Filter package structure, multiplexer package structure and module package structure

Abstract

The utility model embodiment provides a kind of filter packaging structure, multiplexer packaging structure and module packaging structure.The filter packaging structure includes: first substrate, including opposite first surface and second surface;First conductive ring is arranged on the first surface;First conductive structure and one or more second conductive structures are arranged in the first substrate, first conductive structure is connected by second conductive structure and first conductive ring, and first conductive structure and first surface, second surface all have spacing;Conductive shell is attached on first conductive ring, and the opening of conductive shell is towards first substrate, and first conductive ring, conductive shell and first substrate jointly form closed first cavity;First filter is arranged in first cavity;Wherein, first conductive structure, second conductive structure, first conductive ring and conductive shell jointly form the shielding path of first filter.

Description

Technical Field

[0001] This utility model relates to the field of packaging structure technology, including but not limited to a filter packaging structure, a multiplexer packaging structure, and a module packaging structure. Background Technology

[0002] Packaging is the final step in completing a filter product, and the packaging method has a significant impact on the filter device. Therefore, higher requirements are placed on the packaging structure. Utility Model Content

[0003] In view of this, the present invention provides a filter packaging structure, a multiplexer packaging structure, and a module packaging structure.

[0004] In a first aspect, this utility model provides a filter packaging structure, the filter packaging structure comprising: a first substrate, including a first surface and a second surface opposite to each other; a first conductive ring disposed on the first surface; a first conductive structure and a plurality of second conductive structures disposed in the first substrate, the first conductive structure being connected to the first conductive ring through the second conductive structures, and a spacing being provided between the first conductive structure and the first surface and the second surface; a conductive shell attached to the first conductive ring, the opening of the conductive shell facing the first substrate, the first conductive ring, the conductive shell and the first substrate together forming a closed first cavity; and a first filter disposed in the first cavity; wherein the first conductive structure, the second conductive structures, the first conductive ring and the conductive shell together form a shielding path for the first filter.

[0005] In some embodiments, there is a gap between the first filter and the conductive shell.

[0006] In some embodiments, the filter packaging structure further includes: conductive adhesive disposed between the first conductive ring and the conductive shell; or, soldering agent disposed between the first conductive ring and the conductive shell.

[0007] In some embodiments, the filter packaging structure further includes: a first pad disposed on the first surface and in the first cavity; wherein the first filter is electrically connected to the first pad via solder balls, and there is a gap between the first filter and the first surface.

[0008] In some embodiments, the filter package structure further includes: a first pad disposed on the first surface and in the first cavity; wherein the first filter is electrically connected to the first pad via a lead, and the first filter is in contact with the first surface.

[0009] In some embodiments, the filter package structure further includes: a second pad disposed on the second surface; a connection structure disposed in the first substrate and passing through the first conductive structure, the connection structure having two opposing ends, one end of the connection structure being electrically connected to the first pad and the other end being electrically connected to the second pad, and the connection structure and the first conductive structure being insulated from each other.

[0010] In some embodiments, the filter packaging structure further includes a plastic encapsulation layer disposed on one side of the first substrate and covering the surface of the conductive shell.

[0011] Secondly, this utility model provides a multiplexer packaging structure, which includes: a filter packaging structure as described in the above technical solution; a second substrate, including a third surface and a fourth surface opposite to each other, the first surface and the third surface being disposed opposite to each other; a second conductive ring disposed on the third surface; a third conductive structure and a plurality of fourth conductive structures disposed in the second substrate, the third conductive structure being connected to the second conductive ring through the fourth conductive structure; a spacing between the third conductive structure and the third surface and the fourth surface; a first support structure disposed between the first substrate and the second substrate and a fifth conductive structure disposed in the first support structure, the fifth conductive structure being connected to the first conductive ring and the second conductive ring; wherein the second conductive ring, the third conductive structure, the fourth conductive structure and the fifth conductive structure together form the conductive shell; the first substrate, the first support structure and the second substrate together form a closed first cavity.

[0012] In some embodiments, the multiplexer packaging structure further includes: a second filter disposed in the first cavity and on the third surface, the second filter and the first support structure having a gap, the first filter and the second filter being disposed opposite to each other; wherein the first conductive structure and the second conductive structure disposed in the first substrate, the third conductive structure and the fourth conductive structure disposed in the second substrate, and the fifth conductive structure disposed in the first support structure together form a shielding path for the first filter and the second filter, the first filter and the second filter sharing the same shielding path.

[0013] In some embodiments, the multiplexer packaging structure further includes: a second support structure disposed between the first substrate and the second substrate, wherein the first substrate, the second support structure, and the second substrate together form a closed second cavity; the first cavity and the second cavity are disposed adjacent to each other, and a portion of the first support structure and a portion of the second support structure are shared; a second filter disposed in the second cavity and on the first surface, or a second filter disposed in the second cavity and on the third surface; wherein there is a gap between the second filter and the second support structure, and the conductive structure disposed in the first substrate, the conductive structure disposed in the second support structure, and the conductive structure disposed in the second substrate together form a shielding path for the second filter, wherein the first filter and the second filter use different shielding paths.

[0014] Thirdly, the present invention provides a module packaging structure, the module packaging structure including: a filter packaging structure as described in the first aspect above; or a multiplexer packaging structure as described in the second aspect above.

