the width of the silicon wafer, and the width of the single row of second nozzles is also greater than or equal to the width of the silicon wafer. The width of the single row of first nozzles 16 and the second nozzle is greater than the width of the silicon wafer, ensuring that the electroplating solution covers the entire silicon wafer during movement (along its length).

[0031] Optionally in this embodiment, both the upper anode nozzle 5 and the lower anode nozzle 6 are made of titanium, and their outer surfaces are covered with an iridium oxide coating. The iridium oxide coating can improve the conductivity of the upper anode nozzle 5 and the lower anode nozzle 6.

[0032] In this embodiment, the number of upper cathode rollers 3 and lower cathode rollers 4 are the same, and the number of upper anode nozzles 5 and lower anode nozzles 6 is the same. The upper cathode rollers 3, lower cathode rollers 4, upper anode nozzles 5 and lower anode nozzles 6 are located near the middle of the base 7. The number of lower drive rollers 2 is more than that of drive rollers 1. The extra lower drive rollers 2 are located on both sides of the base 7, corresponding to the inlet and outlet ends of the base 7 respectively. The lower drive rollers 2 located at the inlet and outlet ends of the base 7 are used for loading and unloading silicon wafers. In operation, the silicon wafer is first placed on the lower drive roller 2 located at the inlet end of the base 7. Then, the motor 14 drives the upper drive roller 1, lower drive roller 2, upper cathode roller 3, and lower cathode roller 4 to rotate, thereby driving the silicon wafer to move. When the silicon wafer moves to the upper cathode roller 3 and lower cathode roller 4, the upper cathode roller 3 and lower cathode roller 4 contact the silicon wafer to achieve electrical connection with the negative terminal of the electroplating rectifier. The pressure is dispersed by the upper drive roller 1 and lower drive roller 2 to prevent the silicon wafer from breaking. Then, the upper anode nozzle 5 and lower anode nozzle 6 spray positively charged electrolyte to electroplate the silicon wafer. During the movement of the silicon wafer, the upper cathode roller 3 and lower cathode roller 4 roll over the top and bottom surfaces of the silicon wafer respectively, while the electrolyte sprayed by the upper anode nozzle 5 and lower anode nozzle 6 also covers the entire silicon wafer to ensure that the entire silicon wafer can be electroplated. The silicon wafer is electroplated while moving. When the silicon wafer moves to the outlet end of the base 7, the electroplating of the entire silicon wafer is completed.

[0033] Using the horizontal electroplating equipment for solar cells in this embodiment has the advantage that the silicon wafers are not easily damaged.

Claims

1. A horizontal electroplating apparatus for solar cells, characterized in that, include: The system includes an upper drive roller (1), a lower drive roller (2), an upper cathode roller (3), a lower cathode roller (4), an upper anode nozzle (5), a lower anode nozzle (6), a drive mechanism, and an electroplating rectifier. The upper cathode roller (3), lower cathode roller (4), upper anode nozzle (5), and lower anode nozzle (6) are all made of conductive material. The lower cathode roller (4) and lower anode nozzle (6) are staggered. A lower drive roller (2) is provided between the lower cathode roller (4) and the lower anode nozzle (6). The upper cathode roller (3) is spaced above the lower cathode roller (4), and the upper anode nozzle (5) is spaced above the lower anode nozzle (6). The upper drive roller (1) is spaced above the lower drive roller (2). The lower drive roller (2) and the lower cathode roller (4) can contact the bottom surface of the silicon wafer, and the upper drive roller (1) and the upper cathode roller (3) can contact the top surface of the silicon wafer. The upper drive roller (1), the lower drive roller (2), the upper cathode roller (3) and the lower cathode roller (4) can rotate under the drive of the drive mechanism and drive the silicon wafer to move from the first end of the base (7) to the second end of the base (7). The upper cathode roller (3) and the lower cathode roller (4) are electrically connected to the negative terminal of the electroplating rectifier. The upper anode nozzle (5) and the lower anode nozzle (6) are electrically connected to the positive terminal of the electroplating rectifier. The upper anode nozzle (5) can spray electroplating liquid onto the top surface of the silicon wafer, and the lower anode nozzle (6) can spray electroplating liquid onto the bottom surface of the silicon wafer.

2. The horizontal electroplating equipment for solar cells according to claim 1, characterized in that: It also includes a base (7), which includes a base plate, a column and a top plate. The top plate is fixed above the base plate by the column. Two side frames (8) are fixed at intervals on the top surface of the top plate. The upper drive roller (1), the lower drive roller (2), the upper cathode roller (3) and the lower cathode roller (4) are rotatably connected to the two side frames (8) by bearings. The side frames (8) are provided with fixing grooves, and the upper anode nozzle (5) and the lower anode nozzle (6) can be locked in the fixing grooves.

3. The horizontal electroplating equipment for solar cells according to claim 2, characterized in that: A bearing seat is provided on the side wall of any of the side frames (8), and a drive shaft (9) is rotatably connected to the bearing seat. A first bevel gear (10) and a first spur gear (11) are coaxially provided at the ends of the lower drive roller (2) and the lower cathode roller (4). A second bevel gear (12) that can mesh with the first bevel gear (10) is provided on the drive shaft (9). A second spur gear (13) that can mesh with the first spur gear (11) is provided at the ends of the upper drive roller (1) and the upper cathode roller (3). A first drive wheel is provided at the rotating end of the drive mechanism, and a second drive wheel is provided on the drive shaft (9). The first drive wheel and the second drive wheel are connected by a chain drive.

4. The horizontal electroplating equipment for solar cells according to claim 3, characterized in that: The driving mechanism is a motor (14).

5. The horizontal electroplating equipment for solar cells according to claim 3, characterized in that: The upper cathode roller (3) and the lower cathode roller (4) are provided with a mercury slip ring (15) at the end away from the drive shaft (9). The upper cathode roller (3) and the lower cathode roller (4) are electrically connected to the negative terminal of the electroplating rectifier through the mercury slip ring (15). The outer peripheral walls of the upper drive roller (1) and the upper cathode roller (3) are flush, and the outer peripheral walls of the lower drive roller (2) and the lower cathode roller (4) are flush.

6. The horizontal electroplating equipment for solar cells according to claim 5, characterized in that: Both the upper drive roller (1) and the lower drive roller (2) are made of insulating material.

7. The horizontal electroplating equipment for solar cells according to claim 6, characterized in that: The upper anode nozzle (5) has at least one row of first nozzles (16) on the side facing the top surface of the silicon wafer, and the lower anode nozzle (6) has at least one row of second nozzles on the side facing the bottom surface of the silicon wafer. Both the upper anode nozzle (5) and the lower anode nozzle (6) have liquid inlet holes (19) at their ends. A water tank (17) and a water pump (18) are provided on the bottom plate. The water tank (17) contains electroplating solution. The electroplating solution in the water tank (17) can enter the upper anode nozzle (5) and the lower anode nozzle (6) through the liquid inlet hole (19) under the drive of the water pump (18). The electroplating solution can be sprayed out from the first nozzle (16) and the second nozzle.

8. The horizontal electroplating equipment for solar cells according to claim 7, characterized in that: Both the upper anode nozzle (5) and the lower anode nozzle (6) are made of titanium, and the outer surfaces of the upper anode nozzle (5) and the lower anode nozzle (6) are covered with an iridium oxide coating.

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