[0015] This invention provides a filter packaging structure, a multiplexer packaging structure, and a module packaging structure. In this embodiment, a first conductive ring, a conductive shell, and a first substrate together form a closed first cavity to encapsulate a first filter disposed in the first cavity in a closed mode, thereby solving the basic packaging problems of the first filter, such as damage caused by external moisture intrusion into the filter packaging structure or external pressure. The first conductive structure, the second conductive structure, the first conductive ring, and the conductive shell together form a shielding path for the first filter to reduce external interference to the first filter and improve the signal attenuation problem of the first filter. Attached Figure Description

[0016] Figure 1 Cross-sectional schematic diagrams of the packaging structure provided for some examples;

[0017] Figure 2 Cross-sectional schematic diagrams of the packaging structure are provided for other examples;

[0018] Figure 3 This is a cross-sectional schematic diagram of the filter packaging structure provided in some embodiments of the present invention;

[0019] Figure 4 A cross-sectional schematic diagram of the filter packaging structure provided in some other embodiments of this utility model;

[0020] Figure 5 This is a cross-sectional schematic diagram of the multiplexer packaging structure provided in some embodiments of the present invention;

[0021] Figure 6Cross-sectional schematic diagram of the module packaging structure provided in some embodiments of this utility model Figure 1 ;

[0022] Figure 7 Cross-sectional schematic diagram of the module packaging structure provided in some embodiments of this utility model Figure 2 ;

[0023] Figures 8 to 11 A cross-sectional schematic diagram of the filter packaging structure provided in some embodiments of this utility model during the manufacturing process;

[0024] Figures 12 to 15 A cross-sectional schematic diagram of the filter packaging structure provided in some other embodiments of this utility model during the manufacturing process;

[0025] Figures 16 to 19 This is a cross-sectional schematic diagram of the multiplexer packaging structure provided in some embodiments of the present invention during the manufacturing process. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments and accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, to avoid confusion with the present invention, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0028] In the accompanying drawings, for clarity, the dimensions of layers, areas, and elements, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0029] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this utility model, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And when a second element, component, area, layer, or portion is discussed, it does not imply that the first element, component, area, layer, or portion necessarily exists in this utility model.

[0030] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below,” “under,” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0031] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0032] To fully understand this utility model, detailed steps and structures will be presented in the following description to illustrate the technical solution of this utility model. Preferred embodiments of this utility model are described in detail below; however, in addition to these detailed descriptions, this utility model may have other embodiments.

[0033] Here, we first define the various directions that may be mentioned below. In the plane containing the substrate, we define the intersecting X and Y directions, and define the direction perpendicular to the substrate as the Z direction. In some embodiments, the X and Y directions can form a right angle, an acute angle, or an obtuse angle. The following explanation will use the example where any two of the X, Y, and Z directions are perpendicular to each other.

[0034] refer to Figure 1 , Figure 1 Cross-sectional schematic diagrams of the packaging structures provided for some examples. For example... Figure 1 As shown, the package structure 100 includes: a substrate 102; a chip 104 disposed on the substrate 102; solder balls 106 disposed between the substrate 102 and the chip 104; and a molding compound 108 disposed on the substrate 102 and covering the substrate 102 and the chip 104; wherein the chip 104 can lead out electrical signals through the solder balls 106 and the conductive structure disposed in the substrate 102.

[0035] In the above technical solution, on the one hand, the packaging structure 100 lacks any anti-intrusion structure. During the molding process, the molding layer may penetrate into the space enclosed by the chip 104, solder balls 106, and substrate 102 through the gap between the chip 104 and substrate 102, causing damage to the chip 104 and affecting its electrical performance. On the other hand, the packaging structure 100 lacks any anti-shielding structure, resulting in severe signal attenuation of the chip 104. It should be noted that filter products are widely used in automotive, radar, communication systems, and navigation remote sensing equipment technologies. Electromagnetic interference may degrade the performance of filter products. For example, due to electromagnetic interference, when the signal from a filter product propagates in the transmission medium, some energy may be converted into heat or absorbed by the transmission medium, causing the signal strength to continuously weaken and affecting the yield of the filter product.

[0036] refer to Figure 2 , Figure 2 Cross-sectional schematic diagrams of the packaging structures provided for other examples. For example... Figure 2 As shown, the package structure 200 includes: a substrate 202; a chip 204 disposed on the substrate 202; solder balls 206 disposed between the substrate 202 and the chip 204; and a molding compound 208 disposed on the substrate 202, the molding compound 208 covering the sidewalls of the chip 204 and exposing the top surface of the chip 204 that is relatively far away from the substrate 202.

[0037] In the above technical solution, because the chip 204 is relatively small and the substrate 202 is relatively large, the area outside the chip 204 is relatively large. During the process of forming the molding layer 208 using, for example, resin material, the resin material will flow to areas outside the chip 204, resulting in the top surface of the chip 204 being exposed after the packaging process is completed. In addition, no anti-shielding structure is provided in the packaging structure 200, resulting in severe signal attenuation of the chip 204.

[0038] In view of this, in order to solve at least one of the above-mentioned technical problems, this utility model provides a filter packaging structure, a multiplexer packaging structure, and a module packaging structure.

[0039] refer to Figure 3 , Figure 3 This is a cross-sectional schematic diagram of a filter packaging structure provided for some embodiments of the present invention. For example... Figure 3 As shown, in a first aspect, this utility model provides a filter packaging structure 300, which includes: a first substrate 302, including a first surface 302a and a second surface 302b opposite to each other along the Z direction; a first conductive ring 304 disposed on the first surface 302a; a first conductive structure 306 and a plurality of second conductive structures 308 disposed in the first substrate 302, wherein the first conductive structure 306 is connected to the first conductive ring 304 through the second conductive structures 308, and the first conductive structure 306 and the first surface 302a are connected to each other. There is a gap between surfaces 302a and 302b; a conductive shell 312 is attached to the first conductive ring 304, with the opening of the conductive shell 312 facing the first substrate 302; the first conductive ring 304, the conductive shell 312 and the first substrate 302 together form a closed first cavity 316; a first filter 318 is disposed in the first cavity 316; wherein, the first conductive structure 306, the second conductive structure 308, the first conductive ring 304 and the conductive shell 312 together form a shielding path for the first filter 318.

[0040] Here, the first substrate 302 can be, for example, a printed circuit board (PCB).

[0041] Here, the first conductive ring 304 is in contact with the first surface 302a. The orthographic projection of the first conductive ring 304 onto the XY plane is a ring shape, such as a circular ring, a square ring, or other ring shapes.

[0042] Here, the first conductive structure 306 and the first surface 302a are not in contact, and the first conductive structure 306 and the second surface 302b are also not in contact. In some embodiments, the first conductive structure 306 may be parallel or non-parallel to the first surface 302a (or the second surface 302b). The orthographic projection shape of the first conductive structure 306 on the XY plane can be circular, elliptical, square, or other irregular shapes, and this utility model does not have any special limitation in this regard. It should be noted that the first conductive structure 306 may include multiple (or multiple layers) first sub-conductive structures, and the multiple first sub-conductive structures are arranged along the Z direction. This disclosure does not have any special limitation on the number of first sub-conductive structures included in the first conductive structure 306. Figure 3 The diagram illustrates that the first conductive structure 306 is a single layer for illustrative purposes only.

[0043] Here, the second conductive structure 308 is in contact with the first surface 302a, that is, the second conductive structure 308 is in contact with the first conductive ring 304 disposed on the first surface 302a. The second conductive structure 308 may or may not be in contact with the second surface 302b. In some embodiments, the second conductive structure 308 may be perpendicular to or not perpendicular to the first substrate 302. The second conductive structure 308 may be a conductive post. It should be noted that the second conductive structure 308 may include a plurality of second sub-conductive structures, which are arranged along the Z direction, and any adjacent first sub-conductive structures can be connected through at least one second sub-conductive structure. This disclosure does not impose a special limitation on the number of second sub-conductive structures included in the second conductive structure 308. Figure 3 The diagram illustrates that the second conductive structure 308 consists of two layers for illustrative purposes only. One end of the second sub-conductive structure is in contact with the first conductive ring, and the other end is in contact with the first conductive structure 306. One end of the other second sub-conductive structure is connected to the third pad 310, and the other end is in contact with the first conductive structure 306.

[0044] Here, the conductive shell 312 may include a first portion and a second portion disposed between the first portion and the first substrate 302. The first portion and the second portion of the conductive shell 312 are in contact with each other. The first portion of the conductive shell 312 and the first substrate 302 are disposed opposite each other along the Z direction. The orthographic projection shape of the second portion of the conductive shell 312 on the XY plane is annular. The conductive shell 312 may include an inner surface facing the first cavity 316 and an outer surface facing away from the first cavity 316.

[0045] Here, the first filter 318 may include a surface acoustic wave (SAW) filter and a bulk acoustic wave (BAW) filter. The BAW filter may also include, for example, a film bulk acoustic resonator (FBAR) and a solid mounted resonator (SMR).

[0046] In this embodiment of the invention, the first conductive ring 304, the conductive shell 312, and the first substrate 302 together form a closed first cavity 316 to encapsulate the first filter 318 disposed in the first cavity 316. This not only solves the problem of external moisture or liquids intruding into the filter encapsulation structure 300 and causing damage to the first filter 318, but also prevents the molding layer 326 from seeping into the space enclosed by the first filter 318, the first solder ball 324, and the first surface 302a through the gap between the first filter 318 and the first surface 302a during the molding process, thus affecting the electrical performance of the first filter 318. Furthermore, the first conductive structure 306, the second conductive structure 308, the first conductive ring 304, and the conductive shell 312 together form a shielding path for the first filter 318, achieving a shielding effect on the first filter 318, thereby reducing external interference to the first filter 318 and improving the signal attenuation problem of the first filter 318.

[0047] In some embodiments, the filter package structure 300 further includes: a first pad 320 disposed on the first surface 302a and in the first cavity 316; a second pad 322 disposed on the second surface 302b; and a first connection structure disposed in the first substrate 302 and passing through the first conductive structure 306. The first connection structure includes two ends opposite each other along the Z direction, one end of the first connection structure is electrically connected to the first pad 320 and the other end is electrically connected to the second pad 322, and the first connection structure and the first conductive structure 306 are insulated from each other. It should be noted that... Figure 3 The diagram shows that the first pad 320 and the second pad 322 are superimposed on the orthographic projection of the XY plane. This is for illustrative purposes only. The second pad 322 can be a pad located at any position on the second surface 302b.

[0048] Here, the first connection structure can be, for example, a conductive structure that penetrates the first substrate 302 along the Z direction, similar to a through-silicon via (TSV). The orthographic projection of the first connection structure in the XY plane and the orthographic projection of the first conductive structure 306 in the XY plane can be staggered. In some embodiments, a through-hole can be formed in the first conductive structure 306, and the first connection structure can pass through the through-hole in the first conductive structure 306.

[0049] In some embodiments, the first filter 318 may be disposed upright within the first cavity 316. Here, the filter package structure 300 further includes: the first filter 318 is electrically connected to the first pad 320 via a first lead, and the first filter 318 is in contact with the first surface 302a. Thus, the first filter 318 can sequentially lead electrical signals out of the filter package structure 300 via the first lead, the first pad 320, the first connection structure, and the second pad 322.

[0050] In other embodiments, reference is made to... Figure 3 As shown, the first filter 318 can be disposed in the first cavity 316 in a flip-chip configuration. Here, the filter package structure 300 further includes: the first filter 318 can be electrically connected to the first solder ball 324 and the first pad 320, and there is a gap between the first filter 318 and the first surface 302a. Thus, the first filter 318 can sequentially lead electrical signals out of the filter package structure 300 through the first solder ball 324, the first pad 320, the first connection structure, and the second pad 322.

[0051] In some embodiments, the material of the first solder ball 324 may include metals such as gold and tin, or lead-tin alloys, lead-free solder, silver-based solder, or other special alloys.

[0052] In some embodiments, the filter package structure 300 further includes a third pad 310 disposed on the second surface 302b. The second conductive structure 308 may include two second sub-conductive structures. One end of one second sub-conductive structure is in contact with the first conductive ring 304, and the other end is in contact with the first conductive structure 306. One end of the other second sub-conductive structure is in contact with the third pad 310, and the other end is in contact with the first conductive structure 306. The axes of the two second sub-conductive structures may coincide to form the second conductive structure 308. The second conductive structure 308 may penetrate the first substrate 302 along the Z direction. One end of the second conductive structure 308 is exposed on the first surface 302a, and the other end of the second conductive structure 308 is exposed on the second surface 302b.

[0053] In some embodiments, there is a gap between the first filter 318 and the conductive shell 312. Here, the first part of the conductive shell 312 and the top surface of the first filter 318 are disposed opposite each other along the Z direction, and the second part of the conductive shell 312 surrounds the sidewall of the first filter 318. Neither the sidewall nor the top surface of the first filter 318 is in contact with the conductive shell 312.

[0054] In some embodiments, the filter packaging structure 300 further includes a molding compound 326 disposed on one side of the first substrate 302 and covering the surface of the conductive shell 312. Here, the molding compound 326 may include a resin material, such as epoxy resin, polyimide, or other thermoplastic resins and thermosetting resins. The molding compound 326 covers the outer surface of the conductive shell 312 and the portion of the first conductive ring 304 exposed outside the first cavity 316. The molding compound 326 prevents moisture ingress, ensures structural reliability, increases thickness, and provides assurance for marking.

[0055] In some embodiments, the materials of the first conductive ring 304, the first conductive structure 306, the second conductive structure 308, the third pad 310, the conductive shell 312, the first pad 320, and the second pad 322 may include conductive materials, such as metallic materials, such as copper or silver. In some embodiments, the first conductive ring 304 and the first pad 320 may be formed in the same manufacturing process, and the materials of the first conductive ring 304 and the first pad 320 may be the same. In some embodiments, the third pad 310 and the second pad 322 may be formed in the same manufacturing process, and the materials of the third pad 310 and the second pad 322 may be the same.

[0056] In this embodiment of the invention, no additional conductive adhesive or soldering agent is introduced between the conductive shell 312 and the first conductive ring 304. The fixed connection between the conductive shell 312 and the first conductive ring 304 relies on the molding layer 326. Utilizing the fluidity of the resin material during heating, the resin material contacts the outer surface of the conductive shell 312 and the exposed surfaces of the first conductive ring 304 and the first substrate 302 outside the first cavity 316, thereby fixing the relative positional relationship between the conductive shell 312 and the first conductive ring 304.

[0057] refer to Figure 4 , Figure 4 This is a cross-sectional schematic diagram of a filter packaging structure provided for other embodiments of the present invention. For example... Figure 4As shown, in a first aspect, this utility model provides a filter packaging structure 400, which includes: a first substrate 402 (including a first surface 402a and a second surface 402b), a first conductive ring 404, a first conductive structure 406, a second conductive structure 408, a third pad 410, a conductive shell 412, a first cavity 416, a first filter 418, a first pad 420, a second pad 422, a first solder ball 424, and a molding compound 426. Here, the relevant descriptions of the above structures in the filter packaging structure 400 can be found by referring to... Figure 3 The relevant statements will not be repeated here.

[0058] In some embodiments, the filter packaging structure 400 further includes: conductive adhesive 414 disposed between the first conductive ring 404 and the conductive shell 412; or, soldering agent disposed between the first conductive ring 404 and the conductive shell 412.

[0059] Here, conductive adhesive 414 can be used to connect the first conductive ring 404 and the conductive shell 412, and solder can be used to solder the first conductive ring 404 and the conductive shell 412. Further, conductive adhesive 414 (or solder) can also be part of the first cavity 416, with the first conductive ring 404, conductive adhesive 414 (or solder), conductive shell 412, and first substrate 402 together forming a closed first cavity 416. Further, the first conductive structure 406, the second conductive structure 408, the first conductive ring 404, conductive adhesive 414 (or solder), and conductive shell 412 together form a shielding path for the first filter 418.

[0060] refer to Figure 5 , Figure 5 This is a cross-sectional schematic diagram of a multiplexer packaging structure provided for some embodiments of the present invention. For example... Figure 5 As shown, in a second aspect, embodiments of the present invention provide a multiplexer packaging structure 500, which includes: a filter packaging structure as described in the above technical solutions, for example... Figure 3 The illustrated filter package structure is 300 or Figure 4 The schematic diagram shows a filter package structure 400. This multiplexer package structure 500 includes: a first substrate 502, including a first surface 502a and a second surface 502b opposite to each other along the Z direction; a first conductive ring 504 disposed on the first surface 502a; a first conductive structure 506 and a plurality of second conductive structures 508 disposed in the first substrate 502, wherein the first conductive structure 506 is connected to the first conductive ring 504 through the second conductive structures 508, and a spacing is provided between the first conductive structure 506 and the first surface 502a and the second surface 502b.

[0061] In this embodiment of the present invention, the multiplexer packaging structure 500 further includes: a second substrate 528, including a third surface 528a and a fourth surface 528b opposite to each other along the Z direction, wherein the first surface 502a and the third surface 528a are disposed opposite to each other along the Z direction, that is, the first surface 502a and the third surface 528a are disposed between the second surface 502b and the fourth surface 528b. A second conductive ring 530 is disposed on the third surface 528a; a third conductive structure 532 and a plurality of fourth conductive structures 534 are disposed in the second substrate 528, the third conductive structure 532 being connected to the second conductive ring 530 through the fourth conductive structures 534; a gap is provided between the third conductive structure 532 and the third surface 528a and the fourth surface 528b; a first support structure 538 is disposed between the first substrate 502 and the second substrate 528, and a fifth conductive structure 540 is disposed in the first support structure 538, the fifth conductive structure 540 including two opposite ends along the Z direction, one end of the fifth conductive structure 540 being connected to the first conductive ring 504 and the other end of the fifth conductive structure 540 being connected to the second conductive ring 530; wherein, the first conductive ring 504, the third conductive structure 532, the fourth conductive structure 534 and the fifth conductive structure 540 together form a conductive shell; the first substrate 502, the first support structure 538 and the second substrate 528 together form a closed first cavity 516.

[0062] Here, the relevant descriptions of the first substrate 502, the first conductive ring 504, the first conductive structure 506, the second conductive structure 508, the first cavity 516, and the first filter 518 can all be found by referring to [the relevant documentation]. Figure 3 The relevant statements will not be repeated here.

[0063] Here, the second substrate 528 can be, for example, a PCB.

[0064] Here, the second conductive ring 530 is in contact with the third surface 528a. The orthographic projection of the second conductive ring 530 onto the XY plane is annular, such as a circular ring, a square ring, or other ring shapes. In some embodiments, the dimensions of the first conductive ring 504 and the second conductive ring 530 may be the same or different. In some embodiments, the fifth conductive structure 540 in the first support structure 538 may be perpendicular or not perpendicular to the first surface 502a (or the third surface 528a).

[0065] Here, the third conductive structure 532 and the third surface 528a are not in contact, nor are the third conductive structure 532 and the fourth surface 528b. In some embodiments, the third conductive structure 532 may be parallel or non-parallel to the third surface 528a (or the fourth surface 528b). The orthographic projection shape of the third conductive structure 532 on the XY plane can be circular, elliptical, square, or other irregular shapes, and this invention does not impose any particular limitation on this. It should be noted that the third conductive structure 532 may include multiple (or multiple layers) first sub-conductive structures, and the multiple third sub-conductive structures are arranged along the Z direction. This disclosure does not impose any particular limitation on the number of third sub-conductive structures included in the third conductive structure 532. Figure 5 The third conductive structure 532 is shown as a single layer for illustrative purposes only.

[0066] Here, the fourth conductive structure 534 is in contact with the third surface 528a, that is, the fourth conductive structure 534 is in contact with the second conductive ring 530 disposed on the third surface 528a. The fourth conductive structure 534 may or may not be in contact with the fourth surface 528b. In some embodiments, the fourth conductive structure 534 may be perpendicular to or not perpendicular to the second substrate 528. The fourth conductive structure 534 may be a conductive post. It should be noted that the fourth conductive structure 534 may include a plurality of fourth sub-conductive structures, which are arranged along the Z direction, and any adjacent fourth sub-conductive structures can be connected through at least one fourth sub-conductive structure. This disclosure does not have a special limitation on the number of fourth sub-conductive structures included in the fourth conductive structure 534. Figure 5 The diagram illustrates that the fourth conductive structure 534 consists of two layers for illustrative purposes only. One end of the fourth sub-conductive structure is in contact with the second conductive ring, and the other end is in contact with the third conductive structure 532. One end of the other fourth sub-conductive structure is connected to the fourth pad 536, and the other end is in contact with the third conductive structure 532.

[0067] In some embodiments, the first support structure 538 may include: a third substrate, the third substrate including a fifth surface and a sixth surface opposite to each other along the Z direction; a fifth conductive structure 540 penetrating the third substrate along the Z direction, one end of the fifth conductive structure 540 exposed on the fifth surface, the other end of the fifth conductive structure 540 exposed on the sixth surface, the orthographic projection shape of the fifth conductive structure 540 on the XY plane being annular, such as a circular ring, a square ring, or other shaped ring; a fifth pad 542 disposed on the fifth surface and a sixth pad 544 disposed on the sixth surface, one end of the fifth conductive structure 540 contacting the fifth pad 542, and the other end of the fifth conductive structure 540 contacting the sixth pad 544. Further, the first conductive ring 504, the second conductive ring 530, the third conductive structure 532, the fourth conductive structure 534, the fifth conductive structure 540, the fifth pad 542, and the sixth pad 544 together form a conductive shell. Furthermore, the first substrate 502, the first support structure 538, the second substrate 528, the fifth pad 542, and the sixth pad 544 together form a closed first cavity 516.

[0068] In some embodiments, the multiplexer package structure 500 further includes a third pad 510 disposed on the second surface 502b. Figure 5 The second conductive structure 508 is illustrated to include two second sub-conductive structures. One end of one second sub-conductive structure is in contact with the first conductive ring 504 and the other end is in contact with the first conductive structure 506. One end of the other second sub-conductive structure is in contact with the third pad 510 and the other end is in contact with the first conductive structure 506.

[0069] In some embodiments, the multiplexer package structure 500 further includes a fourth pad 536 disposed on the fourth surface 528b. Figure 5 The fourth conductive structure 534 is illustrated to include two fourth sub-conductive structures. One end of one fourth sub-conductive structure is in contact with the second conductive ring 530 and the other end is in contact with the third conductive structure 532. The other fourth sub-conductive structure is in contact with the fourth pad 536 and the other end is in contact with the third conductive structure 532.

[0070] In the multiplexer packaging structure of this embodiment, the first substrate 502 and the second substrate 528 can be the same substrate. Of course, "the first substrate 502 and the second substrate 528 are the same substrate" means that the first substrate 502 and the second substrate 528 have the same structure, not that the first substrate 502 and the second substrate 528 are the same substrate. Any conductive structure extending in any direction perpendicular to the Z-direction in the first substrate 502 can be called a first conductive structure 506, and any conductive structure extending in the Z-direction can be called a second conductive structure 508; any conductive structure extending in any direction perpendicular to the Z-direction in the second substrate 528 can be called a third conductive structure 532, and any conductive structure extending in the Z-direction can be called a fourth conductive structure 534.

[0071] In some embodiments, the multiplexer package structure 500 further includes a second filter disposed in the first cavity 516 and on the third surface 528a, with a gap between the second filter and the first support structure 538, and the first filter 518 and the second filter being disposed opposite each other along the Z direction; wherein, the first conductive structure 506 and the second conductive structure 508 disposed in the first substrate 502, the third conductive structure 532 and the fourth conductive structure 534 disposed in the second substrate 528, and the fifth conductive structure 540 disposed in the first support structure 538 together form a shielding path for the first filter 518 and the second filter, and the first filter 518 and the second filter share the same shielding path. That is, both the first filter 518 and the second filter are disposed in the first cavity 516, and both the first filter 518 and the second filter share the same shielding path.

[0072] Here, the second filter may include active or passive filters such as SAW filters, BAW filters, or integrated passive device (IPD) filters. BAW filters may also include, for example, FBAR and SMR.

[0073] In some embodiments, the multiplexer package structure 500 further includes a third conductive ring 546 disposed on the first surface 502a, the third conductive ring 546 being in contact with the first surface 502a. The orthographic projection shape of the third conductive ring 546 on the XY plane is annular, such as a circular ring, a square ring, or other shaped rings.

[0074] In some embodiments, a portion of the first conductive ring 504 and a portion of the third conductive ring 546 disposed on the first surface 502a can be shared, that is, a portion of the structure on the first surface 502a can belong to both the first conductive ring 504 and the third conductive ring 546. In this way, the area occupied by the multiplexer package structure 500 in the XY plane can be reduced.

[0075] In some embodiments, the multiplexer package structure 500 further includes a seventh pad 550 disposed on the second surface 502b. It should be noted that the first substrate 502 is provided with a plurality of second conductive structures 508, some of which have their ends disposed opposite to each other along the Z direction in contact with the first conductive ring 504 and the first conductive structure 506, respectively; and some of which have their ends disposed opposite to each other along the Z direction in contact with the third conductive ring 546 and the first conductive structure 506, respectively.

[0076] In some embodiments, the multiplexer package structure 500 further includes a fourth conductive ring 552 disposed on the third surface 528a, the fourth conductive ring 552 being in contact with the third surface 528a. The orthographic projection shape of the fourth conductive ring 552 on the XY plane is annular, such as a circular ring, a square ring, or other ring shapes.

[0077] In some embodiments, a portion of the second conductive ring 530 and a portion of the fourth conductive ring 552 disposed on the third surface 528a can be shared, meaning that a portion of the structure on the third surface 528a can belong to both the second conductive ring 530 and the fourth conductive ring 552. This reduces the area occupied by the multiplexer package structure 500 in the XY plane.

[0078] In some embodiments, the multiplexer package structure 500 further includes an eighth pad 556 disposed on the fourth surface 528b. It should be noted that the second substrate 528 is provided with a plurality of fourth conductive structures 534, some of which have their ends disposed opposite to each other along the Z direction in contact with the second conductive ring 530 and the third conductive structure 532 respectively, while others have their ends disposed opposite to each other along the Z direction in contact with the fourth conductive ring 552 and the third conductive structure 532 respectively.

[0079] In some embodiments, the multiplexer package structure 500 further includes: a second support structure 558 disposed between a first substrate 502 and a second substrate 528, wherein the first substrate 502, the second support structure 558, and the second substrate 528 together form a closed second cavity 566; the first cavity 516 and the second cavity 566 are disposed adjacent to each other, and a portion of the first support structure 538 and a portion of the second support structure 558 are shared; a second filter disposed in the second cavity 566 and on the first surface 502a, or a second filter 568 disposed in the second cavity 566 and on the third surface 528a; wherein there is a gap between the second filter 568 and the second support structure 558, and the conductive structure disposed in the first substrate 502, the conductive structure disposed in the second support structure 558, and the conductive structure disposed in the second substrate 528 together form a shielding path for the second filter 568, and the first filter 518 and the second filter 568 use different shielding paths.

[0080] In some embodiments, the second support structure 558 may include: a third substrate, the third substrate including a fifth surface and a sixth surface opposite to each other along the Z direction; a sixth conductive structure 560 penetrating the third substrate along the Z direction, one end of the sixth conductive structure 560 exposed on the fifth surface, the other end of the sixth conductive structure 560 exposed on the sixth surface, the orthographic projection shape of the sixth conductive structure 560 on the XY plane being annular, such as a circular ring, a square ring, or other shaped ring; a ninth pad 562 disposed on the fifth surface and a tenth pad 564 disposed on the sixth surface, one end of the sixth conductive structure 560 contacting the ninth pad 562, and the other end of the sixth conductive structure 560 contacting the tenth pad 564. Further, the third conductive ring 546, the third conductive structure 532, the fourth conductive structure 534, the sixth conductive structure 560, the ninth pad 562, and the tenth pad 564 together form a conductive shell. Furthermore, the first substrate 502, the second support structure 558, the second substrate 528, the ninth pad 562, and the tenth pad 564 together form a closed second cavity 566. That is to say, the fifth conductive structure 540 and the sixth conductive structure 560 are arranged adjacent to each other, and a portion of the fifth conductive structure 540 and a portion of the sixth conductive structure 560 can be shared. In other words, a portion of the conductive structure provided in the third substrate can belong to both the fifth conductive structure 540 and the sixth conductive structure 560.

[0081] Here, the second filter can be disposed in the first cavity 516 and on the third surface 528a; alternatively, the second filter 568 can also be disposed in the second cavity 566 and on the third surface 528a; or alternatively, the second filter can also be disposed in the second cavity 566 and on the first surface 502a. In some embodiments, the second filter 568 can be disposed upright in the first cavity 316 or the second cavity 566. In other embodiments, the second filter 568 can be disposed in the first cavity 316 or the second cavity 566 in an inverted manner. (See reference...) Figure 5 As shown, the second filter 568 can be coupled to the eleventh pad 570 on the third surface 528a via the second solder ball 574, and the eleventh pad 570 can be coupled to the twelfth pad 572 on the fourth surface 528b via the second connection structure. The second connection structure and the third conductive structure 532 are insulated from each other.

[0082] In this embodiment of the invention, the first substrate 502, the first conductive ring 504, the first support structure 538, the second conductive ring 530, and the second substrate 528 together form a closed first cavity 516 to encapsulate the first filter 518 disposed in the first cavity 516 in a closed mode. This solves the problem of damage to the first filter 518 caused by external moisture or liquids entering the filter multiplexer encapsulation structure 500. Similarly, the first substrate 502, the third conductive ring 546, the second support structure 558, the fourth conductive ring 552, and the second substrate 528 together form a closed first cavity 516 to encapsulate the second filter 568 disposed in the first cavity 516 in a closed mode. This solves the problem of damage to the second filter 568 caused by external moisture or liquids entering the multiplexer encapsulation structure 500. The first cavity 516 and the second cavity 566 are two independent cavities, respectively encapsulating the first filter 518 and the second filter 568 in a closed mode, thus avoiding mutual interference between the first filter 518 and the second filter 568. Furthermore, the first cavity 516 and the second cavity 566 are arranged adjacent to each other and share a portion of the support structure, which can further reduce the area occupied by the multiplexer package structure 500 in the XY plane. In addition, since the multiplexer package structure 500 uses the substrate as a sealing layer, there is no need to set a plastic sealing layer, which can save manufacturing steps.

[0083] refer to Figure 6 and Figure 7 , Figure 6 and Figure 7 These are cross-sectional schematic diagrams of the module packaging structure provided in some embodiments of this utility model. For example... Figure 6 As shown, in a third aspect, this utility model embodiment provides a module packaging structure 600, which includes a filter packaging structure 602 as described in the above technical solution. The filter packaging structure 602 here can be... Figure 3 The illustrated filter package structure is 300, or... Figure 4 The schematic diagram shows the filter packaging structure 400.

[0084] like Figure 7 As shown, in a third aspect, this utility model embodiment provides a module packaging structure 600, which includes: a multiplexer packaging structure 604 as described in the above technical solution. The multiplexer packaging structure 604 here can be... Figure 5 The schematic diagram shows the multiplexer package structure 500.

[0085] refer to Figures 8 to 11 , Figures 8 to 11 This is a cross-sectional schematic diagram showing the manufacturing process of the filter packaging structure provided in some embodiments of this utility model. The following will be combined with... Figures 8 to 11This invention provides a detailed description of the manufacturing method of the filter packaging structure provided in some embodiments of the present invention.

[0086] like Figure 8 As shown, after the resin material is cured, a cavity is milled out or a pre-shaped sealing layer 326 is made by using a mold.

[0087] like Figure 9 As shown, a metal material layer, namely conductive shell 312, is formed by sputtering or vapor deposition on the inner surface of the molding layer 326.

[0088] In some embodiments, under a high vacuum environment, argon gas can be excited by a glow discharge due to high voltage to generate positive ions. The positive ions bombard the surface of the metal target, causing the metal atoms of the target to be ejected and sputtered and deposited on the inner surface of the encapsulation layer 326 to form a conductive shell 312.

[0089] like Figure 10 As shown, the molding layer 326 and conductive shell 312 formed above are attached to the first conductive ring 304. By heating the molding layer 326, the molding layer 326, conductive shell 312, first conductive ring 304 and first substrate 302 are fixedly connected. Figure 10 The diagram shows that the first filter 318 is disposed on the first surface 302a in a flip-chip manner, and the first filter 318 is coupled to the first pad 320 disposed on the first surface 302a through the first solder ball 324.

[0090] like Figure 11 As shown, the first filter 318 can also be mounted upright on the first surface 302a, and the first filter 318 is coupled to the first pad 320 on the first surface 302a via the first lead 328. Combined with... Figure 10 and Figure 11 As shown, the first conductive ring 304 and the first pad 320 on the first surface 302a can be formed in the same manufacturing process, and the second pad 322 and the third pad 310 on the second surface can be formed in the same manufacturing process.

[0091] refer to Figures 12 to 15 , Figures 12 to 15 This is a cross-sectional schematic diagram showing the manufacturing process of a filter packaging structure provided for other embodiments of the present invention. The following will be combined with... Figures 12 to 15 This invention provides a detailed description of the manufacturing method of the filter packaging structure provided in other embodiments of the present invention.

[0092] like Figure 12 As shown, the first filter 418 can be disposed on the first surface 402a in a flip-chip manner, and the first filter 418 is coupled to the first pad 320 disposed on the first surface 402a through the first solder ball 424.

[0093] like Figure 13 As shown, conductive adhesive 414 can be dotted on the surface of the first conductive ring 404.

[0094] In some embodiments, solder paste (containing flux) can also be formed on the surface of the first conductive ring 404. For example, a stencil can be used, and the solder paste can be applied to the corresponding positions on the first substrate 402 by opening the stencil. In this case, the solder paste needs to be applied first, and then the first filter 418 can be flip-chipped. Alternatively, the solder paste can be applied to the corresponding positions on the first substrate 402 using a dotting machine.

[0095] like Figure 14 As shown, the conductive shell 412 is attached to the first conductive ring 304 using conductive adhesive 414. When an external force is applied, the gap between the conductive shell 412 and the first filter 418 can serve as a buffer and protection.

[0096] In some embodiments, the conductive shell 412 is manufactured by machining. This can be achieved by milling grooves and cutting a block of conductive material, such as a metal block, using high-precision machine tools. In other embodiments, a mold is made into the shape of the conductive shell, and conductive material, such as a metal, is melted and poured into the mold, then cooled to obtain the conductive shell 412.

[0097] like Figure 15 As shown, a molding compound 426 is formed covering the outer surface of the conductive shell 412. The outermost resin material is sealed by molding or dispensing.

[0098] refer to Figures 16 to 19 , Figures 16 to 19 This is a cross-sectional schematic diagram showing the manufacturing process of the multiplexer packaging structure provided in some embodiments of this utility model. The following will be combined with... Figures 16 to 19 This invention provides a detailed description of the manufacturing method of the multiplexer packaging structure provided in some embodiments of the present invention.

[0099] like Figure 16 As shown, the first filter 518 can be disposed on the first surface 502a in a flip-chip manner. The first filter 518 is coupled to the first pad 520 on the first surface 502a via the first solder ball 524, and then the electrical signal is extracted through the second pad 522 on the second surface 502b. The second filter 568 can also be disposed on the third surface 528a in a flip-chip manner. The second filter 568 is coupled to the eleventh pad 570 on the third surface 528a via the second solder ball 574, and then the electrical signal is extracted through the twelfth pad 572 on the fourth surface 528b.

[0100] like Figure 17As shown, conductive adhesive 514 can be applied to the surfaces of the first conductive ring 504 and the third conductive ring 546 on the surface of the first substrate 502, and conductive adhesive 514 can also be applied to the surfaces of the second conductive ring 530 and the fourth conductive ring 552 on the surface of the second substrate 528. Of course, soldering agent can also be formed on the surfaces of the first conductive ring 504, the second conductive ring 530, the third conductive ring 546, and the fourth conductive ring 552.

[0101] like Figure 18 As shown, the first support structure 538 is fixedly connected to the first conductive ring 504, and the second support structure 558 is fixedly connected to the third conductive ring 546. The first support structure 538 may include a fifth conductive structure 540 disposed in the third substrate, and the second support structure 558 may include a sixth conductive structure 560 disposed in the third substrate. The fifth pad 542 in the first support structure 538 and the first conductive ring 504 can be fixedly connected by conductive adhesive 514, and the ninth pad 562 in the second support structure 558 and the third conductive ring 546 are fixedly connected.

[0102] like Figure 19 As shown, the second substrate 528 is flip-chip mounted on the first support structure 538 and the second support structure 558. A closed first cavity 516 can be formed between the first substrate 502, the first support structure 538, and the second substrate 528, and a closed second cavity 566 can be formed between the first substrate 502, the second support structure 558, and the second substrate 528. The sixth pad 544 and the second conductive ring 530 in the first support structure 538 can be fixedly connected by conductive adhesive 514, and the tenth pad 564 and the fourth conductive ring 552 in the second support structure 558 are fixedly connected.

[0103] This invention provides a filter packaging structure, a multiplexer packaging structure, and a module packaging structure. In this embodiment, a first conductive ring, a conductive shell, and a first substrate together form a closed first cavity to encapsulate a first filter disposed in the first cavity in a closed mode, thereby solving the basic packaging problems of the first filter, such as damage caused by external moisture intrusion into the filter packaging structure or external pressure. The first conductive structure, the second conductive structure, the first conductive ring, and the conductive shell together form a shielding path for the first filter to reduce external interference to the first filter and improve the signal attenuation problem of the first filter.

[0104] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of the present invention, the sequence number of the above-described processes does not imply a sequential order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention. The sequence numbers of the above-described embodiments of the present invention are merely descriptive and do not represent the superiority or inferiority of the embodiments.

[0105] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the concept of the present utility model and using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A filter packaging structure, characterized in that, The filter packaging structure includes: The first substrate includes opposing first and second surfaces; A first conductive ring is disposed on the first surface; A first conductive structure and a plurality of second conductive structures are disposed in the first substrate. The first conductive structure is connected to the first conductive ring through the second conductive structures. There is a gap between the first conductive structure and the first surface and the second surface. A conductive shell is attached to the first conductive ring, the opening of the conductive shell facing the first substrate, and the first conductive ring, the conductive shell and the first substrate together form a closed first cavity. A first filter is disposed in the first cavity; wherein the first conductive structure, the second conductive structure, the first conductive ring and the conductive shell together form a shielding path for the first filter.

2. The filter packaging structure according to claim 1, characterized in that, There is a gap between the first filter and the conductive shell.

3. The filter packaging structure according to claim 1, characterized in that, The filter packaging structure also includes: A conductive adhesive disposed between the first conductive ring and the conductive shell; or, A welding agent is placed between the first conductive ring and the conductive shell.

4. The filter packaging structure according to claim 1, characterized in that, The filter packaging structure also includes: A first pad is disposed on the first surface and in the first cavity; wherein the first filter is electrically connected to the first pad via solder balls, and there is a gap between the first filter and the first surface.

5. The filter packaging structure according to claim 1, characterized in that, The filter packaging structure also includes: A first pad is disposed on the first surface and in the first cavity; wherein the first filter is electrically connected to the first pad via a lead, and the first filter is in contact with the first surface.

6. The filter packaging structure according to claim 4 or 5, characterized in that, The filter packaging structure also includes: The second pad is located on the second surface; A connection structure disposed in the first substrate and passing through the first conductive structure, the connection structure having two opposing ends, one end of the connection structure being electrically connected to the first pad and the other end being electrically connected to the second pad, and the connection structure being insulated from the first conductive structure.

7. The filter packaging structure according to claim 1, characterized in that, The filter packaging structure also includes: A plastic encapsulation layer disposed on one side of the first substrate and covering the surface of the conductive shell.

8. A multiplexer packaging structure, characterized in that, The multiplexer packaging structure includes: The filter packaging structure as described in any one of claims 1 to 6; The second substrate includes a third surface and a fourth surface opposite to each other, wherein the first surface and the third surface are disposed opposite to each other; A second conductive ring is disposed on the third surface; A third conductive structure and a plurality of fourth conductive structures are disposed in the second substrate, the third conductive structure being connected to the second conductive ring through the fourth conductive structures; a gap is provided between the third conductive structure and the third surface and the fourth surface; A first support structure is disposed between the first substrate and the second substrate, and a fifth conductive structure is disposed in the first support structure. The fifth conductive structure is connected to the first conductive ring and the second conductive ring. The second conductive ring, the third conductive structure, the fourth conductive structure, and the fifth conductive structure together form the conductive shell. The first substrate, the first support structure, and the second substrate together form a closed first cavity.

9. The multiplexer packaging structure according to claim 8, characterized in that, The multiplexer packaging structure also includes: A second filter is disposed in the first cavity and on the third surface, with a gap between the second filter and the first support structure, and the first filter and the second filter are disposed opposite to each other; The first conductive structure and the second conductive structure disposed in the first substrate, the third conductive structure and the fourth conductive structure disposed in the second substrate, and the fifth conductive structure disposed in the first support structure together form a shielding path for the first filter and the second filter, and the first filter and the second filter share the same shielding path.

10. The multiplexer packaging structure according to claim 8, characterized in that, The multiplexer packaging structure also includes: A second support structure is disposed between the first substrate and the second substrate, and the first substrate, the second support structure and the second substrate together form a closed second cavity; the first cavity and the second cavity are disposed adjacent to each other, and a portion of the first support structure and a portion of the second support structure are shared; A second filter disposed in the second cavity and on the first surface, or a second filter disposed in the second cavity and on the third surface; The second filter and the second support structure are spaced apart. The conductive structure in the first substrate, the conductive structure in the second support structure, and the conductive structure in the second substrate together form a shielding path for the second filter. The first filter and the second filter use different shielding paths.

11. A module packaging structure, characterized in that, The module packaging structure includes: a filter packaging structure as described in any one of claims 1 to 7; or a multiplexer packaging structure as described in any one of claims 8 to 10.

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